U.S. patent number D442,568 [Application Number D/120,362] was granted by the patent office on 2001-05-22 for ic module insert.
This patent grant is currently assigned to advantest Corporation. Invention is credited to Toshiyuki Kiyokawa, Yoshiyuki Masuo, Hiroyuki Takahashi.
United States Patent |
D442,568 |
Masuo , et al. |
May 22, 2001 |
IC module insert
Claims
The ornamental design for an IC module insert, as shown and
described.
Inventors: |
Masuo; Yoshiyuki (Tokyo,
JP), Kiyokawa; Toshiyuki (Tokyo, JP),
Takahashi; Hiroyuki (Tokyo, JP) |
Assignee: |
advantest Corporation (Tokyo,
JP)
|
Appl.
No.: |
D/120,362 |
Filed: |
March 20, 2000 |
Foreign Application Priority Data
|
|
|
|
|
Sep 20, 1999 [JP] |
|
|
11-24949 |
Sep 20, 1999 [JP] |
|
|
11-24950 |
|
Current U.S.
Class: |
D13/199;
D13/182 |
Current International
Class: |
1399 |
Field of
Search: |
;D13/182,199
;211/41.17,162 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Vinson; Brian N.
Attorney, Agent or Firm: Birch, Stewart, Kolasch &
Birch, LLP
Description
FIG. 1 is a perspective view of an IC module insert according to a
first embodiment of the present design.
FIG. 2 is a front view of the IC module insert shown in FIG. 1.
FIG. 3 is a rear view of the IC module insert shown in FIG. 1.
FIG. 4 is a left side view of the IC module insert shown in FIG.
1.
FIG. 5 is a right side view of the IC module insert shown in FIG.
1.
FIG. 6 is a top plan view of the IC module insert shown in FIG.
1.
FIG. 7 is a bottom plan view of the IC module insert shown in FIG.
1.
FIG. 8 is a sectional view along line VIII--VIII of FIG. 2.
FIG. 9 is a sectional view along line IX--IX of FIG. 6.
FIG. 10 is a perspective view of an IC module insert according to a
second embodiment of the present design.
FIG. 11 is a front view of the IC module insert shown in FIG.
10.
FIG. 12 is a rear view of the IC module insert shown in FIG.
10.
FIG. 13 is a left side view of the IC module insert shown in FIG.
10.
FIG. 14 is a right side view of the IC module insert shown in FIG.
10.
FIG. 15 is a top plan view of the IC module insert shownn in FIG.
10.
FIG. 16 is a bottom plan view of the IC module insert shown in FIG.
10.
FIG. 17 is a sectional view along line XVII--XVII of FIG. 11.
FIG. 18 is a sectional view along line XVIII--XVIII of FIG. 15;
and,
FIG. 19 is a reduced perspective view of the embodiment of FIG. 1,
with the broken-line disclosure of a second module insert and the
larger rack assembly being for illustrative purposes only and
forming no part of the claimed design.
* * * * *