U.S. patent application number 17/454403 was filed with the patent office on 2022-06-02 for substrate plating apparatus including hybrid paddle that simultaneously circulates and stirs plating solution and removes air bubbles.
The applicant listed for this patent is HOJIN PLATECH CO., LTD.. Invention is credited to Jin Gyu IM, Woon Suk JUNG, Jong Uk KIM, Duk Haeng LEE, Jin Gyu LEE.
Application Number | 20220170161 17/454403 |
Document ID | / |
Family ID | 1000006024785 |
Filed Date | 2022-06-02 |
United States Patent
Application |
20220170161 |
Kind Code |
A1 |
IM; Jin Gyu ; et
al. |
June 2, 2022 |
SUBSTRATE PLATING APPARATUS INCLUDING HYBRID PADDLE THAT
SIMULTANEOUSLY CIRCULATES AND STIRS PLATING SOLUTION AND REMOVES
AIR BUBBLES
Abstract
Provided is a substrate plating apparatus capable of
simultaneously circulating and stirring a plating solution and
removing air bubbles. The plating apparatus includes a hybrid
paddle disposed in front of a substrate in a plating bath to stir
the plating solution. Here, the hybrid paddle includes a spray
assembly for spraying the plating solution toward the substrate and
a suction assembly for suctioning air bubbles formed on the
substrate during plating, and the spray assembly and the suction
assembly are coupled into one body and perform a reciprocating
movement along a surface of the substrate to stir the plating
solution.
Inventors: |
IM; Jin Gyu; (Incheon,
KR) ; JUNG; Woon Suk; (Ansan-si, KR) ; KIM;
Jong Uk; (Siheung-si, KR) ; LEE; Jin Gyu;
(Bucheon-si, KR) ; LEE; Duk Haeng; (Bucheon-si,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
HOJIN PLATECH CO., LTD. |
Ansan-si |
|
KR |
|
|
Family ID: |
1000006024785 |
Appl. No.: |
17/454403 |
Filed: |
November 10, 2021 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C25D 21/10 20130101;
C25D 21/16 20130101; C23C 18/1669 20130101; C23C 18/1628 20130101;
C23C 18/1683 20130101 |
International
Class: |
C23C 18/16 20060101
C23C018/16; C25D 21/10 20060101 C25D021/10; C25D 21/16 20060101
C25D021/16 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 30, 2020 |
KR |
10-2020-0163612 |
Claims
1. A plating apparatus for a substrate, which plates a substrate,
comprising: a plating bath configured to accommodate a plating
solution; and a hybrid paddle disposed in front of the substrate in
the plating bath to stir the plating solution, wherein the hybrid
paddle comprises a spray assembly configured to spray the plating
solution toward the substrate and a suction assembly configured to
suction air bubbles formed on the substrate during plating, and the
spray assembly and the suction assembly are coupled into one body
and perform a reciprocating movement along a surface of the
substrate to stir the plating solution.
2. The plating apparatus of claim 1, wherein the spray assembly
comprises: a plurality of spray tubes spaced in parallel to each
other to spray the plating solution; and a supply tube connected to
one end of each of the plurality of spray tubes to transfer the
plating solution, and the suction assembly comprises: a plurality
of suction tubes arranged alternately with the plurality of spray
tubes to suction the air bubbles; and a discharge tube connected to
one end of each of the plurality of suction tubes to transfer the
air bubbles.
3. The plating apparatus of claim 2, wherein each of the spray
tubes sprays the plating solution through a plurality of spray
nozzles formed toward the substrate, and each of the suction tubes
suctions the air bubbles through a plurality of suction holes
formed toward the substrate.
4. The plating apparatus of claim 1, further comprising a pump and
a venturi tube, which circulate the plating solution and supply the
plating solution to the hybrid paddle, wherein the pump collects
the plating solution accommodated in the plating bath and
discharges the collected plating solution to the venturi tube, the
venturi tube supplies the plating solution discharged from the pump
to the spray assembly, and an acceleration section in which a flow
velocity in the venturi tube is accelerated is connected to the
suction assembly through a circulation flow path to provide a
suction force to the suction assembly.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This U.S. non-provisional patent application claims priority
under 35 U.S.C. .sctn. 119 of Korean Patent Application No.
10-2020-0163612, filed on Nov. 30, 2020, the entire contents of
which are hereby incorporated by reference.
