U.S. patent application number 17/540636 was filed with the patent office on 2022-06-23 for package protector with integrated guide pin.
The applicant listed for this patent is Intel Corporation. Invention is credited to Liguang DU, Song Kok HANG, Wei LIAO, Jun LU, Wesley B. MORGAN, Juan A. OROZCO RAMIREZ, Guoliang YING, Guangying ZHANG, Fangbo ZHU.
Application Number | 20220200177 17/540636 |
Document ID | / |
Family ID | 1000006196852 |
Filed Date | 2022-06-23 |
United States Patent
Application |
20220200177 |
Kind Code |
A1 |
LU; Jun ; et al. |
June 23, 2022 |
PACKAGE PROTECTOR WITH INTEGRATED GUIDE PIN
Abstract
Herein described are apparatuses and systems for facilitating
alignment of computer component connectors. A package protector may
include a body to at least partially surround an integrated circuit
package of a circuit card when the package protector is mounted to
the circuit card. The package protector may further include a guide
pin component that extends from a side of the body, wherein the
guide pin component is to be located adjacent to a header of the
circuit card when the package protector is mounted to the circuit
card, wherein a connector uses the guide pin component to align
with the header via a guide pin.
Inventors: |
LU; Jun; (Shanghai, CN)
; LIAO; Wei; (Shanghai, CN) ; ZHANG;
Guangying; (Shanghai, CN) ; DU; Liguang;
(Shanghai, CN) ; YING; Guoliang; (Shanghai,
CN) ; ZHU; Fangbo; (Shanghai, CN) ; HANG; Song
Kok; (Fremont, CA) ; OROZCO RAMIREZ; Juan A.;
(Zapopan JAL, MX) ; MORGAN; Wesley B.; (Olympia,
WA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Intel Corporation |
Santa Clara |
CA |
US |
|
|
Family ID: |
1000006196852 |
Appl. No.: |
17/540636 |
Filed: |
December 2, 2021 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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16976380 |
Aug 27, 2020 |
11201420 |
|
|
PCT/CN2018/092418 |
Jun 22, 2018 |
|
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17540636 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01R 12/7005 20130101;
H01R 2201/06 20130101; H01R 13/6278 20130101; G06F 1/185
20130101 |
International
Class: |
H01R 12/70 20060101
H01R012/70; G06F 1/18 20060101 G06F001/18; H01R 13/627 20060101
H01R013/627 |
Claims
1. A package protector, comprising: a body to at least partially
surround an integrated circuit package of a circuit card when the
package protector is mounted to the circuit card; and a guide pin
component that extends from a side of the body, wherein the guide
pin component is to be located adjacent to a header of the circuit
card when the package protector is mounted to the circuit card,
wherein a connector uses the guide pin component to align with the
header via a guide pin.
2. The package protector of claim 1, wherein the guide pin
component comprises a guide pin receptacle, and the guide pin
receptacle is to receive the guide pin within a recess of the guide
pin receptacle.
3. The package protector of claim 2, wherein sidewalls of the guide
pin receptacle that abut the recess are threaded, and wherein the
guide pin comprises a screw to engage with the sidewalls of the
guide pin receptacle.
4. The package protector of claim 1, wherein the guide pin
component extends perpendicular from the side of the body.
5. The package protector of claim 1, wherein a portion the guide
pin component extends past an edge of the circuit card, and wherein
the portion of the guide pin component has a recess that is to
receive the guide pin.
6. The package protector of claim 1, wherein the body has an
opening formed in a center of the body, wherein the body includes a
frame that surrounds the opening, and wherein the integrated
circuit package is to extend through the opening when the package
protector is mounted to the circuit card.
7. The package protector of claim 1, wherein the guide pin
component is a first guide pin component, the guide pin is a first
guide pin, the header is a first header, and the connector is a
first connector, wherein the package protector further comprises a
second guide pin component that extends from the side of the body,
and wherein the guide pin component is to be located adjacent to a
second header of the circuit card, and wherein a second connector
uses the second guide pin component to align with the second header
via a second guide pin.
8. A circuit card, comprising: a printed circuit board (PCB); an
integrated circuit package mounted to the PCB; a header mounted to
the PCB; and a package protector mounted to the PCB, wherein the
package protector includes: a frame that surrounds the integrated
circuit package; and a guide pin component that is located adjacent
to the header, wherein a connector uses the guide pin component to
align with the header via a guide pin.
9. The circuit card of claim 8, wherein a portion of the header
extends past an edge of the PCB, and wherein a portion of the guide
pin component extends past the edge of the PCB, the portion of the
guide pin component located adjacent to the portion of the
header.
10. The circuit card of claim 8, wherein the guide pin component
comprises a guide pin receptacle, wherein the guide pin receptacle
is to receive the guide pin within a recess of the guide pin
receptacle.
11. The circuit card of claim 10, wherein sidewalls of the guide
pin receptacle that abut the recess are threaded, and wherein the
guide pin comprises a screw to engage with the sidewalls of the
guide pin receptacle.
12. The circuit card of claim 8, wherein the guide pin component
extends perpendicular from a side of the frame and parallel to a
surface of the PCB to which the package protector is mounted.
13. The circuit card of claim 8, wherein the guide pin component is
a first guide pin component and the guide pin is a first guide pin,
wherein the package further includes a second guide pin component
that extends parallel to the first guide pin component and along a
same plane as the first guide pin component, and wherein the
connector further uses the second guide pin component to align with
the header via a second guide pin.
14. The circuit card of claim 13, wherein the first guide pin
component and the second guide pin component extend parallel to a
surface of the PCB to which the package protector is mounted.
15. The circuit card of claim 14, wherein the header is located
between the first guide pin component and the second guide pin
component.
