U.S. patent number 8,735,972 [Application Number 13/227,554] was granted by the patent office on 2014-05-27 for sram cell having recessed storage node connections and method of fabricating same.
This patent grant is currently assigned to International Business Machines Corporation. The grantee listed for this patent is Brent A. Anderson, Edward J. Nowak, Jed H. Rankin. Invention is credited to Brent A. Anderson, Edward J. Nowak, Jed H. Rankin.
United States Patent |
8,735,972 |
Anderson , et al. |
May 27, 2014 |
SRAM cell having recessed storage node connections and method of
fabricating same
Abstract
An SRAM cell and a method of forming an SRAM cell. The SRAM cell
includes a first pass gate field effect transistor (FET) and a
first pull-down FET sharing a first common source/drain (S/D) and a
first pull-up FET having first and second S/Ds; a second pass gate
FET and a second pull-down FET sharing a second common S/D and a
second pull-up FET having first and second S/Ds; a first gate
electrode common to the first pull-down FET and the first pull-up
FET and physically and electrically contacting the first S/D of the
first pull-up FET; a second gate electrode of the first pull-up
FET; a third gate electrode common to the second pull-down FET and
the second pull-up FET and physically and electrically contacting
the first S/D of the second pull-up FET; and a fourth gate
electrode of the first pull-up FET.
Inventors: |
Anderson; Brent A. (Jericho,
VT), Nowak; Edward J. (Essex Junction, VT), Rankin; Jed
H. (Richmond, VT) |
Applicant: |
Name |
City |
State |
Country |
Type |
Anderson; Brent A.
Nowak; Edward J.
Rankin; Jed H. |
Jericho
Essex Junction
Richmond |
VT
VT
VT |
US
US
US |
|
|
Assignee: |
International Business Machines
Corporation (Armonk, NY)
|
Family
ID: |
47829072 |
Appl.
No.: |
13/227,554 |
Filed: |
September 8, 2011 |
Prior Publication Data
|
|
|
|
Document
Identifier |
Publication Date |
|
US 20130062687 A1 |
Mar 14, 2013 |
|
Current U.S.
Class: |
257/330; 365/154;
257/E21.41; 365/156; 257/E29.262; 438/270 |
Current CPC
Class: |
H01L
21/26586 (20130101); H01L 27/1104 (20130101); H01L
29/7833 (20130101); H01L 29/0847 (20130101) |
Current International
Class: |
H01L
29/76 (20060101); H01L 31/119 (20060101); H01L
31/113 (20060101); H01L 21/336 (20060101); G11C
11/00 (20060101); H01L 29/94 (20060101); H01L
31/062 (20120101) |
Field of
Search: |
;257/E27.098-E27.101,E27.077,E21.661,330,777,903,E21.487,E21.294,E21.41,E29.362
;365/154,156 ;438/270 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
Noda et al., A 2.9 um2 Embedded SRAM Cell with Co-Salicide
Direct-Strap Technology for 0.18 um High Performance CMOS Logic,
0-7803-4100-7/97, 1997 IEEE, pp. 34.1.1-34.1.4. cited by
applicant.
|
Primary Examiner: Blum; David S
Attorney, Agent or Firm: Schmeiser, Olsen & Watts
LeStrange; Michael
Claims
What is claimed is:
1. A static random access memory (SRAM) cell, comprising: a first
pass gate field effect transistor (FET) and a first pull-down FET
sharing a first common source/drain (S/D); a first pull-up FET
having first and second S/Ds; a second pass gate FET and a second
pull-down FET sharing a second common S/D; a second pull-up FET
having first and second S/Ds; a first gate electrode common to said
first pull-down FET and said first pull-up FET and physically and
electrically contacting said first S/D of said second pull-up FET,
said first S/D of said second pull-up FET having a first end
adjacent to said first gate electrode and a opposite second end
adjacent to a third gate electrode, said first gate electrode
extending over and electrically and physically contacting an end
wall of said first end of said first S/D of said second pull-up FET
and extending over an adjacent top surface of said first end of
said first S/D of said second pull-up FET; a second gate electrode
of said first pass gate FET; said third gate electrode common to
said second pull-down FET and said second pull-up FET and
physically and electrically contacting said first S/D of said first
pull-up FET, said first S/D of said first pull-up FET having a
first end adjacent to said third gate electrode and a opposite
second end adjacent to said first gate electrode, said third gate
electrode extending over and electrically and physically contacting
an end wall of said first end of said first S/D of said first
pull-up FET and extending over an adjacent top surface of said
first end of said first S/D of said first pull-up FET; and a fourth
gate electrode of said second pass gate FET.
2. The SRAM cell of claim 1, wherein said first, second, third and
fourth gate electrodes are unconnected regions of a same layer of a
same material.
