U.S. patent application number 17/193321 was filed with the patent office on 2022-03-10 for oled panel with inorganic pixel encapsulating barrier.
The applicant listed for this patent is Applied Materials, Inc.. Invention is credited to Ji-young CHOUNG, Dieter HAAS, Si Kyoung KIM, Jungmin LEE, Yu Hsin LIN, Seong Ho YOO.
Application Number | 20220077251 17/193321 |
Document ID | / |
Family ID | 1000005478759 |
Filed Date | 2022-03-10 |
United States Patent
Application |
20220077251 |
Kind Code |
A1 |
CHOUNG; Ji-young ; et
al. |
March 10, 2022 |
OLED PANEL WITH INORGANIC PIXEL ENCAPSULATING BARRIER
Abstract
Embodiments described herein relate to sub-pixel circuits and
methods of forming sub-pixel circuits that may be utilized in a
display such as an organic light-emitting diode (OLED) display. The
device includes a substrate, adjacent pixel-defining layer (PDL)
structures disposed over the substrate and defining sub-pixels of
the device, inorganic overhang structures disposed on an upper
surface of the PDL structures, and a plurality of sub-pixels. Each
sub-pixel includes an anode, an organic light-emitting diode (OLED)
material disposed over and in contact with the anode, a cathode
disposed over the OLED material and extending under the inorganic
overhang structures adjacent to each sub-pixel, and an
encapsulation layer disposed over the cathode. The encapsulation
layer extends under at least a portion of the inorganic overhang
structures and along a sidewall of the inorganic overhang
structures.
Inventors: |
CHOUNG; Ji-young;
(Hwaseong-si, KR) ; HAAS; Dieter; (San Jose,
CA) ; LIN; Yu Hsin; (Zhubei City, TW) ; LEE;
Jungmin; (Santa Clara, CA) ; YOO; Seong Ho;
(San Ramon, CA) ; KIM; Si Kyoung; (Gwangju-si,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Applied Materials, Inc. |
Santa Clara |
CA |
US |
|
|
Family ID: |
1000005478759 |
Appl. No.: |
17/193321 |
Filed: |
March 5, 2021 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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63075025 |
Sep 4, 2020 |
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|
63084445 |
Sep 28, 2020 |
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63075028 |
Sep 4, 2020 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 51/56 20130101;
H01L 51/5237 20130101; H01L 27/3246 20130101 |
International
Class: |
H01L 27/32 20060101
H01L027/32; H01L 51/52 20060101 H01L051/52; H01L 51/56 20060101
H01L051/56 |
Claims
1. A device, comprising: a substrate; adjacent pixel-defining layer
(PDL) structures disposed over the substrate and defining
sub-pixels of the device; inorganic overhang structures disposed
over an upper surface of the PDL structures, wherein each of the
inorganic overhang structures comprises: a lower layer disposed as
a single body over the upper surface of a PDL structure of the PDL
structures, the lower layer comprising a first composition of a
conductive inorganic material; and an upper portion comprising a
second composition different than the first composition, the upper
portion disposed over the lower layer, the upper portion including
first and second extensions extending laterally past first and
second sidewalls of the lower layer, respectively; and a first
sub-pixel comprising: a first anode; a first organic light-emitting
diode (OLED) material disposed over and in contact with the first
anode; a first cathode disposed over the first OLED material, the
first cathode extending under the first extension of the upper
portion of a first inorganic overhang structure and contacting the
conductive inorganic material of the first composition of the lower
layer at the first sidewall of the first inorganic overhang
structure of the inorganic overhang structures; and a first
encapsulation layer disposed over the first cathode, wherein the
first encapsulation layer extends: to contact the conductive
inorganic material of the first composition of the lower layer of
the first inorganic overhang structure at the first sidewall; to
contact the second composition of the upper portion of the first
inorganic overhang structure at a first underside surface of the
first extension such that a first area is defined between the first
encapsulation layer on the first underside surface and the first
encapsulation layer over the first cathode; and over at least a
first portion of a top surface of the upper portion of the first
inorganic overhang structure; and a second sub-pixel comprising: a
second anode; a second OLED material disposed over and in contact
with the second anode; a second cathode disposed over the second
OLED material, the second cathode extending under the second
extension of the upper portion of the first inorganic overhang
structure; and a second encapsulation layer disposed over the
second cathode, wherein the second encapsulation layer extends: to
contact the conductive inorganic material of the first composition
of the lower layer of the first inorganic overhang structure at the
second sidewall; to contact the second composition of the upper
portion of the first inorganic overhang structure at a second
underside surface of the second extension such that a second area
is defined between the second encapsulation layer on the second
underside surface and the second encapsulation layer over the
second cathode; and over at least a second portion of the top
surface of the upper portion of the first inorganic overhang
structure.
2-4. (canceled)
5. The device of claim 1, wherein: the first OLED material is
defined by a first underside edge of the first extension of the of
the upper portion such that the first OLED material does not
contact the lower layer of the first inorganic overhang structure;
and the first cathode is defined by the first underside edge of the
upper portion of the first inorganic overhang structure.
6. The device of claim 1, wherein: the upper portion comprising the
second composition includes a non-conductive inorganic material or
the conductive inorganic material, the non-conductive inorganic
material comprising an inorganic silicon-containing material and
the conductive inorganic material comprising a metal-containing
material.
7. The device of claim 1, wherein the first sub-pixel further
comprises a first plug disposed over the first encapsulation layer,
the first plug having a plug transmittance that is matched or
substantially matched to an OLED transmittance of the first OLED
material.
8-11. (canceled)
12. The device of claim 1, further comprising a global passivation
layer disposed over the inorganic overhang structures, the first
encapsulation layer, and the second encapsulation layer.
13-15. (canceled)
16. The device of claim 23, wherein: the first OLED material is
defined by the first underside edge of the upper portion such that
the first OLED material does not contact the lower layer of the
first inorganic overhang structure; and the first cathode is
defined by the first underside edge of the upper portion of the
first inorganic overhang structure.
17-19. (canceled)
20. The OLED display of claim 23, wherein: the first OLED material
forms an OLED angle .theta..sub.OLED between a first OLED vector
and a first overhang vector, the first overhang vector defined by
the first underside edge and a respective PDL structure, the OLED
vector defined by an edge of the first OLED material and the first
underside edge; and the first cathode forms a first cathode angle
.theta..sub.cathode between a first cathode vector and the overhang
vector, the first cathode vector defined by the edge of the first
cathode and the first underside edge.
21. (canceled)
22. (canceled)
23. A device, comprising: a substrate; adjacent pixel-defining
layer (PDL) structures disposed over the substrate and defining
sub-pixels of the device; inorganic overhang structures disposed
over an upper surface of the PDL structures, wherein each of the
inorganic overhang structures comprises: a lower layer disposed as
a single body over the upper surface of a PDL structure of the PDL
structures, the lower layer comprising a first composition of a
conductive inorganic material; and an upper portion comprising a
second composition different than the first composition, the upper
portion disposed over the lower layer, the upper portion including
first and second extensions extending laterally past first and
second sidewalls of the lower layer, respectively; and a first
sub-pixel comprising: a first anode; a first organic light-emitting
diode (OLED) material disposed over and in contact with the first
anode; and a first cathode disposed over the first OLED material,
the first cathode of the first sub-pixel having the first OLED
material configured to emit light of a first color when energized,
the first cathode extending under the first extension of the upper
portion of a first inorganic overhang structure and contacting the
conductive inorganic material of the first composition of the lower
layer at the first sidewall of the first inorganic overhang
structure of the inorganic overhang structures; a first
encapsulation layer disposed over the first cathode, wherein the
first encapsulation layer extends: to contact the conductive
inorganic material of the first composition of the lower layer of
the first inorganic overhang structure at the first sidewall; to
contact the second composition of the upper portion of the first
inorganic overhang structure at a first underside surface of the
first extension; and over at least a first portion of a top surface
of the upper portion of the first inorganic overhang structure; a
second sub-pixel comprising: a second anode; and a second OLED
material disposed over and in contact with the second anode; a
second cathode disposed over the second OLED material, the second
cathode of the second sub-pixel having the second OLED material
configured to emit light of a second color when energized, the
first color being different from the second color, the second
cathode extending under the second extension of the upper portion
of the first inorganic overhang structure; and a second
encapsulation layer disposed over the second cathode, the second
encapsulation layer spaced apart from the first encapsulation
layer, wherein the second encapsulation layer extends: to contact
the conductive inorganic material of the first composition of the
lower layer of the first inorganic overhang structure at the second
sidewall; to contact the second composition of the upper portion of
the first inorganic overhang structure at a second underside
surface of the second extension; and over at least a second portion
of the top surface of the upper portion of the first inorganic
overhang structure; and a global passivation layer disposed over
the inorganic overhang structures and the first and second
sub-pixels.
