U.S. patent number 6,046,477 [Application Number 09/042,795] was granted by the patent office on 2000-04-04 for dense soi programmable logic array structure.
This patent grant is currently assigned to Micron Technology, Inc.. Invention is credited to Wendell P. Noble.
United States Patent |
6,046,477 |
Noble |
April 4, 2000 |
Dense SOI programmable logic array structure
Abstract
A semiconductor device array having silicon device islands
isolated from the substrate by an insulator. High array density is
achieved by forming source and drain interconnects in the space
between the islands. Also disclosed are processes for forming and
programming such arrays.
Inventors: |
Noble; Wendell P. (Milton,
VT) |
Assignee: |
Micron Technology, Inc. (Boise,
ID)
|
Family
ID: |
21923796 |
Appl.
No.: |
09/042,795 |
Filed: |
March 17, 1998 |
Current U.S.
Class: |
257/347; 257/353;
257/354; 257/374; 257/383; 257/499; 257/506; 257/508; 257/510;
257/520; 257/E21.668; 257/E21.703; 257/E27.107; 257/E27.112 |
Current CPC
Class: |
H01L
21/84 (20130101); H01L 27/1122 (20130101); H01L
27/11803 (20130101); H01L 27/1203 (20130101) |
Current International
Class: |
H01L
21/70 (20060101); H01L 21/8246 (20060101); H01L
27/12 (20060101); H01L 27/118 (20060101); H01L
21/84 (20060101); H01L 027/01 () |
Field of
Search: |
;257/374,353,382,383,508,510,520,524,905,298,347,349,350,351,379,354,501,506,202
;438/403,404,412,424 ;365/63,93 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Thomas; Tom
Assistant Examiner: Hu; Shouxiang
Attorney, Agent or Firm: Dickstein Shapiro Morin &
Oshinsky LLP
Claims
What is claimed as new and desired to be protected by Letters
Patent of the United States is:
1. A semiconductor device array comprising:
a substrate;
a plurality of silicon islands, wherein each silicon island is a
device;
an insulating material layer between the silicon islands and the
substrate, horizontally isolating the silicon islands;
refractory metal plugs connecting the silicon islands to the
substrate, wherein the metal plugs are located between the silicon
islands and are recessed below the top of the silicon islands;
and
polysilicon drain lines connecting the silicon islands, wherein the
polysilicon drain lines are recessed below the top of the silicon
islands.
2. The device array of claim 1, wherein the device array is a
programmable logic array.
3. The device array of claim 1, wherein the refractory metal is
tungsten.
4. A semiconductor structure, comprising:
a substrate;
an insulating layer formed on said substrate;
a plurality of silicon islands on the insulating layer which are
isolated from each other, wherein the sidewalls of the silicon
islands define parallel isolation trenches;
electrical contact plugs connecting the silicon islands to the
substrate, wherein the electrical contact plugs are made of a
refractory metal and are located in alternate parallel isolation
trenches; and
a plurality of polysilicon drain lines connecting the silicon
islands and located in alternate parallel isolation trenches other
than those in which the electrical contact plugs are located.
5. The semiconductor structure of claim 4, wherein the
semiconductor structure is a memory array.
6. The semiconductor structure of claim 4, wherein each silicon
island is a device.
7. The semiconductor structure of claim 4, wherein the refractory
metal is tungsten.
8. A semiconductor device array comprising:
a foundation;
a plurality of silicon islands laterally spaced apart from each
other on the foundation, wherein each silicon island comprises a
device;
a metal film made of a refractory metal disposed on at least part
of the foundation, wherein the metal film forms a set of
interconnects;
a thermal oxide layer between the silicon islands and the
foundation, horizontally isolating the silicon islands; and
a plurality of polysilicon lines connecting parallel rows of the
silicon islands, wherein the polysilicon lines are recessed below
the top surface of the silicon islands.
9. The device array of claim 8, wherein the foundation is a silicon
wafer.
10. The device array of claim 8, wherein the metal film comprises
tungsten.
