U.S. patent number D475,288 [Application Number D/155,150] was granted by the patent office on 2003-06-03 for package.
This patent grant is currently assigned to Henkel Kommanditgesellschaft auf Aktien. Invention is credited to Sandra L. Hoffmann, Wilfried Raehse.
United States Patent |
D475,288 |
Hoffmann , et al. |
June 3, 2003 |
Package
Claims
The ornamental design for package, as shown and described.
Inventors: |
Hoffmann; Sandra L.
(Duesseldorf, DE), Raehse; Wilfried (Duesseldorf,
DE) |
Assignee: |
Henkel Kommanditgesellschaft auf
Aktien (Duesseldorf, DE)
|
Appl.
No.: |
D/155,150 |
Filed: |
February 4, 2002 |
Foreign Application Priority Data
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Aug 3, 2001 [DE] |
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4 01 06 863 |
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Current U.S.
Class: |
D9/426; D9/428;
D9/429 |
Current International
Class: |
0903 |
Field of
Search: |
;D9/428,429,305,424-426
;220/4.21-4.25,4.01 ;206/303,446,389 ;229/406 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Deshmukh; Prabhakar
Attorney, Agent or Firm: Harper; Stephen D. Murphy; Glenn E.
J.
Description
FIG. 1 is a right front perspective view of a package according to
the new design;
FIG. 2 is a right front perspective view thereof from a higher
elevation than shown in FIG. 1;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a top plan view thereof
FIG. 5 is a back elevation view thereof; and,
FIG. 6 is a sectional view taken along line 6--6 of FIG 4.
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