24. (canceled)
25. An organic light-emitting diode (OLED) display, comprising: a
sub-pixel circuit, the sub-pixel circuit comprising: a substrate;
adjacent pixel-defining layer (PDL) structures disposed over the
substrate and defining sub-pixels of the sub-pixel circuit;
inorganic overhang structures disposed over an upper surface of the
PDL structures, wherein each of the inorganic overhang structures
comprises: a lower layer disposed as a single body over the upper
surface of a PDL structure of the PDL structures, the lower layer
comprising a first composition of a conductive inorganic material;
and an upper portion comprising a second composition different than
the first composition, the upper portion disposed over the lower
layer, the upper portion including first and second extensions
extending laterally past first and second sidewalls of the lower
layer, respectively; a first sub-pixel comprising: a first anode; a
first organic light-emitting diode (OLED) material disposed over
and in contact with the first anode; a first cathode disposed over
the first OLED material, the first cathode extending under the
first extension of the upper portion of a first inorganic overhang
structure and contacting the conductive inorganic material of the
first composition of the lower layer at the first sidewall of the
first inorganic overhang structure of the inorganic overhang
structures; and a first encapsulation layer disposed over the first
cathode, wherein the first encapsulation layer extends: to contact
the conductive inorganic material of the first composition of the
lower layer of the first inorganic overhang structure at the first
sidewall; to contact the second composition of the upper portion of
the first inorganic overhang structure at a first underside surface
of the first extension such that a first area is defined between
the first encapsulation layer on the first underside surface and
the first encapsulation layer over the first cathode; and over at
least a first portion of a top surface of the upper portion of the
first inorganic overhang structure; a second sub-pixel comprising:
a second anode; a second OLED material disposed over and in contact
with the second anode; a second cathode disposed over the second
OLED material, the second cathode extending under the second
extension of the upper portion of the first inorganic overhang
structure; and a second encapsulation layer disposed over the first
cathode, the second encapsulation layer spaced apart from the first
encapsulation layer, wherein the second encapsulation layer
extends: to contact the conductive inorganic material of the first
composition of the lower layer of the first inorganic overhang
structure at the second sidewall; to contact the second composition
of the upper portion of the first inorganic overhang structure at a
second underside surface of the second extension such that a second
area is defined between the second encapsulation layer on the
second underside surface and the second encapsulation layer over
the second cathode; and over at least a second portion of the top
surface of the upper portion of the first inorganic overhang
structure; and a global passivation layer disposed over the
inorganic overhang structures and the first and second
sub-pixels.
26. (canceled)
27. (canceled)
28. The device of claim 1, wherein the first encapsulation layer is
separated from the second encapsulation layer by a discontinuity,
the discontinuity between the first encapsulation layer and the
second encapsulation layer over the top surface of the upper
portion of the first overhang structure.
29. The device of claim 1, wherein the first and second
encapsulation layers contact the top surface of the upper portion
of the first overhang structure.
30. The device of claim 1, wherein the first and second
encapsulation layers include a non-conductive inorganic
material.
31. The device of claim 1, wherein the non-conductive inorganic
material includes a silicon-containing material.
32. The device of claim 1, wherein: the inorganic overhang
structures are disposed on the upper surface of the PDL structures;
the lower layer is disposed as the single body on the upper surface
of the PDL structure of the PDL structures; and the upper portion
disposed on the lower layer.
33. The device of claim 1, wherein the second cathode contacts the
conductive inorganic material of the second composition of the
lower layer at the second sidewall of the first inorganic overhang
structure of the inorganic overhang structures.
34. The device of claim 1, wherein the single body is a composition
of indium tin oxide.
35. The device of claim 1, wherein the single body includes copper,
titanium, aluminum, molybdenum, silver, indium tin oxide, indium
zinc oxide, or combinations thereof.
36. The device of claim 1, wherein: the first encapsulation layer
is disposed over a first upper sidewall of the upper portion of the
first inorganic overhang structure; and the second encapsulation
layer is disposed over a second upper sidewall of the upper portion
of the first inorganic overhang structure.
37. The device of claim 36, wherein: the first OLED material, the
first cathode, and the first encapsulation layer are disposed over
the first upper sidewall of the upper portion of the first
inorganic overhang structure; and the second OLED material, second
first cathode, and the second encapsulation layer are disposed over
the upper second sidewall of the upper portion of the first
inorganic overhang structure.
38. The device of claim 1, wherein: the first encapsulation layer
is a first passivation layer; and the second encapsulation layer is
a second passivation layer.
39. The device of claim 38, wherein: the first passivation layer is
continuous from the upper portion of the first inorganic overhang
structure, the first underside surface of the first extension, and
to the first cathode at the first sidewall of the first inorganic
overhang structure; and the second passivation layer is continuous
from the upper portion of the first inorganic overhang structure,
the second underside surface of the second extension, and to the
second cathode at second sidewall of the first inorganic overhang
structure.
40. The device of claim 38, wherein the first passivation layer and
the second passivation layer include a non-conductive inorganic
material.
41. The device of claim 40, wherein the non-conductive inorganic
material is a silicon-containing material.
42. The device of claim 28, wherein a first material is disposed
between the second encapsulation layer and the first encapsulation
layer that are spaced apart from each other.
43. The device of claim 42, wherein the first material is an
acrylic material.
44. The device of claim 42, wherein the first material is disposed
in: the first area between the first encapsulation layer on the
first underside surface and the first encapsulation layer over the
first cathode; and the second area between the second encapsulation
layer on the second underside surface and the second encapsulation
layer over the second cathode.
45. The device of claim 7, wherein: the first plug of the first
sub-pixel is disposed in the first area between the first
encapsulation layer on the first underside surface and the first
encapsulation layer over the first cathode; and the a second plug
of the second sub-pixel is disposed in the second area between the
second encapsulation layer on the second underside surface and the
second encapsulation layer over the second cathode.
46. The device of claim 1, wherein: the first encapsulation layer
is continuous from the upper portion of the first inorganic
overhang structure, the first underside surface of the first
extension, and to the first cathode at the first sidewall of the
first inorganic overhang structure; and the second encapsulation
layer is continuous from the upper portion of the first inorganic
overhang structure, the second underside surface of the second
extension, and to the second cathode at second sidewall of the
first inorganic overhang structure.
47. A device, comprising: a substrate; adjacent pixel-defining
layer (PDL) structures disposed over the substrate and defining
sub-pixels of the device; inorganic overhang structures disposed
over an upper surface of the PDL structures, wherein each of the
inorganic overhang structures comprises: a lower layer disposed as
a single body over the upper surface of a PDL structure of the PDL
structures, the lower layer comprising a first composition of a
conductive inorganic material; and an upper portion comprising a
second composition different than the first composition, the upper
portion disposed over the lower layer, the upper portion including
first and second extensions extending laterally past first and
second sidewalls of the lower layer, respectively; and a first
sub-pixel comprising: a first anode; a first organic light-emitting
diode (OLED) material disposed over and in contact with the first
anode; a first cathode disposed over the first OLED material, the
first cathode extending under the first extension of the upper
portion of a first inorganic overhang structure and contacting the
conductive inorganic material of the first composition of the lower
layer at the first sidewall of the first inorganic overhang
structure of the inorganic overhang structures; and a first
encapsulation layer disposed over the first cathode, wherein the
first encapsulation layer extends: to contact the conductive
inorganic material of the first composition of the lower layer of
the first inorganic overhang structure at the first sidewall; to
contact the second composition of the upper portion of the first
inorganic overhang structure at a first underside surface of the
first extension such that a first area is defined between the first
encapsulation layer on the first underside surface and the first
encapsulation layer over the first cathode; and over at least a
first portion of a top surface of the upper portion of the first
inorganic overhang structure; and a second sub-pixel comprising: a
second anode; a second OLED material disposed over and in contact
with the second anode; a second cathode disposed over the second
OLED material, the second cathode extending under the second
extension of the upper portion of the first inorganic overhang
structure; and a second encapsulation layer disposed over the
second cathode, the second encapsulation layer spaced apart from
the first encapsulation layer, wherein the second encapsulation
layer extends: to contact the conductive inorganic material of the
first composition of the lower layer of the first inorganic
overhang structure at the second sidewall; to contact the second
composition of the upper portion of the first inorganic overhang
structure at a second underside surface of the second extension
such that a second area is defined between the second encapsulation
layer on the second underside surface and the second encapsulation
layer over the second cathode; and over at least a second portion
of the top surface of the upper portion of the first inorganic
overhang structure.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to U.S. Provisional Patent
Application Ser. No. 63/075,025, filed on Sep. 4, 2020, which is
herein incorporated by reference.
