U.S. patent number 7,359,204 [Application Number 11/355,092] was granted by the patent office on 2008-04-15 for multiple cover memory card.
This patent grant is currently assigned to Amkor Technology, Inc.. Invention is credited to Jong Woon Choi, Sang Jae Jang, Jae Dong Kim, Chang Deok Lee, Choon Heung Lee, Chul Woo Park.
United States Patent |
7,359,204 |
Jang , et al. |
April 15, 2008 |
Multiple cover memory card
Abstract
A memory card including a module comprising at least a printed
circuit board having an electronic circuit device mounted thereto
and at least one I/O pad and at least one test pad disposed
thereon. The module is inserted into a complementary cavity formed
within a case of the memory card, such case generally defining the
outer appearance of the memory card. The module is secured within
the cavity of the case through the use of an adhesive. In each
embodiment of the present invention, first and second covers are
movably attached to a case for selectively covering or exposing the
I/O pads and the test features/pads of the module of the memory
card.
Inventors: |
Jang; Sang Jae (Gwangjin-gu,
KR), Park; Chul Woo (Gangdong-gu, KR),
Choi; Jong Woon (Nowon-gu, KR), Kim; Jae Dong
(Gwangjin-gu, KR), Lee; Choon Heung (Gwangju,
KR), Lee; Chang Deok (Uijeongbu, KR) |
Assignee: |
Amkor Technology, Inc.
(Chandler, AZ)
|
Family
ID: |
39281626 |
Appl.
No.: |
11/355,092 |
Filed: |
February 15, 2006 |
Current U.S.
Class: |
361/715; 235/492;
361/600; 361/679.01; 361/740; 361/751; 365/63 |
Current CPC
Class: |
G06K
19/07 (20130101); G06K 19/07732 (20130101); H05K
5/0256 (20130101) |
Current International
Class: |
H05K
7/20 (20060101) |
Field of
Search: |
;361/600,679,760,772,683-685,715,728,730,736,737,740-748,751-753,785,787,791,800
;365/63 ;235/492 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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3112688 |
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May 1991 |
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JP |
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7017175 |
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Jan 1995 |
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JP |
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8190615 |
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Jul 1996 |
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JP |
|
10334205 |
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Dec 1998 |
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JP |
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199410938 |
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May 1994 |
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KR |
|
199552621 |
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Dec 1995 |
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KR |
|
Primary Examiner: Dinh; Tuan T.
Assistant Examiner: Chen; Xiaoliang
Attorney, Agent or Firm: Stetina Brunda Garred &
Brucker
Claims
What is claimed is:
1. A memory card comprising: a circuit board having at least one
I/O pad and at least one test pad formed thereon; at least one
electronic circuit device mounted to the circuit board and
electrically connected to the I/O pad and the test pad; a body
covering the electronic circuit device and a portion of the circuit
board such that the I/O pad is uncovered by the body, the
electronic circuit device, the circuit board and the body
collectively defining a module of the memory card; a case defining
a bottom surface and a cavity which is disposed in the bottom
surface, the cavity being sized and configured to accommodate the
module which is inserted into the cavity such that the I/O pad is
uncovered by the case; a first cover moveably attached to the case
so as to overlap a portion of the bottom surface thereof, the first
cover being slidably moveable along the bottom surface between a
closed position whereat the I/O pad is covered by the first cover
and an open position whereat the I/O pad is exposed; and a second
cover moveably attached to the case so as to overlap a portion of
the bottom surface thereof, the second cover being slidably
moveable along the bottom surface between a closed position whereat
the test pad is covered by the second cover and an open position
whereat the test pad is exposed.
2. The memory card of claim 1 wherein the electronic circuit device
comprises at least one semiconductor die.
3. The memory card of claim 1 wherein: the module includes a
plurality of I/O pads; and a guide block is disposed on the bottom
surface of the case and includes portions which extend between
respective adjacent pairs of the I/O pads and partially define a
plurality of slots, the I/O pads being located in respective ones
of the slots.
4. The memory card of claim 3 wherein the first cover defines a
plurality of couplers which are advanceable into respective ones of
the slots in a nesting fashion when the first cover is moved to the
closed position, the couplers each being sized and configured to
cover a respective one of the I/O pads when the first cover is in
the closed position.
5. The memory card of claim 1 wherein the module is secured to the
case by an adhesive layer interposed therebetween.
6. The memory card of claim 1 wherein: the case includes a spaced,
generally parallel pair of elongate retainers; and the first and
second covers each define a spaced generally parallel pair of
elongate slide grooves which are sized and configured to receive
respective ones of the retainers; the receipt of the retainers into
respective ones of the slide grooves of each of the first and
second covers effectuating the slidable attachment of the first and
second covers to the case.
7. The memory card of claim 6 wherein: the case includes an opposed
pair of longitudinal sides; and the retainers are formed to extend
along respective ones of the longitudinal sides.
8. The memory card of claim 1 wherein: the case includes a spaced,
generally parallel pair of elongate retaining grooves; and the
first and second covers each define a spaced generally parallel
pair of elongate protrusions which are sized and configured to be
insertable into respective ones of the retaining grooves; the
receipt of the protrusions of each of the first and second covers
into respective ones of the retaining grooves effectuating the
slidable attachment of the first and second covers to the case.
9. The memory card of claim 8 wherein: the retaining grooves are
formed in the bottom surface.
