U.S. patent number 3,884,296 [Application Number 05/400,443] was granted by the patent office on 1975-05-20 for storable cryogenic heat pipe.
This patent grant is currently assigned to Hughes Aircraft Company. Invention is credited to Algerd Basiulis.
United States Patent |
3,884,296 |
Basiulis |
May 20, 1975 |
Storable cryogenic heat pipe
Abstract
A cryogenic heat pipe that may be conveniently stored at normal
room temperatures and pressures is disclosed. The cryogenic working
fluid is caused to expand into a storage reservoir under these room
conditions of temperature and pressure since all cryogenic fluids
exceed critical pressure and temperature conditions at room
temperatures. To activate the heat pipe from storage conditions,
the condenser region must be cooled down to cryogenic temperatures.
The cryogenic working fluid vapor in the system forms a condensate
in the wick and only superheated gas remains in the reservoir. In
one embodiment an adsorption reservoir is employed to reduce the
external volume of the unit from that which would be obtained using
a purely volumetric reservoir. The adiabatic region of the heat
pipe is covered with a multi-foil-vacuum, super-insulation section
to minimize ambient temperature effects when the device is
activated and operating.
Inventors: |
Basiulis; Algerd (Redondo
Beach, CA) |
Assignee: |
Hughes Aircraft Company (Culver
City, CA)
|
Family
ID: |
23583637 |
Appl.
No.: |
05/400,443 |
Filed: |
September 24, 1973 |
Current U.S.
Class: |
165/96;
165/104.26 |
Current CPC
Class: |
F28D
15/04 (20130101) |
Current International
Class: |
F28D
15/04 (20060101); F28d 015/00 () |
Field of
Search: |
;165/105,32,96
;220/15 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
joy, P. Optimum Cryogenic Heat Pipe Design Advances In Cryogenic
Engineering Series, Plenum Press, NYC, NY, 6/1970, Vol. 17, pp.
438-448, (TP480.A3)..
|
Primary Examiner: Davis, Jr.; Albert W.
Attorney, Agent or Firm: Ware; Paul H. MacAllister, Jr.; W.
H.
Claims
What is claimed is:
1. A cryogenic heat transfer device comprising:
an hermetically sealed, evacuated elongated housing;
a capillary wick longitudinally disposed within said housing;
an expansion reservoir in fluid communication with said elongated
housing;
an insulation shell, longitudinally disposed about a substantial
portion of the outer lateral surface of said elongated housing;
said reservoir is a shell-like structure enclosing said insulation
shell; and
a quantity of cryogenic working fluid disposed within said
capillary wick and said expansion reservoir.
2. A cryogenic heat transfer device in accordance with claim 1
wherein said insulation comprises an hermetically sealed evacuated
chamber containing foil wrappings.
3. A cryogenic heat transfer device comprising:
an hermetically sealed, evacuated elongated housing;
a capillary wick longitudinally disposed within said housing;
an adsorption reservoir in fluid communication with said elongated
housing;
an insulation shell, longitudinally disposed about a substantial
portion of the outer lateral surface of said elongated housing;
and
a quantity of cryogenic working fluid disposed within said
capillary wick and said expansion reservoir.
4. A cryogenic heat transfer device in accordance with claim 2
wherein said adsorption reservoir is a shell-like structure
enclosing said insulation shell.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to cryogenic heat transfer devices, and more
particularly to cryogenic heat pipes capable of safe, convenient
storage at room temperatures.
2. Description of the Prior Art
A heat pipe is fundamentally an evacuated chamber employing a
volatile working fluid that occupies the interstices of a capillary
wick. Heat is transferred from a heated evaporator section at one
end of the heat pipe to a condenser section at the other end by a
process called vapor heat transfer. When vaporization of the
working fluid in a heat pipe occurs, two important phenomena come
into play. First, upon evaporating, the working fluid absorbs from
the heated evaporator surface a quantity of heat equal to its
latent heat of vaporization. Second, as the working fluid changes
its state from liquid to vapor, the vapor pressure increases in the
evaporator section of the heat pipe causing the working fluid vapor
to move toward the condenser section. Since the temperature in the
condenser section is lower than that in the evaporator section,
condensation of working fluid vapor occurs on the capillary wick in
the condenser section. Upon condensation, the working fluid vapor
gives up the thermal energy stored as its latent heat of
vaporization. In addition, as the working fluid vapor changes state
from vapor to liquid the vapor pressure decreases in the condenser
section, thereby maintaining a pressure differential between the
evaporator section and the condenser section so as to continue
repetition of the vapor heat transfer cycle. It is important to
note that the working fluid stores heat energy at the temperature
at which it evaporates, retaining that heat energy at that
temperature until the working fluid condenses.