BACKGROUND
[0002] The present invention relates to a substrate plating
apparatus, and more particularly, to a substrate plating apparatus
that simultaneously circulates and stirs a plating solution and
removes air bubbles.
[0003] A substrate plating apparatus necessarily has a force of
stirring a plating solution to realize a constant plating quality.
To this end, the related art discloses various stirring units for
performing a reciprocating movement of a substrate, supplying the
plating solution to the substrate through a spray device, or
stirring the plating solution by using a paddle.
[0004] Here, a feature of effectively removing air bubbles
generated from the substrate during plating is important to realize
the constant plating quality. However, the typical stirring unit
may not effectively remove air bubbles attached to the substrate
although exhibiting an effect of distributing a portion of the air
bubbles. Also, a typical vertical-type plating apparatus attempts
to apply an impact or a vibration to the substrate for removing the
air bubbles, which causes damages or deviation of the substrate.
The typical horizontal-type plating apparatus also attempts to
incline or rotate the substrate for removing the air bubbles, which
requires a separate driving device.
SUMMARY
[0005] The present invention provides a substrate plating apparatus
capable of simultaneously circulating and stirring a plating
solution and removing air bubbles.
[0006] The object of the present invention is not limited to the
aforesaid, but other objects not described herein will be clearly
understood by those skilled in the art from descriptions below.
[0007] An embodiment of the present invention provides a plating
apparatus for a substrate, which plates a substrate, including: a
plating bath for accommodating a plating solution; and a hybrid
paddle disposed in front of the substrate in the plating bath to
stir the plating solution. Here, the hybrid paddle includes a spray
assembly for spraying the plating solution toward the substrate and
a suction assembly for suctioning air bubbles formed on the
substrate during plating, and the spray assembly and the suction
assembly are coupled into one body and perform a reciprocating
movement along a surface of the substrate to stir the plating
solution.
[0008] In an embodiment, the spray assembly may include: a
plurality of spray tubes spaced in parallel to each other to spray
the plating solution; and a supply tube connected to one end of
each of the plurality of spray tubes to transfer the plating
solution, and the suction assembly may include: a plurality of
suction tubes arranged alternately with the plurality of spray
tubes to suction the air bubbles; and a discharge tube connected to
one end of each of the plurality of suction tubes to transfer the
air bubbles.
[0009] In an embodiment, each of the spray tubes may spray the
plating solution through a plurality of spray nozzles formed toward
the substrate, and each of the suction tubes may suction the air
bubbles through a plurality of suction holes formed toward the
substrate.
[0010] In an embodiment, the plating apparatus may further include
a pump and a venturi tube, which circulate the plating solution and
supply the plating solution to the hybrid paddle. Here, the pump
may collect the plating solution accommodated in the plating bath
and discharge the collected plating solution to the venturi tube,
the venturi tube may supply the plating solution discharged from
the pump to the spray assembly, and an acceleration section in
which a flow velocity in the venturi tube is accelerated may be
connected to the suction assembly through a circulation flow path
to provide a suction force to the suction assembly.
[0011] Particularities of other embodiments are included in the
detailed description and drawings.
BRIEF DESCRIPTION OF THE FIGURES
[0012] The accompanying drawings are included to provide a further
understanding of the inventive concept, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the inventive concept and, together with the
description, serve to explain principles of the inventive concept.
In the drawings:
[0013] FIG. 1 is a schematic longitudinal cross sectional view
illustrating a substrate plating apparatus according to an
embodiment of the present invention;
[0014] FIG. 2 is an exploded perspective view illustrating a state
in which components of a hybrid paddle in FIG. 1 are functionally
separated;
[0015] FIG. 3 is a perspective view illustrating the hybrid paddle
and a substrate in FIG. 1;
[0016] FIG. 4 is a longitudinal cross-sectional view illustrating
the hybrid paddle in FIG. 3;
[0017] FIG. 5 is a transversal cross-sectional view illustrating
the hybrid paddle and the substrate in FIG. 3;
[0018] FIG. 6 is a longitudinal cross-sectional view illustrating
the hybrid paddle and the substrate in FIG. 3;
[0019] FIG. 7 is a cross-sectional view illustrating a venturi tube
in FIG. 1;
[0020] FIG. 8 is a schematic longitudinal cross sectional view
illustrating a substrate plating apparatus according to another
embodiment of the present invention;
[0021] FIG. 9 is a transversal cross-sectional view illustrating a
hybrid paddle and a substrate in FIG. 8;
[0022] FIG. 10 is a longitudinal cross-sectional view illustrating
the hybrid paddle and the substrate in FIG. 8; and
[0023] FIG. 11 is a schematic longitudinal cross sectional view
illustrating a substrate plating apparatus according to another
embodiment of the present invention.