10. The memory card of claim 1 wherein: the case includes a rear
side; and an anti-protrusion portion is disposed on a portion of
the bottom surface of the case, the anti-protrusion portion being
sized and configured to prevent any portion of the second cover
from protruding beyond the rear side of the case when the second
cover is moved to the open position.
11. The memory card of claim 1 wherein first and second modules are
advanced into respective ones of first and second cavities disposed
in the bottom surface of the case, the first module including at
least one I/O pad and at least one test pad, with the second module
including at least one test pad.
12. A memory card comprising: a circuit board having at a plurality
of I/O pads and at least one test pad formed thereon; at least one
electronic circuit device mounted to the circuit board and
electrically connected to the I/O pads and to the test pad, a body
covering the electronic circuit device and a portion of the circuit
board such that the I/O pads and the test pad are each uncovered by
the body, the electronic circuit device, the circuit board and the
body collectively defining a module of the memory card; a case
defining a cavity which is sized and configured to accommodate the
module which is inserted into the cavity such that the I/O pads and
the test pad are each uncovered by the case; a first cover moveably
attached to the case so as to be slidably moveable along a first
axis between a closed position whereat the I/O pads are each
covered by the first cover and an open position whereat the I/O
pads are each exposed; and a second cover moveably attached to the
case so as to be slidably moveable along the first axis between a
closed position whereat the test pad is covered by the second cover
and an open position whereat the test pad is exposed.
13. The memory card of claim 12 wherein a guide block is disposed
on the case and includes portions which extend between respective
adjacent pairs of the I/O pads and partially define a plurality of
slots, the I/O pads being located in respective ones of the
slots.
14. The memory card of claim 13 wherein the first cover defines a
plurality of couplers which are advanceable into respective ones of
the slots in a nesting fashion when the first cover is moved to the
closed position, the couplers each being sized and configured to
cover a respective one of the I/O pads when the first cover is in
the closed position.
15. The memory card of claim 12 wherein: the case includes a
spaced, generally parallel pair of elongate retainers; and the
first and second covers each define a spaced generally parallel
pair of elongate slide grooves which are sized and configured to
receive respective ones of the retainers; the receipt of the
retainers into respective ones of the slide grooves of each of the
first and second covers effectuating the slidable attachment of the
first and second covers to the case.
16. The memory card of claim 12 wherein: the case includes a
spaced, generally parallel pair of elongate retaining grooves; and
the first and second covers each define a spaced generally parallel
pair of elongate protrusions which are sized and configured to be
insertable into respective ones of the retaining grooves; the
receipt of the protrusions of each of the first and second covers
into respective ones of the retaining grooves effectuating the
slidable attachment of the first and second covers to the case.
17. In a memory card having a case and module which is inserted
into and secured within the case, the module including at least one
I/O pad and at least one test pad which are not covered by the
case, the improvement comprising: a first cover moveably attached
to the case so as to be slidably moveable along a first axis
between a closed position whereat the I/O pad is covered by the
first cover and an open position whereat the I/O pad is exposed;
and a second cover moveably attached to the case so as to be
slidably moveable along the first axis between a closed position
whereat the test pad is covered by the second cover and an open
position whereat the test pad is exposed.
18. The memory card of claim 17 wherein: the case includes a
spaced, generally parallel pair of elongate retainers; and the
first and second covers each define a spaced generally parallel
pair of elongate slide grooves which are sized and configured to
receive respective ones of the retainers; the receipt of the
retainers into respective ones of the slide grooves of each of the
first and second covers effectuating the slidable attachment of the
first and second covers to the case.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
Not Applicable
STATEMENT RE: FEDERALLY SPONSORED RESEARCH/DEVELOPMENT
Not Applicable
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to memory cards, and more
particularly to a memory card (e.g., a multi-media card or secure
digital card) comprising a semiconductor device module which is
configured to be interfaced to an external case having first and
second covers movably attached thereto for selectively exposing the
I/O pads or contacts and the test features/pads of the module.
2. Description of the Related Art
As is well known in the electronics industry, memory cards are
being used in increasing numbers to provide memory storage and
other electronic functions for devices such as digital cameras, MP3
players, cellular phones, and personal digital assistants. In this
regard, memory cards are provided in various formats, including
multi-media cards and secure digital cards.
Many memory cards include a module which itself comprises a printed
circuit board (PCB) having a conductive wiring pattern disposed
thereon. Attached to one side or surface of the PCB and
electrically connected to the conductive pattern thereof is a
plurality of electronic circuit devices, such as semiconductor
packages, semiconductor dies, and/or passive elements. These
electronic circuit devices and a portion of the PCB are often
covered or encapsulated by an encapsulant material. The PCB also
includes a plurality of input/output (I/O) pads disposed on the
side or surface thereof opposite that having the electronic circuit
devices thereon. These I/O pads are not covered by the encapsulant
material, and thus are exposed in the completed module which
comprises the PCB, the electronic circuit devices and the
encapsulant material. Attached to the module is a skin or case of
the memory card, such case generally defining the outer appearance
of the memory card. The module is coupled to the case such that the
I/O pads disposed on the PCB are not covered by the case, and thus
remain exposed in the fully assembled memory card. These I/O pads
of the memory card provide an external interface for an insertion
point or socket. The completed memory card has a generally
rectangular configuration, with most memory cards including a
chamfer formed at one edge thereof which is adjacent to the I/O
pads.