3. The SRAM cell of claim 1, including: metal silicide layers on
respective top surfaces of said first, second, third and fourth
gate electrodes, said first, second, third and fourth gate
electrodes comprising polysilicon.
4. The SRAM cell of claim 1, wherein: first major axes of said
first, second, third and fourth gate electrodes are parallel; said
first common S/D, a second S/D of said first pass gate FET and a
second S/D of said first pull-down FET are located in a contiguous
first region of a semiconductor substrate; said first S/D and said
second S/D of said first pull-up FET are located in a contiguous
second region of said semiconductor substrate; said first S/D and
said second S/D of said second pull-up FET are located in a
contiguous third region of said semiconductor substrate; said
second common S/D, a second S/D of said second pass gate FET and a
second S/D of said second pull-down FET are located in a contiguous
fourth region of said semiconductor substrate; second major axes of
said first, second, third and fourth regions are parallel; and said
first and second major axes are perpendicular.
5. The SRAM cell of claim 1, including: dielectric trench isolation
between first, second, third and fourth regions of a single crystal
bulk silicon substrate or a single crystal layer of a
silicon-on-insulator substrate, said first common S/D in said first
region, said first and second S/Ds of said first pull-up FET in
said second region, said second common S/D in said third region,
said first and second S/Ds of said second pull-up FET in said
fourth region; a first trench in said dielectric trench isolation
abutting said end wall of said first end of first S/D of said first
pull-up FET, said third gate electrode at least partially filling
said first trench and physically and electrically contacting said
end wall of said first end and said adjacent top surface of said
first S/D of said first pull-up FET; and a second trench in said
dielectric trench isolation abutting said end wall of said first
end of first S/D of said second pull-up FET, said first gate
electrode at least partially filling said second trench and
physically and electrically contacting said end wall of said first
end and said adjacent top surface of said first S/D of said second
pull-up FET.
6. The SRAM cell of claim 5, including: a second S/D of said first
pass gate FET in said first region and on an opposite side of said
second gate electrode from said first common S/D; a second S/D of
said first pull-down FET in said first region and on an opposite
side of said first gate electrode from said first common S/D; said
second S/D of said first pull-up FET in said second region and on
an opposite side of said first gate electrode from said first S/D
of said first pull-up FET; a second S/D of said second pass gate
FET in said third region and on an opposite side of said fourth
gate electrode from said second common S/D; a second S/D of said
second pull-down FET in said third region and on an opposite side
of said third gate electrode from said second common S/D; and said
second S/D of said second pull-up FET in said fourth region and on
an opposite side of said third gate electrode from said first S/D
of said second pull-up FET.
7. The SRAM cell of claim 1, including: a first buried strap
between said first common S/D and said first S/D of said first
pull-up FET, said first buried strap in direct physical and
electrical contact with a sidewall of said first common S/D and a
sidewall of said of said first S/D of said first pull-up FET; and a
second buried strap between said second common S/D and said first
S/D of said second pull-up FET, said second buried strap in direct
physical and electrical contact with a sidewall of said second
common S/D and a sidewall of said of said first S/D of said second
pull-up FET.
8. The SRAM cell of claim 7, wherein said first, second, third and
fourth gate electrodes and said first buried strap and second
buried strap are unconnected regions of a same layer of a same
material.
9. The SRAM cell of claim 7, including: metal silicide layers on
respective top surfaces of said first, second, third and fourth
gate electrodes and said first and second straps, said first,
second, third and fourth gate electrodes and said first and second
straps comprising polysilicon.
10. The SRAM cell of claim 7, wherein: first major axes of said
first, second, third and fourth gate electrodes and said first and
second straps are parallel; said first common S/D, said second S/D
of said first pass gate FET and said S/D of said first pull-down
FET are located in a contiguous first region of a semiconductor
substrate; said first S/D and said second S/D of said first pull-up
FET are located in a contiguous second region of said semiconductor
substrate; said first S/D and said second S/D of said second
pull-up FET are located in a contiguous third region of said
semiconductor substrate; said second common S/D, said second S/D of
said second pass gate FET and said S/D of said second pull-down FET
are located in a contiguous fourth region of said semiconductor
substrate; second major axes of said first, second, third and
fourth regions are parallel; and said first and second major axes
are perpendicular.