11. A metal-oxide-semiconductor transistor comprising:
an insulating foundation;
a silicon island on said foundation;
a polysilicon gate layer formed on the top surface of the silicon
island;
a source region and a drain region in said silicon island;
a metal source interconnect that contacts the source region of the
silicon island for connection to external circuitry, wherein the
metal source interconnect is recessed below the polysilicon gate
layer;
a polysilicon drain interconnect that contacts the drain region of
the silicon island for connection to external circuitry, wherein
the polysilicon drain interconnect is recessed below the
polysilicon gate layer; and
a gate conductor line in contact with the polysilicon gate layer
for connection to external circuitry.
12. The transistor of claim 11, wherein the insulating foundation
is a silicon wafer coated with a thermal oxide layer.
13. The transistor of claim 12, wherein the silicon wafer is doped
to a first conductivity type and the source and drain regions are
doped to a second conductivity type.
14. The transistor of claim 11, wherein the metal source
interconnect is comprised of refractory metal.
15. The transistor of claim 14, wherein the refractory metal is
tungsten.
16. A semiconductor device array comprising:
a substrate;
a thermal silicon oxide insulating layer formed on said
substrate;
a plurality of silicon islands on the insulating layer spaced apart
from each other, and arranged in parallel rows, wherein each
silicon island comprises a device, and the sidewalls of the silicon
islands define parallel isolation trenches;
a polysilicon gate layer formed on the top surface of the silicon
island;
a source region and a drain region formed in said silicon island,
wherein said source region and drain region are formed from doped
material;
electrical contact plugs made of refractory metal connecting the
source regions of the silicon islands to the substrate, wherein the
electrical contact plugs are located in alternate parallel
isolation trenches;
a plurality of polysilicon drain lines connecting the drain regions
of the silicon islands and located in alternate parallel isolation
trenches other than those in which the electrical contact plugs are
located; and
a gate conductor line that contacts the polysilicon gate layer of
each silicon island for connecting the silicon islands to external
circuitry.
17. The device array of claim 16, wherein the substrate is a
silicon wafer of a first conductivity type and the source and drain
regions are doped to a second conductivity type.
18. The device array of claim 16, wherein the refractory metal is
tungsten.
Description
FIELD OF THE INVENTION
The present invention relates to an improved semiconductor
structure for high density device arrays, such as ROMs,
programmable logic arrays or memory decode arrays. In particular,
this invention relates to a Silicon-On-Insulator (SOI) array of
fully isolated device islands that can be implemented with a small
feature size, and a process for its formation.
BACKGROUND OF THE INVENTION
SOI technology provides many advantages when used in Complementary
Metal-Oxide-Semiconductor (CMOS) Integrated Circuits (ICs). One
primary advantage is a significant reduction of parasitic
capacitance between a source/drain and a substrate. Other major
advantages include elimination of latch-up, reduction of chip size
and/or increased device density, and increased circuit speed. SOI
devices also have lower power requirements and higher speeds
compared to non-SOI devices, making SOI technology popular for use
in battery-operated equipment.
The advantages of SOI structures result from the total isolation of
the device islands from the substrate. Total isolation has been
achieved using a sapphire substrate instead of a semiconductor
substrate, but the resultant product is expensive and the quality
of the crystalline silicon grown on sapphire is usually poor.
Processes to achieve device-substrate isolation using a silicon
substrate are known, but such processes may not achieve total
isolation, and may cause defects in the resultant structures.
SOI structures may be formed through a variety of processes,
including SIMOX, wafer bonding, FIPOS and etch and oxidation
processes. Separation by Implanted Oxygen (SIMOX) involves oxygen
ion implantation into a silicon substrate to form a buried oxide
insulating layer. This method is expensive and has the disadvantage
of damaging the crystalline structure of the silicon above the
insulating layer due to the passage of high energy oxygen ions.
Wafer bonding is another technique for forming an isolation layer
in a substrate. It involves the fusing together of two oxidized
silicon wafers in a high-temperature furnace. However, wafer
bonding is an undesirable technique because it increases the
substrate thickness, and has low production yields due to voids and
particles interfering with adequate bonding between the wafers.
The Full Isolation by Porous Oxidized Silicon (FIPOS) process forms
an insulating layer through the initial formation of a doped layer
in the silicon substrate, covered with a layer of undoped epitaxial
silicon. The substrate is then anodized to create a porous layer of
silicon under islands of undoped silicon in the substrate. The
FIPOS process is slow and expensive, and produces a substrate with
a tendency to warp or curl due to the thermal stresses it has
undergone.
