HOJIN PLATECH CO., LTD.
Patent Applications and Registrations
Patent applications and USPTO patent grants for HOJIN PLATECH CO., LTD..The latest application filed is for "substrate plating apparatus including hybrid paddle that simultaneously circulates and stirs plating solution and removes air bubbles".
- HOJIN PLATECH CO., LTD. - Ansan-si KR
| Patent | Date |
|---|---|
| Substrate Plating Apparatus Including Hybrid Paddle That Simultaneously Circulates And Stirs Plating Solution And Removes Air Bubbles App 20220170161 - IM; Jin Gyu ; et al. | 2022-06-02 |
| Plating equipment for solar cell wafer using electroplating and light-induced plating jointly and method of the same Grant 9,525,096 - Kim , et al. December 20, 2 | 2016-12-20 |
| Substrate carrier device for double-sided electroplating of solar cell Grant 9,194,053 - Kim , et al. November 24, 2 | 2015-11-24 |
| Copper plating solution Grant 9,150,977 - Kim , et al. October 6, 2 | 2015-10-06 |
| Substrate Carrier Device For Double-sided Electroplating Of Solar Cell App 20150176148 - Kim; Pan Soo ; et al. | 2015-06-25 |
| Copper Plating Solution App 20140151238 - Kim; Pan Soo ; et al. | 2014-06-05 |
| Plating Equipment For Solar Cell Wafer Using Electroplating And Light-induced Plating Jointly And Method Of The Same App 20140154836 - Kim; Pan Soo ; et al. | 2014-06-05 |
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