Bubble package

Lee October 3, 2

Patent Grant D431459

U.S. patent number D431,459 [Application Number D/097,848] was granted by the patent office on 2000-10-03 for bubble package. This patent grant is currently assigned to Monster Cable, Inc.. Invention is credited to Kendrew Lee.


United States Patent D431,459
Lee October 3, 2000

Bubble package

Claims

The ornamental design for a bubble package, as shown and described.
Inventors: Lee; Kendrew (San Jose, CA)
Assignee: Monster Cable, Inc. (Sunnyvale, CA)
Appl. No.: D/097,848
Filed: December 15, 1998

Current U.S. Class: D9/415
Current International Class: 0903
Field of Search: ;D9/415,418,341,337,414,456 ;206/461-471,806,495,769-773,215,579,457 ;229/162

References Cited [Referenced By]

U.S. Patent Documents
D355600 February 1995 Ford
D371071 June 1996 Frod
D405368 February 1999 Lee
4278693 July 1981 Dingethal et al.
4469226 September 1984 Matney
5890593 April 1999 Humphrey

Other References

Modern Packaging Catalog, p. 300, Jan. 1941. .
Techform Inc. (From 206/461 Shoe), Nov. 1982..

Primary Examiner: Deshmukh; Prabhakar
Attorney, Agent or Firm: Lariviere, Grubman & Payne, LLP

Description



FIG. 1 is a front elevational view of a bubble package showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a front elevational view of a second embodiment of the bubble package;

FIG. 8 is a rear elevational view of FIG. 7;

FIG. 9 is a left side elevational view of FIG. 7;

FIG. 10 is a right side elevational view of FIG. 7;

FIG. 11 is a bottom plan view of FIG. 7;

FIG. 12 is a top plan view of FIG. 7;

FIG. 13 is a front elevational view of a third embodiment of the bubble package;

FIG. 14 is a rear elevational view of FIG. 13;

FIG. 15 is a left side evelational view of FIG. 13;

FIG. 16 is a right side elevational view of FIG. 13;

FIG. 17 is a bottom plan view of FIG. 13; and,

FIG. 18 is a top plan view of FIG. 13.

* * * * *


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