BACKGROUND
Field
[0002] Embodiments described herein generally relate to a display.
More specifically, embodiments described herein relate to sub-pixel
circuits and methods of forming sub-pixel circuits that may be
utilized in a display such as an organic light-emitting diode
(OLED) display.
Description of the Related Art
[0003] Input devices including display devices may be used in a
variety of electronic systems. An organic light-emitting diode
(OLED) is a light-emitting diode (LED) in which the emissive
electroluminescent layer is a film of an organic compound that
emits light in response to an electric current. OLED devices are
classified as bottom emission devices if light emitted passes
through the transparent or semi-transparent bottom electrode and
substrate on which the panel was manufactured. Top emission devices
are classified based on whether or not the light emitted from the
OLED device exits through the lid that is added following the
fabrication of the device. OLEDs are used to create display devices
in many electronics today. Today's electronics manufacturers are
pushing these display devices to shrink in size while providing
higher resolution than just a few years ago.
[0004] OLED pixel patterning is currently based on a process that
restricts panel size, pixel resolution, and substrate size. Rather
than utilizing a fine metal mask, photo lithography should be used
to pattern pixels. Currently, OLED pixel patterning requires
lifting off organic material after the patterning process. When
lifted off, the organic material leaves behind a particle issue
that disrupts OLED performance. Accordingly, what is needed in the
art are sub-pixel circuits and methods of forming sub-pixel
circuits to increase pixel-per-inch and provide improved OLED
performance.
SUMMARY
[0005] In one embodiment, a device is provided. The device includes
a substrate, adjacent pixel-defining layer (PDL) structures
disposed over the substrate and defining sub-pixels of the device,
inorganic overhang structures disposed on an upper surface of the
PDL structures, and a plurality of sub-pixels. Each sub-pixel
includes an anode, an organic light-emitting diode (OLED) material
disposed over and in contact with the anode, a cathode disposed
over the OLED material and extending under the inorganic overhang
structures adjacent to each sub-pixel, and an encapsulation layer
disposed over the cathode. The encapsulation layer extends under at
least a portion of the inorganic overhang structures and along a
sidewall of the inorganic overhang structures.
[0006] In another embodiment, a device is provided. The device
includes a substrate, adjacent pixel-defining layer (PDL)
structures disposed over the substrate and defining sub-pixels of
the device, inorganic overhang structures disposed on an upper
surface of the PDL structures, and a plurality of sub-pixels. Each
sub-pixel includes an anode, an organic light-emitting diode (OLED)
material disposed over and in contact with the anode, a cathode
disposed over the OLED material and extending under the inorganic
overhang structures adjacent to each sub-pixel, and an
encapsulation layer disposed over the cathode. The cathode contacts
one or more of an assistant cathode disposed under the inorganic
overhang structures or part of a sidewall under the inorganic
overhang structures. The encapsulation layer extends under at least
a portion of the inorganic overhang structures and along a sidewall
of the inorganic overhang structures.
[0007] In yet another embodiment, a device is provided. The device
includes a substrate, a substrate, adjacent pixel-defining layer
(PDL) structures disposed over the substrate and defining
sub-pixels of the device, inorganic overhang structures disposed on
an upper surface of the PDL structures, and a plurality of
sub-pixels. Each inorganic overhang structure has a lower portion
disposed on a upper surface of a PDL structure of the PDL
structures, and a upper portion disposed on the lower portion, the
upper portion including an underside edge extending past a sidewall
of the lower portion. Each sub-pixel includes an anode, an organic
light-emitting diode (OLED) material disposed over the anode, the
OLED material having an OLED edge defined by the underside edge of
the upper portion such that the OLED material does not contact the
lower portion, and a cathode disposed over the OLED material, the
cathode having an cathode edge defined by the underside edge of the
upper portion such that the extending under the upper portion and
cathode contacts one or more of an assistant cathode disposed under
the lower portion or part of the sidewall of the lower portion.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] So that the manner in which the above recited features of
the present disclosure can be understood in detail, a more
particular description of the disclosure, briefly summarized above,
may be had by reference to embodiments, some of which are
illustrated in the appended drawings. It is to be noted, however,
that the appended drawings illustrate only exemplary embodiments
and are therefore not to be considered limiting of its scope, and
may admit to other equally effective embodiments.
[0009] FIG. 1A is a schematic, cross-sectional view of a sub-pixel
circuit having a plugless arrangement according to embodiments.
[0010] FIG. 1B is a schematic, cross-sectional view of a sub-pixel
circuit having a plug arrangement according to embodiments.
[0011] FIG. 1C is a schematic, top sectional view of a sub-pixel
circuit having a dot-type architecture according to
embodiments.
[0012] FIG. 1D is a schematic, cross-sectional view of a sub-pixel
circuit having a line-type architecture according to
embodiments.
[0013] FIG. 2 is a schematic, cross-sectional view of an inorganic
overhang structure of a sub-pixel circuit according to
embodiments.
[0014] FIG. 3 is a flow a flow diagram of an on-demand method for
forming a sub-pixel circuit according to embodiments.
[0015] FIGS. 4A-4O are schematic, cross-sectional views of a
substrate during a method for forming a sub-pixel circuit according
embodiments.
[0016] FIGS. 4P-4W are schematic, cross-sectional views of a
substrate during a method for forming a sub-pixel circuit according
embodiments.
[0017] FIG. 5 is a flow a flow diagram of an on-demand half-tone
lithography method for forming a sub-pixel circuit according to
embodiments.
[0018] FIG. 6 is a flow a flow diagram of a one-step method for
forming a sub-pixel circuit according to embodiments.
[0019] FIGS. 7A-7L are schematic, cross-sectional views of a
substrate during a method for forming a sub-pixel circuit according
embodiments described herein.
[0020] To facilitate understanding, identical reference numerals
have been used, where possible, to designate identical elements
that are common to the figures. It is contemplated that elements
disclosed in one embodiment may be beneficially utilized on other
embodiments without specific recitation.
DETAILED DESCRIPTION
[0021] Embodiments described herein generally relate to a display.
More specifically, embodiments described herein relate to sub-pixel
circuits and methods of forming sub-pixel circuits that may be
utilized in a display such as an organic light-emitting diode
(OLED) display. In one embodiment, which can be combined with other
embodiments described herein, the display is a bottom emission (BE)
or a top emission (TE) OLED display. In another embodiment, which
can be combined with other embodiments described herein, the
display is a passive-matrix (PM) or an active matrix (AM) OLED
display.
[0022] A first exemplary embodiment of the embodiments described
herein includes a sub-pixel circuit having a dot-type architecture.
A second exemplary embodiment of the embodiments described herein
includes a sub-pixel circuit having a line-type architecture. A
third exemplary embodiment of the embodiments described herein
includes a sub-pixel circuit having a dot-type architecture with a
plug disposed on an encapsulation layer of a respective sub-pixel.
A fourth exemplary embodiment of the embodiments described herein
includes a sub-pixel circuit having a line-type architecture with a
plug disposed on an encapsulation layer of a respective sub-pixel.
A fifth exemplary embodiment of the embodiments described herein
includes an on-demand method to fabricate a sub-pixel circuit of
one of the first, second, third, or fourth exemplary embodiments. A
sixth exemplary embodiment of the embodiments described herein
includes an on-demand half-tone lithography method to fabricate a
sub-pixel circuit of one of the first and second exemplary
embodiments. A seventh exemplary embodiment of the embodiments
described herein includes a one-step method to fabricate a
sub-pixel circuit of one of the first, second, third, or fourth
exemplary embodiments.
[0023] Each of the embodiments (including the first-seventh
exemplary embodiments) described herein of the sub-pixel circuit
include a plurality of sub-pixels with each of the sub-pixels
defined by adjacent inorganic overhang structures that are
permanent to the sub-pixel circuit. While the Figures depict two
sub-pixels with each sub-pixel defined by adjacent inorganic
overhang structures, the sub-pixel circuit of the embodiments
described herein include a plurality of sub-pixels, such as two or
more sub-pixels. Each sub-pixel has the OLED material configured to
emit a white, red, green, blue or other color light when energized.