Another known technique used to form an isolation layer is a series
of etch and oxidation steps used to create silicon islands, as
described in U.S. Pat. No. 4,604,162. Islands are formed by the
etching and subsequent partial undercutting of the islands. Silicon
filaments maintain the connection of the islands to the substrate
during the undercutting step, and the subsequent thermal oxidation
step. During thermal oxidation, which creates an isolation layer
under the islands, expansion of the oxide subjects the islands to
substantial mechanical stress and crystal damage. The silicon
filaments connecting the islands to the substrate are also under
tensile stress that creates dislocations of the islands, resulting
in high junction leakage and low carrier mobility.
In addition to the isolation of the devices from the substrate, it
is also important to isolate the devices from each other. The use
of silicon device islands with isolation trenches is known, but
such devices typically do not have a high functional density. As
the minimum feature size decreases, the number of devices in a chip
area (active device density) increases, but the area occupied by
interconnection lines on the chip surface minimizes the number of
interconnected devices in a chip area (functional density). To be
effective, a high density device array should maximize both active
device density and functional density.
There is a need for a fully isolated high density semiconductor
structure suitable for use in, e.g., ROMs, programmable logic
arrays, or memory decode arrays.
SUMMARY OF THE INVENTION
The present invention provides a fully isolated semiconductor
structure that has a high density and is suitable for use in ROMs,
programmable logic arrays, or memory decode arrays. The present
invention permits effective isolation between devices and reduces
the area occupied by interconnection lines on the device
surface.
In addition, the present invention provides a process for
fabricating an isolated structure that minimizes damage to the
structure and avoids dislocations during the isolation process.
Advantage and features of the present invention will be apparent
from the following detailed description and drawings which
illustrate preferred embodiments of the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view of a device array constructed in
accordance with a preferred embodiment of the invention;
FIG. 2 is a perspective view of the device array after the
formation of the silicon dioxide bars;
FIG. 3 is a perspective view of the device array after the
definition of the second set of trenches;
FIG. 4 is a cross-sectional view of the device array illustrating
silicon islands;
FIG. 5 is a cross-sectional view of the device array illustrating
evacuated regions after the silicon islands have been undercut;
FIG. 6 is a cross-sectional view of the device array after the
formation of the insulation layer;
FIG. 7 is a cross-sectional view of the device array illustrating
the location of the source trenches;
FIG. 8 is a cross-sectional view of the device array illustrating
the electrical contact plug; and
FIG. 9 is a cross-sectional view of the device array illustrating
the polysilicon drain lines.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
In the following detailed description, reference is made to the
accompanying drawings which form a part hereof, and in which is
shown by way of illustration specific embodiments in which the
invention may be practiced. These embodiments are described in
sufficient detail to enable those skilled in the art to practice
the invention, and it is to be understood that other embodiments
may be utilized and that structural, logical and electrical changes
may be made without departing from the spirit and scope of the
present invention.
The terms wafer or substrate used in the following description
include any semiconductor-based structure having an exposed silicon
surface in which to form the silicon-on-insulator structure of this
invention. Wafer and substrate are to be understood as including
silicon-on-sapphire (SOS) technology, doped and undoped
semiconductors, epitaxial layers of silicon supported by a base
semiconductor foundation, and other semiconductor structures.
Furthermore, when reference is made to a wafer or substrate in the
following description, previous process steps may have been
utilized to form regions/junctions in the base semiconductor
structure or foundation. The following detailed description is,
therefore, not to be taken in a limiting sense, and the scope of
the present invention is defined by the appended claims.
Referring now to the drawings, where like elements are designated
by like reference numerals, an embodiment of the device array 20 of
the present invention is shown in FIG. 1. The device array 20 is
comprised of a plurality of silicon islands 22 resting on an
insulation layer 24 of silicon dioxide on top of a silicon
substrate 26, where the silicon islands 22 are separated from each
other by isolation trenches 28. Each silicon island 22 has
dimensions of one F by one F, and each isolation trench 28 is
preferably one F wide, where F is the feature size, e.g., 0.25
.mu.m. Each silicon island 22 is a device, such as a transistor,
capacitor or other single-function component. Thus, with the
inclusion of island to island isolation, the area per programmed
device cell is 4 F.sup.2 (2 F.times.2 F).