DETAILED DESCRIPTION
[0024] Advantages and features of the present disclosure, and
implementation methods thereof will be clarified through following
embodiments described with reference to the accompanying drawings.
The present invention may, however, be embodied in different forms
and should not be construed as limited to the embodiments set forth
herein. Rather, these embodiments are provided so that this
disclosure will be thorough and complete, and will fully convey the
scope of the present disclosure to those skilled in the art.
Further, the present disclosure is only defined by scopes of
claims. Like reference numerals refer to like elements
throughout.
[0025] Hereinafter, a substrate plating apparatus according to an
embodiment of the present invention will be described with
reference to FIGS. 1 to 7.
[0026] FIG. 1 is a schematic longitudinal cross sectional view
illustrating the substrate plating apparatus according to an
embodiment of the present invention.
[0027] Referring to FIG. 1, a plating apparatus 100 according to
the present invention, which is a substrate plating apparatus for
plating a substrate W, includes: a plating bath 10 for
accommodating a plating solution 15 therein; a substrate holder
(not shown) for supporting the substrate W that is an object to be
plated in a detachable manner; an anode 20 disposed at a position
opposite to the substrate W in the plating bath 10; a hybrid paddle
50 disposed parallel to a surface of the substrate W between the
substrate W and the anode 20; and a pump 30 and a venturi tube 40
for circulating the plating solution.
[0028] The substrate W and the anode 20 are electrically connected
through a power 25. A current flows between the substrate W and the
anode 20 so that a plated layer or a metal layer is formed on the
surface of the substrate W. The plating apparatus 100 according to
the present invention may process a circular substrate such as a
wafer. However, the embodiment of the present invention is not
limited thereto. For example, the plating apparatus 100 according
to the present invention may process substrates having various
shapes such as a rectangular substrate. The plating apparatus 100
according to the embodiment is a vertical type plating apparatus,
in which the substrate W and the anode 20 are submerged into the
plating solution 15 in a vertical direction.
[0029] FIG. 2 is an exploded perspective view illustrating a state
in which components of the hybrid paddle in FIG. 1 are functionally
separated. FIG. 3 is a perspective view illustrating the hybrid
paddle and the substrate in FIG. 1. FIG. 4 is a longitudinal
cross-sectional view illustrating the hybrid paddle in FIG. 3. FIG.
5 is a transversal cross-sectional view illustrating the hybrid
paddle and the substrate in FIG. 3. FIG. 6 is a longitudinal
cross-sectional view illustrating the hybrid paddle and the
substrate in FIG. 3.
[0030] Referring to FIGS. 2 to 6, the hybrid paddle 50 is disposed
in front of the substrate W in the plating bath 10 to stir the
plating solution 15. The hybrid paddle 50 includes a spray assembly
52a and 54a for spraying the plating solution 15 toward the
substrate W and a suction assembly 52b and 54b for suctioning air
bubbles formed on the substrate W during plating. The spray
assembly 52a and 54a and the suction assembly 52b and 54b are
physically coupled into one body to perform a reciprocating
movement along the surface of the substrate W and stir the plating
solution 15. A driving unit (not shown) for driving the
reciprocating movement of the hybrid paddle 50 may be provided.
[0031] The spray assembly 52a and 54a includes a plurality of spray
tubes 54a spaced in parallel to each other and a supply tube 52a
connected to one end of each of the plurality of spray tubes 54a.
In other words, the supply tube 52a extends in a first direction,
and each of the plurality of spray tubes 54a is branched from the
supply tube 52a in a second direction that is substantially
perpendicular to the first direction. The plurality of spray tubes
54a are spaced a constant gap from each other. Each of the spray
tubes 54a sprays the plating solution through a plurality of spray
nozzles 56a formed toward the substrate W. The plurality of spray
nozzles 56a may be spaced a predetermined gap from each other along
a longitudinal direction of the spray tube 54a.