16. A computer device, comprising: a printed circuit board (PCB); a
circuit card mounted to the PCB, wherein the circuit card includes:
a header; and a package protector that includes: a frame that
surrounds an integrated circuit package of the circuit card; and a
guide pin component that is located adjacent to the header; and a
coupling board mounted to the circuit card, wherein the coupling
board includes: a first connector that is coupled to the header of
the circuit card; a mating guide pin component that mates with the
guide pin component of the circuit card, wherein the first
connector uses the mating guide pin component and the guide pin
component to align the first connector with the header; and a
second connector that is coupled to a component of the computer
device and electrically couples a portion of the circuit card to a
portion of the component via the coupling board.
17. The computer device of claim 16, wherein the guide pin
component comprises a guide pin receptacle with a recess, and
wherein the mating guide pin component comprises a guide pin that
is located within the recess.
18. The computer device of claim 17, wherein sidewalls of the guide
pin receptacle that abut the recess are threaded, wherein the guide
pin comprises a screw that engages with the sidewalls of the guide
pin receptacle and retains mating of the header and the first
connector.
19. The computer device of claim 16, wherein the coupling board is
mounted to the circuit card at an opposite side of the circuit card
from the PCB.
20. The computer device of claim 16, wherein the circuit card is a
first circuit card, wherein the computer device further comprises a
second circuit card mounted to the PCB, and wherein the component
of the computer device is the second circuit card.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] The present application is a continuation of U.S. Patent
Application No. 16/976,380, filed Aug. 27, 2020 which is a national
phase entry under 35 U.S.C. .sctn. 371 of International Application
No. PCT/CN2018/092418, filed Jun. 22, 2018, entitled "PACKAGE
PROTECTOR WITH INTEGRATED GUIDE PIN", which designated, among the
various States, the United States of America. The Specifications of
the PCT/CN2018/092418 and 16/976,380 Applications are hereby
incorporated by reference.
BACKGROUND
[0002] The background description provided herein is for the
purpose of generally presenting the context of the disclosure.
Unless otherwise indicated herein, the materials described in this
section are not prior art to the claims in this application and are
not admitted to be prior art by inclusion in this section.
[0003] Capabilities of computer devices are often expanded via
mounting of circuit cards to motherboards of the computer devices.
Further, there may be additional connections between the circuit
cards, and/or between circuit cards and other components within the
computer devices. Mounting of the circuit cards to the motherboards
and providing the additional connections have presented the
challenge of aligning headers and connectors, which may be
performed without seeing the connection point in some instances.
Legacy approaches to address this challenge involved mounting two
independent guide pins and two independent guide pin receptacles to
the circuit card and the mating component (the motherboards or
other components), respectively or vice versa. Mounting the two
guide pins and the two guide pin receptacles involved forming holes
in the circuit card and the mating component for the mounting.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] Embodiments will be readily understood by the following
detailed description in conjunction with the accompanying drawings.
To facilitate this description, like reference numerals designate
like structural elements. Embodiments are illustrated by way of
example, and not by way of limitation, in the figures of the
accompanying drawings.
[0005] FIG. 1 illustrates an example circuit card, according to
various embodiments.
[0006] FIG. 2 illustrates the example package protector of FIG. 1,
according to various embodiments.
[0007] FIG. 3 illustrates an example circuit card arrangement,
according to various embodiments.
[0008] FIG. 4 illustrates another example circuit card arrangement,
according to various embodiments.
[0009] FIG. 5 illustrates another example circuit card arrangement,
according to various embodiments.
[0010] FIG. 6 illustrates an example computer device that may
employ the apparatuses and/or methods described herein.
[0011] FIG. 7 illustrates another example computer device that may
employ the apparatuses and/or methods described herein.
DETAILED DESCRIPTION
[0012] Apparatuses and systems for facilitating alignment of
computer component connectors are disclosed herein. A package
protector may include a body to at least partially surround an
integrated circuit package of a circuit card when the package
protector is mounted to the circuit card. The package protector may
further include a guide pin component that extends from a side of
the body, wherein the guide pin component is to be located adjacent
to a header of the circuit card when the package protector is
mounted to the circuit card, wherein a connector uses the guide pin
component to align with the header via a guide pin.
[0013] In the following detailed description, reference is made to
the accompanying drawings which form a part hereof wherein like
numerals designate like parts throughout, and in which is shown by
way of illustration embodiments that may be practiced. It is to be
understood that other embodiments may be utilized and structural or
logical changes may be made without departing from the scope of the
present disclosure. Therefore, the following detailed description
is not to be taken in a limiting sense, and the scope of
embodiments is defined by the appended claims and their
equivalents.
[0014] Aspects of the disclosure are disclosed in the accompanying
description. Alternate embodiments of the present disclosure and
their equivalents may be devised without parting from the spirit or
scope of the present disclosure. It should be noted that like
elements disclosed below are indicated by like reference numbers in
the drawings.
[0015] Various operations may be described as multiple discrete
actions or operations in turn, in a manner that is most helpful in
understanding the claimed subject matter. However, the order of
description should not be construed as to imply that these
operations are necessarily order dependent. In particular, these
operations may not be performed in the order of presentation.
Operations described may be performed in a different order than the
described embodiment. Various additional operations may be
performed and/or described operations may be omitted in additional
embodiments.
[0016] For the purposes of the present disclosure, the phrase "A
and/or B" means (A), (B), or (A and B). For the purposes of the
present disclosure, the phrase "A, B, and/or C" means (A), (B),
(C), (A and B), (A and C), (B and C), or (A, B and C).
[0017] The description may use the phrases "in an embodiment," or
"in embodiments," which may each refer to one or more of the same
or different embodiments. Furthermore, the terms "comprising,"
"including," "having," and the like, as used with respect to
embodiments of the present disclosure, are synonymous.
[0018] As used herein, the term "circuitry" may refer to, be part
of, or include an Application Specific Integrated Circuit (ASIC),
an electronic circuit, a processor (shared, dedicated, or group)
and/or memory (shared, dedicated, or group) that execute one or
more software or firmware programs, a combinational logic circuit,
and/or other suitable components that provide the described
functionality.
