Package for a headphone

Ichikawa , et al. July 5, 1

Patent Grant D348391

U.S. patent number D348,391 [Application Number D/005,419] was granted by the patent office on 1994-07-05 for package for a headphone. This patent grant is currently assigned to Sony Corporation. Invention is credited to Toru Ichikawa, Yoshie Nagasaka, Yuko Suzuki, Ellen Tave, Yuko Wada, Rosalin Yin.


United States Patent D348,391
Ichikawa ,   et al. July 5, 1994

Package for a headphone

Claims

The ornamental design for a package for a headphone, as shown.
Inventors: Ichikawa; Toru (Yokohama, JP), Wada; Yuko (Kawasaki, JP), Suzuki; Yuko (Fujisawa, JP), Tave; Ellen (Haworth, NJ), Yin; Rosalin (Riverdale, NY), Nagasaka; Yoshie (Tokyo, JP)
Assignee: Sony Corporation (Tokyo, JP)
Appl. No.: D/005,419
Filed: March 4, 1993

Current U.S. Class: D9/415
Field of Search: ;D9/415,418,337,341 ;206/461-471,806,216,316.1,307,495

References Cited [Referenced By]

U.S. Patent Documents
D291064 July 1987 Haber et al.
D321323 November 1991 Nakamura
D341777 November 1993 Sheu
4319684 March 1982 Backman et al.
4781289 November 1988 Perkins
4901858 February 1990 Anderson

Other References

Modern Packaging, 1978, p. 300, as shown. .
Hardware Age, Sep. 1984, p. 60 as shown..

Primary Examiner: Deshmukh; Prabhakar G.
Attorney, Agent or Firm: Eslinger; Lewis H. Maioli; Jay H.

Description



FIG. 1 is a top, front and right-side perspective view of a package for a headphone, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side elevational view thereof;

FIG. 5 is a right-side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

* * * * *


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