[0032] The suction assembly 52b and 54b includes a plurality of
suction tubes 54b arranged alternately with the plurality of spray
tubes 54a and a discharge tube 52b connected to one end of each of
the plurality of suction tubes 54b. In other words, the discharge
tube 52b extends in parallel to the supply tube 52a in the first
direction, and each of the plurality of suction tubes 54b is
branched from the discharge tube 52b in the second direction to
extend while the plurality of suction tubes 54b are spaced in
parallel to each other. Each of the suction tubes 54b suctions the
plating solution and air bubbles 2 around the substrate W through a
plurality of suction holes 56b formed toward the substrate W. The
plurality of suction holes 56b may be spaced a predetermined gap
from each other along a longitudinal direction of the suction tube
54b. Although the air bubbles 2 are formed around a via hole 3 of
the substrate W, the air bubbles 2 may be effectively removed
through the suction holes 56b.
[0033] Since the plurality of spray tubes 54a and the plurality of
suction tubes 54b are alternately arranged, the hybrid paddle 50
has a ladder shape. As described above, the spray assembly 52a and
54a and the suction assembly 52b and 54b are coupled into one body
to perform a reciprocating movement, thereby stirring the plating
solution. The hybrid paddle 50 performs a reciprocating movement in
the first direction, i.e., the longitudinal direction of the supply
tube 52a or the discharge tube 52b, or a direction perpendicular to
the longitudinal direction of each of the plurality of spray tubes
54a or each of the suction tubes 54b. This reciprocating movement
may effectively circulate and stir the plating solution around the
substrate W.
[0034] Plating solution flow paths respectively formed in the spray
assembly 52a and 54a and the suction assembly 52b and 54b may be
separated from each other. In terms of a plating solution
circulation, since the supply tube 52a of the spray assembly 52a
and 54a is connected to the venturi tube 40, the plating solution
supplied from the venturi tube 40 passes the spray tube 54a through
the supply pipe 52a and is sprayed toward the substrate W through
the spray nozzles 56a. Also, since the discharge tube 52b of the
suction assembly 52b and 54b is connected to the venturi tube 40,
the plating solution and the air bubbles 2 around the substrate W,
which are suctioned through the suction holes 56b, pass the
discharge tube 52b through the suction tubes 54b and are
transferred to the venturi tube 40.
[0035] FIG. 7 is a cross-sectional view illustrating the venturi
tube in FIG. 1.
[0036] Referring to FIGS. 1 and 7, the pump 30 and the venturi tube
40 circulate and stir the plating solution and remove air bubbles
in conjunction with the hybrid paddle 50. Specifically, the pump 30
is connected to the plating bath 10 and collects the plating
solution 15 accommodated in the plating bath 10 to discharge the
plating solution 15 to the venturi tube 40.
[0037] The venturi tube 40 supplies the plating solution 15
discharged from the pump 30 to the spray assembly 52a and 54a. An
inlet 41 connected to the pump 30 is formed at one side of the
venturi tube 40, and an outlet 42 connected to the spray assembly
52a and 54a or the supply tube 52a is formed at the other side of
the venturi tube 40. An acceleration section 43 having an internal
diameter less than that of each of the inlet 41 and the outlet 42
is formed between the inlet 41 and the outlet 42. A circulation
flow path 44 is formed in the acceleration section 43 and connected
to the suction assembly 52b and 54b or the discharge tube 52b.
[0038] The plating solution introduced from the pump 30 to the
inlet 41 by the venturi effect has a flow velocity that increases
while passing through the acceleration section 43 by a pressure
difference. That is, as a pressure is reduced in the acceleration
section 43, a suction force is generated in the suction assembly
52b and 54b connected through the circulation flow path 44.
[0039] Hereinafter, a substrate plating apparatus according to
another embodiment of the present invention will be described with
reference to FIGS. 8 to 10. FIG. 8 is a schematic longitudinal
cross sectional view illustrating the substrate plating apparatus
according to another embodiment of the present invention. FIG. 9 is
a transversal cross-sectional view illustrating a hybrid paddle and
a substrate in FIG. 8. FIG. 10 is a longitudinal cross-sectional
view illustrating the hybrid paddle and the substrate in FIG. 8.
For convenience of description, a member having the same function
as that shown in the drawings (FIGS. 1 to 7) of the previous
embodiment is designated by the same reference numeral, and a
description thereof will be omitted. Hereinafter, different points
will be mainly described.