11. The SRAM cell of claim 1, including: trench isolation between
first, second, third and fourth regions of a semiconductor
substrate; said first common S/D, a second S/D of said first pass
gate FET and a second S/D of said first pull-down FET in said first
region of said semiconductor substrate, said first S/D and said
second S/D of said first pull-up FET in said second region of said
semiconductor substrate, said first S/D and said second S/D of said
second pull-up FET in said third region of said semiconductor
substrate, and said second common S/D, a second S/D of said second
pass gate FET and a second S/D of said second pull-down FET are
located in said fourth region of said semiconductor substrate; a
first trench in said trench isolation abutting said sidewall of
said first end of first S/D of said first pull-up FET, said third
gate electrode at least partially filling said first trench and
physically and electrically contacting said sidewall of said first
end and said adjacent top surface of said first S/D of said first
pull-up FET; a second trench in said trench isolation abutting said
sidewall of said first end of first S/D of said second pull-up FET,
said first gate electrode at least partially filling said second
trench and physically and electrically contacting said sidewall of
said first end and said adjacent top surface of said first S/D of
said second pull-up FET; a third trench in said trench isolation
between and abutting said first and second regions and a first
electrically conductive strap in said trench, said strap in direct
physical and electrical contact with a sidewall of said first
common S/D and in direct physical and electrical contact with said
end wall of said first S/D of said first pull-up FET; and a fourth
trench in said trench isolation between and abutting said third and
fourth regions and a second electrically conductive strap in said
fourth trench, said second strap in direct physical and electrical
contact with said end wall of said second common S/D and in direct
physical and electrical contact with a sidewall of said first S/D
of said second pull-up FET.
12. The SRAM cell of claim 11, wherein top surfaces of said first
and second straps are recessed below a top surface of said trench
isolation and respective top surfaces of said first, second, third
and fourth regions.
13. The SRAM cell of claim 11, further including: a first notch in
a top surface and a sidewall of said first common S/D and a second
notch in a top surface and a sidewall of said first S/D of said
first pull-up device, said first and second notches open to said
first trench; and a third notch in a top surface and a sidewall of
said second common S/D and a fourth notch in a top surface and a
sidewall said first S/D of said second pull-up device, said third
and fourth notches open to said second trench.
14. A method of forming static random access memory (SRAM) cell,
comprising: forming a first pass gate field effect transistor (FET)
and a first pull-down FET sharing a first common source/drain (S/D)
and a first pull-up FET having first and second S/Ds; forming a
second pass gate FET and a second pull-down FET sharing a second
common S/D and a second pull-up FET having first and second S/Ds;
forming a first gate electrode common to said first pull-down FET
and said first pull-up FET and physically and electrically
contacting said first S/D of said second pull-up FET, said first
S/D of said second pull-up FET having a first end adjacent to said
first gate electrode and a opposite second end adjacent to a third
gate electrode, said first gate electrode extending over and
electrically and physically contacting an end wall of said first
end of said first S/D of said second pull-up FET and extending over
an adjacent top surface of said first end of said first S/D of said
second pull-up FET; forming a second gate electrode of said first
pass gate FET; forming said third gate electrode common to said
second pull-down FET and said second pull-up FET and physically and
electrically contacting said first S/D of said first pull-up FET,
said first S/D of said first pull-up FET having a first end
adjacent to said third gate electrode and a opposite second end
adjacent to said first gate electrode, said third gate electrode
extending over and electrically and physically contacting an end
wall of said first end of said first S/D of said first pull-up FET
and extending over an adjacent top surface of said first end of
said first S/D of said first pull-up FET; and forming a fourth gate
electrode of second pass gate FET.
15. The method of claim 14, wherein said first, second, third and
fourth gate electrodes are unconnected regions of a same layer of a
same material.
16. The method of claim 14, including: forming metal silicide
layers on respective top surfaces of said first, second, third and
fourth gate electrodes, said first, second, third and fourth gate
electrodes comprising polysilicon.
17. The method of claim 14, wherein: first major axes of said
first, second, third and fourth gate electrodes are parallel; said
first common S/D, a second S/D of said first pass gate FET and a
second S/D of said first pull-down FET are located in a contiguous
first region of a semiconductor substrate; said first S/D and said
second S/D of said first pull-up FET are located in a contiguous
second region of said semiconductor substrate; said first S/D and
said second S/D of said second pull-up FET are located in a
contiguous third region of said semiconductor substrate; said
second common S/D, a second S/D of said second pass gate FET and
said second S/D of a second pull-down FET are located in a
contiguous fourth region of said semiconductor substrate; second
major axes of said first, second, third and fourth regions are
parallel; and said first and second major axes are
perpendicular.
18. The method of claim 14, including: forming trench isolation
between first, second, third and fourth regions of a semiconductor
substrate, said first common S/D in said first region, said first
and second S/Ds of said first pull-up FET in said second region,
said second common S/D in said third region, said first and second
S/Ds of said second pull-up FET in said fourth region; forming a
first trench in said dielectric trench isolation abutting said end
wall of said first end of first S/D of said first pull-up FET, said
third gate electrode at least partially filling said first trench
and physically and electrically contacting said end wall of said
first end and said adjacent top surface of said first S/D of said
first pull-up FET; and forming a second trench in said dielectric
trench isolation abutting said end wall of said first end of first
S/D of said second pull-up FET, said first gate electrode at least
partially filling said second trench and physically and
electrically contacting said end wall of said first end and said
adjacent top surface of said first S/D of said second pull-up
FET.
