U.S. patent number 3,776,304 [Application Number 05/259,729] was granted by the patent office on 1973-12-04 for controllable heat pipe.
This patent grant is currently assigned to RCA Corporation. Invention is credited to Victor Auerbach.
United States Patent |
3,776,304 |
Auerbach |
December 4, 1973 |
CONTROLLABLE HEAT PIPE
Abstract
In a heat pipe comprising three heat-transfer regions, a first
capillary structure is disposed at, and extends between, two of the
regions; and a second capillary structure, hydrodynamically
isolated from the first capillary structure, is disposed at the
third region. Thermal switching between the first two regions, one
of which serves as the condenser region of the heat pipe, is
controlled by a heat flow between the third region and the
condenser region.
Inventors: |
Auerbach; Victor (Cranbury,
NJ) |
Assignee: |
RCA Corporation (New York,
NY)
|
Family
ID: |
22986128 |
Appl.
No.: |
05/259,729 |
Filed: |
June 5, 1972 |
Current U.S.
Class: |
165/96;
165/104.26; 136/203; 165/DIG.132 |
Current CPC
Class: |
F28D
15/06 (20130101); Y10S 165/132 (20130101) |
Current International
Class: |
F28D
15/06 (20060101); F28d 015/00 () |
Field of
Search: |
;165/105,96 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Davis, Jr.; Albert W.
Claims
What is claimed is:
1. A heat pipe comprising:
a. a sealed envelope containing a first chamber in communication
with a second chamber;
b. said first chamber including two heat-transfer regions in
contact with a first capillary structure extending
therebetween;
c. said second chamber including a third heat-transfer region in
contact with a second capillary structure, said second capillary
structure being hydrodynamically isolated from said first capillary
structure;
d. a vaporizable working fluid disposed within said envelope;
and
e. means for producing a heat flow between said third heat-transfer
region and one of said other two heat-transfer regions.
2. The heat pipe of claim 1, wherein said means comprises a
thermoelectric device.
3. The heat pipe of claim 1, wherein said third heat-transfer
region is thermally insulated from said other two heat-transfer
regions.
4. The heat pipe of claim 3 wherein a first portion of said
envelope is made of metal and a second portion thereof is made of
glass or ceramic.
5. The heat pipe of claim 4, wherein said first envelope portion
contains said first chamber and said second envelope portion
contains said second chamber.
Description
BACKGROUND OF THE INVENTION
This invention relates to a novel heat pipe and particularly to an
improved controllable heat pipe.
Controllable heat pipes, i.e., heat pipes capable of functioning as
thermal switches, have been prepared for various applications,
including the temperature regulation of electronic equipment.
Heretofore, such devices have comprised separate evaporator and
condenser chambers interconnected by separate vapor-flow and
liquid-flow conduits. See, for example, U.S. Pat. No. 3,543,839,
issued on Dec. 1, 1970, to A. P. Schlosinger; and U.S. Pat. No.
3,614,981, issued on Oct. 26, 1971, to J. B. Coleman et al. To
effect thermal switching, the devices disclosed in the former
patent necessarily include a control valve, preferably
pneumatically-actuated, in the vapor-flow conduit; and the devices
disclosed in the latter patent necessarily include a
wick-compression means, preferably magnetically-controlled, in the
liquid-flow conduit.
Thus, in addition to being complicated in structure, these
prior-art devices must employ internal moving parts and external
mechanical control means. These disadvantages could be severely
limiting in space-type environments.
SUMMARY OF THE INVENTION
The novel heat pipe comprises a sealed envelope including three
heat-transfer regions. Adjacent to the inner wall of the envelope,
at two of the regions, is a first capillary structure extending
therebetween. Adjacent to the inner wall of the envelope, at
another of the regions, is a second capillary structure
hydrodynamically isolated from the first capillary structure. A
vaporizable working fluid is also disposed within the envelope.
Preferably, the two heat-transfer regions interconnected by the
first capillary structure are included in a first chamber of the
envelope, and the heat-transfer region in contact with the second
capillary structure is included in a second chamber of the
envelope, the second chamber being in communication with the first
chamber. Also preferably, a thermoelectric (Peltier) device is
connected between one of the heat-transfer regions of the first
chamber and the heat-transfer region of the second chamber.
