Device And Method For The High-frequency Etching Of A Substrate Using A Plasma Etching Installation And Device And Method For Igniting A Plasma And For Pulsing The Plasma Out Put Or Adjusting The Same Upwards

Becker , et al. April 13, 2

Patent Grant 6720273

U.S. patent number 6,720,273 [Application Number 09/763,138] was granted by the patent office on 2004-04-13 for device and method for the high-frequency etching of a substrate using a plasma etching installation and device and method for igniting a plasma and for pulsing the plasma out put or adjusting the same upwards. This patent grant is currently assigned to Robert Bosch GmbH. Invention is credited to Thomas Beck, Volker Becker, Franz Laermer, Andrea Schilp.


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