The silicon islands 22 have doped regions diffused into their
sides, such as the source n-regions 30 and drain n-regions 32 shown
in FIG. 1. Polysilicon drain lines 34 run within the isolation
trenches 28 on the drain side of the silicon islands 22. If the
drain n-region 32 of a silicon island 22 is connected to the
polysilicon drain line 34, that silicon island is a contacted
device 36, and if it is not connected, it is a non-contacted device
38. The source n-regions 30 of the silicon islands 22 form source
contacts to the silicon substrate 26 through a contact plug 40 made
from a refractory metal and located within alternate parallel
isolation trenches 28. Gate conductor lines 42 connecting
individual silicon islands 22 are metal wires running orthogonal to
the polysilicon drain lines 34.
There are three sets of interconnects in the device array 20. The
contact plug 40 serves as a source interconnect, the polysilicon
drain line 34 serves as a drain interconnect, and the gate
conductor lines 42 serve as gate interconnects. A high density
array is achieved by locating one or more of these interconnects in
the isolation trenches 28, thereby utilizing this normally empty
space. Even though the preferred embodiment of the device array 20
places the source and drain interconnects in the isolation trenches
28, island-to-island isolation is maintained by the insulation
layer 24 and by careful design of the device array 20.
The device array 20 is manufactured through a process described as
following, and illustrated by FIGS. 2 through 9. First, a silicon
substrate 26 is selected as the base for the device array 20. The
silicon substrate 26 may be doped or undoped, but a doped wafer is
preferred. Next, a gate oxide layer 60 is grown on top of the
silicon substrate 26 by means of thermal oxidation of the silicon
substrate 26. Polysilicon is then deposited, preferably by Chemical
Vapor Deposition (CVD), on top of the gate oxide layer 60 to form a
polysilicon gate layer 62. The polysilicon gate layer 62 is
preferably about 50 to 100 nm thick.
A nitride pad 64 is then formed by depositing a layer of silicon
nitride (Si.sub.3 N.sub.4) ("nitride") by CVD or other means, on
top of the polysilicon gate layer 62. The nitride pad 64 is
preferably about 60-100 nm thick. Taken together, the gate oxide
layer 60, the polysilicon gate layer 62, and the nitride pad 64
form the device layer 66.
The next step is to define trenches in the silicon substrate 26. A
resist (not shown) and mask (not shown) are applied, and
photolithographic techniques are used to define the area to be
etched-out. A directional etching process such as Reactive Ion
Etching (RIE) is used to etch through the device layer 66 and into
the silicon substrate 26 to a depth of preferably about 600 nm to
form a first set of trenches 70. The first set of trenches 70 is
defined by laterally-isolated bars of silicon 72 in the silicon
substrate 26. After removal of the resist, the first set of
trenches 70 is filled with silicon dioxide by CVD or other suitable
process, to form silicon dioxide bars 74. The device array 20 is
then planarized by any suitable means, such as Chemical-Mechanical
Polishing (CMP), stopping on the nitride pad 64. The structure now
appears as shown in FIG. 2.
A nitride masking layer 76 is applied, preferably by CVD, to a
thickness of about 60-100 nm. Photolithography is used to define a
second set of trenches 80 orthogonal to the first set of trenches
70. The nitride masking layer 76 and the device layer 66 are etched
out by a directional etching process such as RIE to define the
sides of the second set of trenches 80. Etching is continued down
to the level of the silicon substrate 26, and then the resist is
removed. The device array 20 now appears as shown in FIG. 3.
Next, a thermal oxide layer 82 of approximately 10 nm thickness is
grown on the edges of the exposed polysilicon gate layer 62 and
directionally etched to remove thermal oxide produced on horizontal
surfaces of the silicon dioxide bars 74 while retaining the thermal
oxide layer 82 on the edges of the exposed polysilicon gate layer
62. The thermal oxide layer 82 serves to protect the polysilicon
gate layer 62 from contact with the source and drain interconnects
40, 34 during subsequent steps of the fabrication process.
The exposed silicon substrate 26 is then etched with a preferential
anisotropic etchant such as a RIE to a depth of preferably about
0.3 .mu.m+1/2 the island width, creating sidewalls 84. The depth
should be sufficient to ensure that the silicon islands 22 will not
be consumed by the thermal oxidation process in the isolation step.