As indicated above, the I/O pads of the memory card are exposed to
allow for the transmission and receipt of signals between the
memory card and an external device. Because they are exposed, the
I/O pads are susceptible to short-circuiting as a result of coming
into contact with conductive substances, such short circuiting
carrying the risk of varying or deleting the data stored within the
memory card. In order to avoid such risk, some currently known
memory cards include a separate lower case on which a guide block
is formed. However, even in those memory cards including a guide
block, there is still a possibility that a short circuit may occur
among the plurality of I/O pads. For example, a memory card having
a guide block is still susceptible to a short circuit occurring as
a result of conductive substances or structures which are not of a
fixed shape (e.g., are flexible) coming into contact with the I/O
pads. As previously explained, such a short circuit may alter or
delete data within the onboard electronic circuit devices of the
memory card.
Further, after assembly, memory cards as currently known in the art
are tested to confirm whether or not the circuit is open. The I/O
pads are commonly used for performing the test. However, completing
this testing using the I/O pads usually takes a long time,
particularly when the number of I/O pads is small. This is because
a limited number of I/O pads must be used to test the entire memory
card. As a result, some currently known memory cards also include a
number of test pads or features that are separately formed on the
memory card module and initially exposed in the memory card. These
test pads/features are adapted to be used during the testing
process to shorten test time. However, these test pads/features, if
included in the memory card, provide the same shorting risk as do
the I/O pads, and therefore must typically be covered with a layer
of tape after the completion of the test. The present invention
provides a memory card which is uniquely configured to include
first and second covers movably attached to a case thereof for
selectively covering or exposing the I/O pads and the test
features/pads of the module of the memory card.
BRIEF SUMMARY OF THE INVENTION
In accordance with the present invention, there is provided
multiple embodiments of a memory card, each embodiment including a
module comprising at least a printed circuit board having an
electronic circuit device mounted thereto and at least one I/O pad
and at least one test pad disposed thereon. The module is inserted
into a complementary cavity formed within a case of the memory
card, such case generally defining the outer appearance of the
memory card. The module is secured within the cavity of the case
through the use of an adhesive. In each embodiment of the present
invention, first and second covers are movably attached to a case
for selectively covering or exposing the I/O pads and the test
features/pads of the module of the memory card.
The present invention will be more apparent from the following
detailed description taken in conjunction with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1A is a top perspective view of a memory card constructed in
accordance with a first embodiment of the present invention;
FIG. 1B is a bottom perspective view of the memory card shown in
FIG. 1A, further illustrating the first and second covers of the
memory card in a closed position;
FIG. 1C is a cross-sectional view taken along line A-A of FIG.
1A;
FIG. 1D is a front elevational view of the memory card shown in
FIG. 1B;
FIG. 1E is a bottom perspective view of the memory card of the
first embodiment similar to that shown in FIG. 1B, but further
illustrating the first and second covers of the memory card in an
open position;
FIG. 1F is a cross-sectional view of the memory card of the first
embodiment similar to that shown in FIG. 1C, but further
illustrating the memory card as cooperatively engaged to a test
socket;
FIG. 2A is a bottom perspective view of a memory card constructed
in accordance with a second embodiment of the present invention,
further illustrating the first and second covers of the memory card
in a closed position;
FIG. 2B is a cross-sectional view taken along line B-B of FIG.
2A;
FIG. 3A is a bottom perspective view of a memory card constructed
in accordance with a third embodiment of the present invention,
further illustrating the first and second covers of the memory card
in a closed position;
FIG. 3B is a bottom perspective view of the memory card of the
third embodiment similar to that shown in FIG. 3A, but further
illustrating the first and second covers of the memory card in an
open position;
FIG. 4 is a bottom perspective view of a memory card constructed in
accordance with a fourth embodiment of the present invention,
further illustrating the first and second covers of the memory card
in a closed position;
FIG. 5A is a cross-sectional view of a memory card constructed in
accordance with a fifth embodiment of the present invention,
further illustrating the first and second covers of the memory card
in a closed position;
FIG. 5B is a cross-sectional view of the memory card of the fifth
embodiment similar to that shown in FIG. 5A, but further
illustrating the first and second covers of the memory card in an
open position;
FIG. 6 is a cross-sectional view of a memory card constructed in
accordance with a sixth embodiment of the present invention,
further illustrating the first and second covers of the memory card
in a closed position;
FIG. 7A is a bottom perspective view of a memory card constructed
in accordance with a seventh embodiment of the present invention,
further illustrating one of the first and second covers of the
memory card in an open position and one of the first and second
covers of the memory card in a closed position; and
FIG. 7B is a cross-sectional view of the memory card of the seventh
embodiment shown in FIG. 7A, but further illustrating the memory
card as cooperatively engaged to an external electronic device.
Common reference numerals are used throughout the drawings and the
detailed description to indicate the same elements.
DETAILED DESCRIPTION OF THE INVENTION
Referring now to the drawings wherein the showings are for purposes
of illustrating preferred embodiments of the present invention
only, and not for purposes of limiting the same, FIGS. 1A-1F depict
a memory card 100 constructed in accordance with a first embodiment
of the present invention. The memory card 100, as well as the
memory cards of other embodiments of the present invention which
will be described in more detail below, may be a multi-media card
(MMC), a reduced size multi-media card (RSMMC), or a secure digital
(SD) card. Additionally, the memory card 100 and those memory cards
of the other embodiments described below may each be an SMT type
memory card or a COB type memory card.