Vaporization of the liquid working fluid at the evaporator end of
the heat pipe causes depletion of the liquid in that area. Movement
of the condensed working fluid from the condenser section back to
the evaporator section is accomplished by means of capillary action
within the wick. The capillarity of the wick, therefore, causes the
liquid to pump itself back to the evaporator section so as to
repeat the heat transfer cycle. There are, however, factors which
limit the operation of heat pipes. An insufficient volume of
working fluid within the system inhibits efficient heat transfer
within the heat pipe. If the wick does not permit sufficiently
rapid movement of the condensed working fluid back to the
evaporator section, all of the incident heat energy cannot be
absorbed. Either circumstance results in a large increase in the
temperature of the evaporator section. Increasing the temperature
of the heat pipe as a whole results in a rise in the vapor pressure
of the working fluid. Temperatures in excess of a maximum allowable
operating temperature may result in a sufficiently high vapor
pressure to rupture the walls of the heat pipe.
One obvious solution to the foregoing problem is to make the walls
of the heat pipe thick enough and the structural bonds strong
enough to withstand such high vapor pressure. However, thick walls
increase the temperature gradients through the walls of the
evaporator and condenser regions, thus lowering the overall
efficiency of heat transfer.
SUMMARY OF THE INVENTION
A cryogenic device according to the invention is an hermetically
sealed unit comprising a cryogenic heat pipe, enough cryogenic
working fluid to completely saturate its wick when the working
fluid is in its liquid state and an expansion chamber. Examples of
particular cryogenic working fluids which may be employed and their
boiling points are: Oxygen at -183.degree.C, liquid nitrogen at
-196.degree.C and freon at -81.degree.C. Insufficient fluid will
limit performance of the heat pipe, on the other hand, if the heat
pipe is over-filled and allowed to warm up, all liquid will become
gas at the critical pressure and this buildup of pressure can cause
an explosion. It has already been pointed out that increasing the
structural strength of the heat pipe is an unsatisfactory
technique. The present invention provides an expansion chamber to
furnish a reservoir for the safe storage of the vaporized working
fluid at room temperatures. To activate the device for use, it is
only necessary to cool the condenser region down to cryogenic
temperatures thus causing the gas contained both in the heat pipe
region and the reservoir region to condense out in the wick.
A chamber formed about the longitudinal dimension of the heat pipe,
wrapped with foil layers and then evacuated forms the
super-insulation section of the device. This superinsulation
section helps to provide efficient heat transfer from the
evaporator section to the condenser section. During operation of
the device, there will be negligible heat transfer to the
environment through that region of the heat pipe protected by the
super-insulation section.
OBJECTS
It is, accordingly, an object of this invention to increase the
efficiency of operation of a cryogenic heat pipe device.
It is a further object of this invention to provide an optimum
amount of working fluid that can be employed with a cryogenic heat
pipe.
It is still another object of this invention to provide a heat pipe
for use at cryogenic temperatures capable of safe storage at room
temperatures.
Other objects and many of the attendant advantages of this
invention will be readily appreciated as the same becomes better
understood by reference to the following detailed description when
considered in connection with the accompanying drawings
wherein:
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a simplified cut away side elevational view of a device
according to one embodiment of the invention;
FIG. 2 is a simplified partially cut away side elevational view of
a device according to another embodiment of the invention;
FIG. 3 is a graph illustrating the functional relationships between
temperature, pressure and the arrival rate of the adsorbate at the
surface of the adsorbent in an adsorptive reservoir;
FIG. 4 is a partial cut-away side elevational view of an adsorption
reservoir showing the adsorbent as a metallic powder.
DETAILED DESCRIPTION
Referring more specifically to the drawings, FIG. 1 is a simplified
pictorial view of a storable cryogenic heat pipe. In FIG. 1 an
elongated cylindrical chamber is provided having an evaporator
section 11, a vapor transfer section 17 and a condenser section 12.
A capillary wick 30 is shown disposed along the inner surface of
the elongated cylindrical chamber. A multifoil-vacuum insulation
section 13 surrounds vapor transfer section 17. Expansion chamber
16 is connected to the elongated cylindrical chamber through tube
15.
In FIG. 2 a different form of the device is illustrated in that
expansion chamber 16' is shown folded back upon and surrounding the
body of the device instead of being an appendage thereto. Such a
construction affords increased structural integrity over the
construction illustrated in FIG. 1 in addition to the greater
efficiency of insulation provided for vapor transfer region 17.
