Heat sink
Lee , et al. February 19, 2
U.S. patent number D453,744 [Application Number D/141,773] was granted by the patent office on 2002-02-19 for heat sink. This patent grant is currently assigned to Foxconn Precision Components Co., Ltd.. Invention is credited to Xue Jin Fu, Cheng-Chi Lee, Xiang Bo Liu.
| United States Patent | D453,744 |
| Lee , et al. | February 19, 2002 |
Heat sink
Claims
The ornamental design for a heat sink, as shown.
| Inventors: | Lee; Cheng-Chi (Taipei, TW), Fu; Xue Jin (Shenzhen, CN), Liu; Xiang Bo (Shenzhen, CN) |
|---|---|
| Assignee: | Foxconn Precision Components Co.,
Ltd. (Taipei, TW) |
| Appl. No.: | D/141,773 |
| Filed: | May 11, 2001 |
| Current U.S. Class: | D13/179 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/179,184 ;165/80.3,180,185 ;174/16.3 ;257/706,707,718,719,720,721,722,686,727 ;361/271,274.3,697,702,704,709,710,711 ;439/485,486,487 |
References Cited [Referenced By]
U.S. Patent Documents
| 5358032 | October 1994 | Arai et al. |
| D400188 | October 1998 | Chu |
| 6241006 | June 2001 | Shih |
Assistant Examiner: Bui; Daniel
Description
FIG. 1 is a perspective view of a heat sink of our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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