E.g., the OLED material of a first sub-pixel emits a red light when
energized, the OLED material of a second sub-pixel emits a green
light when energized, and the OLED material of a third sub-pixel
emits a blue light when energized.
[0024] The inorganic overhang structures are permanent to the
sub-pixel circuit and include at least an upper portion disposed on
a lower portion. A first configuration of the inorganic overhang
structures includes the upper portion of a non-conductive inorganic
material and the lower portion of a conductive inorganic material.
A second configuration of the inorganic overhang structures
includes the upper portion of a conductive inorganic material and
the lower portion of a conductive inorganic material. A third
configuration of the inorganic overhang structures includes the
upper portion of a non-conductive inorganic material, the lower
portion of a non-conductive inorganic material, and an assistant
cathode disposed under the lower portion. A fourth configuration of
the inorganic overhang structures includes the upper portion of a
conductive inorganic material, the lower portion of a
non-conductive inorganic material, and an assistant cathode
disposed under the lower portion. Any of the first, second, third,
and fourth exemplary embodiments include inorganic overhang
structures of at least one of the first, second, third, or fourth
configurations.
[0025] The adjacent inorganic overhang structures defining each
sub-pixel of the sub-pixel circuit of the display provide for
formation of the sub-pixel circuit using evaporation deposition and
provide for the inorganic overhang structures to remain in place
after the sub-pixel circuit is formed (e.g., utilizing the methods
of the fifth, sixth, or seventh exemplary embodiments). Evaporation
deposition may be utilized for deposition of an OLED material
(including a hole injection layer (HIL), a hole transport layer
(HTL), an emissive layer (EML), and an electron transport layer
(ETL)) and cathode. One or more of an encapsulation layer, the
plug, and a global passivation layer may be disposed via
evaporation deposition. In embodiments including one or more
capping layers, the capping layers are disposed between the cathode
and the encapsulation layer. The inorganic overhang structures
define deposition angles, i.e., provide for a shadowing effect
during evaporation deposition, for each of the OLED material and
the cathode such the OLED material does not contact the lower
portion (and assistant cathode according to embodiments with the
third and fourth configurations) and the cathode contacts the lower
portion according to the first and second configurations or at
least the assistant cathode of the third and fourth configurations.
The encapsulation layer of a respective sub-pixel is disposed over
the cathode with the encapsulation layer extending under at least a
portion of each of the adjacent inorganic overhang structures and
along a sidewall of each of the adjacent inorganic overhang
structures.
[0026] FIG. 1A is a schematic, cross-sectional view of a sub-pixel
circuit 100 having a plugless arrangement 101A. The plugless
arrangement 101A may correspond to the first or second exemplary
embodiments of the sub-pixel circuit 100. FIG. 1B is a schematic,
cross-sectional view of a sub-pixel circuit 100 having a plug
arrangement 101B. The plug arrangement 101B may correspond to the
third or fourth exemplary embodiments of the sub-pixel circuit 100.
Each of the cross-sectional views of FIGS. 1A and 1B are taken
along section line 1''-1'' of FIGS. 1C and 1D.
[0027] The sub-pixel circuit 100 includes a substrate 102. Metal
layers 104 may be patterned on the substrate 102 and are defined by
adjacent pixel-defining layer (PDL) structures 126 disposed on the
substrate 102. In one embodiment, which can be combined other
embodiments described herein, the metal layers 104 are
pre-patterned on the substrate 102. E.g., the substrate 102 is a
pre-patterned indium tin oxide (ITO) glass substrate. The metal
layers 104 are configured to operate anodes of respective
sub-pixels. The metal layers 104 include, but are not limited to,
chromium, titanium, gold, silver, copper, aluminum, ITO, a
combination thereof, or other suitably conductive materials.
[0028] The PDL structures 126 are disposed on the substrate 102.
The PDL structures 126 include one of an organic material, an
organic material with an inorganic coating disposed thereover, or
an inorganic material. The organic material of the PDL structures
126 includes, but is not limited to, polyimides. The inorganic
material of the PDL structures 126 includes, but is not limited to,
silicon oxide (SiO.sub.2), silicon nitride (Si.sub.3N.sub.4),
silicon oxynitride (Si.sub.2N.sub.2O), magnesium fluoride
(MgF.sub.2), or combinations thereof. Adjacent PDL structures 126
define a respective sub-pixel and expose the anode (i.e., metal
layer 104) of the respective sub-pixel of the sub-pixel circuit
100.
[0029] The sub-pixel circuit 100 has a plurality of sub-pixels 106
including at least a first sub-pixel 108a and a second sub-pixel
108b. While the Figures depict the first sub-pixel 108a and the
second sub-pixel 108b. The sub-pixel circuit 100 of the embodiments
described herein may include two or more sub-pixels 106, such as a
third and a fourth sub-pixel. Each sub-pixel 106 has an OLED
material 112 configured to emit a white, red, green, blue or other
color light when energized. E.g., the OLED material 112 of the
first sub-pixel 108a emits a red light when energized, the OLED
material of the second sub-pixel 108b emits a green light when
energized, the OLED material of a third sub-pixel emits a blue
light when energized, and the OLED material of a fourth sub-pixel
emits a other color light when energized
[0030] Inorganic overhang structures 110 are disposed on an upper
surface 103 of each of the PDL structures 126. The inorganic
overhang structures 110 are permanent to the sub-pixel circuit. The
inorganic overhang structures 110 further define each sub-pixel 106
of the sub-pixel circuit 100. The inorganic overhang structures 110
include at least an upper portion 1106 disposed on a lower portion
110A. A first configuration of the inorganic overhang structures
110 includes the upper portion 1106 of a non-conductive inorganic
material and the lower portion 110A of a conductive inorganic
material. A second configuration of the inorganic overhang
structures 110 includes the upper portion 1106 of a conductive
inorganic material and the lower portion 110A of a conductive
inorganic material. A third configuration of the inorganic overhang
structures 110 includes the upper portion 1106 of a non-conductive
inorganic material, the lower portion 110A of a non-conductive
inorganic material, and an assistant cathode 202 (shown in FIG. 2)
disposed under the lower portion 110A. A fourth configuration of
the inorganic overhang structures 110 includes the upper portion
1106 of a conductive inorganic material, the lower portion 110A of
a non-conductive inorganic material, and an assistant cathode 202
disposed under the lower portion 110A. The first, second, third,
and fourth exemplary embodiments of the sub-pixel circuit 100
include inorganic overhang structures 110 of at least one of the
first, second, third, or fourth configurations. The inorganic
overhang structures 110 are able to remain in place, i.e., are
permanent. Thus, organic material from lifted off overhang
structures that disrupt OLED performance would not be left behind.
Eliminating the need for a lift-off procedure also increases
throughput.
[0031] The non-conductive inorganic material includes, but it not
limited to, an inorganic silicon-containing material. E.g., the
silicon-containing material includes oxides or nitrides of silicon,
or combinations thereof. The conductive inorganic material
includes, but it not limited to, a metal-containing material. E.g.,
the metal-containing material includes copper, titanium, aluminum,
molybdenum, silver, indium tin oxide, indium zinc oxide, or
combinations thereof.
[0032] At least a bottom surface 107 of the upper portion 1106 is
wider than a top surface 105 of the lower portion 110A to form an
overhang 109. The bottom surface 107 larger than the top surface
105 forming the overhang 109 allows for the upper portion 1106 to
shadow the lower portion 110A. The shadowing of the overhang 109
provides for evaporation deposition each of the OLED material 112
and a cathode 114. As further discussed in the corresponding
description of FIG. 2, the shadowing effect of the inorganic
overhang structures 110 define a OLED angle .theta..sub.OLED (shown
in FIG. 2) of the OLED material 112 and a cathode angle
.theta..sub.cathode (shown in FIG. 2) of the cathode 114. The OLED
angle .theta..sub.OLED of the OLED material 112 and the cathode
angle .theta..sub.cathode of the cathode 114 may result from
evaporation deposition of the OLED material 112 and the cathode
114. In the first and second configurations, the OLED material 112
does not contact and the cathode 114 contacts the lower portion
110A of the inorganic overhang structures 110. In the third and
fourth configurations, the OLED material 112 does not contact the
lower portion 110A and the assistant cathode 202, and the cathode
114 contacts at least the assistant cathode 202. In another
configurations, the lower portion 110A is non-conductive and the
assistant cathode 202 is not included. In this configuration the
cathode 114 contacts busbars (not shown) outside of an active area
of the sub-pixel circuit 100.