Assuming quiescent conditions of storage at room temperature and
pressure, it is necessary to activate the device before operating
conditions may be attained. Under room conditions of temperature
and pressure the working fluid is in the vapor state both in the
heat pipe chamber and in the reservoir 16. It is necessary to cool
the condenser section 12 down to cryogenic temperatures, thus
working fluid vapor will condense on the wick 30 of the heat pipe
in the vicinity of condenser section 12 and migrate under capillary
action to evaporator section 11. Because of the high temperature
gradient now existing between the reservoir 16 and the condenser
section 12 of the heat pipe, all cryogenic vapors condense in the
condenser section 12 and only superheated gas remains in the
reservoir 16. Exposure of evaporator section 11 to a source of heat
will initiate the vapor heat transfer cycle by causing the liquid
working fluid in that section of the heat pipe to vaporize.
Vaporization of working fluid causes an increase in vapor pressure
in the vicinity of evaporator section 11 and a subsequent migration
of the working fluid vapor toward condenser section 12, a region of
comparatively low vapor pressure. The liquid working fluid, upon
vaporizing, retains its latent heat of vaporization as taken in
from the evaporator surface 11. Upon the subsequent condensation of
the working fluid vapor within condenser region 12 this latent heat
of vaporization is released. The condensate thus formed in region
12 collects on the wick 30 where it is transported through
capillary action to region 11 where the supply of liquid working
fluid has been depleted through evaporation. The vapor heat
transfer cycle thus described will continue so as to maintain
evaporator section 11 at approximately the temperature at which the
liquid working fluid evaporates. Multifoil-vacuum insulation
section 13 prevents heat transfer through the walls of the heat
pipe in vapor transfer section 17, thus heat is transferred from
evaporator section 11 to condenser section 12 without attendant
losses through the walls of region 17. Expansion chamber 16 is
connected to condenser section 12 through low thermal conductivity
tubing 15.
In one embodiment, the expansion reservoir utilized with the
invention is an adsorption chamber. The phenomenon of adsorption is
shown functionally by the curves of FIG. 3. Some solids can take up
several times their own volume of gases by a process known as
sorption, a generic term referring to and including both absorption
and adsorption. The solid which takes up the gas is known as the
sorbent; the gas or vapor removed from the gas phase is called the
sorbate; and the process of removing gas from a sorbent is usually
referred to as desorption. The gas or vapor may, however, interact
only with the surface of the solid in which case the process
involved is known as adsorption which may be defined as the
deposition of a layer having a thickness of one or more molecules
on the surface of a solid. The solid taking up the gas or vapor is
referred to as the adsorbent; the gas or vapor removed from the gas
phase is called the adsorbate; and the process of removing gas from
the adsorbent is referred to, as before, as desorption. An
adsorbent is generally a material with large surface-to-mass ratio.
The quantity of gas or vapor contained by adsorption is a function
of the temperature and pressure of the environment surrounding the
adsorbent as well as the gas or vapor to which it is exposed. In
FIG. 3 the arrival rate of the adsorbate at the surface of the
adsorbent is plotted as the ordinate in atoms/cm.sup.2 -sec, while
the absolute temperature of the system is plotted as the abscissa.
A coverage coefficient 0 provides a measure of the coverage of the
adsorbent by the absorbate. A value of .theta. equal to unity
corresponds to one complete monolayer coverage. The term
"monolayer" has reference to a layer of the adsorbate that is one
molecule thick. Thus, a reservoir can be designed to contain large
numbers of vapor molecules which can, when needed, be transferred
to a heat pipe section by creating a pressure gradient between the
heat pipe and the reservoir. Such pressure gradient may be created
by cooling the condenser section of the heat pipe to cryogenic
temperatures.
FIG. 4 shows a cut-away view of an adsorption type reservoir
wherein 15' is low conductivity tubing connecting the reservoir to
the heat pipe proper, 21 is the envelope of the reservoir and 22
represents the adsorbent in the form of a metallic power. The
required storage area for a reservoir of this type is given by the
relation: ##EQU1## where V= volume d= particle diameter
We may estimate the storage capabilities of an adsorption type
reservoir in comparison to a volume type reservoir from a
consideration of the general gas equation:
Pv=n RT
where P=pressure
V=volume
T=absolute temperature
n=the number of molecules, and
R=the gas constant
According to this relation, the number of molecules, n, will be
given as: ##EQU2## and the resultant volume required to contain
these molecules as: ##EQU3## in the volume type of reservoir. In
the adsorption reservoir, storage capability is increased by the
added term: ##EQU4## so that ##EQU5## gives the number of molecules
capable of storage in the adsorption type reservoir. The resultant
volume required to contain these molecules is given by ##EQU6##
which may be rewritten in the form ##EQU7## thereby showing that
the required volume for an adsorption reservoir is less by the
second term than that for a volume reservoir.
It should be understood, of course, that the foregoing disclosure
relates to only preferred embodiments of the invention and that it
is intended to cover all changes and modifications of the examples
of the invention herein chosen for the purposes of the disclosure,
which do not constitute departures from the spirit and scope of the
invention.
* * * * *