Now that the silicon islands 22 have been created, the next step is
to isolate them from the silicon substrate 26. A nitride film 86
approximately 20 nm thick is formed on the sidewalls 84 by
depositing a layer of CVD nitride and directionally etching to
remove excess nitride from horizontal surfaces of the silicon
dioxide bars 74 and the nitride masking layer 76. The nitride film
86 acts as an oxidation and etch barrier during subsequent steps.
The structure is now as shown in FIG. 4.
The silicon islands 22 are then fully undercut by a timed isotropic
etching process that extends the second set of trenches 80 downward
and laterally until the silicon islands 22 are completely undercut
as shown in FIG. 5. Any suitable isotropic etchant may be used,
such as a commercial etchant sold under the name CP4 (a mixture of
approximately 1 part of 46% HF: 1 part CH.sub.3 COOH: 3 parts
HNO.sub.3). An isotropic etch is employed in this step to
compensate for the volume of oxide to be formed in the next step.
The time of the etching process is calculated to undercut the
islands completely while not excessively consuming the silicon
comprising the silicon islands 22. As is known, thermal oxidation
produces a volume of oxide approximately twice that of the silicon
consumed. Although completely undercut, the silicon islands 22 are
supported by contact (bonding) with the silicon dioxide bars 74.
Each silicon island 22 retains a quantity of silicon attached to
the bottom of the device layer 66 that forms a device base 90, and
the space between the device base 90 of each silicon island 22 and
the silicon substrate 26 defines an evacuated region 88.
The evacuated regions 88 are then filled with an insulation layer
24 by thermally oxidizing the exposed silicon substrate 26 and the
device bases 90. The insulation layer 24 horizontally isolates the
silicon islands 22 from the silicon substrate 26, as seen in FIG.
6. A suitable oxidation process can be performed in a standard
silicon processing furnace at a temperature of approximately 900 to
1100 degrees Celsius. A wet, oxidizing ambient is used in the
furnace chamber to oxidize the exposed silicon substrate 26 and the
device bases 90 in a parallel direction to the surface of the
silicon substrate 26. The oxidation time is selected to cause the
evacuated regions 88 to be filled. As the desired width of the
silicon islands 22 decreases, so does the required oxidation time.
For example, for sub-micron technology the oxidation time is
approximately 3 to 4 hours. For sub-0.25 micron technology, the
oxidation time is approximately 1 hour.
Because no silicon filaments connect the silicon islands 22 to the
silicon substrate 26 during thermal oxidation, tensile
stress-induced crystal damage is minimized and preferably
eliminated at the silicon/oxide interface. Furthermore, dislocation
of the silicon islands 22 due to tensile stress is also minimized
or eliminated because the silicon islands 22 are bonded into
position by the silicon dioxide bars 74. The second set of trenches
80 are then filled with polysilicon, preferably intrinsic
polysilicon, i.e., purified and undoped polysilicon, by CVD or
other suitable process, and subsequently the device array 20 is
planarized, preferably by CMP, to form intrinsic polysilicon blocks
100, as shown in cross section FIG. 6.
Source trenches 102 are then defined by photolithography, and
subsequent etching of the intrinsic polysilicon blocks 100, as
shown in FIG. 7. The source trenches 102 are formed by etching out
alternate trenches of the second set of trenches 80, and are
defined by sidewalls 84, as shown in FIG. 3. The source trenches
102 extend through the intrinsic polysilicon blocks 100 to expose
the insulation layer 24 and the nitride film 86. After the resist
is removed, the nitride film 86 is removed from the exposed trench
sidewalls 84, preferably by isotropic etching with a nitride
etchant such as phosphoric acid.
With reference to FIG. 8, a polysilicon liner 104 abutting the
sidewalls 84, approximately 50 nm thick, is then formed by
deposition of doped polysilicon, preferably by CVD. The nature of
the dopant in the deposited polysilicon will vary depending on the
nature of the device array 20 to be formed. For example, if the
device array 20 will be an NMOS, the polysilicon will be n-doped. A
short thermal anneal sufficient to drive dopant from the
polysilicon liner 104 into the sides of the exposed device bases 90
is then performed, forming source n-regions 30 of the silicon
islands 22.