[0033] The OLED material 112 may include one or more of a HIL, a
HTL, an EML, and an ETL. The OLED material 112 is disposed on the
metal layer 104. In some embodiments, which can be combined with
other embodiments described herein, the OLED material 112 is
disposed on the metal layer 104 and over a portion of the PDL
structures 126. The cathode 114 is disposed over the OLED material
112 of the PDL structures 126 in each sub-pixel 106. The cathode
114 may be disposed on a portion of a sidewall 111 of the lower
portion 110A. The cathode 114 and the assistant cathode 202 include
a conductive material, such as a metal. E.g., the cathode 114
and/or the assistant cathode 202 include, but are not limited to,
chromium, titanium, aluminum, ITO, or a combination thereof. In
some embodiments, which can be combined with other embodiments
described herein, the OLED material 112 and the cathode 114 are
disposed over a sidewall 113 of the upper portion 1106 of the
inorganic overhang structures 110. In other embodiments, which can
be combined with other embodiments described herein, the OLED
material 112 and the cathode 114 are disposed over a top surface
115 of the upper portion 1106 of the inorganic overhang structures
110.
[0034] Each sub-pixel 106 includes include an encapsulation layer
116. The encapsulation layer 116 may be or may correspond to a
local passivation layer. The encapsulation layer 116 of a
respective sub-pixel is disposed over the cathode 114 (and OLED
material 112) with the encapsulation layer 116 extending under at
least a portion of each of the inorganic overhang structures 110
and along a sidewall of each of the inorganic overhang structures
110. The encapsulation layer 116 is disposed over the cathode 114
and over at least the sidewall 111 of the lower portion 110A. In
some embodiments, which can be combined with other embodiments
described herein, the encapsulation layer 116 is disposed over the
sidewall 113 of the upper portion 1106. In some embodiments, which
can be combined with other embodiments described herein, the
encapsulation layer 116 is disposed over the top surface 115 of the
upper portion 1106 of the inorganic overhang structures 110. The
encapsulation layer 116 includes the non-conductive inorganic
material, such as the silicon-containing material. The
silicon-containing material may include Si.sub.3N.sub.4 containing
materials.
[0035] In embodiments including one or more capping layers, the
capping layers are disposed between the cathode 114 and the
encapsulation layer 116. E.g., as shown in FIG. 1A, a first capping
layer 121 and a second capping layer 123 are disposed between the
cathode 114 and the encapsulation layer 116. While FIG. 1A depicts
the sub-pixel circuit 100 having one or more capping layers, each
of the embodiments described herein may include one or more capping
layers disposed between the cathode 114 and the encapsulation layer
116. The first capping layer 121 may include an organic material.
The second capping layer 123 may include an inorganic material,
such as lithium fluoride. The first capping layer 121 and the
second capping layer 123 may be deposited by evaporation
deposition.
[0036] The plugless arrangement 101A and the plug arrangement 101B
of the sub-pixel circuit 100 further include at least a global
passivation layer 120 disposed over the inorganic overhang
structures 110 and the encapsulation layers 116. An inkjet layer
118 may be disposed between the global passivation layer 120 and
the inorganic overhang structures 110 and the encapsulation layers
116. The inkjet layer 118 may include an acrylic material. The plug
arrangement 101B (including the third and fourth exemplary
embodiments) may include an intermediate passivation layer disposed
over the inorganic overhang structures 110 and plugs 122 of each of
the sub-pixels 106, and disposed between the inkjet layer 118 and
the global passivation layer 120.
[0037] The plug arrangement 101B, including the third and fourth
exemplary embodiments, includes plugs 122 disposed over the
encapsulation layers 116. Each plug 122 is disposed in a respective
sub-pixel 106 of the sub-pixel circuit 100. The plugs 122 may be
disposed over the top surface 115 of the upper portion 110B of the
inorganic overhang structures 110. The plugs 122 may have an
additional passivation layer disposed thereon (as shown in FIG.
4Q). The plugs 122 include, but are not limited to, a photoresist,
a color filter, or a photosensitive monomer. The plugs 122 have a
plug transmittance that is matched or substantially matched to an
OLED transmittance of the OLED material 112. The plugs 122 may each
be the same material and match the OLED transmittance. The plugs
122 may be different materials that match the OLED transmittance of
each respective sub-pixel of the plurality of sub-pixels 106. The
matched or substantially matched resist transmittance and OLED
transmittance allow for the plugs 122 to remain over the sub-pixels
106 without blocking the emitted light from the OLED material 112.
The plugs 122 are able to remain in place and thus do not require a
lift off procedure to be removed from the sub-pixel circuit 100.
Additional pattern resist materials disposed over the formed
sub-pixels 106 at subsequent operations are not required because
the plugs 122 remain. Eliminating the need for a lift-off procedure
on the plugs 122 and the need for additional pattern resist
materials on the sub-pixel circuit 100 increases throughput.
[0038] FIG. 1C is a schematic, top sectional view of a sub-pixel
circuit 100 having a dot-type architecture 101C. The dot-type
architecture 101C may correspond to the first or third exemplary
embodiments of the sub-pixel circuit 100. FIG. 1D is a schematic,
cross-sectional view of a sub-pixel circuit 100 having a line-type
architecture 101D. The line-type architecture 101D may correspond
to the second or fourth exemplary embodiments of the sub-pixel
circuit 100. Each of the top sectional views of FIGS. 1C and 1D are
taken along section line 1'-1' of FIGS. 1A and 1B.
[0039] The dot-type architecture 101C includes a plurality of pixel
openings 124A. Each of pixel opening 124A is surrounded by
inorganic overhang structures 110 that define each of the
sub-pixels 106 of the dot-type architecture 101C. The line-type
architecture 101D includes a plurality of pixel openings 124B. Each
of pixel opening 124B is abutted by inorganic overhang structures
110 that define each of the sub-pixels 106 of the line-type
architecture 101D. Each of an on-demand method 300, an on-demand
half-tone lithography method 500, and an one-step method 600 of
fabricating a sub-pixel circuit 100 described herein provide for
the ability to fabricate both the sub-pixel circuit 100 with the
dot-type architecture 101C and the sub-pixel circuit 100 with the
line-type architecture 101D.
[0040] FIG. 2 is a schematic, cross-sectional view of an inorganic
overhang structure 110 of a sub-pixel circuit 100. While FIG. 2
depicts the third and fourth configurations of the inorganic
overhang structures 110, the description herein is applicable to
the first configuration of the inorganic overhang structures 110
including the upper portion 110B of a non-conductive inorganic
material and the lower portion 110A of a conductive inorganic
material, and the second configuration of the inorganic overhang
structures 110 including the upper portion 110B of a conductive
inorganic material and the lower portion 110A of a conductive
inorganic material. In the first and second configurations, the
OLED material 112 does not contact and the cathode 114 contacts the
lower portion 110A of the inorganic overhang structures 110. In the
third and fourth configurations, the OLED material 112 does not
contact the lower portion 110A and the assistant cathode 202, and
the cathode 114 contacts at least the assistant cathode 202.
[0041] The upper portion 1106 includes an underside edge 206 and an
overhang vector 208. The underside edge 206 extends past the
sidewall 111 of the lower portion 110A. The overhang vector 208 is
defined by the underside edge 206 and the PDL structure 126. The
OLED material 112 is disposed over the anode and over a shadow
portion 210 of the PDL structure 126. The OLED material 112 forms
an OLED angle % LED between an OLED vector 212 and the overhang
vector 208. The OLED vector 212 is defined by an OLED edge 214
extending under the upper portion 1106 and the underside edge 206
of the upper portion 1106. In one embodiment, which can be combined
with other embodiments described herein, a HIL 204 of the OLED
material 112 included. In the embodiment including the HIL 204, the
OLED material 112 includes the HTL, the EML, and the ETL. The HIL
204 forms an HIL angle .theta..sub.HIL between a HIL vector 216 and
the overhang vector 208. The HIL vector 216 is defined by an HIL
edge 218 extending under the upper portion 1106 and the underside
edge 206 of the upper portion 1106.