19. The method of claim 18, including: forming a second S/D of said
first pass gate FET in said first region and on an opposite side of
said second gate electrode from said first common S/D; forming a
second S/D of said first pull-down FET in said first region and on
an opposite side of said first gate electrode from said first
common S/D; forming said second S/D of said first pull-up FET in
said second region and on an opposite side of said first gate
electrode from said first S/D of said first pull-up FET; forming a
second S/D of said second pass gate FET in said third region and on
an opposite side of said fourth gate electrode from said second
common S/D; forming a second S/D of said second pull-down FET in
said third region and on an opposite side of said third gate
electrode from said second common S/D; and forming said second S/D
of said second pull-up FET in said fourth region and on an opposite
side of said third gate electrode from said first S/D of said
second pull-up FET.
20. The method of claim 14, including: forming a first buried strap
between said first common S/D and said first S/D of said first
pull-up FET, said first buried strap in direct physical and
electrical contact with a sidewall of said first common S/D and a
sidewall of said of said first S/D of said first pull-up FET; and
forming a second buried strap between said second common S/D and
said first S/D of said second pull-up FET, said second buried strap
in direct physical and electrical contact with a sidewall of said
second common S/D and a sidewall of said of said first S/D of said
second pull-up FET.
21. The method of claim 20, wherein said first, second, third and
fourth gate electrodes and said first and second straps are
unconnected regions of a same layer of a same material.
22. The method of claim 20, including: forming metal silicide
layers on respective top surfaces of said first, second, third and
fourth gate electrodes and said first and second straps, said
first, second, third and fourth gate electrodes and said first and
second straps comprising polysilicon.
23. The method of claim 20, wherein: first major axes of said
first, second, third and fourth gate electrodes and said first and
second straps are parallel; said first common S/D, said second S/D
of said first pass gate FET and said S/D of said first pull-down
FET are located in a contiguous first region of a semiconductor
substrate; said first S/D and said second S/D of said first pull-up
FET are located in a contiguous second region of said semiconductor
substrate; said first S/D and said second S/D of said second
pull-up FET are located in a contiguous third region of said
semiconductor substrate; said second common S/D, said second S/D of
said second pass gate FET and said S/D of said second pull-down FET
are located in a contiguous fourth region of said semiconductor
substrate; second major axes of said first, second, third and
fourth regions are parallel; and said first and second major axes
are perpendicular.
24. The method of claim 14, including: forming trench isolation
between first, second, third and fourth regions of a semiconductor
substrate, said first common S/D, a second S/D of said first pass
gate FET and a second S/D of said first pull-down FET in said first
region of said semiconductor substrate, said first S/D and said
second S/D of said first pull-up FET in said second region of said
semiconductor substrate, said first S/D and said second S/D of said
second pull-up FET in said third region of said semiconductor
substrate, and said second common S/D, a second S/D of said second
pass gate FET and a second S/D of said second pull-down FET are
located in said fourth region of said semiconductor substrate;
forming a first trench in said trench isolation abutting said
sidewall of said first end of first S/D of said first pull-up FET,
said third gate electrode at least partially filling said first
trench and physically and electrically contacting said sidewall of
said first end and said adjacent top surface of said first S/D of
said first pull-up FET; and forming a second trench in said trench
isolation abutting said sidewall of said first end of first S/D of
said second pull-up FET, said first gate electrode at least
partially filling said second trench and physically and
electrically contacting said sidewall of said first end and said
adjacent top surface of said first S/D of said second pull-up FET;
forming a third trench in said trench isolation between and
abutting said first and second regions and a first electrically
conductive strap in said trench, said strap in direct physical and
electrical contact with said end wall of said first common S/D and
in direct physical and electrical contact with a sidewall of said
first S/D of said first pull-up FET; and forming a fourth trench in
said trench isolation between and abutting said third and fourth
regions and a second electrically conductive strap in said fourth
trench, said second strap in direct physical and electrical contact
with said end wall of said second common S/D and in direct physical
and electrical contact with a sidewall of said first S/D of said
second pull-up FET.
25. The method of claim 24, wherein top surfaces of said first and
second straps are recessed below a top surface of said trench
isolation and respective top surfaces of said first, second, third
and fourth regions.
26. The method of claim 24, further including: forming a first
notch in a top surface and a sidewall of said first common S/D and
forming a second notch in a top surface and a sidewall of said
first S/D of said first pull-up device, said first and second
notches open to said first trench; and forming a third notch in a
top surface and a sidewall of said second common S/D and a forming
fourth notch in a top surface and a sidewall said first S/D of said
second pull-up device, said third and fourth notches open to said
second trench.
Description
FIELD OF THE INVENTION
The present invention relates to the field of semiconductor
devices; more specifically, it relates to SRAM cells having
recessed storage node connections and methods of fabricating SRAM
cells having recessed storage node connections.