The memory card 100 includes a module 110 which comprises a circuit
board 120. The circuit board 120 itself includes an insulative
layer 123 defining a generally planar lower surface 121 and an
opposed, generally planar upper surface 122. Formed on the lower
surface 121 of the insulative layer 123 in close proximity to one
of the peripheral edge segments thereof is a plurality of
input/output (I/O) pads 124. The insulative layer 123 has a
generally quadrangular (e.g., rectangular) configuration defining
opposed pairs of longitudinally and laterally extending sides, with
the I/O pads 124 extending along and in close proximity to a common
one of the laterally extending sides of the insulative layer 123.
The laterally extending side of the insulative layer 123 disposed
closest to the I/O pads 124 will hereinafter be referred to as the
front side, with the opposite laterally extending side of the
insulative layer 123 being referred to as the back side. Formed on
the upper surface 122 of the insulative layer 123 is a conductive
pattern which is placed into electrical communication with the I/O
pads 124 on the lower surface 121 through a conductive medium
formed through and/or upon the insulative layer 123. Such
conductive medium may include conductive vias which extend through
the insulative layer 123, conductive traces which extend along the
upper and lower surfaces 122, 121 of the insulative layer 123, or
combinations thereof. The circuit board 120 can be a hardened
printed circuit board, a flexible printed circuit board, or any
equivalent thereto, the present invention not being restricted to
any particular type of circuit board 120.
Mounted to the upper surface 122 of the insulative layer 123 of the
circuit board 120 is an electronic circuit device 130. The mounting
of the electronic circuit device 130 to the circuit board 120 is
preferably facilitated by a layer 139 of a suitable adhesive. As
best seen in FIG. 1C, the electronic circuit device 130 comprises a
pair of semiconductor dies which are each electrically connected to
the conductive pattern formed on the upper surface 122 through the
use of conductive wires 135. A flip chip interconnection may also
be employed to facilitate the electrical connection of the
electronic circuit device 130 to the conductive pattern of the
circuit board 120. As will be recognized, the conductive pattern
and/or conductive medium of the circuit board 120 may be used to
facilitate the placement of the electronic circuit device 130 into
electrical communication with the I/O pads 124 in any desired
pattern or arrangement. Those of ordinary skill in the art will
recognize that rather than comprising only the semiconductor dies,
the electronic circuit device 130 may comprise a semiconductor die
or a semiconductor package alone or in combination with various
passive devices (e.g., a resistor and/or a condenser). Further, it
is contemplated that one or more components of the electronic
circuit device 130 can be vertically stacked. In this regard, the
type, number and arrangement of the components included in the
electronic circuit device 130 may be selectively varied depending
on the desired application for the memory card 100. All that is
necessary is that the circuit board 120 be configured to facilitate
the electrical communication between any such component(s) and the
I/O pads 124 in a prescribed manner. Along these lines, the number
of I/O pads 124 included in the circuit board 120 is also variable,
in that the number of such I/O pads 124 may be varied according to
the particular application for the memory card 100.
In addition to the I/O pads 124, formed on the lower surface 121 of
the insulative layer are a plurality of test features or pads 126.
The test pads 126 are each electrically connected to the conductive
pattern formed on the upper surface 122 of the insulative layer 123
by the conductive medium, and thus are in electrical communication
with the electronic circuit device 130 by virtue of the electrical
connection of the electronic circuit device 130 to the conductive
pattern by the conductive wires 135. Since the test pads 126 are
electrically connected to the electronic circuit device 130, they
may be used to test the memory card 100 as will be discussed in
more detail below.
In the module 110 of the memory card 100, the electronic circuit
device 130, the conductive pattern, and the conductive wires 135
are covered by a layer of encapsulant material which hardens into a
body 140 of the module 110. The body 140 may be formed from an
epoxy molding compound, a glop top, or an equivalent thereof. The
body 140 defines a generally planar lateral front side surface
which is substantially flush or continuous with the front side of
the insulative layer 123. In addition to the front side surface,
the body 140 defines a generally planar lateral rear side surface
which is substantially flush or continuous with the back side of
the insulative layer 123, and an opposed pair of generally planar
longitudinal side surfaces which are substantially flush with
respective ones of the longitudinally extending sides of the
insulative layer 123 which extend generally perpendicularly between
the front and back sides thereof. In the module 110, the height of
the body 140 (i.e., the distance separating the top surface of the
body 140 from the upper surface 122 of the insulative layer 123) is
predetermined according to the height of the electronic circuit
device 130 encapsulated by the body 140.
It is contemplated that the body 140 of the module 110 may be
formed to include a chamfer 147 formed at least one of its four
corners between the front lateral side surface and one of the
longitudinal side surfaces thereof. Along these lines, if the
chamfer 147 is included in the body 140, a corresponding chamfer
will typically be formed on the underlying insulative layer 123
that that the chamfer 147 and the chamfer of the insulative layer
extend in substantially flush relation to each other. The chamfer
147, if included, may be used as a guide when the module 110 is
inserted into a case 150 of the memory card 100, as discussed
below.