[0042] The cathode 114 is disposed over the OLED material 112 and
over the shadow portion 210 of the PDL structure 126. In some
embodiments, which can be combined with other embodiments described
herein, the cathode 114 is disposed on a portion 220 of the
sidewall 111 of the lower portion 110A. In other embodiments, which
can be combined with other embodiments described herein, the
cathode 114 contacts a portion 222 of the assistant cathode 202 on
the shadow portion 210 of the PDL 126. In the embodiments with the
cathode 114 contacting the portion 222 of the assistant cathode
202, the cathode 114 may also contact the portion 220 of the
sidewall 111 of the lower portion 110A. The cathode 114 forms a
cathode angle .theta..sub.cathode between a cathode vector 224 and
the overhang vector 208. The cathode vector 224 is defined by a
cathode edge 226 at least extending under the upper portion 1106
and the underside edge 206 of the upper portion 1106. The
encapsulation layer 116 is disposed over the cathode 114 (and OLED
material 112) with the encapsulation layer 116 extending at least
under the upper portion 110B of the inorganic overhang structure
110 and along the sidewall 111 of the lower portion 110A.
[0043] During evaporation deposition of the OLED material 112, the
underside edge 206 of the upper portion 110B defines the position
of the OLED edge 214. E.g., the OLED material 112 is evaporated at
an OLED maximum angle that corresponds to the OLED vector 212 and
the underside edge 206 ensures that the OLED material 112 is not
deposited past the OLED edge 214. In embodiments with the HIL 204,
the underside edge 206 of the upper portion 110B defines the
position of the HIL edge 218. E.g., the HIL 204 is evaporated at an
HIL maximum angle that corresponds to the HIL vector 216 and the
underside edge 206 ensures that HIL 204 is not deposited past the
HIL edge 218. During evaporation deposition of the cathode 114, the
underside edge 206 of the upper portion 110B defines the position
of the cathode edge 226. E.g., the cathode 114 is evaporated at a
cathode maximum angle that corresponds to the cathode vector 224
and the underside edge 206 ensures that the cathode 114 is not
deposited past the cathode edge 226. The OLED angle
.theta..sub.OLED is less than the cathode angle
.theta..sub.cathode. The HIL angle .theta..sub.HIL is less than the
OLED angle % LED.
[0044] FIG. 3 is a flow a flow diagram of an on-demand method 300
for forming a sub-pixel circuit 100. The on-demand method 300
corresponds to the on-demand method to fabricate a sub-pixel
circuit 100 of one of the first, second, third, or fourth exemplary
embodiments. FIGS. 4A-4O are schematic, cross-sectional views of a
substrate 102 during the method 300 for forming the sub-pixel
circuit 100 according embodiments described herein. FIGS. 4A-4F,
4H, 4J, 4L, and 4N correspond to the plugless arrangement 101A of
the first or second exemplary embodiments of the sub-pixel circuit
100. FIGS. 4A-4E, 4G, 4I, 4K, 4M, and 4O correspond to the plug
arrangement 101B of the third or fourth exemplary embodiments of
the sub-pixel circuit 100.
[0045] At operation 301, as shown in FIG. 4A, a lower portion layer
402A and an upper portion layer 402B are deposited over the
substrate 102. The lower portion layer 402A is disposed over the
PDL structures 126 and the metal layers 104. The upper portion
layer 402B is disposed over the lower portion layer 402A. The lower
portion layer 402A corresponds to the lower portion 110A and the
upper portion layer 402B corresponds to the upper portion 110B of
the inorganic overhang structures 110. In embodiments including the
third and fourth configurations of the inorganic overhang
structures 110, an assistant cathode layer 404 is disposed between
the lower portion layer 402A and the PDL structures 126 and the
metal layers 104.
[0046] At operation 302, as shown in FIG. 4B, a resist 406 is
disposed and patterned. The resist 406 is disposed over the upper
portion layer 402B. The resist 406 is a positive resist or a
negative resist. A positive resist includes portions of the resist,
which, when exposed to electromagnetic radiation, are respectively
soluble to a resist developer applied to the resist after the
pattern is written into the resist using the electromagnetic
radiation. A negative resist includes portions of the resist,
which, when exposed to radiation, will be respectively insoluble to
the resist developer applied to the resist after the pattern is
written into the resist using the electromagnetic radiation. The
chemical composition of the resist 406 determines whether the
resist is a positive resist or a negative resist. The resist 406 is
patterned to form one of a pixel opening 124A of the dot-type
architecture 101C or a pixel opening 124B of the line-type
architecture 101D of a first sub-pixel 108a. The patterning is one
of a photolithography, digital lithography process, or laser
ablation process.
[0047] At operation 303, as shown in FIG. 4C, portions of the upper
portion layer 402B and the lower portion layer 402A exposed by the
pixel opening 124A, 124B are removed. The upper portion layer 402B
exposed by the pixel opening 124A, 124B may be removed a dry etch
process. The lower portion layer 402A exposed by the pixel opening
124A, 124B may be removed by a wet etch process. In embodiments
including the assistant cathode layer 404, a portion of the
assistant cathode layer 404 may be removed by a dry etch process or
a wet etch process to form the assistant cathode 202 disposed under
the lower portion 110A. Operation 303 forms the inorganic overhang
structures 110 of the first sub-pixel 108a. The etch selectivity of
the between the materials of the upper portion layer 402B
corresponding to the upper portion 110B and the lower portion layer
402A corresponding to the lower portion 110A and the etch processes
to remove the exposed portions of the upper portion layer 402B and
the lower portion layer 402A provide for the bottom surface 107 of
the upper portion 110B being wider than the top surface 105 of the
lower portion 110A to form the overhang 109 (as shown in FIGS. 1A,
1B, and 2). The shadowing of the overhang 109 provides for
evaporation deposition the OLED material 112 and the cathode
114.
[0048] At operation 304, as shown in FIG. 4D, the OLED material 112
of the first sub-pixel 108a, the cathode 114, and the encapsulation
layer 116 are deposited. The shadowing of the overhang 109 provides
for evaporation deposition each of the OLED material 112 and a
cathode 114. As further discussed in the corresponding description
of FIG. 2, the shadowing effect of the inorganic overhang
structures 110 define the OLED angle .theta..sub.OLED (shown in
FIG. 2) of the OLED material 112 and the cathode angle
.theta..sub.cathode (shown in FIG. 2) of the cathode 114. The OLED
angle .theta..sub.OLED of the OLED material 112 and the cathode
angle .theta..sub.cathode of the cathode 114 result from
evaporation deposition of the OLED material 112 and the cathode
114. In the first and second configurations, the OLED material 112
does not contact and the cathode 114 contacts the lower portion
110A of the inorganic overhang structures 110. In the third and
fourth configurations, the OLED material 112 does not contact the
lower portion 110A and the assistant cathode 202, and the cathode
114 contacts at least the assistant cathode 202. The encapsulation
layer 116 is deposited over the cathode 114. In embodiments
including capping layers, the capping layers are deposited between
the cathode 114 and the encapsulation layer 116. The capping layers
may be deposited by evaporation deposition.
[0049] At operation 305, as shown in FIG. 4E, a resist 408 is
formed in a well 410 of the first sub-pixel 108a. At operation 306,
as shown in FIGS. 4F and 4G, the encapsulation layer 116, the
cathode 114, and the OLED material 112 exposed by the resist 408
are removed. The encapsulation layer 116, the cathode 114, and the
OLED material 112 exposed by resist 408 may be removed by wet etch
processes. According to embodiments with the plugless arrangement
101A of the sub-pixel circuit 100, the resist 408 is removed, as
shown in FIG. 4F. According to embodiments with the plug
arrangement 101B of the sub-pixel circuit 100, the resist 408 is
corresponds to the plug 122 of the first sub-pixel 108a, as shown
in FIG. 4G. At operation 307, as shown in FIGS. 4H and 4I, a resist
412 is disposed and patterned. The resist 412 is disposed over the
upper portion layer 402B and the upper portion 110B of the first
sub-pixel 108a. In embodiments with the plug arrangement 101B, as
shown in FIG. 4I, a passivation layer 414 is disposed at least the
plug 122 of the first sub-pixel 108a. The passivation layer 414 of
the plug arrangement 101B may be disposed over the upper portion
layer 402B and the upper portion 110B of the first sub-pixel 108a.
The resist 412 is patterned to form one of the pixel opening 124A
of the dot-type architecture 101C or the pixel opening 124B of the
line-type architecture 101D of a second sub-pixel 108b.