[0019] FIG. 1 illustrates an example circuit card 100, according to
various embodiments. The circuit card 100 may be coupled to a
motherboard of a computer device. In particular, the circuit card
100 may be coupled to the motherboard via edge connector 102. In
other embodiments, the edge connector 102 may couple the circuit
card 100 to another component of the computer device, such as a
backplane and/or a riser card. The circuit card 100 may comprise a
daughter card. In some embodiments, the circuit card 100 may
comprise a peripheral component interconnect express (PCIe) card.
The PCIe card may support the PCIe bus standard, e.g., PCIe bus
standard as specified by PCI Express Base Specification Revision
4.0, Version 1.0. Support of the PCIe bus standard may include
communication encapsulated in serialized packets, wherein the
packetizing and de-packetizing may be handled by a transaction
layer of the PCIe card.
[0020] The circuit card 100 may include a printed circuit board
(PCB) 104 and one or more components coupled to the PCB 104. The
PCB 104 may include one or more conductive elements (such as
traces, vias, and/or other conductive elements) that provide
electrical coupling between the components coupled to the PCB
104.
[0021] The circuit card 100 may further include one or more headers
106 coupled to the PCB 104. In the illustrated embodiment, a first
header 106a and a second header 106b are shown. The headers 106 may
be electrically coupled to one or more other components of the
circuit card 100 via the conductive elements of the PCB 104. Each
of the headers 106 may receive one or more connectors and may
provide electrical coupling with the connectors. In the illustrated
embodiment, the headers 106 are shown as extending from the PCB 104
past an edge 108 of the PCB 104 and parallel to a surface of the
PCB 104 to which the headers 106 are mounted, where the headers 106
are located at an opposite side of the circuit card 100 from the
edge connector 102. In particular, a portion of each of the headers
106 may extend past the edge 108 of the PCB 104 while another
portion of each of the headers 106 is located adjacent to the PCB
104. It is to be understood that the headers 106 may extend at
different angles to the surface of the PCB 104, may extend past
other edges of the PCB 104, and/or may be located within the edges
of the PCB 104 in other embodiments. Further, it is to be
understood that each of the headers 106 may extend at a different
angle to the surface of the PCB 104 and/or may extend past a
different edge than one or more of the other headers 106.
[0022] The circuit card 100 may further include an integrated
circuit (IC) package 110. The IC package 110 may be coupled to the
PCB 104. The IC package 110 may comprise a processing unit, such as
a graphics processing unit, an input/output (I/O) controller, a
digital signal processing unit, a microprocessor, and/or a system
on chip (SoC).
[0023] The circuit card 100 may further include a package protector
112. The package protector 112 may be coupled to the PCB 104 via
fasteners, epoxy, other adhesives, or some combination thereof. The
package protector 112 may be formed of a rigid material, such as
metal. The package protector 112 may reduce the flexibility of at
least a portion of the circuit card 100, where flexing of the
circuit card 100 may cause damage to one or more of the components
of the circuit card 100, such as the IC package 110.
[0024] The package protector 112 may include a body 114. The body
114 may at least partially surround the IC package 110. In the
illustrated embodiment, the body 114 may include a frame 116 that
surrounds the IC package 110 on four sides of the IC package 110.
The body 114 may have an opening 118 formed in the center of the
body 114, wherein the frame 116 surrounds the opening 118. The IC
package 110 may extend through the opening 118.
[0025] The package protector 112 may further include one or more
guide pin components 120. The guide pin components 120 may be
formed of the same piece of material as the body 114, thereby
integrating the guide pin components 120 as part of the package
protector 112. Integrating the guide pin components 120 as part of
the package protector 112 may reduce manufacturing errors and/or
reduce manufacturing time presented by legacy independent guide
pins and independent guide pin receptacles. The guide pin
components 120 may extend from the body 114. In some embodiments,
the body 114 may include one or more extensions (such as extension
122) that extend from the frame 116 to one or more of the guide pin
components 120. For example, the guide pin components 120 may
extend from one or more sides of the body 114. Each of the guide
pin components 120 may extend perpendicular to the sides from which
the guide pin components 120 extend. Further, the guide pin
components 120 may extend parallel to a surface of the PCB 104 to
which the package protector 112 is mounted. In other embodiments,
each of the guide pin components 120 may extend at other angles to
the sides from which the guide pin components 120 extend.
[0026] The guide pin components 120, or some portion thereof, may
each be located adjacent to one or more headers 106 of the circuit
card 100. For example, a first guide pin component 120a may be
located adjacent to the first header 106a and a second guide pin
component 120b may be located adjacent to the second header 106b in
the illustrated embodiment. The guide pin components 120 may extend
past the edge 108 of the PCB 104 adjacent to the headers 106. In
particular, a portion of each of the guide pin components 120 may
extend past the edge 108 of the PCB 104 adjacent to the portion of
the headers 106 that extends past the edge 108. For example, the
portion of the first guide pin component 120a may extend past the
edge 108 adjacent to the portion of the first header 106a that
extends past the edge 108. Further, one or more of the headers 106
may be located between two of the guide pin components 120. For
example, the second header 106b may be located between the first
guide pin component 120a and the second guide pin component 120b in
the illustrated embodiment.
[0027] The guide pin components 120 may comprise guide pin
receptacles. Each of the guide pin receptacles may have a recess
(as is described further in relation to FIG. 2) formed in each of
the guide pin receptacles. The guide pin receptacle may receive a
guide pin within the recess. Receiving the guide pin receptacle
within the recess may facilitate alignment of connectors with the
headers 106. For example, the connectors may utilize the guide pin
components 120 to align with the headers 106 via the guide pins. In
some embodiments, sidewalls of the guide pin receptacles that abut
the recesses may be threaded. In these embodiments, the guide pins
may comprise screws, where the screws engage with the sidewalls of
the guide pin receptacles to maintain the guide pins within the
recess. Engagement and disengagement of the screws with the
sidewalls of the guide pin receptacles may provide force and linear
movement for mating and unmating the connectors with the headers
106, respectively.
[0028] In other embodiments, the guide pin components 120 may
comprise guide pins. In these embodiments, the guide pins may be
received within guide pin receptacles associated with the
connectors to be received by the headers 106. In some of these
embodiments, the guide pins may comprise screws, where the screws
engage with the guide pin receptacles.