The source trenches 102 are then cleaned out by directionally
etching to remove the polysilicon liner 104 from all horizontal
surfaces of the device array 20. A timed directional etch of the
insulation layer 24 is then performed to expose the silicon
substrate 26 at the bottom of the source trench 102. Overetch
should be minimized because this etching process can also attack
the exposed silicon dioxide bars 74 to the same depth.
A contact plug 40 is then formed between the silicon substrate 26
and the polysilicon liner 104, preferably by chemical vapor
deposition of refractory metal (not shown) to fill the source
trenches 102. A timed selective etch such as RIE is then performed
to recess the electrical contact plug 40 and to clear off any metal
which was deposited on the top of the silicon dioxide bars 74.
In addition, to prevent undesirable rectification which may result
from inadvertent formation of a Schottky diode, the contact plug 40
is preferably comprised of refractory metal. Any refractory metal
such as tungsten, titanium, tantalum or molybdenum is suitable for
forming the contact plug 40, but tungsten is preferred. A
cross-section of the device array 20 at this point in the process
is shown in FIG. 8.
The next step is to remove excess polysilicon by isotropic etching
of exposed portions of the polysilicon liners 104 so that they are
recessed below the level of the polysilicon gate layer 62. This
etch will have the side effect of partially recessing the intrinsic
polysilicon blocks 100 across the device array 20. Next, silicon
dioxide is deposited to form oxide filler 106, and subsequently
planarized. Any suitable deposition method may be used, such as
CVD, and any effective planarization method such as CMP is suitable
for use.
Drain trenches 108 are next defined by photolithography to mask the
remaining alternate trenches of the second set of trenches 80.
Directional etching is used to remove the oxide filler 106, and to
clean out the drain trench 108 to the approximate level of the
bottom of the silicon islands 22. A selective etch is then used to
remove any remaining polysilicon from the intrinsic polysilicon
blocks 100.
A resist and programming mask are then applied to define contacted
devices 36 and non-contacted devices 38. The resist (not shown)
covers the contacted devices 36 during this step. An isotropic etch
is performed to remove the nitride film 86 from the sidewalls 84 of
the non-contacted devices 38. The resist is removed, and a thermal
oxide liner 110 is formed by growing thermal oxide on the sidewall
84 portions abutting the device bases 90 of the non-contacted
devices 38. The thermal oxide liner is approximately 50 nm
thick.
Isotropic etching is then performed to remove any remaining nitride
film 86 from the sidewalls 84. Doped polysilicon (not shown) is
deposited by chemical vapor deposition, and directional etching,
such as RIE, is performed to remove polysilicon from horizontal
surfaces of the device array 20, and to recess the polysilicon to
the approximate level of the top of the polysilicon gate layer 62.
The remaining doped polysilicon forms polysilicon drain lines 34
abutting the sidewalls 84. An annealing process is then performed
to drive dopant from the polysilicon drain lines 34 into the sides
of the exposed device bases 90 of the contacted devices 36, forming
n-region drains 32. The non-contacted devices 38 are not doped in
this step because of the protective thermal oxide liner 110. The
device array at this stage is shown in FIG. 9.
The device array 20 then undergoes a finishing process. The drain
trenches 108 are filled with silicon oxide and the surface of the
device array is planarized, by CVD and CMP, respectively, or other
suitable processes. Selective etching with hot phosphoric acid or
another suitable etchant is then performed to remove the nitride
masking layer 76 and the nitride pad 64 from the top surface of the
silicon islands 22. Conventional processing methods may then be
used to form contact holes and metal wiring to connect gate lines
and to equip the device array 20 for peripheral circuits. The final
structure of the device array 20 is as shown in FIG. 1.
The process sequence described and illustrated above provides for
the formation of minimum dimension programmable devices of one
carrier type. It follows that devices of either carrier type may be
made on the same chip by substitution of the appropriately doped
materials and addition of appropriate masks. In addition, implanted
source/drain devices may be fabricated on the same chip by process
integration with common process steps.
The above description and drawings illustrate preferred embodiments
which achieve the objects, features and advantages of the present
invention. It is not intended that the present invention be limited
to the illustrated embodiments. Any modification of the present
invention which comes within the spirit and scope of the following
claims should be considered part of the present invention.
* * * * *