[0050] At operation 308, portions of the upper portion layer 402B
and the lower portion layer 402A exposed by the pixel opening 124A,
124B of the second sub-pixel 108b are removed. The upper portion
layer 402B exposed by the pixel opening 124A, 124B may be removed a
dry etch process. The lower portion layer 402A exposed by the pixel
opening 124A, 124B may be removed by a wet etch process. In
embodiments including the assistant cathode layer 404, a portion of
the assistant cathode layer 404 may be removed by a dry etch
process or a wet etch process to form the assistant cathode 202
disposed under the lower portion 110A. Operation 308 forms the
inorganic overhang structures 110 of the second sub-pixel 108b. The
etch selectivity of the between the materials of the upper portion
layer 402B corresponding to the upper portion 110B and the lower
portion layer 402A corresponding to the lower portion 110A and the
etch processes to remove the exposed portions of the upper portion
layer 402B and the lower portion layer 402A provide for the bottom
surface 107 of the upper portion 110B being wider than the top
surface 105 of the lower portion 110A to form the overhang 109 (as
shown in FIGS. 1A, 1B, and 2). The shadowing of the overhang 109
provides for evaporation deposition the OLED material 112 and the
cathode 114.
[0051] At operation 309, as shown in FIGS. 4J and 4K, the OLED
material 112 of the second sub-pixel 108b, the cathode 114, and the
encapsulation layer 116 are deposited. In embodiments including
capping layers, the capping layers are deposited between the
cathode 114 and the encapsulation layer 116. The capping layers may
be deposited by evaporation deposition. The shadowing of the
overhang 109 provides for evaporation deposition each of the OLED
material 112 and a cathode 114. As further discussed in the
corresponding description of FIG. 2, the shadowing effect of the
inorganic overhang structures 110 define the OLED angle
.theta..sub.OLED (shown in FIG. 2) of the OLED material 112 and the
cathode angle .theta..sub.cathode (shown in FIG. 2) of the cathode
114. The OLED angle .theta..sub.OLED of the OLED material 112 and
the cathode angle .theta..sub.cathode Of the cathode 114 result
from evaporation deposition of the OLED material 112 and the
cathode 114. In the first and second configurations, the OLED
material 112 does not contact and the cathode 114 contacts the
lower portion 110A of the inorganic overhang structures 110. In the
third and fourth configurations, the OLED material 112 does not
contact the lower portion 110A and the assistant cathode 202, and
the cathode 114 contacts at least the assistant cathode 202. The
encapsulation layer 116 is deposited over the cathode 114.
[0052] At operation 310, as shown in FIGS. 4L and 4M, a resist 416
is formed in a well 418 of the second sub-pixel 108b. At operation
311, as shown in FIGS. 4N and 4O, the encapsulation layer 116, the
cathode 114, and the OLED material 112 exposed by the resist 416
are removed. The encapsulation layer 116, the cathode 114, and the
OLED material 112 exposed by resist 416 may be removed by wet etch
processes. According to embodiments with the plugless arrangement
101A of the sub-pixel circuit 100, the resist 416 is removed, as
shown in FIG. 4F. According to embodiments with the plug
arrangement 101B of the sub-pixel circuit 100, the resist 416 is
corresponds to the plug 122 of the second sub-pixel 108b, as shown
in FIGS. 4G and 4O. Operations 301-311 described herein form the
sub-pixel circuit 100 including two sub-pixels 106. Operations
306-310 may be repeated for each addition sub-pixel, e.g. for a
third and/or a fourth sub-pixel.
[0053] FIG. 5 is a flow a flow diagram of an on-demand half-tone
lithography method 500 for forming a sub-pixel circuit 100. The
on-demand half-tone lithography method 500 corresponds to the
on-demand half-tone lithography method to fabricate a sub-pixel
circuit 100 of one of the first and second exemplary embodiments.
FIGS. 4A-4D and 4P-4W are schematic, cross-sectional views of a
substrate 102 during the method 500 for forming the sub-pixel
circuit 100 according embodiments described herein.
[0054] At operation 501, as shown in FIG. 4A, a lower portion layer
402A and an upper portion layer 402B are deposited over the
substrate 102. The lower portion layer 402A is disposed over the
PDL structures 126 and the metal layers 104. The upper portion
layer 402B is disposed over the lower portion layer 402A. The lower
portion layer 402A corresponds to the lower portion 110A and the
upper portion layer 402B corresponds to the upper portion 110B of
the inorganic overhang structures 110. In embodiments including the
third and fourth configurations of the inorganic overhang
structures 110, an assistant cathode layer 404 is disposed between
the lower portion layer 402A and the PDL structures 126 and the
metal layers 104.
[0055] At operation 502, as shown in FIG. 4B, a resist 406 is
disposed and patterned. The resist 406 is disposed over the upper
portion layer 402B. The resist 406 is a positive resist or a
negative resist. A positive resist includes portions of the resist,
which, when exposed to electromagnetic radiation, are respectively
soluble to a resist developer applied to the resist after the
pattern is written into the resist using the electromagnetic
radiation. A negative resist includes portions of the resist,
which, when exposed to radiation, will be respectively insoluble to
the resist developer applied to the resist after the pattern is
written into the resist using the electromagnetic radiation. The
chemical composition of the resist 406 determines whether the
resist is a positive resist or a negative resist. The resist 406 is
patterned to form one of a pixel opening 124A of the dot-type
architecture 101C or a pixel opening 124B of the line-type
architecture 101D of a first sub-pixel 108a. The patterning is one
of a photolithography, digital lithography process, or laser
ablation process.
[0056] At operation 503, as shown in FIG. 4C, portions of the upper
portion layer 402B and the lower portion layer 402A exposed by the
pixel opening 124A, 124B are removed. The upper portion layer 402B
exposed by the pixel opening 124A, 124B may be removed a dry etch
process. The lower portion layer 402A exposed by the pixel opening
124A, 124B may be removed by a wet etch process. In embodiments
including the assistant cathode layer 404, a portion of the
assistant cathode layer 404 may be removed by a dry etch process or
a wet etch process to form the assistant cathode 202 disposed under
the lower portion 110A. Operation 503 forms the inorganic overhang
structures 110 of the first sub-pixel 108a. The etch selectivity of
the between the materials of the upper portion layer 402B
corresponding to the upper portion 110B and the lower portion layer
402A corresponding to the lower portion 110A and the etch processes
to remove the exposed portions of the upper portion layer 402B and
the lower portion layer 402A provide for the bottom surface 107 of
the upper portion 110B being wider than the top surface 105 of the
lower portion 110A to form the overhang 109 (as shown in FIGS. 1A,
1B, and 2). The shadowing of the overhang 109 provides for
evaporation deposition the OLED material 112 and the cathode
114.
[0057] At operation 504, as shown in FIG. 4D, the OLED material 112
of the first sub-pixel 108a, the cathode 114, and the encapsulation
layer 116 are deposited. In embodiments including capping layers,
the capping layers are deposited between the cathode 114 and the
encapsulation layer 116. The capping layers may be deposited by
evaporation deposition. The shadowing of the overhang 109 provides
for evaporation deposition each of the OLED material 112 and a
cathode 114. As further discussed in the corresponding description
of FIG. 2, the shadowing effect of the inorganic overhang
structures 110 define the OLED angle .theta..sub.OLED (shown in
FIG. 2) of the OLED material 112 and the cathode angle
.theta..sub.cathode (shown in FIG. 2) of the cathode 114. The OLED
angle .theta..sub.OLED of the OLED material 112 and the cathode
angle .theta..sub.cathode of the cathode 114 result from
evaporation deposition of the OLED material 112 and the cathode
114. In the first and second configurations, the OLED material 112
does not contact and the cathode 114 contacts the lower portion
110A of the inorganic overhang structures 110. In the third and
fourth configurations, the OLED material 112 does not contact the
lower portion 110A and the assistant cathode 202, and the cathode
114 contacts at least the assistant cathode 202. The encapsulation
layer 116 is deposited over the cathode 114.
[0058] At operation 505, as shown in FIG. 4P, a resist 420 is
deposed and half-tone patterned. Half-tone patterning the resist
420 includes a digital lithography process that patterns the resist
to form two or more portions with each of the portions having
different depths. Each portion corresponds to a respective
sub-pixel. As shown in FIG. 4P, the half-tone patterning of the
resist 420 forms a first portion 422 over the first sub-pixel 108a
and a second portion 424 over the second sub-pixel 108b to be
formed. The second portion 424 exposes portions of the pixel
opening 124A, 124B of the second sub-pixel 108b. At operation 506,
as shown in FIG. 4Q, the encapsulation layer 116, the cathode 114,
the OLED material 112, the upper portion layer 402B, and the lower
portion layer 402A exposed by the pixel opening 124A, 124B are
removed. Operation 506 forms the inorganic overhang structures 110
of the second sub-pixel 108b. The etch selectivity of the between
the materials of the upper portion layer 402B corresponding to the
upper portion 110B and the lower portion layer 402A corresponding
to the lower portion 110A and the etch processes to remove the
exposed portions of the upper portion layer 402B and the lower
portion layer 402A provide for the bottom surface 107 of the upper
portion 110B being wider than the top surface 105 of the lower
portion 110A to form the overhang 109 (as shown in FIGS. 1A, 1B,
and 2). The shadowing of the overhang 109 provides for evaporation
deposition the OLED material 112 and the cathode 114.