BACKGROUND
As the dimensions of field effect transistors (FETs) decrease,
lithographic constraints are tending toward the gates of the FETs
to be orientated in a single direction on a fixed pitch. When SRAM
(static random access memory) cells are fabricated using these gate
lithographic constraints it is becoming more difficult to fabricate
storage node connections using the metal contact level.
Accordingly, there exists a need in the art to mitigate the
deficiencies and limitations described hereinabove.
SUMMARY
A first aspect of the present invention is a static random access
memory (SRAM) cell comprising: a first pass gate field effect
transistor (FET) and a first pull-down FET sharing a first common
source/drain (S/D) and a first pull-up FET having first and second
S/Ds; a second pass gate FET and a second pull-down FET sharing a
second common S/D and a second pull-up FET having first and second
S/Ds; a first gate electrode common to the first pull-down FET and
the first pull-up FET and physically and electrically contacting
the first S/D of the first pull-up FET; a second gate electrode of
the first pull-up FET; a third gate electrode common to the second
pull-down FET and the second pull-up FET and physically and
electrically contacting the first S/D of the second pull-up FET;
and a fourth gate electrode of the first pull-up FET.
A second aspect of the present invention is a method of forming a
static random access memory (SRAM) cell, comprising: forming a
first pass gate field effect transistor (FET) and a first pull-down
FET sharing a first common source/drain (S/D) and a first pull-up
FET having first and second S/Ds; forming a second pass gate FET
and a second pull-down FET sharing a second common S/D and a second
pull-up FET having first and second S/Ds; forming a first gate
electrode common to said first pull-down FET and said first pull-up
FET and physically and electrically contacting said first S/D of
said first pull-up FET; forming a second gate electrode of said
first pull-up FET; a third gate electrode common to said second
pull-down FET and said second pull-up FET and physically and
electrically contacting said first S/D of said second pull-up FET;
and forming a fourth gate electrode of said first pull-up FET.
These and other aspects of the invention are described below.
BRIEF DESCRIPTION OF THE DRAWINGS
The features of the invention are set forth in the appended claims.
The invention itself, however, will be best understood by reference
to the following detailed description of illustrative embodiments
when read in conjunction with the accompanying drawings,
wherein:
FIG. 1 is schematic diagram of an exemplary SRAM cell;
FIGS. 2 through 7 illustrate methods of fabricating a gate-to-gate
strap according to embodiments of the present invention;
FIGS. 8 and 9 illustrate detailed steps in the formation of NFETs
and PFETs of SRAM cells according to embodiments of the present
invention; and
FIG. 10 illustrates an alternative strapping technique according to
embodiments of the present invention.
FIG. 11 illustrates a completed SRAM cell according to embodiments
of the present invention.
DETAILED DESCRIPTION
The embodiments of the present invention provide SRAM cells having
recessed storage node straps that are formed from gate electrode
material (not contact level or metal wire level material) and
formed during the gate electrode fabrication steps, thereby
eliminating the need for complex contact shapes and processes
currently used.
A photolithographic process is defined as a process in which a
photoresist layer is applied to a surface of a substrate, the
photoresist layer exposed to actinic radiation through a patterned
photomask and the exposed photoresist layer developed to form a
patterned photoresist layer. When the photoresist layer comprises
positive photoresist, the developer dissolves the regions of the
photoresist exposed to the actinic radiation and does not dissolve
the regions where the patterned photomask blocked (or greatly
attenuated the intensity of the radiation) from impinging on the
photoresist layer. When the photoresist layer comprises negative
photoresist, the developer does not dissolve the regions of the
photoresist exposed to the actinic radiation and does dissolve the
regions where the patterned photomask blocked (or greatly
attenuated the intensity of the radiation) from impinging on the
photoresist layer. After processing (e.g., an etch or an ion
implantation), the patterned photoresist is removed. The
photoresist layer may optionally be baked at one or more of the
following steps: prior to exposure to actinic radiation, between
exposure to actinic radiation and development, after
development.
FIG. 1 is schematic diagram of an exemplary SRAM cell. In FIG. 1,
an SRAM cell 100 comprises pass gate field effect transistors
(FETs) T0 and T1 (which are illustrated as n-channel FETs (NFETs),
NFETs N1 and N1 and p-channel FETs (PFETs) P0 and P1. The sources
of PFETs P0 and P1 are connected to VDD and the drains of PFETs P0
and P1 to nodes A and B respectively. The sources of NFETs N0 and
N1 are connected to GND and the drains of NFETs N0 and N1 to nodes
A and B respectively. The gates of PFET P0 and NFET N0 are
connected to node B and the gates of PFET P1 and NFET N1 are
connected to node A. The drain of NFET T0 is connected to node A,
the source of NFET T0 is connected to a bitline true (BT) line and
the gate of NFET T0 is connected to a wordline WL. PFET P0 and NFET
N0 form a first inverter and PFET P1 and NFET N1 form a second
inverter. PFETS P0 and P1 are pull-up devices and NFETs N0 and N1
are pull-down devices in that they pull-up nodes A and B to VDD or
pull-down nodes A and be to GND. The first and second inverters are
cross-coupled. The drain of NFET T1 is connected to node B, the
source of NFET T1 is connected to a bitline complement (BC) line
and the gate of NFET T1 is connected to wordline WL. Alternatively,
pass gate FETs T0 and T1 may be PFETs. The connection between FET
T0 and node A and FET T1 and node B is made by first recessed
straps according to embodiments of the present invention.
