| Patent | Date |
|---|
Semiconductor Device Using Emc Wafer Support System And Fabricating Method Thereof
App 20220181314 - Kim; Jin Young ; et al. | 2022-06-09 |
Semiconductor Device and Method of Forming Discrete Antenna Modules
App 20220148983 - Lee; HunTeak ; et al. | 2022-05-12 |
Semiconductor device using EMC wafer support system and fabricating method thereof
Grant 11,183,493 - Kim , et al. November 23, 2 | 2021-11-23 |
Wafer Level Fan Out Semiconductor Device And Manufacturing Method Thereof
App 20210217717 - Jung; Boo Yang ; et al. | 2021-07-15 |
Wafer level fan out semiconductor device and manufacturing method thereof
Grant 10,903,181 - Jung , et al. January 26, 2 | 2021-01-26 |
Semiconductor Device With Redistribution Layers Formed Utilizing Dummy Substrates
App 20200335461 - Kim; Jin Young ; et al. | 2020-10-22 |
Semiconductor device with redistribution layers formed utilizing dummy substrates
Grant 10,707,181 - Kim , et al. | 2020-07-07 |
Semiconductor Device Using Emc Wafer Support System And Fabricating Method Thereof
App 20200203331 - Kim; Jin Young ; et al. | 2020-06-25 |
Semiconductor device using EMC wafer support system and fabricating method thereof
Grant 10,388,643 - Kim , et al. A | 2019-08-20 |
Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure
Grant 10,177,117 - Bang , et al. J | 2019-01-08 |
Semiconductor package and manufacturing method thereof
Grant 10,115,705 - Kim , et al. October 30, 2 | 2018-10-30 |
Wafer Level Fan Out Semiconductor Device And Manufacturing Method Thereof
App 20170323862 - Jung; Boo Yang ; et al. | 2017-11-09 |
Semiconductor Device Using Emc Wafer Support System And Fabricating Method Thereof
App 20170271315 - Kim; Jin Young ; et al. | 2017-09-21 |
Wafer level fan out semiconductor device and manufacturing method thereof
Grant 9,748,154 - Jung , et al. August 29, 2 | 2017-08-29 |
Semiconductor device using EMC wafer support system and fabricating method thereof
Grant 9,627,368 - Kim , et al. April 18, 2 | 2017-04-18 |
Laser assisted bonding for semiconductor die interconnections
Grant 9,627,348 - Ryu , et al. April 18, 2 | 2017-04-18 |
Method For Fabricating Semiconductor Package Having A Multi-layer Molded Conductive Substrate And Structure
App 20160343688 - Bang; Won Bae ; et al. | 2016-11-24 |
Semiconductor Package and Manufacturing Method Thereof
App 20160322334 - Kim; Jin Young ; et al. | 2016-11-03 |
Semiconductor package and fabricating method thereof
Grant 9,412,729 - Chung , et al. August 9, 2 | 2016-08-09 |
Semiconductor package and manufacturing method thereof
Grant 9,406,639 - Kim , et al. August 2, 2 | 2016-08-02 |
Laser Assisted Bonding For Semiconductor Die Interconnections
App 20160049381 - Ryu; Dong Su ; et al. | 2016-02-18 |
Singulated Unit Substrate For A Semicondcutor Device
App 20150303170 - Kim; Keun Soo ; et al. | 2015-10-22 |
Semiconductor Device With Redistribution Layers Formed Utilizing Dummy Substrates
App 20150221601 - Kim; Jin Young ; et al. | 2015-08-06 |
Semiconductor Package And Fabricating Method Thereof
App 20150041975 - Chung; Ji Young ; et al. | 2015-02-12 |
Method of fabricating a semiconductor device having an interposer
Grant 8,802,494 - Lee , et al. August 12, 2 | 2014-08-12 |
Semiconductor Device Using Emc Wafer Support System And Fabricating Method Thereof
App 20140147970 - Kim; Jin Young ; et al. | 2014-05-29 |
