Tray for semiconductor packaging

Soh , et al. May 21, 2

Patent Grant D457434

U.S. patent number D457,434 [Application Number D/136,212] was granted by the patent office on 2002-05-21 for tray for semiconductor packaging. This patent grant is currently assigned to Texchem-Pack (M) SDN BHD. Invention is credited to Geap Wooi Goh, Shuib Bin Hassan, Tee Hock Lim, Swee Chuan Soh.


United States Patent D457,434
Soh ,   et al. May 21, 2002

Tray for semiconductor packaging

Claims

The ornamental design for a tray for semiconductor packaging, as shown and described.
Inventors: Soh; Swee Chuan (Penang, MY), Lim; Tee Hock (Bukit Mertajam, MY), Goh; Geap Wooi (Bukit Mertajam, MY), Hassan; Shuib Bin (Seberang Perai, MY)
Assignee: Texchem-Pack (M) SDN BHD (Penang, MY)
Appl. No.: D/136,212
Filed: January 26, 2001

Current U.S. Class: D9/456
Current International Class: 0907
Field of Search: ;D9/434,456 ;206/832,710-712

References Cited [Referenced By]

U.S. Patent Documents
D125151 February 1941 Pagan
3469686 September 1969 Gutsche et al.
3719273 March 1973 Abe
D301013 May 1989 Creaden
5400904 March 1995 Maston, III et al.
5960960 October 1999 Yamamoto
Foreign Patent Documents
00-00115 Mar 2000 MY
Primary Examiner: Simone; Dominic
Attorney, Agent or Firm: Merchant & Gould P.C.

Description



FIG. 1 is a top plan view of a tray for semiconductor packaging showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a rear elevational view thereof; and,

FIG. 6 is a front elevational view thereof.

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