Packaging assembly

Description

FIG. 1 is an exploded view of a packaging assembly embodying my design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a back elevational view thereof;

FIG. 4 is a right elevational view thereof, the left elevational view being a mirror image thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a cross-sectional view taken along line 7--7 in FIG. 2;

FIG. 8 is a perspective view thereof;

FIG. 9 is an exploded view of an alternate embodiment of my design; and,

FIG. 10 is a perspective view thereof.

The corresponding views of the second embodiment (FIG. 9) are similar to the views of the first embodiment (FIG. 1) FIGS. 2-8 inclusive with the exception of transparent surface.

Claims

The ornamental design for a packaging assembly, as shown and described.

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Inventors:	Wada; Yuko (Kanagawa, JP)
Assignee:	Sony Corporation (Tokyo, JP)
Appl. No.:	D/028,173
Filed:	September 8, 1994

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Current U.S. Class:	D9/415
Field of Search:	;D9/415,418,341,337 ;206/461-471,45.34,44R,477,495,806

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References Cited [Referenced By]

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U.S. Patent Documents

D250092	October 1978	Schoenfield et al.
D348391	July 1994	Ichikawa et al.
D348392	July 1994	Tannen
D352236	November 1994	Althaus
4326546	April 1982	Acker
4697700	October 1987	Weissman

Other References

Packaging, Aug. 1986, vol. 31, p. 53. . Modern Packaging, 1963, p. 334..

Primary Examiner: Deshmukh; Prabhakar G.
Attorney, Agent or Firm: Finnegan, Henderson, Farabow, Garrett & Dunner