As indicated above, in addition to the module 110, the memory card
100 comprises a case 150. The case 150 has a plate-like shape of
predetermined thickness. More particularly, as seen in FIGS. 1A-1E,
the case 150 defines a generally planar bottom surface 151 and an
opposed, generally planar top surface 152. In addition, the case
150 defines a generally planar front side 153 and an opposed,
generally planar rear side 154. Extending generally perpendicularly
from the rear side 154 is an opposed pair of generally planar
longitudinal sides 155, 156 of the case 150. The case 150 is
further formed to include at least one generally planar chamfer 157
which extends angularly between the front side 153 and one of the
longitudinal sides 155, 156. Formed in the bottom surface 151 of
the case 150 is a recess or cavity 158 which is sized and
configured to accommodate the module 110 in the manner shown in
FIG. 1C. In the memory card 100, the module 110 is inserted into
and secured within the cavity 158 in a manner which will be
discussed below.
In the memory card 100, the cavity 158 is preferably oriented
within the case 150 so as to be disposed in relative close
proximity to the front side 153 thereof. As indicated above, the
shape of the cavity 158 is complimentary to that of the module 110,
the cavity 158 shown in FIG. 1C having a generally quadrangular
configuration defining four separate corners, one of which may be
chamfered to correspond to the chamfer 147 of the module 110. If a
chamfer is defined by the cavity 158, it is contemplated that such
chamfer will extend in generally parallel relation to the chamfer
157 defined by the case 150. However, those of ordinary skill in
the art will recognize that the shape of the cavity 158 is not
limited to such a four cornered configuration, with it being
contemplated that the cavity 158 may take the form of any one of
various shapes depending on the shape of the module 110. The depth
of the cavity 158 is preferably sized such that when the module 110
is fully advanced thereinto and secured therewithin, the lower
surface 121 of the insulative layer 123 of the circuit board 120
will extend in substantially flush, continuous relation to the
bottom surface 151 of the case 150, as also shown in FIG. 1C.
In the memory card 100, the module 110 is secured within the cavity
158 by a layer 160 of adhesive which is preferably applied to the
internal, innermost top wall of the cavity 158 and/or portions of
the top surface of the body 140 in a predetermined thickness. The
layer 160 may be formed using a film type adhesion tape or a liquid
adhesive. When the module 110 is advanced into the cavity 158, the
adhesive layer 160 is interposed between portions of the top
surface of the body 140 and the internal top wall of the cavity
158, thus adhering and affixing the module 110 to the case 150. As
indicated above, the depth of the cavity 158 is preferably sized
such that when the module 110 is secured therein via the layer 160,
the lower surface 121 of the insulative layer 123 of the circuit
board 120 is substantially flush or continuous with the generally
planar bottom surface 151 of the case 150.
The memory card 100 further comprises a first cover 170 which is
slideably mounted to the case 150, and is selectively moveable
between a closed position (shown in FIG. 1B) and an open position
(shown in FIG. 1E). When in its closed position, the first cover
170 is sized and configured to cover or shield the I/O pads 124 of
the module 110. The movement of the first cover 170 to its open
position facilitates the uncovering or exposure of the I/O pads
124. To facilitate the slideable attachment of the first cover 170
to the case 150, the first cover 170 is formed to define an opposed
pair of slide grooves 172 which are best shown in FIG. 1D. The
slide grooves 172 of the first cover 170 are sized and configured
to receive respective ones of an opposed pair of elongate retainers
159 which extend along respective ones of the longitudinal sides
155, 156 of the case 150. The receipt of the retainers 159 into
respective ones of the slide grooves 172 in the manner shown in
FIG. 1D allows the first cover 170 to be slideably moved along the
longitudinal sides 155, 156 of the case 150, and hence along the
longitudinal axis of the case 150 between the laterally extending
front and rear sides 153, 154 thereof. Thus, when transitioning
from its closed position to its open position, the first cover 170
moves toward the rear side 154 of the case 150. Conversely, when
transitioning from its open position to its closed position, the
first cover 170 moves toward the front side 153 of the case 150. As
is further seen in FIGS. 1B and 1E, the first cover 170 is formed
to include a chamfer which, when the first cover 170 assumes its
closed position as shown in FIG. 1B, extends along and is
substantially flush with the chamfer 157 defined by the case 150.
As indicated above, the sliding movement of the first cover 170 to
its open position as shown in FIG. 1E effectively uncovers and thus
exposes each of the I/O pads 124 of the module 110.
In addition to the first cover 170, also included in the memory
card 100 is a second cover 180. Like the first cover 170, the
second cover 180 is formed to include the slide grooves 172 which
also receive respective ones of the opposed retainers 159 defined
by the case 150 and extending along respective ones of the
longitudinal sides 155, 156 thereof. The second cover 180 has a
generally quadrangular configuration, and is selectively moveable
between a closed position (shown in FIG. 1B) and an open position
(shown in FIG. 1E). When in its closed position, the second cover
180 effectively covers or shields the test pads 126 disposed on the
lower surface 121 of the insulative layer 123 of the module 110.
Like the first cover 170, the second cover 180 is slideably
moveable along the longitudinal axis of the case 150, the sliding
movement of the second cover 180 to its open position shown in FIG.
1E effectively uncovering and exposing the test pads 126. As is
further seen in FIG. 1E, the movement of the second cover 180 to
its open position results in one of the four peripheral edge
segments defined by the second cover 180 protruding beyond the rear
side 154 of the case 150. When the second cover 180 is in its
closed position as shown in FIG. 1B, that edge segment thereof
which protrudes beyond the rear side 154 when the second cover 180
is in its open position extends along and in substantially flush
relation to the rear side 154.