[0029] FIG. 2 illustrates the example package protector 112 of FIG.
1, according to various embodiments. The package protector 112 may
include may include the body 114 with the first guide pin component
120a and the second guide pin component 120b extending from the
body 114. The second guide pin component 120b may extend parallel
to the first guide pin component 120a and along a same plane as the
first guide pin component 120a.
[0030] The first guide pin component 120a may comprise a first
guide pin receptacle. The first guide pin receptacle may have a
first recess 202. The first recess 202 may receive a first guide
pin. Sidewalls 206 of the first guide pin receptacle that abut the
first recess 202 may be threaded. The first guide pin may comprise
a screw and may engage with the sidewalls 206 of the first guide
pin receptacle. Engagement and disengagement of the screw with the
sidewalls 206 of the first guide pin receptacle may provide force
and linear movement for mating and unmating connectors with
headers, respectively.
[0031] The second guide pin component 120b may comprise a second
guide pin receptacle. The second guide pin receptacle may have a
second recess 204. The second recess 204 may receive a second guide
pin. Sidewalls 208 of the second guide pin receptacle that abut the
second recess 204 may be threaded. The second guide pin may
comprise a screw and may engage with the sidewalls 208 of the
second guide pin receptacle. Engagement and disengagement of the
screw with the sidewalls 208 of the second guide pin receptacle may
provide force and linear movement for mating and unmating
connectors with headers, respectively.
[0032] FIG. 3 illustrates an example circuit card arrangement 300,
according to various embodiments. The circuit card arrangement 300
may be implemented within a computer device, such as the computer
device 600 (FIG. 6) and/or the computer device 700 (FIG. 7).
[0033] The circuit card arrangement 300 may include a PCB 302. The
PCB 302 may be a motherboard of the computer device. The PCB 302
may include one or more conductive elements (such as traces, vias,
and/or other conductive elements) that provide electrical coupling
between the components coupled to the PCB 302. The PCB 302 may
include one or more headers 304 coupled to the PCB 302. The
conductive elements 302 may electrically couple one or more of the
headers 304 and may provide for communication among the headers
304.
[0034] The circuit card arrangement 300 may further include one or
more circuit cards 306. The circuit cards 306 may include one or
more of the features of the circuit card 100 (FIG. 1). The circuit
cards 306 may be coupled to the PCB 302 via the headers 304. For
example, each of the headers 304 may receive an edge connector
(such as the edge connector 102 (FIG. 1)) of a corresponding one of
the circuit cards 306. The headers 304 may provide for electrical
coupling between the circuit cards 306 and the PCB 302.
[0035] The circuit card arrangement 300 may further include a first
top plane PCB 308 and a second top plane PCB 310. The first top
plane PCB 308 and the second top plane PCB 310 may each include one
or more conductive elements (such as traces, vias, and/or other
conductive elements) that provide electrical coupling between the
components coupled to the PCB 302.
[0036] The first top plane PCB 308 and the second top plane PCB 310
may each include one or more connectors. In some embodiments, the
connectors may be whisper connectors. The first top plane PCB 308
may be coupled to a first portion 312 of the circuit cards 306 and
the second top plane PCB 310 may be coupled to a second portion 314
of the circuit cards 306 via the connectors. For example, the first
top plane PCB 308 and the second top plane PCB 310 may include
mating guide pin components that mate with guide pin components
(such as the guide pin components 120 (FIG. 1)) of the circuit
cards 306. The mating guide pin components may comprise guide pins
and the guide pin components may comprise guide pin receptacles as
described throughout this disclosure. In other embodiments, the
mating guide pin components may comprise guide pin receptacles and
the guide pin components may comprise guide pins. The connectors of
the first top plane PCB 308 and the second top plane PCB 310 may
utilize the mating guide pin component and the guide pin component
to align each of the connectors with corresponding headers (such as
the headers 106 (FIG. 1)) of the circuit cards 306.
[0037] The circuit card arrangement 300 may further include one or
more cables 316. The cables 316 may be coupled to the first top
plane PCB 308 and the second top plane PCB 310 and may allow
communication between the first top plane PCB 308 and the second
top plane PCB 310 via the cables 316. Accordingly, communication
among the circuit cards 306 may be transmitted via the PCB 302
and/or via the first top plane PCB 308, the cables 316, and the
second top plane PCB 310. This may allow for higher transfer rates
for communication among the circuit cards 306 than if communication
among the circuit cards 306 was only available via the PCB 302.
[0038] FIG. 4 illustrates another example circuit card arrangement
400, according to various embodiments. In particular, the circuit
card arrangement 400 may illustrate an arrangement of circuit cards
that may be coupled to a PCB.
[0039] The circuit card arrangement 400 may include a first circuit
card 402 and a second circuit card 404. The first circuit card 402
and the second circuit card 404 may each include one or more of the
features of the circuit card 100 (FIG. 1). The second circuit card
404 may be located adjacent to the first circuit card 402 and may
be aligned with the first circuit card 402. For example, each of
the edges of the second circuit card 404 may be aligned along the
same planes as corresponding edges of the first circuit card 402.
Further, an edge connector 406 of the first circuit card 402 may be
aligned along a same plane as an edge connector (obscured due to
angle of view) of the second circuit card 404, such that the edge
connector 406 and the edge connector of the second circuit card 404
may each mate with corresponding headers coupled to a single, flat
PCB.
[0040] The first circuit card 402 and the second circuit card 404
may each include one or more headers 408 that couple with one or
more connectors of one or more top plane PCBs 410. The top plane
PCBs 410 may each include one or more of the features of the first
top plane PCB 308 (FIG. 3) and/or the second top plane PCB 310
(FIG. 3). Further, the first circuit card 402 and the second
circuit card 404 may each include one or more guide pin components
412 that facilitate alignment of the headers 408 with the
connectors of the top plane PCBs 410. The headers 408 may include
one or more of the features of the headers 106 (FIG. 1). Further,
the guide pin components 412 may include one or more of the
features of the guide pin components 120 (FIG. 1). For brevity, the
headers 408 and the guide pin components 412 of the first circuit
card 402 are described in detail, while details of the headers 408
and the guide pin components 412 of the second circuit card 404 may
be omitted from the description. However, it is to be understood
that the headers 408 and the guide pin components 412 of the second
circuit card 404 include the same features of the headers 408 and
the guide pin components 412 of the first circuit card 402 except
where otherwise indicated.
