Semiconductor element

Description

FIG. 1 is a perspective view of a first embodiment of a semiconductor element showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof; and,

FIG. 7 is a rear elevational view thereof.

FIG. 8 is a perspective view of a second embodiment of a semiconductor element showing our new design;

FIG. 9 is a top plan view thereof;

FIG. 10 is a left side elevational view thereof;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a bottom plan view thereof;

FIG. 13 is a right side elevational view thereof; and,

FIG. 14 is a rear elevational view thereof.

Claims

The ornamental design for a semiconductor element, as shown and described.

---

Inventors:	Oba; Haruo (Tokyo, JP), Hibino; Takuro (Tokyo, JP), Kondo; Yoshio (Tokyo, JP)
Assignee:	Sony Corporation (Tokyo, JP)
Appl. No.:	D/086,990
Filed:	April 24, 1998

---

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182,105,107,114,117 ;174/521 ;361/679,728,736,737,742,752,802 ;439/328,377

---

References Cited [Referenced By]

---

U.S. Patent Documents

D317592	June 1991	Yoshizawa
D358806	May 1995	Siegel et al.
D375941	November 1996	Kerklaan
D376133	December 1996	Kerklaan
D379350	May 1997	Kerklaan
D386475	November 1997	Hiramatsu
D401912	December 1998	Majumdar et al.

Primary Examiner: Vinson; Brian N.
Attorney, Agent or Firm: Foley & Lardner