As is shown in FIGS. 1A-1C, the first and second covers 170, 180
are preferably sized relative to each other such that when each is
slideably engaged to the case 150 in the above-described manner and
moved to its closed position, a gap is defined therebetween.
Advantageously, the formation of this gap allows the first cover
170 to be slideably moved from its closed position to its open
position without the necessity of having to move the second cover
180 from its closed position to its open position. Thus, when both
the first and second covers 170, 180 are oriented in their closed
positions, a portion or segment of the lower surface 121 of the
insulative layer 123 of the circuit board 120 is uncovered and thus
exposed.
The memory card 100 is typically advanced into a host socket formed
on an electronic device such as a digital camera, thus allowing the
memory card 100 to be electrically connected to such external
device for purposes of transmitting and receiving signals. Prior to
such advancement into the host socket, it is contemplated that the
first cover 170 of the memory card 100 will be slid into its open
state or position, thus exposing the I/O pads 124. The subsequent
advancement of the memory card 100 into the host socket allows the
exposed I/O pads 124 to be electrically connected to the
corresponding leads or terminals disposed inside the host socket,
thus allowing data to be stored in and retrieved from the memory
card 100. When the memory card 100 is not coupled to the host
socket of the electronic device, it is contemplated that the first
cover 170 will be slid into its closed state or position, thus
covering the I/O pads 124. As a result of the I/O pads being
covered and thus protected by the first cover 170, a short circuit
is avoided among the I/O pads 124. Prevention of any short
circuiting between the I/O pads 124 of the memory card 100 prevents
inadvertent damage or deletion of the data stored thereon. Though
not shown, it is further contemplated that the first cover 170 may
be outfitted with an elastic body such as a spring. Such elastic
body/spring would be oriented on the first cover 170 so as to be
compressed when the first cover 170 is slid from its closed
position to its open position, the first cover 170 being configured
to be automatically forced to its open position and the elastic
body/spring compressed as a result of the advancement of the memory
card 100 into the host socket. When the memory card 100 is removed
from the host socket, the biasing force exerted by the elastic
body/spring would effectively return the first cover 170 from its
open position back to its closed position effectively covering the
I/O pads 124. Thus, the optional inclusion of such elastic
body/spring on the first cover 170 automatically facilitates the
movement of the first cover 170 from its open position back to its
closed position upon the removal of the memory card 100 from within
the host socket.
Referring now to FIG. 1F, before being placed on the market, the
memory card 100 must be tested to confirm that it is functioning in
a prescribed manner. As indicated above, the test pads 126 of the
circuit board 120 are used for such testing. In order to allow for
such testing, the second cover 180 is slid into its open state or
position, thereby exposing the test pads 126. The memory card 100,
having both the first and second covers 170, 180 in the open state
or position, is inserted into a test socket 190 for purposes of
verifying its functionality. Upon the completion of the requisite
testing, the second cover 180 is slid from its open position back
to its closed state or position. The second cover 180 may be slid
back to its open position even after being placed on the market so
that if and when the memory card 100 has a problem, the test
features 126 can be exposed and used for a retest thereof. Though
not shown, it is contemplated that the second cover 180, like the
first cover 170 described above, may also be formed with some type
of elastic body/spring which is compressed when the second cover
180 is slid from its closed position to its open position, such
movement/compression occurring automatically upon the advancement
of the memory card 100 into the test socket 190. When the memory
card 100 is removed from within the test socket 190, the biasing
force exerted by the elastic body/spring effectively returns the
second cover 180 from its open position to its closed position,
thus covering the test pads 126.
Referring now to FIGS. 2A and 2B, there is shown a memory card 200
constructed in accordance with a second embodiment of the present
invention. The memory card 200 of the second embodiment bears
substantial similarity in construction to the memory card 100 of
the first embodiment, with the 200 series reference numerals in
FIGS. 2A and 2B being used to identify the same structures
identified by the corresponding 100 series reference numerals
included in FIGS. 1A-1E. In this regard, only the distinctions
between the memory cards 200, 100 will be discussed below.
In the memory card 200, the case 250 thereof is provided with an
opposed pair of elongate, generally parallel retaining grooves 257
as an alternative to the retainers 159 formed on and extending
along respective ones of the longitudinal sides 155, 156 of the
case 150 of the memory card 100. The retaining grooves 257 are
formed in the lower surface 251 of the case 250 and extend in close
proximity to respective ones of the longitudinal sides 255, 256
thereof. As is best seen in FIG. 2B, each of the grooves 257 has a
generally L-shaped configuration.
In the memory card 200, the first and second covers 270, 280 each
define a spaced, generally parallel pair of protrusions 272 which
each have a configuration complimentary to that of the retaining
grooves 257. In this regard, the receipt of the protrusions 272 of
the first and second covers 270, 280 into respective ones of the
retaining grooves 257 of the case 250 effectuates the slideable
attachment of the first and second covers 270, 280 to the case 250.
Upon such slideable engagement, the first and second covers 270,
280 are each moveable between open and closed positions relative to
the case 250 in the same manner described above in relation to the
first and second covers 170, 180 and case 150 of the memory card
100.
Referring now to FIGS. 3A and 3B, there is shown a memory card 300
constructed in accordance with a third embodiment of the present
invention. The memory card 300 of the third embodiment also bears
substantial similarity in construction to the memory card 100 of
the first embodiment, with the 300 series reference numerals in
FIGS. 3A and 3B being used to identify the same structures
identified by the corresponding 100 series reference numerals
included in FIGS. 1A-1E. In this regard, only the distinctions
between the memory cards 300, 100 will be discussed below.