[0041] The first circuit card 402 may include a first header 408a
and a second header 408b that couple to a first connector and a
second connector of a first top plane PCB 410a. The first circuit
card 402 may further include a first guide pin component 412a that
couples to a mating guide pin component of the first top plane PCB
410a. The first guide pin component 412a may be located adjacent to
the second header 408b and along a same plane as both the first
header 408a and the second header 408b. The first connector and the
second connector of the first top plane PCB 410a may utilize the
first guide pin component 412a to align with the first header 408a
and the second header 408b, respectively. The second circuit card
404 may further be coupled to the first top plane PCB 410a and the
first top plane PCB 410a may provide for communication between the
first circuit card 402 and the second circuit card 404.
[0042] The first circuit card 402 may further include a third
header 408c and a fourth header 408d that couple to a first
connector and a second connector of a second top plane PCB 410b.
The first circuit card 402 may further include a second guide pin
component 412b that couples to a mating guide pin component of the
second top plane PCB 410b. The second guide pin component 412b may
be located adjacent to the fourth header 408d and along a same
plane as both the third header 408c and the fourth header 408d. The
first connector and the second connector of the second top plane
PCB 410b may utilize the second guide pin component 412b to align
with the third header 408c and the fourth header 408d,
respectively. The second circuit card 404 may further be coupled to
the second top plane PCB 410b and the second top plane PCB 410b may
provide for communication between the first circuit card 402 and
the second circuit card 404.
[0043] FIG. 5 illustrates another view of a portion of the example
circuit card arrangement 400, according to various embodiments. In
particular, FIG. 5 shows the second circuit card 404, the first top
plane PCB 410a, and the second top plane PCB 410b. In the
illustrated embodiment, the first top plane PCB 410a and the second
top plane PCB 410b are illustrated decoupled from the second
circuit card 404 to show the alignment of the elements.
[0044] The second circuit card 404 may include a first header 502
and a second header 504. The first header 502 and the second header
504 may be coupled to a PCB 506 of the second circuit card 404 and
may extend past an edge 508 of the PCB 506. The first header 502
and the second header 504 each may have one or more recesses
510.
[0045] The second circuit card 404 may further include a package
protector 512. The package protector 512 may include one or more of
the features of the package protector 112 (FIG. 1). The package
protector 512 may be coupled to the PCB 506. A body 518 of the
package protector 512 may at least partially surround a package 520
of the second circuit card 404. For example, the body 518
completely surrounds the package 520 in the illustrated
embodiment.
[0046] The package protector 512 may include a first guide pin
component 514 and a second guide pin component 516. The first guide
pin component 514 may extend from the body 518 past the edge 508 of
the PCB 506. In particular, the first guide pin component 514 may
be located adjacent to the first header 502 and may extend past the
edge 508 adjacent to the first header 502. The second guide pin
component 516 may extend from the body 518 past the edge 508 of the
PCB 506. In particular, the second guide pin component 516 may be
located adjacent to the second header 504 and may extend past the
edge 508 adjacent to the second header 504.
[0047] The first top plane PCB 410a may include a connector 522.
The connector 522 may include one or more pins 524. The connector
522 may be mated within the second header 504 by inserting the pins
524 within the recesses 510 of the second header 504. The connector
522 may be electrically coupled with the second header 504 when the
connector 522 is mated with the second header 504, thereby allowing
communication to be transmitted between the second circuit card 404
and the first top plane PCB 410a.
[0048] The first top plane PCB 410a may further include a mating
guide pin component 526. The mating guide pin component 526 may be
located adjacent to the connector 522. The mating guide pin
component 526 may mate with the second guide pin component 516. In
the illustrated embodiment, the mating guide pin component 526
comprises a guide pin and the second guide pin component 516
comprises a guide pin receptacle. The guide pin may be received
within a recess of the guide pin receptacle to mate the mating
guide pin component 526 with the second guide pin component 516. In
some embodiments, the guide pin may comprise a screw and the screw
may engage with sidewalls abutting the recess of the guide pin
receptacle, where the sidewalls are threaded. In other embodiments,
the mating guide pin component 526 may comprise a guide pin
receptacle and the second guide pin component 516 may comprise a
guide pin. Engagement and disengagement of the screw with the
sidewalls of the guide pin receptacle may provide force and linear
movement for mating and unmating of the connector 522 with the
second header 504, respectively.
[0049] The connector 522 may utilize the second guide pin component
516 and the mating guide pin component 526 to align the connector
522 with the second header 504. For example, positioning the guide
pin within the recess of the guide pin receptacle may cause the
connector 522 to be aligned with the second header 504. Aligning
the connector 522 with the second header 504 may align the pins 524
of the connector 522 with the recesses 510 of the second header
504, and may reduce or prevent damage being caused to the pins 524
during mating of the connector 522 with the second header 504. A
length of the guide pin may be longer than lengths of the pins 524
such that the guide pin engages with the guide pin receptacle
before the pins 524 engage with the second header 504 when coupling
the first top plane PCB 410a to the second circuit card 404.
[0050] The second top plane PCB 410b may include a connector 528.
The connector 528 may include one or more pins 530. The connector
528 may be mated within the first header 502 by inserting the pins
530 within the recesses 510 of the first header 502. The connector
528 may be electrically coupled with the first header 502 when the
connector 528 is mated with the first header 502, thereby allowing
communication to be transmitted between the second circuit card 404
and the second top plane PCB 410b.
