Semiconductor power package with three leads
Choi February 22, 2
U.S. patent number D420,983 [Application Number D/095,110] was granted by the patent office on 2000-02-22 for semiconductor power package with three leads. This patent grant is currently assigned to IXYS Corporation. Invention is credited to KangRim Choi.
| United States Patent | D420,983 |
| Choi | February 22, 2000 |
Semiconductor power package with three leads
Claims
The ornamental design for a semiconductor power package with three leads, as shown and described.
| Inventors: | Choi; KangRim (Santa Clara, CA) |
|---|---|
| Assignee: | IXYS Corporation (Santa Clara,
CA) |
| Appl. No.: | D/095,110 |
| Filed: | October 16, 1998 |
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182,199 ;257/690,692,693,694,697 ;315/291 ;361/744 |
References Cited [Referenced By]
U.S. Patent Documents
| D202271 | September 1965 | Wulc |
| D277955 | March 1985 | Takahashi |
| D288557 | March 1987 | Bois |
| 5754405 | May 1998 | Derouiche |
| 5861721 | January 1999 | Johnson |
Other References
|
Ixys Corporation Product Catalog, p. 18, HiPerFET.TM. Power Mosfets.. |
Primary Examiner: Aronovich; Adir
Attorney, Agent or Firm: Townsend and Townsend and Crew
Description
FIG. 1 is a perspective view of a semiconductor power package with three leads showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a right side elevational view thereof, the left side elevational view being a mirror image;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a rear elevational view thereof; and,
FIG. 6 is a front elevational view thereof.
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