In the memory card 300, the case 350 is formed to include a guide
block 355 which is adapted to avoid any short circuiting among the
I/O pads 324. As seen in FIGS. 3A and 3B, the guide block 355 is
positioned so as to extend along the front side 353 and the chamfer
357 of the case 350. Additionally, the guide block 355 is shaped so
as to include portions which extend between and thus effectively
separate adjacent pairs of the I/O pads 324 from each other. The
guide block 355 is preferably formed to have a height or thickness
generally corresponding to that of the first cover 370 slideably
mounted to the case 350.
The first cover 370 is preferably formed to define a plurality of
couplers 375 which are integrally connected to and extend from a
common side of a supporter 376. The number of couplers 375 included
on the first cover 370 corresponds to the number of I/O pads 324
included in the memory card 300. The couplers 375 are sized and
oriented so as to be slideably advanceable into respective ones of
the slots defined by the guide block 355, the I/O pads 324 being
located in respective ones of such slots. In this respect, each
coupler 375 has a shape corresponding to the slot of the guide
block 355 into which it is advanced, thus facilitating the receipt
of each coupler 375 into a corresponding slot in a nested fashion
when the first cover 370 is moved to its closed position. Thus,
when the first cover 370 is in its closed position, the couplers
375 thereof effectively cover or shield respective ones of the I/O
pads 324. The first cover 370 is shown in its closed position in
FIG. 3A, and in its open position effectively exposing the I/O pads
324 in FIG. 3B. In addition to the first cover 370, the memory card
300 also includes the second cover 380 which is also slideably
mounted to the case 350. The structures which are used to
facilitate the slideable attachment of the first and second covers
370, 380 to the case 350 in the memory card 300 are the same as
those described above in relation to the memory card 100.
Referring now to FIG. 4, there is shown a memory card 400
constructed in accordance with a fourth embodiment of the present
invention. The memory card 400 of the fourth embodiment bears
substantial similarity in construction to the memory card 300 of
the third embodiment, with the 400 series reference numerals in
FIG. 4 being used to identify the same structures identified by the
corresponding 300 series reference numerals included in FIGS. 3A
and 3B. In this regard, only the distinctions between the memory
cards 400, 300 will be discussed below.
As indicated above, the structures used to facilitate the slideable
attachment of the first and second covers 370, 380 of the memory
card 300 to the case 350 thereof are the same as those previously
described in relation to the memory card 100 shown in FIGS. 1A-1F.
Similarly, those structures of the memory card 400 which are used
to facilitate the slideable attachment of the first and second
covers 470, 480 to the body 450 thereof are the same as those
previously described in relation to the memory card 200 shown in
FIGS. 2A and 2B.
Referring now to FIGS. 5A and 5B, there is shown a memory card 500
constructed in accordance with a fifth embodiment of the present
invention. The memory card 500 of the fifth embodiment bears
similarity to the memory card 100 of the first embodiment, with the
500 series reference numerals in FIGS. 5A and 5B being used to
identify the same structures identified by the corresponding 100
series reference numerals included in FIGS. 1A-1E. In this regard,
only the distinctions between the memory cards 500, 100 will be
discussed below.
As explained above in relation to the memory card 100 and as shown
in FIG. 1E, the movement of the second cover 180 to its open
position results in one of the four peripheral edge segments
defined thereby protruding beyond the rear side 154 of the case
150. In the memory card 500, the second cover 580 thereof is
shorter or of reduced longitudinal length in comparison to the
first cover 180 of the memory card 100. In addition, the memory
card 500 includes an anti-protrusion portion 582 which has a
generally quadrangular configuration, and is disposed on a portion
of the bottom surface 551 of the case 550. More particularly, the
anti-protrusion portion 582 is located such that one side thereof
terminates at approximately the circuit board 520 of the module
510, with an opposed side extending in substantially flush relation
to the rear side 554 of the case 550. The remaining opposed sides
of the anti-protrusion portion 582 may extend to and in
substantially flush relation with respective ones of the
longitudinal sides of the case 550. It is contemplated that the
anti-protrusion portion 582 may be separately fabricated and
attached to the lower surface 551 of the case 550 in the
aforementioned orientation through the use of an adhesive, or may
alternatively be fabricated as an integral part of the case 550.
Further, the anti-protrusion portion 582 is preferably formed to
have a thickness substantially equal to that of the second cover
580, with a preferred width of the anti-protrusion portion 582
being the same as the width of the case 550, i.e., the distance
separating the longitudinal sides of the case 550 from each
other.
As a result of the shortening of the second cover 580 in the memory
card 500 and the addition of the anti-protrusion portion 582 to the
case 550, the movement of the second cover 580 to its closed
position as shown in FIG. 5A facilitates the formation of a sliding
space 584 between the second cover 580 and the anti-protrusion
portion 582. The width of the sliding space 584 is approximately
the same as the span or distance between the test pads 526. As
such, when the second cover 580 is slid away from the test pads 526
to its open position, the test pads 526 are effectively exposed,
despite the second cover 580 being stopped by the anti-protrusion
portion 582. Thus, the anti-protrusion portion 582 prevents the
second cover 580 from protruding beyond the rear side 554 of the
case 550 so that, when the memory card 500 is inserted into a host
socket, no portion thereof protrudes out of such socket.