[0051] The second top plane PCB 410b may further include a mating
guide pin component 532. The mating guide pin component 532 may be
located adjacent to the connector 528. The mating guide pin
component 532 may mate with the first guide pin component 514. In
the illustrated embodiment, the mating guide pin component 532
comprises a guide pin and the first guide pin component 514
comprises a guide pin receptacle. The guide pin may be received
within a recess of the guide pin receptacle to mate the mating
guide pin component 532 with the first guide pin component 514. In
some embodiments, the guide pin may comprise a screw and the screw
may engage with sidewalls abutting the recess of the guide pin
receptacle, where the sidewalls are threaded. In other embodiments,
the mating guide pin component 532 may comprise a guide pin
receptacle and the first guide pin component 514 may comprise a
guide pin. Engagement and disengagement of the screw with the
sidewalls of the guide pin receptacle may provide force and linear
movement for mating and unmating of the connector 525 with the
first header 502, respectively.
[0052] The connector 528 may utilize the first guide pin component
514 and the mating guide pin component 532 to align the connector
528 with the first header 502. For example, positioning the guide
pin within the recess of the guide pin receptacle may cause the
connector 528 to be aligned with the first header 502. Aligning the
connector 528 with the first header 502 may align the pins 530 of
the connector 528 with the recesses 510 of the first header 502,
and may reduce or prevent damage being caused to the pins 530
during mating of the connector 528 with the first header 502. A
length of the guide pin may be longer than lengths of the pins 530
such that the guide pin engages with the guide pin receptacle
before the pins 530 engage with the first header 502 when coupling
the second top plane PCB 410b to the second circuit card 404.
[0053] FIG. 6 illustrates an example computer device 600 that may
employ the apparatuses and/or methods described herein (e.g., the
circuit card 100, the package protector 112, the circuit card
arrangement 300, and/or the circuit card arrangement 400), in
accordance with various embodiments. As shown, computer device 600
may include a number of components, such as one or more
processor(s) 604 (one shown) and at least one communication chip
606. In various embodiments, the one or more processor(s) 604 each
may include one or more processor cores. In various embodiments,
the at least one communication chip 606 may be physically and
electrically coupled to the one or more processor(s) 604. In
further implementations, the communication chip 606 may be part of
the one or more processor(s) 604. In various embodiments, computer
device 600 may include printed circuit board (PCB) 602. For these
embodiments, the one or more processor(s) 604 and communication
chip 606 may be disposed thereon. In alternate embodiments, the
various components may be coupled without the employment of PCB
602.
[0054] Depending on its applications, computer device 600 may
include other components that may or may not be physically and
electrically coupled to the PCB 602. These other components
include, but are not limited to, memory controller 626, volatile
memory (e.g., dynamic random access memory (DRAM) 620),
non-volatile memory such as read only memory (ROM) 624, flash
memory 622, storage device 654 (e.g., a hard-disk drive (HDD)), an
I/O controller 641, a digital signal processor (not shown), a
crypto processor (not shown), a graphics processor 630, one or more
antenna 628, a display (not shown), a touch screen display 632, a
touch screen controller 646, a battery 636, an audio codec (not
shown), a video codec (not shown), a global positioning system
(GPS) device 640, a compass 642, an accelerometer (not shown), a
gyroscope (not shown), a speaker 650, a camera 652, and a mass
storage device (such as hard disk drive, a solid state drive,
compact disk (CD), digital versatile disk (DVD)) (not shown), and
so forth.
[0055] In some embodiments, the one or more processor(s) 604, flash
memory 622, and/or storage device 654 may include associated
firmware (not shown) storing programming instructions configured to
enable computer device 600, in response to execution of the
programming instructions by one or more processor(s) 604, to
practice all or selected aspects of the methods described herein.
In various embodiments, these aspects may additionally or
alternatively be implemented using hardware separate from the one
or more processor(s) 604, flash memory 622, or storage device
654.
[0056] In various embodiments, one or more components of the
computer device 600 may include the package protector 112 (FIG. 1)
and/or may comprise a circuit card (such as the circuit card 100
(FIG. 1), the circuit cards 306 (FIG. 3), the first circuit card
402 (FIG. 4), and/or the second circuit card 404 (FIG. 4)) coupled
to the computer device 600. For example, the graphics processor 630
may be mounted to a circuit card with the package protector 112
encircling the graphics processor 630, where the circuit card is
coupled to the PCB 602. The package protector 112 may facilitate
alignment of one or more headers/connectors of the circuit card
having the graphics processor 630 with the PCB 602 and/or some
other component of the computer device 600.
[0057] The communication chips 606 may enable wired and/or wireless
communications for the transfer of data to and from the computer
device 600. The term "wireless" and its derivatives may be used to
describe circuits, devices, systems, methods, techniques,
communications channels, etc., that may communicate data through
the use of modulated electromagnetic radiation through a non-solid
medium. The term does not imply that the associated devices do not
contain any wires, although in some embodiments they might not. The
communication chip 606 may implement any of a number of wireless
standards or protocols, including but not limited to IEEE 802.20,
Long Term Evolution (LTE), LTE Advanced (LTE-A), General Packet
Radio Service (GPRS), Evolution Data Optimized (Ev-DO), Evolved
High Speed Packet Access (HSPA+), Evolved High Speed Downlink
Packet Access (HSDPA+), Evolved High Speed Uplink Packet Access
(HSUPA+), Global System for Mobile Communications (GSM), Enhanced
Data rates for GSM Evolution (EDGE), Code Division Multiple Access
(CDMA), Time Division Multiple Access (TDMA), Digital Enhanced
Cordless Telecommunications (DECT), Worldwide Interoperability for
Microwave Access (WiMAX), Bluetooth, derivatives thereof, as well
as any other wireless protocols that are designated as 3G, 4G, 5G,
and beyond. The computer device 600 may include a plurality of
communication chips 606. For instance, a first communication chip
606 may be dedicated to shorter range wireless communications such
as Wi-Fi and Bluetooth, and a second communication chip 606 may be
dedicated to longer range wireless communications such as GPS,
EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.