Semiconductor Package and Manufacturing Method Thereof
App 20140042600 - Kim; Jin Young ; et al. | 2014-02-13 |
Method Of Fabricating A Semiconductor Device Having An Interposer
App 20130109135 - LEE; Choon Heung ; et al. | 2013-05-02 |
Semiconductor device having an interposer
Grant 8,183,678 - Lee , et al. May 22, 2 | 2012-05-22 |
Semiconductor Device And Fabricating Method Thereof
App 20110031598 - LEE; Choon Heung ; et al. | 2011-02-10 |
Modular memory card and method of making same
Grant 7,837,120 - Jang , et al. November 23, 2 | 2010-11-23 |
Chamfered memory card module and method of making same
Grant 7,719,845 - Jang , et al. May 18, 2 | 2010-05-18 |
Double mold memory card and its manufacturing method
Grant 7,633,763 - Park , et al. December 15, 2 | 2009-12-15 |
Memory card and its manufacturing method
App 20090021921 - Jang; Sang Jae ; et al. | 2009-01-22 |
Enhanced durability memory card
Grant 7,375,975 - Jang , et al. May 20, 2 | 2008-05-20 |
Surface acoustic wave (SAW) device package and method for packaging a SAW device
Grant 7,362,038 - Jang , et al. April 22, 2 | 2008-04-22 |
Multiple cover memory card
Grant 7,359,204 - Jang , et al. April 15, 2 | 2008-04-15 |
Chamfered Memory Card
App 20070270040 - Jang; Sang Jae ; et al. | 2007-11-22 |
Stack-type semiconductor package and manufacturing method thereof
App 20070145548 - Park; Sung Su ; et al. | 2007-06-28 |
Memory card and its manufacturing method
Grant 7,220,915 - Park , et al. May 22, 2 | 2007-05-22 |
Memory card and its manufacturing method
Grant 7,201,327 - Park , et al. April 10, 2 | 2007-04-10 |
Semiconductor package and method of manufacturing the same which reduces warpage
Grant 7,042,072 - Kim , et al. May 9, 2 | 2006-05-09 |
Semiconductor package with increased number of input and output pins
Grant 6,995,459 - Lee , et al. February 7, 2 | 2006-02-07 |
Semiconductor package including passive elements and method of manufacture
Grant 6,995,448 - Lee , et al. February 7, 2 | 2006-02-07 |
Stacking structure for semiconductor chips and a semiconductor package using it
Grant 6,982,485 - Lee , et al. January 3, 2 | 2006-01-03 |
Semiconductor package structure reducing warpage and manufacturing method thereof
Grant 6,936,922 - Park , et al. August 30, 2 | 2005-08-30 |
Semiconductor package exhibiting efficient lead placement
Grant 6,927,483 - Lee , et al. August 9, 2 | 2005-08-09 |
Semiconductor package with increased number of input and output pins
App 20050139969 - Lee, Choon Heung ; et al. | 2005-06-30 |
Semiconductor package including low temperature co-fired ceramic substrate
Grant 6,879,034 - Yang , et al. April 12, 2 | 2005-04-12 |
Semiconductor package with increased number of input and output pins
Grant 6,876,068 - Lee , et al. April 5, 2 | 2005-04-05 |
Leadframe including corner leads and semiconductor package using same
Grant 6,867,071 - Lee , et al. March 15, 2 | 2005-03-15 |
Surface excited device package including a substrate having a vibration-permitted cavity
App 20040164384 - Youl Min, Byoung ; et al. | 2004-08-26 |
Semiconductor package capable of die stacking
Grant 6,750,545 - Lee , et al. June 15, 2 | 2004-06-15 |
Semiconductor package including passive elements and method of manufacture
App 20020140085 - Lee, Sang Ho ; et al. | 2002-10-03 |
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