The two heat-transfer regions interconnected by the first capillary
structure serve as the evaporator and condenser regions of the heat
pipe. By having the second capillary structure hydrodynamically
isolated (i.e., isolated by a non-wetting barrier zone) from the
first capillary structure, thermal switching between the evaporator
and condenser regions can be controlled merely by varying the
direction of the heat flow between the third heat-transfer region
and the condenser region. Thus, the novel heat pipe eliminates the
need for internal moving parts and external mechanical-control
means. Including the evaporator and condenser regions in a first
chamber of the heat pipe, while including the third heat-transfer
region in a communicating second chamber thereof, serves to
thermally-insulate the third heat-transfer region from the
condenser region and thereby effect better switching control. By
connecting a thermoelectric (Peltier) device between the condenser
region and the third heat-transfer region, the direction of the
heat flow between these two regions can be varied simply by varying
the direction of a small direct current through the device. Hence,
the novel heat pipe is simpler to construct and also to operate
than are the prior art controllable heat pipes. Moreover, it is
better suited to space applications.
BRIEF DESCRIPTION OF THE DRAWING
FIG. 1 is a longitudinal sectional view of an example of the novel
heat pipe; and
FIG. 2 is a longitudinal sectional view of an alternative form of a
portion of the novel heat pipe of FIG. 1.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
In the example shown in FIG. 1, the novel heat pipe 10 comprises a
sealed envelope 12 containing a first chamber 14 in communication
with a second chamber 16. The wall of the envelope 12 is made of a
metal which may be copper; and the first and second chambers 14 and
16, respectively, may each be tubular in shape. The first chamber
14 includes a first heat-transfer region 18, which serves as teh
evaporator region of the heat pipe 10, and a second heat-transfer
region 20, which serves as the condenser region thereof. Adjacent
to the inner wall of the envelope 12, within the first chamber 14,
is a first capillary structure 22 disposed at, and extending
between, the first and second heat-transfer regions 18 and 20,
respectively. The first capillary structure 22 may be a tubular
mesh made of copper wire.
The second chamber 16 includes a third heat-transfer region 24,
which serves as the control region of the heat pipe 10 (the
operation of which is described below). Adjacent to the inner wall
of the envelope 12, within the second chamber 16, is a second
capillary structure 26 disposed at the third heat-transfer region
24. The second capillary structure 26, which also may be a tubular
mesh made of copper wire, is hydrodynamically isolated from the
first capillary structure 22. That is, the second capillary
structure 26 is separated from the first capillary structure 22 by
a non-wetting barrier zone which prevents any liquid flow
therebetween. The envelope 12 also contains a quantity of
vaporizable working fluid (not shown), such as water, preferably
insufficient to saturate either the first or the second capillary
structure 22 or 26, respectively.
Connected between, and thermally coupled to, the second and third
heat transfer regions 20 and 24, respectively, is a typical
thermoelectric (Peltier) device 28. As is known, the junction of
two dissimilar thermoelectric materials can be cooled or heated by
passing a direct current in either of two directions therethrough.
Two of these junctions can be connected in series with a direct
current source so that one junction can be cooled while the other
is being heated, i.e., a heat flow can be produced between the two
junctions. See, for example, McGraw-Hill Encyclopedia of Science
and Technology, Vol. 13, pp. 577-585 (1960). The device 28 employs
two such junctions (not shown), one junction in thermal contact
with the second heat-transfer region 20 and the other junction in
thermal contact with the third heat-transfer region 24. The
direction and magnitude of the heat flow between the second and
third heat-transfer regions 20 and 24, respectively, can then be
controlled by a suitable direct current supply (not shown)
electrically connected to the device 28 by means of two input
terminals 30. Thermoelectric (Peltier) devices, as well as power
supplies therefor, are discussed by R. R. Heikes and R. W. Ure, Jr.
in Thermoelectricity: Science and Engineering, Interscience
Publishers, N. Y. (1961).