[0058] In various implementations, the computer device 600 may be a
laptop, a netbook, a notebook, an ultrabook, a smartphone, a
computer tablet, a personal digital assistant (PDA), an
ultra-mobile PC, a mobile phone, a desktop computer, a server, a
printer, a scanner, a monitor, a set-top box, an entertainment
control unit (e.g., a gaming console or automotive entertainment
unit), a digital camera, an appliance, a portable music player, or
a digital video recorder. In further implementations, the computer
device 600 may be any other electronic device that processes
data.
[0059] FIG. 7 illustrates another example computer device that may
employ the apparatuses and/or methods (e.g., the circuit card 100,
the package protector 112, the circuit card arrangement 300, and/or
the circuit card arrangement 400) described herein. As shown,
computer device 700 may include a number of components, such as one
or more processor and memory controller device(s) 704 (one shown)
and at least one communication chip 706. In various embodiments,
the one or more processor and memory controller device(s) 704 each
may include one or more processor cores. In various embodiments,
the at least one communication chip 706 may be physically and
electrically coupled to the one or more processor and memory
controller device(s) 704. In further implementations, the
communication chip 706 may be part of the one or more processor and
memory controller device(s) 704. In some embodiments, the processor
and memory controller device(s) 704 may include one or more neural
network processors.
[0060] Further, in various embodiments, a system management device
730 (such as baseboard management controller (BMC)) may be coupled
to the one or more processor and memory controller device(s) 704.
The system management device 730 may monitor the state of the
computer device 700 via one or more sensors 760. The one or more
sensors 760 may sense the physical state of the computer device
700, such as a temperature of the computer device 700. In some
embodiments, the system management device 730 may communicate with
the one or more processor and memory controller device(s) 704
through an independent connection. Further, in some embodiments,
the system management device 730 and/or the sensors 760 may be
omitted.
[0061] In various embodiments, computer device 700 may include
printed circuit board (PCB) 702. For these embodiments, the one or
more processor and memory controller device(s) 704 and
communication chip 706 may be disposed thereon. In alternate
embodiments, the various components may be coupled without the
employment of PCB 702. Depending on its applications, computer
device 700 may include other components that may or may not be
physically and electrically coupled to the PCB 702. These other
components include, but are not limited to, main memory (e.g.,
volatile memory, non-volatile memory, and/or dynamic random access
memory (DRAM)) 720, read-only memory (ROM) 724, flash memory 722,
storage device 754 (e.g., a hard-disk drive (HDD)), an I/O
controller 741, a digital signal processor (not shown), a crypto
processor (not shown), a system management device 730, a display
(not shown), a power conversion device 736, an audio codec (not
shown), a video codec (not shown), and a mass storage device (such
as hard disk drive, a solid state drive, compact disk (CD), digital
versatile disk (DVD)) (not shown), and so forth.
[0062] In various embodiments, the computer device 700 may include
one or more fans 740. The one or more fans 740 may be directed at
and/or mounted to one or more of the components within the computer
device 700. In some embodiments, the one or more fans 740 may be
coupled to the one or more processor and memory controller
device(s) 704 and/or the system management device 730, which may
control operation of the one or more fans 740.
[0063] In some embodiments, the one or more processor and memory
controller device(s) 704, flash memory 722, and/or storage device
754 may include associated firmware (not shown) storing programming
instructions configured to enable computer device 700, in response
to execution of the programming instructions by one or more
processor and memory controller device(s) 704, to implement an
operating system and/or one or more applications. In various
embodiments, these aspects may additionally or alternatively be
implemented using hardware separate from the one or more processor
and memory controller device(s) 704, flash memory 722, or storage
device 754.
[0064] In various embodiments, one or more components of the
computer device 700 may include the package protector 112 (FIG. 1)
and/or may comprise a circuit card (such as the circuit card 100
(FIG. 1), the circuit cards 306 (FIG. 3), the first circuit card
402 (FIG. 4), and/or the second circuit card 404 (FIG. 4)) coupled
to the computer device 700. For example, the processor and memory
controller devices 704 may be mounted to a circuit card with the
package protector 112 encircling the processor and/or memory
controller device, where the circuit card is coupled to the PCB
702. The package protector 112 may facilitate alignment of one or
more headers/connectors of the circuit card having the processor
and memory controller devices 704 with the PCB 702 and/or some
other component of the computer device 700.
[0065] The communication chips 706 may enable wired and/or wireless
communications for the transfer of data to and from the computer
device 700. The term "wireless" and its derivatives may be used to
describe circuits, devices, systems, methods, techniques,
communications channels, etc., that may communicate data through
the use of modulated electromagnetic radiation through a non-solid
medium. The term does not imply that the associated devices do not
contain any wires, although in some embodiments they might not. The
communication chip 706 may implement any of a number of wireless
standards or protocols, including but not limited to IEEE 702.20,
Long Term Evolution (LTE), LTE Advanced (LTE-A), General Packet
Radio Service (GPRS), Evolution Data Optimized (Ev-DO), Evolved
High Speed Packet Access (HSPA+), Evolved High Speed Downlink
Packet Access (HSDPA+), Evolved High Speed Uplink Packet Access
(HSUPA+), Global System for Mobile Communications (GSM), Enhanced
Data rates for GSM Evolution (EDGE), Code Division Multiple Access
(CDMA), Time Division Multiple Access (TDMA), Digital Enhanced
Cordless Telecommunications (DECT), Worldwide Interoperability for
Microwave Access (WiMAX), Bluetooth, derivatives thereof, as well
as any other wireless protocols that are designated as 3G, 4G, 5G,
and beyond. The computer device 700 may include a plurality of
communication chips 706. For instance, a first communication chip
706 may be dedicated to shorter range wireless communications such
as Wi-Fi and Bluetooth, and a second communication chip 706 may be
dedicated to longer range wireless communications such as GPS,
EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.