It is contemplated that in the memory card 500 of the fifth
embodiment, the structures used to facilitate the slideable
attachment of the first and second covers 570, 580 to the case 550
may be the same as those used to facilitate the slideable
attachment of the first and second covers 170, 180 to the case 150
in the memory card 100, or alternatively those used to facilitate
the slideable attachment of the first and second covers 270, 280 to
the case 250 in the memory card 200. Further, it is contemplated
that the memory card 500 may be outfitted with a guide block such
as the guide blocks 355, 455 shown and described in relation to the
memory cards 300, 400. As will be recognized, if such guide block
is included in the memory card 500, the first cover 570 thereof
will be configured to mirror the configurations of the first covers
370, 470 of the memory cards 300, 400 described above.
Referring now to FIG. 6, there is shown a memory card constructed
in accordance with a sixth embodiment of the present invention. The
memory card 600 of the sixth embodiment bears similarity in
construction to the memory card 100 of the first embodiment, with
the 600 series reference numerals in FIG. 6 being used to identify
the same structures identified by the corresponding 100 series
reference numerals included in FIGS. 1A-1E. In this regard, the
distinctions between the memory cards 600, 100 will be discussed
below.
As explained above, the memory card 100 includes the single module
110. Such single module 110 of the memory card 100 is advanced into
and secured within the sole cavity 158 defined by the case 150
thereof. In contrast, the memory card 600 includes separate modules
610a, 610b. The module 610a includes its own corresponding
electronic circuit device 630a, with the module 610b likewise
including its own corresponding electronic circuit device 630b. The
modules 610a, 610b are advanced into and secured within respective
ones first and second cavities 658a, 658b defined by the case 650,
in the manner shown in FIG. 6. The modules 610a, 610b are secured
within respective cavities 658a, 658b by respective adhesive layers
660. In the arrangement of the memory card 600 shown in FIG. 6, the
I/O pads of the memory card 600 will be defined by the module 610a,
the test pads being defined by both modules 610a, 610b, such test
pads being exposed by the movement of the second cover 680 from its
closed position shown in FIG. 6 to its open position. As will be
recognized, the I/O pads defined by the module 610a are exposed by
the movement of the first cover 670 from its closed position shown
in FIG. 6 to its open position. Though not shown, it is also
contemplated that the modules 610a, 610b will be electrically
connected to each other in a prescribed manner. Such electrical
connection may be facilitated by the advancement of some conductive
structural element through that portion of the case 650 separating
the modules 610a, 610b from each other. As described above in
relation to the memory card 500, the slideable attachment of the
first and second cover 670, 680 to the case 650 in the memory card
600 may be implemented through the use of those structures
described above in relation to either of the memory cards 100, 200.
Similarly, the memory card 600 may be outfitted to include a guide
block such as the guide blocks 355, 455 of the memory cards 300,
400, the first cover 670 being configured to mirror those of the
first covers 370, 470 described above if any such guide block is
included in the memory card 600.
Referring now to FIGS. 7A and 7B, there is shown a memory card 700
constructed in accordance with a seventh embodiment of the present
invention. The memory card 700 of the seventh embodiment also bears
similarity in construction to the memory card 100 of the first
embodiment, with the 700 series reference numerals in FIGS. 7A and
7B being used to identify the same structures identified by the
corresponding 100 series reference numerals included in FIGS.
1A-1E. In this regard, only the distinctions between the memory
cards 700, 100 will be discussed below.
In the memory card 700, subsequent to the completion of the testing
thereof, the second cover 780 is fixed to the case 750. Such
affixation is preferably accomplished through the use of a suitable
adhesive. Thus, upon such affixation of the second cover 780 to the
case 750, only the first cover 770 of the memory card 700 is
slideably moveable between the open and closed positions. The
movement of the first cover 770 to its open position (as shown in
FIG. 7A) effectively uncovers or exposes the I/O pads 724 of the
memory card 700.
As seen in FIG. 7B, the memory card 700 is preferably configured
such that when advanced into the socket 790 of an electronic
device, the leads or terminals 792 of such device will act against
the first cover 770 in a manner effectively sliding such first
cover 770 from its closed position to its open position, thus
allowing the I/O pads 724 to electrically communicate with the
terminals 792. It is contemplated that the first cover 770 may be
outfitted with an elastic body/spring which is oriented on the
first cover 770 so as to be compressed when the first cover 770 is
slid from its closed position to its open position, such elastic
body/spring thus being compressed as a result of the advancement of
the memory card 700 into the socket 790. When the memory card 700
is removed from the socket 790, the biasing force exerted by the
elastic body/spring would effectively return the first cover 770
from its open position back to its closed position effectively
covering the I/O pads 724. The slideable attachment of the first
and second covers 770, 780 to the case 750 in the memory card 700
may be facilitated by through the use of those structures described
above in relation to either the memory cards 100, 200. Further, the
memory card 700 may be outfitted with a guide block similar to the
guide blocks 355, 455 shown and described in relation to the memory
cards 300, 400, with the first cover 770 of the memory card 700
being configured to mirror the first covers 370, 470 described
above if such guide block is included in the memory card 700.
This disclosure provides exemplary embodiments of the present
invention. The scope of the present invention is not limited by
these exemplary embodiments. Numerous variations, whether
explicitly provided for by the specification or implied by the
specification, such as variations in structure, dimension, type of
material and manufacturing process, may be implemented by one
skilled in the art in view of this disclosure.
* * * * *