FIGS. 2 through 7 illustrate methods of fabricating a gate-to-gate
strap according to embodiments of the present invention. In FIGS.
2-7 (and FIG. 10) labels T0, N0, P0, T1, N1 and P1 mark the channel
regions of the six transistors of the SRAM cell 100 of FIG. 1.
While only three cross-sections relative to FETS T0, N0, and P0 are
illustrated in FIGS. 2-7 (and FIG. 10), similar respective
cross-sections may be drawn relative to FETs T1, N1 an P1.
FIG. 2 is a plan view and FIGS. 2A, 2B and 2C are cross-sectional
views through lines 2A-2A, 2B-2B and a portion of line 2C-2C
respectively of FIG. 2. In FIGS. 2, 2A, 2B and 2C, P-type regions
105A and 105D and N-type regions 105B and 105C are formed in a
semiconductor substrate 110 (e.g., a single crystal bulk silicon
substrate as illustrated or a single crystal silicon layer of an
silicon-on-insulator (SOI) substrate) 110. P-type regions 105A and
105D and N-type regions 105B and 105C are respectively P-type and
N-type doped regions of substrate 110. Trench isolation 115
surrounds the P-type regions 105A and 105D and N-type regions 105B
and 105C and a gate dielectric layer 120 is formed on P-type
regions 105A and 105D and N-type regions 105B and 105C trench
isolation 115. In one example, trench isolation 115 comprises
silicon dioxide (SiO.sub.2). In one example, gate dielectric layer
120 comprises SiO.sub.2, silicon nitride (Si.sub.3N.sub.4) or
combinations of layers thereof. In one example gate dielectric
layer 120 is a high-K (dielectric constant) material, examples of
which include but are not limited to metal oxides such as
Ta.sub.2O.sub.5, BaTiO.sub.3, HfO.sub.2, ZrO.sub.2,
Al.sub.2O.sub.3, or metal silicates such as HfSi.sub.xO.sub.y or
HfSi.sub.xO.sub.yN.sub.z or combinations of layers thereof. A
high-K dielectric material has a relative permittivity above about
10. In one example, gate dielectric layer 120 is about 0.5 nm to
about 20 nm thick.
FIG. 3 is a plan view and FIGS. 3A, 3B and 3C are cross-sectional
views through lines 3A-3A, 3B-3B and a portion of line 3C-3C
respectively of FIG. 3. In FIGS. 3, 3A, 3B and 3C, trenches 121,
122, 123 and 124 are formed in trench isolation using a
photolithographic process as defined supra. As illustrated in FIGS.
3, 3A, 3B and 3C, a reactive ion etch (RIE) has removed regions of
gate dielectric layer 120 and etched trenches 121, 122, 123 and 124
into trench isolation 115. In one example, trenches 121, 122, 123
and 124 are etched using a RIE etch selective to substrate 110
(e.g., silicon) over trench isolation 115 (e.g., silicon oxide).
Trenches 121, 122, 123 and 124 do not extend all the way through
trench isolation 115.
FIG. 4 is a plan view and FIGS. 4A, 4B and 4C are cross-sectional
views through lines 4A-4A, 4B-4B and a portion of line 4C-4C
respectively of FIG. 4. In FIGS. 4, 4A, 4B and 4C, gate electrodes
125A, 125B, 125C and 125D have been formed using a
photolithographic process to define the horizontal (parallel to the
top surface of substrate 110) extents of the gate electrodes 125A,
125B, 125C and 125D, followed by an etch (e.g., using an RIE
process) to form gate electrodes 125A, 125B and 125C and 125D and
straps 130A, 130B, 130C and 130D. Strap 130C is a buried portion of
gate electrode 125C formed in trench 122 (see FIGS. 3 and 3C).
Strap 130B is a buried portion of gate electrode 125B formed in a
corresponding trench abutting N-type region 105C. Strap 130A is
formed entirely within trench 121 (see FIGS. 3, 3A and 3B). Note
the RIE process used to etch gate electrodes 125A, 125B, 125C and
125D have recessed strap 130A below the top surface 132 of trench
isolation 115 and etched notches 133 and 134 into P-type region
105A and N-type region 105B respectively (e.g., when substrate 110
is silicon and the gate electrodes are polysilicon). Strap 130D is
similar to strap 130A.