[0066] In various implementations, the computer device 700 may be a
server. In other implementations, the computer device 700 may be,
or components of the computer device 700 may be implemented in, a
laptop, a netbook, a notebook, an ultrabook, a smartphone, a
computer tablet, a personal digital assistant (PDA), an
ultra-mobile PC, a mobile phone, a desktop computer, a printer, a
scanner, a monitor, a set-top box, an entertainment control unit
(e.g., a gaming console or automotive entertainment unit), a
digital camera, an appliance, a portable music player, or a digital
video recorder. In further implementations, the computer device 700
may be any other electronic device that processes data.
[0067] Example 1 may include a package protector, comprising a body
to at least partially surround an integrated circuit package of a
circuit card when the package protector is mounted to the circuit
card, and a guide pin component that extends from a side of the
body, wherein the guide pin component is to be located adjacent to
a header of the circuit card when the package protector is mounted
to the circuit card, wherein a connector uses the guide pin
component to align with the header via a guide pin.
[0068] Example 2 may include the package protector of example 1,
wherein the guide pin component comprises a guide pin receptacle,
and the guide pin receptacle is to receive the guide pin within a
recess of the guide pin receptacle.
[0069] Example 3 may include the package protector of example 2,
wherein sidewalls of the guide pin receptacle that abut the recess
are threaded, and wherein the guide pin comprises a screw to engage
with the sidewalls of the guide pin receptacle.
[0070] Example 4 may include the package protector of any of
examples 1-3, wherein the guide pin component extends perpendicular
from the side of the body.
[0071] Example 5 may include the package protector of any of
examples 1-3, wherein a portion the guide pin component extends
past an edge of the circuit card, and wherein the portion of the
guide pin component has a recess that is to receive the guide
pin.
[0072] Example 6 may include the package protector of any of
examples 1-3, wherein the body has an opening formed in a center of
the body, wherein the body includes a frame that surrounds the
opening, and wherein the integrated circuit package is to extend
through the opening when the package protector is mounted to the
circuit card.
[0073] Example 7 may include the package protector of any of
examples 1-3, wherein the guide pin component is a first guide pin
component, the guide pin is a first guide pin, the header is a
first header, and the connector is a first connector, wherein the
package protector further comprises a second guide pin component
that extends from the side of the body, and wherein the guide pin
component is to be located adjacent to a second header of the
circuit card, and wherein a second connector uses the second guide
pin component to align with the second header via a second guide
pin.
[0074] Example 8 may include a circuit card, comprising a printed
circuit board (PCB), an integrated circuit package mounted to the
PCB, a header mounted to the PCB, and a package protector mounted
to the PCB, wherein the package protector includes a frame that
surrounds the integrated circuit package, and a guide pin component
that is located adjacent to the header, wherein a connector uses
the guide pin component to align with the header via a guide
pin.
[0075] Example 9 may include the circuit card of example 8, wherein
a portion of the header extends past an edge of the PCB, and
wherein a portion of the guide pin component extends past the edge
of the PCB, the portion of the guide pin component located adjacent
to the portion of the header.
[0076] Example 10 may include the circuit card of example 8 or
example 9, wherein the guide pin component comprises a guide pin
receptacle, wherein the guide pin receptacle is to receive the
guide pin within a recess of the guide pin receptacle.
[0077] Example 11 may include the circuit card of example 10,
wherein sidewalls of the guide pin receptacle that abut the recess
are threaded, and wherein the guide pin comprises a screw to engage
with the sidewalls of the guide pin receptacle.
[0078] Example 12 may include the circuit card of example 8 or
example 9, wherein the guide pin component extends perpendicular
from a side of the frame and parallel to a surface of the PCB to
which the package protector is mounted.
[0079] Example 13 may include the circuit card of example 8 or
example 9, wherein the guide pin component is a first guide pin
component and the guide pin is a first guide pin, wherein the
package further includes a second guide pin component that extends
parallel to the first guide pin component and along a same plane as
the first guide pin component, and wherein the connector further
uses the second guide pin component to align with the header via a
second guide pin.
[0080] Example 14 may include the circuit card of example 13,
wherein the first guide pin component and the second guide pin
component extend parallel to a surface of the PCB to which the
package protector is mounted.
[0081] Example 15 may include the circuit card of example 14,
wherein the header is located between the first guide pin component
and the second guide pin component.
[0082] Example 16 may include a computer device, comprising a
printed circuit board (PCB), a circuit card mounted to the PCB,
wherein the circuit card includes a header, and a package protector
that includes a frame that surrounds an integrated circuit package
of the circuit card, and a guide pin component that is located
adjacent to the header, and a coupling board mounted to the circuit
card, wherein the coupling board includes a first connector that is
coupled to the header of the circuit card, a mating guide pin
component that mates with the guide pin component of the circuit
card, wherein the first connector uses the mating guide pin
component and the guide pin component to align the first connector
with the header, and a second connector that is coupled to a
component of the computer device and electrically couples a portion
of the circuit card to a portion of the component via the coupling
board.
[0083] Example 17 may include the computer device of example 16,
wherein the guide pin component comprises a guide pin receptacle
with a recess, and wherein the mating guide pin component comprises
a guide pin that is located within the recess.
[0084] Example 18 may include the computer device of example 17,
wherein sidewalls of the guide pin receptacle that abut the recess
are threaded, wherein the guide pin comprises a screw that engages
with the sidewalls of the guide pin receptacle and retains mating
of the header and the first connector.
[0085] Example 19 may include the computer device of any of
examples 16-18, wherein the coupling board is mounted to the
circuit card at an opposite side of the circuit card from the
PCB.
[0086] Example 20 may include the computer device of any of
examples 16-18, wherein the circuit card is a first circuit card,
wherein the computer device further comprises a second circuit card
mounted to the PCB, and wherein the component of the computer
device is the second circuit card.
[0087] It will be apparent to those skilled in the art that various
modifications and variations can be made in the disclosed
embodiments of the disclosed device and associated methods without
departing from the spirit or scope of the disclosure. Thus, it is
intended that the present disclosure covers the modifications and
variations of the embodiments disclosed above provided that the
modifications and variations come within the scope of any claims
and their equivalents.
* * * * *