IC module insert

Masuo , et al. May 22, 2

Patent Grant D442568

U.S. patent number D442,568 [Application Number D/120,362] was granted by the patent office on 2001-05-22 for ic module insert. This patent grant is currently assigned to advantest Corporation. Invention is credited to Toshiyuki Kiyokawa, Yoshiyuki Masuo, Hiroyuki Takahashi.


United States Patent D442,568
Masuo ,   et al. May 22, 2001

IC module insert

Claims

The ornamental design for an IC module insert, as shown and described.
Inventors: Masuo; Yoshiyuki (Tokyo, JP), Kiyokawa; Toshiyuki (Tokyo, JP), Takahashi; Hiroyuki (Tokyo, JP)
Assignee: advantest Corporation (Tokyo, JP)
Appl. No.: D/120,362
Filed: March 20, 2000

Foreign Application Priority Data

Sep 20, 1999 [JP] 11-24949
Sep 20, 1999 [JP] 11-24950
Current U.S. Class: D13/199; D13/182
Current International Class: 1399
Field of Search: ;D13/182,199 ;211/41.17,162

References Cited [Referenced By]

U.S. Patent Documents
D268754 April 1983 Chaney et al.
3184069 May 1965 Rosenberg
3470420 September 1969 Marks
Primary Examiner: Vinson; Brian N.
Attorney, Agent or Firm: Birch, Stewart, Kolasch & Birch, LLP

Description



FIG. 1 is a perspective view of an IC module insert according to a first embodiment of the present design.

FIG. 2 is a front view of the IC module insert shown in FIG. 1.

FIG. 3 is a rear view of the IC module insert shown in FIG. 1.

FIG. 4 is a left side view of the IC module insert shown in FIG. 1.

FIG. 5 is a right side view of the IC module insert shown in FIG. 1.

FIG. 6 is a top plan view of the IC module insert shown in FIG. 1.

FIG. 7 is a bottom plan view of the IC module insert shown in FIG. 1.

FIG. 8 is a sectional view along line VIII--VIII of FIG. 2.

FIG. 9 is a sectional view along line IX--IX of FIG. 6.

FIG. 10 is a perspective view of an IC module insert according to a second embodiment of the present design.

FIG. 11 is a front view of the IC module insert shown in FIG. 10.

FIG. 12 is a rear view of the IC module insert shown in FIG. 10.

FIG. 13 is a left side view of the IC module insert shown in FIG. 10.

FIG. 14 is a right side view of the IC module insert shown in FIG. 10.

FIG. 15 is a top plan view of the IC module insert shownn in FIG. 10.

FIG. 16 is a bottom plan view of the IC module insert shown in FIG. 10.

FIG. 17 is a sectional view along line XVII--XVII of FIG. 11.

FIG. 18 is a sectional view along line XVIII--XVIII of FIG. 15; and,

FIG. 19 is a reduced perspective view of the embodiment of FIG. 1, with the broken-line disclosure of a second module insert and the larger rack assembly being for illustrative purposes only and forming no part of the claimed design.

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