Straps 130A and 130D were defined by the photomask used to etch
trenches 121, 122, 123 and 124 (see FIGS. 2, 2A, 2B and 2C). Straps
130A and 130B are not defined by the photomask used to define gate
electrodes 125A, 125B, 125C and 125D. Straps 130A and 130B are
formed from the gate electrode layer that was not protected by the
photoresist during the gate electrode RIE process and are a
residual layer of that gate electrode layer that was not removed
from trenches 121 and 123 (see FIGS. 3, 3A and 3B) during the RIE
process. The gate electrode RIE stopped on gate dielectric layer
120.
The major axis A1 of gate electrode 125A, the major axis A2 of gate
electrode 125B, the major axis A3 of gate electrode 125C, and the
major axis A4 of gate electrode 125D are all aligned in the same
direction (i.e., are mutually parallel).
While the illustrated embodiment shows both straps 130A and 130D
and straps 130C and 130D, alternative embodiments include forming
straps 130A and 130D but not 130B and 130C and forming straps 130B
and 130C but not straps 130A and 130D.
FIG. 5 is a plan view and FIGS. 5A, 5B and 5C are cross-sectional
views through lines 5A-5A, 5B-5B and a portion of line 5C-5C
respectively of FIG. 5. In FIGS. 5, 5A, 5B and 5C, dielectric
sidewall spacers 135A are formed on the sidewalls of gate
electrodes 125A, 125B, 125C and 125D. Sidewall spacers 135B are
also formed on exposed sidewalls of P-type region 105A (and 105D)
and N-type region 105D (and 105C) the sidewalls of trench 140.
Sidewall spacers 135C may also be formed on internal sidewalls of
gate electrode 125C (and 125B) over strap 130C (and 130B).
Formation or non-formation of sidewall spacers 135C depends upon
the exact geometry and dimensions of the actual structure. In one
example, sidewall spacers 135A, 135B and 135C comprise
Si.sub.3N.sub.4. Sidewall spacers 135A, 135B and 135C may be formed
simultaneously by a blanket deposition of a conformal dielectric
layer (e.g. Si.sub.3N.sub.4) followed by an RIE to remove the
dielectric material from horizontal surfaces (surfaces parallel to
the top surface of substrate 110).
Prior to sidewall spacer formation, optional source/drain (S/D)
extensions may be formed by ion implantation as illustrated in
FIGS. 8A and 8B and described infra. After sidewall spacer
formation, S/Ds may be formed by ion implantation as illustrated in
FIGS. 9A and 9B and described infra. In FIGS. 5, 5A, 5B and 5C, the
label N+ indicates the S/D of an NFET and the label P+ indicates
the S/D of a PFET. S/D extensions are not illustrated in FIGS. 5,
5A, 5B and 5C.
FIG. 6 is a plan view and FIGS. 6A, 6B and 6C are cross-sectional
views through lines 6A-6A, 6B-6B and a portion of line 6C-6C
respectively of FIG. 6. In FIGS. 6, 6A, 6B and 6C, sidewall spacers
135B and 135C (see FIGS. 5, 5A, 5B and 5C) are removed using a
photolithographic/etch process. Sidewall spacers 135A are not
removed. For an alternative where sidewall spacers 135B and 135C
are not removed, see FIGS. 10, 10A, 10B and 10C. Also any exposed
gate dielectric 120 not protected by sidewall spacers 135A or gate
electrodes 125A, 125B, 125C and 125D is removed and optional metal
silicide layers 140 formed on exposed surfaces S/Ds formed in
P-type regions 105A and 105D, N-type regions 105B and 105C and
straps 130A and 130D. Metal silicide layers 140 may be formed by
blanket depositing a thin metal layer, followed by high temperature
heating in an inert or reducing atmosphere at a temperature that
will cause the metal to react with silicon, and followed by an etch
to remove un-reacted metal.
FIG. 7 is a plan view and FIGS. 7A, 7B and 7C are cross-sectional
views through lines 7A-7A, 7B-7B and a portion of line 7C-7C
respectively of FIG. 7. In FIGS. 7, 7A, 7B and 7C, electrically
conductive contacts 145A, 145B, 145C, 145D, 145E and 145F are
formed in a dielectric layer 150 that is formed on exposed surfaces
of trench isolation 115, sidewall spacers 135A and metal silicide
layer 140. Contact 145A is typical of contacts 145A, 145B, 145C,
145D, 145E and 145F. In FIG. 7D, contact 145A extends from the top
surface of dielectric layer 150 to a top surface of metal silicide
layer 140. The top surface of contact 145A is coplanar with the top
surface of dielectric layer 150. Contact 145A is shared with an
adjacent SRAM cell not illustrated in FIG. 7, but a portion of
which is shown in FIG. 7D, so contact 145 also contacts a S/D 155
of an FET T0 of the adjacent SRAM cell. In one example, contacts
145A, 145B, 145C, 145D, 145E and 145F comprise tungsten. In one
example, dielectric layer 150 comprises SiO.sub.2.
