DU; Liguang
Patent Applications and Registrations
Patent applications and USPTO patent grants for DU; Liguang.The latest application filed is for "package protector with integrated guide pin".
- DU; Liguang - Shanghai CN
| Patent | Date |
|---|---|
| Package Protector With Integrated Guide Pin App 20220200177 - LU; Jun ; et al. | 2022-06-23 |
| Resilient Electrical Connectors For Electromagnetic Interference Shielding Structures In Integrated Circuit Assemblies App 20220139843 - LU; Jun ; et al. | 2022-05-05 |
| Package protector with integrated guide pin Grant 11,201,420 - Lu , et al. December 14, 2 | 2021-12-14 |
| Heat dissipation using airflow diversion with cooling fins Grant 11,106,256 - Shu , et al. August 31, 2 | 2021-08-31 |
| Package Protector With Integrated Guide Pin App 20210143566 - LU; Jun ; et al. | 2021-05-13 |
| Ground heat sink for dual inline memory module cooling Grant 10,873,145 - Ying , et al. December 22, 2 | 2020-12-22 |
| Heat Dissipation Using Airflow Diversion With Cooling Fins App 20200218317 - SHU; Tao ; et al. | 2020-07-09 |
| Ground Heat Sink For Dual Inline Memory Module Cooling App 20190319385 - Ying; Guoliang ; et al. | 2019-10-17 |
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