Jang; Sang Jae
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jang; Sang Jae.The latest application filed is for "semiconductor devices and methods of manufacturing semiconductor devices".
- Jang; Sang Jae - Seoul KR
- Jang; Sang Jae - Gwangjin-gu KR
- Jang; Sang Jae - Kwanggin-gu KR
- Jang; Sang Jae - Kwangjin-gu KR
| Patent | Date |
|---|---|
| Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices App 20210265225 - Jang; Sang Jae ; et al. | 2021-08-26 |
| Semiconductor device Grant 7,872,341 - Jang , et al. January 18, 2 | 2011-01-18 |
| Modular memory card and method of making same Grant 7,837,120 - Jang , et al. November 23, 2 | 2010-11-23 |
| Chamfered memory card module and method of making same Grant 7,719,845 - Jang , et al. May 18, 2 | 2010-05-18 |
| Double mold memory card and its manufacturing method Grant 7,633,763 - Park , et al. December 15, 2 | 2009-12-15 |
| Memory card and its manufacturing method App 20090021921 - Jang; Sang Jae ; et al. | 2009-01-22 |
| Enhanced durability memory card Grant 7,375,975 - Jang , et al. May 20, 2 | 2008-05-20 |
| Multiple cover memory card Grant 7,359,204 - Jang , et al. April 15, 2 | 2008-04-15 |
| Chamfered Memory Card App 20070270040 - Jang; Sang Jae ; et al. | 2007-11-22 |
| Stack-type semiconductor package and manufacturing method thereof App 20070145548 - Park; Sung Su ; et al. | 2007-06-28 |
| Memory card and its manufacturing method Grant 7,220,915 - Park , et al. May 22, 2 | 2007-05-22 |
| Memory card and its manufacturing method Grant 7,201,327 - Park , et al. April 10, 2 | 2007-04-10 |
| Semiconductor package structure reducing warpage and manufacturing method thereof Grant 6,936,922 - Park , et al. August 30, 2 | 2005-08-30 |
| Thin profile semiconductor package which reduces warpage and damage during laser markings Grant 6,833,619 - Jang , et al. December 21, 2 | 2004-12-21 |
| Semiconductor package capable of die stacking Grant 6,750,545 - Lee , et al. June 15, 2 | 2004-06-15 |
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