To effect normal operation of the heat pipe 10, a direct current is
passed through the terminals 30 in a first direction such that the
thermoelectric device maintains a heat flow from the second
heat-transfer region 20 to the third heat-transfer region 24. As a
result, the working fluid in the second capillary structure 26 is
evaporated therefrom and condensed onto the first capillary
structure 22, at the second heat-transfer region 20.
Liquid flow in the first capillary structure 22 transfers the
condensate from the second heat-transfer region 20 to the first
heat-transfer region 18. Heat into the first heat-transfer region
18 is then conducted out of the second heat-transfer region 20 by
typical heat pipe action. That is, the working fluid at the first
heat input region 18 is vaporized by absorption of the
thermal-energy input; the pressure difference between the first and
second heat-transfer regions 18 and 20, respectively, causes the
vapor to flow from the former to the latter; the thermal energy is
released by condensation of the vapor at the second heat-transfer
region 20; and the condensate is returned to the first
heat-transfer region 18 by liquid flow in the first capillary
structure 22.
When it is desired to inhibit normal operation of the heat pipe 10,
a direct current is passed through the terminals 30 in a second
direction, opposite to the first, such that the thermoelectric
device 28 maintains a heat flow from the third heat-transfer region
24 to the second heat-transfer region 20. As a result, the
vaporized working fluid at the first heat input region 18 flows to
the third heat-transfer region 24, at which condensation occurs.
The condensate is not returned to the first heat-transfer region
18, because of the hydrodynamic isolation of the first and second
capillary structures 22 and 26, respectively, but is instead
retained at the third heat-transfer region 24. Such action
continues until all of the working fluid is "stored" in the second
capillary structure 26 and complete turn-off of the heat pipe 10 is
effected. To resume normal operation as described above, the
current is again reversed through the terminals 30, whereby the
stored working fluid is evaporated from the third heat-transfer
region 24 and condensed at the second heat-transfer region 20.
A typical application for the heat pipe 10 is the temperature
regulation of electronic equipment. For example, an electronic
component may serve as the heat source (not shown) at the first
heat-transfer region 18. When the temperature of the component
rises above a given value, the heat pipe 10 can be switched "on";
and when it falls below another given value, the latter can be
switched "off"--all preferably automatically.
An alternative form of the envelope 12 of the heat pipe 10 is shown
in FIG. 2, wherein the former comprises a first metal portion 12a
sealed to a second glass or ceramic portion 12b. The first envelope
portion 12a encloses the first chamber 14 and includes the first
and second heat-transfer regions 18 and 20, respectively. The
second envelope portion 12b encloses the second chamber 16 and
includes the third heat-transfer region 24. Thus, the alternative
form of the envelope 12 serves to further thermally-insulate the
second and third heat-transfer regions 20 and 24, respectively, so
as to effect better switching control of the heat pipe, 10.
Metal-to-glass or ceramic envelopes for heat pipes are disclosed in
U.S. Pat. No. 3,543,841, issued on Dec. 1, 1970, to G. Y.
Eastman.
General Considerations
It should be understood that the invention is not limited to the
embodiments described above. For example, various combinations of
envelope, capillary structure, and working fluid materials may be
employed by the novel heat pipe. Thus, for sodium or potassium
working fluids, the envelope and capillary structures may be made
of nickel; for mercury working fluids, the latter may be made of
stainless steel. Also, various envelope and capillary-structure
geometries may be employed. Thus, the envelope may comprise an
annular, angular, or flat-plate design; and the capillary
structures may be of the porous-fiber or groove type. See G. Y.
Eastman, "The Heat Pipe--A Progress Report," Proceedings of the 4th
Intersociety Energy Conversion Engineering Conference, pp. 873-878
(September 1969); see also U.S. Pat. Application Ser. No. 38,323,
filed on May 18, 1970, by R. A. Freggens.
The thermoelectric (Peltier) device may be internal to the heat
pipe envelope or it may be entirely eliminated from the design,
where appropriate. Thus, other means may be employed to control the
direction of the heat flow between the control and condenser
regions of the heat pipe. Also, these two heat-transfer regions may
be thermally insulated from one another (as well as from the
evaporator region) by further envelope design, external means, etc.
Finally, the heat source may be a mechanical, as well as
electrical, component whose temperature is to be controlled
manually or automatically.
* * * * *