[0040] Referring to FIG. 8, a plating apparatus 200 according to
the embodiment is a vertical type plating apparatus, in which one
pair of anodes 20 are disposed at both sides of a substrate W, and
a hybrid paddle 50 is disposed between the substrate W and each of
the anodes 20.
[0041] Referring to FIGS. 9 and 10, the hybrid paddles 50 are
disposed at both the sides of the substrate W so that spray tubes
54a and the suction tubes 54b of the hybrid paddles 50 face each
other with the substrate W disposed therebetween. When air bubbles
2 are formed around a through hole 4 of the substrate W, a plating
solution sprayed from a spray nozzle 56a of the spray tube 54a
disposed at one side of the substrate W may pass through a
through-hole 4 and be suctioned to a suction hole 56b of the
suction tube 54b disposed at the other side of the substrate W
together with the air bubbles 2, so that the plating solution and
the air bubbles 2 are removed.
[0042] Hereinafter, a substrate plating apparatus according to
another embodiment of the present invention will be described with
reference to FIG. 11. FIG. 11 is a schematic longitudinal cross
sectional view illustrating the substrate plating apparatus
according to another embodiment of the present invention. For
convenience of description, a member having the same function as
that shown in the drawings (FIGS. 1 to 7) of the previous
embodiment is designated by the same reference numeral, and a
description thereof will be omitted. Hereinafter, different points
will be mainly described.
[0043] Referring to FIG. 11, a substrate plating apparatus 300
according to the embodiment is a vertical type plating apparatus,
in which a hybrid paddle 50 is disposed below a substrate W. A pump
30 collects a plating solution accommodated in a plating bath 10
and discharges the collected plating solution to a venturi tube 40,
and the venturi tube 40 supplies the plating solution to a hybrid
paddle 50 and an inner bath 12.
[0044] In this embodiment, the hybrid paddle 50 may also spray the
plating solution toward the substrate W and simultaneously suction
the plating solution and air bubbles around the substrate W to
circulate and stir the entire plating solution, thereby removing
the air bubbles around the substrate W.
[0045] Although the technical idea of the hybrid paddle and/or the
venturi tube is applied to the electroplating apparatus as an
example in the above-described embodiments of the present
invention, the embodiment of the present invention is not limited
thereto. The embodiments of the present invention may be applied to
an electroless plating apparatus in the substantially same
manner.
[0046] As described above, the substrate plating apparatus
according to the present invention may improve the plating quality
through excellent effects stated below by using the hybrid paddle
including the spray assembly and the suction assembly, which are
coupled into one body.
[0047] First, the spray assembly of the hybrid paddle may supply
the constant plating solution or metal ions to the surrounding of
the substrate through the circulation of the plating solution by
collecting the plating solution accommodated in the plating bath
and re-supplying the plating solution to the substrate.
Furthermore, the force of stirring the plating solution may be
improved by the spraying force of the spray assembly.
[0048] Second, the suction assembly of the hybrid paddle may
maintain the constant state of the plating solution or the metal
ions at the surrounding of the substrate by collecting the plating
solution remained around the substrate after the plating. Also, the
suction assembly may effectively remove the air bubbles generated
during the plating while the plating solution is collected.
Furthermore, the force of stirring the plating solution may be
improved by the suction force of the suction assembly.
[0049] Third, the spray assembly and the suction assembly, which
are alternately arranged, may be coupled into one body to perform
the reciprocating movement along the surface of the substrate, and
this physical movement may improve the force of stirring the
plating solution.
[0050] Fourth, the pump may collect the plating solution
accommodated in the plating bath and then supply the plating
solution to the spray assembly of the hybrid paddle through the
venturi tube. The circulation flow path is formed in the
acceleration section in which the pressure in the venturi tube
increases and connected to the suction assembly of the hybrid
paddle. Thus, when the plating solution discharged from the pump is
sprayed through the spray assembly, the suction force of the
suction assembly connected to the circulation flow path increases
by the pressure difference in the venturi tube, and the overall
force of circulating the plating solution in the plating bath
increases.
[0051] The description of the present invention is intended to be
illustrative, and those with ordinary skill in the technical field
of the present invention will be understood that the present
invention can be carried out in other specific forms without
changing the technical idea or essential features. Thus, the
above-disclosed embodiments are to be considered illustrative and
not restrictive.
* * * * *