Comparing FIG. 7 to FIG. 1, contact 145A connects to the bitline
true (BT), contact 145F connects to the bitline complement (BC),
contacts 145C and 145D connect to GND and contacts 145B and 145E
connect to VDD. Transistors T0 and N0 share a common S/D and FETS
N1 and T1 share a common S/D. Storage node A comprises the common
S/D of FETS T0 and N0 which are connected to a S/D of FET P0 by
strap 130A. Storage node A is connected to the gates of FETs P1 and
N1 by strap 130C and gate electrode 130D. Storage node B comprises
the common S/D of FETS T1 and N1 which are connected to a S/D of
FET P1 by strap 130D. Storage node B is connected to the gates of
FETs P0 and N0 by strap 130B and gate electrode 125C. Thus nodes A
and B do not include any connection made at the contact level.
FIGS. 8 and 9 illustrate detailed steps in the formation of NFETs
and PFETs of SRAM cells according to embodiments of the present
invention. In FIG. 8A, prior to sidewall spacer formation, an
angled extension ion implantation of species X1 (an N dopant) for
NFET N0 where P-type region 105A is not protected by gate
electrodes 125B to form S/D extension regions 160. In FIG. 8B,
prior to sidewall spacer formation, an angled extension ion
implantation of species X2 (a P dopant) for PFET P0 where N-type
region 105B is not protected by gate electrodes 125B to form S/D
extension regions 165. In FIG. 9A, after sidewall spacer formation,
a S/Dion implantation of species X3 (an N dopant) for NFET N0 where
P-type region 105A is not protected by gate electrodes 125B and
spacers 135A to form S/D regions 170. In FIG. 9B, after sidewall
spacer formation, a S/Dion implantation of species X4 (a P dopant)
for PFET P0 where N-type region 105B is not protected by gate
electrodes 125B and spacers 135A to form S/D regions 175.
FIG. 10 illustrates an alternative strapping technique according to
embodiments of the present invention. FIG. 10 is a plan view and
FIGS. 10A, 10B and 10C are cross-sectional views through lines
10A-10A, 10B-10B and a portion of line 10C-10C respectively of FIG.
10. FIGS. 10, 10A, 10B and 120C are similar to respective FIGS. 6,
6a, 6B and 6C with the exception that metal silicide layer 140 is
not formed on regions of P-type region 105A and N-type region 105B
that are protected by sidewall spacers 135A or 135B.
FIG. 11 illustrates a completed SRAM cell according to embodiments
of the present invention after the implantations of species X1, X2,
X3 and X4 and silicide formation described supra. FIG. 11 is
similar to FIG. 7 except the source/drains rather than the silicide
regions 140 (see FIG. 7) are illustrated. In FIG. 11, A SRAM cell
100A includes a first pass gate FET T0 and a first pull-down FET N0
sharing a first common S/D 200, a first pull-up FET P0 having a
first S/D 205 and a second S/D 210, a second pass gate FET T1 and a
second pull-down FET N1 sharing a second common S/D 215, a second
pull-up FET P1 having a first S/D 220 and second S/D 225, first
gate electrode 125B is common to first pull-down FET N0 and first
pull-up FET P0 and in physical and electrical contact with first
S/D 220 of said second pull-up FET P1, second gate electrode 125A
of first pass gate FET T0, third gate electrode 125C common to
second pull-down FET N1 and second pull-up FET P1 and in physical
and electrical contact with first S/D 205 of first pull-up FET P0,
fourth gate electrode 125D of said second pass gate FET T1, a
second S/D 230 of first pass gate FET T0, a second S/D 235 of first
pull-down FET N0, a second S/D 240 of second pass gate T1, and a
second S/D 245 of second pull-down FET N1. Strap 130A is partially
formed in third trench 121, strap 130B is partially formed in
fourth trench 124, strap 130C is partially formed in first trench
122, and strap 130D is partially formed in second trench 123.
Thus the embodiments of the present invention provide SRAM cells
having recessed storage node straps and method of fabricating SRAM
cells having recessed storage node straps that are formed from gate
electrode material (not metal contact or metal wire material) and
defined during the gate electrode fabrication steps.
The description of the embodiments of the present invention is
given above for the understanding of the present invention. It will
be understood that the invention is not limited to the particular
embodiments described herein, but is capable of various
modifications, rearrangements and substitutions as will now become
apparent to those skilled in the art without departing from the
scope of the invention. Therefore, it is intended that the
following claims cover all such modifications and changes as fall
within the true spirit and scope of the invention.
* * * * *