[0059] At operation 507, as shown in FIG. 4R, the resist 420 is
removed. At operation 508, as shown in FIG. 4S, the OLED material
112 of the second sub-pixel 108b, the cathode 114, and the
encapsulation layer 116 are deposited. In embodiments including
capping layers, the capping layers are deposited between the
cathode 114 and the encapsulation layer 116. The capping layers may
be deposited by evaporation deposition. The shadowing of the
overhang 109 provides for evaporation deposition each of the OLED
material 112 and a cathode 114. As further discussed in the
corresponding description of FIG. 2, the shadowing effect of the
inorganic overhang structures 110 define the OLED angle
.theta..sub.OLED (shown in FIG. 2) of the OLED material 112 and the
cathode angle .theta..sub.cathode (shown in FIG. 2) of the cathode
114. The OLED angle .theta..sub.OLED of the OLED material 112 and
the cathode angle .theta..sub.cathode of the cathode 114 result
from evaporation deposition of the OLED material 112 and the
cathode 114. In the first and second configurations, the OLED
material 112 does not contact and the cathode 114 contacts the
lower portion 110A of the inorganic overhang structures 110. In the
third and fourth configurations, the OLED material 112 does not
contact the lower portion 110A and the assistant cathode 202, and
the cathode 114 contacts at least the assistant cathode 202. The
encapsulation layer 116 is deposited over the cathode 114.
[0060] At operation 509, as shown in FIG. 4T, a resist 426 is
deposed and half-tone patterned. Half-tone patterning the resist
426 includes a digital lithography process that patterns the resist
to form two or more portions with each of the portions having
different depths. Each portion corresponds to a respective
sub-pixel. As shown in FIG. 4U, the half-tone patterning of the
resist 426 forms a first portion 422 over the first sub-pixel 108a
and a second portion 424 over the second sub-pixel 108b. At
operation 510, as shown in FIG. 4V, the first portion 422 of the
resist 426 is plasma ashed. At operation 511, as shown in FIG. 4W,
the encapsulation layer 116, the cathode 114, and the OLED material
112 of the second sub-pixel 108b exposed by the resist 426 are
removed. At operation 512, as shown in FIG. 4Y, the resist 426 is
removed. Operations 501-512 described herein form the sub-pixel
circuit 100 including two sub-pixels 106. Operations 505-512 may be
repeated for each addition sub-pixel, e.g. for a third and/or a
fourth sub-pixel.
[0061] FIG. 6 is a flow a flow diagram of a one-step method 600 for
forming a sub-pixel circuit 100. The one-step method 600
corresponds to the one-step method to fabricate a sub-pixel circuit
100 of one of the first, second, third, or fourth exemplary
embodiments. FIGS. 7A-7L are schematic, cross-sectional views of a
substrate 102 during the method 600 for forming the sub-pixel
circuit 100 according embodiments described herein. FIGS. 7A-7C,
7E, 7G, 7I, and 7K correspond to the plugless arrangement 101A of
the first or second exemplary embodiments of the sub-pixel circuit
100. FIGS. 7A, 7B, 7D, 7F, 7H, 7J, and 7L correspond to the plug
arrangement 101B of the third or fourth exemplary embodiments of
the sub-pixel circuit 100.
[0062] At operation 601, as shown in FIG. 7A, the inorganic
overhang structures 110 are formed. Forming the inorganic overhang
structures 110 includes a lower portion layer and an upper portion
layer are deposited over the substrate 102. The first lower portion
is disposed over the PDL structures 126 and the metal layers 104.
The upper portion layer is disposed over the lower portion layer.
The lower portion layer corresponds to the lower portion 110A and
the upper portion layer corresponds to the upper portion 110B of
the inorganic overhang structures 110. In embodiments including the
third and fourth configurations of the inorganic overhang
structures 110, an assistant cathode layer is disposed between the
lower portion layer 402A and the PDL structures 126 and the metal
layers 104. The assistant cathode layer corresponds to the
assistant cathode 202. A resist is disposed and patterning over the
upper portion layer. To form the inorganic overhang structures 110
portions of the upper portion layer 402B and the lower portion
layer 402A exposed by the pixel opening 124A, 124B are removed.
[0063] At operation 602, as shown in FIG. 7B, the OLED material 112
of the first sub-pixel 108a, the cathode 114, and the encapsulation
layer 116 are deposited. In embodiments including capping layers,
the capping layers are deposited between the cathode 114 and the
encapsulation layer 116. The capping layers may be deposited by
evaporation deposition. As further discussed in the corresponding
description of FIG. 2, the shadowing effect of the inorganic
overhang structures 110 define the OLED angle .theta..sub.OLED
(shown in FIG. 2) of the OLED material 112 and the cathode angle
.theta..sub.cathode (shown in FIG. 2) of the cathode 114. The OLED
angle .theta..sub.OLED of the OLED material 112 and the cathode
angle .theta..sub.cathode of the cathode 114 result from
evaporation deposition of the OLED material 112 and the cathode
114. In the first and second configurations, the OLED material 112
does not contact and the cathode 114 contacts the lower portion
110A of the inorganic overhang structures 110. In the third and
fourth configurations, the OLED material 112 does not contact the
lower portion 110A and the assistant cathode 202, and the cathode
114 contacts at least the assistant cathode 202. The encapsulation
layer 116 is deposited over the cathode 114.
[0064] At operation 603, as shown in FIG. 7C, a resist 702 is
formed in a well 704 of the first sub-pixel 108a. At operation 604,
as shown in FIGS. 7E and 7F, the encapsulation layer 116, the
cathode 114, and the OLED material 112 exposed by the resist 702
are removed. The encapsulation layer 116, the cathode 114, and the
OLED material 112 exposed by resist 702 may be removed by wet etch
processes. According to embodiments with the plugless arrangement
101A of the sub-pixel circuit 100, the resist 408 is removed, as
shown in FIG. 7E. According to embodiments with the plug
arrangement 101B of the sub-pixel circuit 100, the resist 702 is
corresponds to the plug 122 of the first sub-pixel 108a, as shown
in FIGS. 7D and 7F.
[0065] At operation 605, as shown in FIGS. 7G and 7H, the OLED
material 112 of the second sub-pixel 108b, the cathode 114, and the
encapsulation layer 116 are deposited. In embodiments including
capping layers, the capping layers are deposited between the
cathode 114 and the encapsulation layer 116. The capping layers may
be deposited by evaporation deposition. The shadowing of the
overhang 109 provides for evaporation deposition each of the OLED
material 112 and a cathode 114. As further discussed in the
corresponding description of FIG. 2, the shadowing effect of the
inorganic overhang structures 110 define the OLED angle
.theta..sub.OLED (shown in FIG. 2) of the OLED material 112 and the
cathode angle .theta..sub.cathode (shown in FIG. 2) of the cathode
114. The OLED angle .theta..sub.OLED of the OLED material 112 and
the cathode angle .theta..sub.cathode of the cathode 114 result
from evaporation deposition of the OLED material 112 and the
cathode 114. In the first and second configurations, the OLED
material 112 does not contact and the cathode 114 contacts the
lower portion 110A of the inorganic overhang structures 110. In the
third and fourth configurations, the OLED material 112 does not
contact the lower portion 110A and the assistant cathode 202, and
the cathode 114 contacts at least the assistant cathode 202. The
encapsulation layer 116 is deposited over the cathode 114.
[0066] At operation 606, as shown in FIG. 4L, a resist 704 is
formed in a well 706 of the second sub-pixel 108b. At operation
607, as shown in FIGS. 7K and 7L, the encapsulation layer 116, the
cathode 114, and the OLED material 112 exposed by the resist 416
are removed. The encapsulation layer 116, the cathode 114, and the
OLED material 112 exposed by resist 706 may be removed by wet etch
processes. According to embodiments with the plugless arrangement
101A of the sub-pixel circuit 100, the resist 706 is removed, as
shown in FIG. 7K. According to embodiments with the plug
arrangement 101B of the sub-pixel circuit 100, the resist 706
corresponds to the plug 122 of the second sub-pixel 108b, as shown
in FIGS. 7J and 7L. Operations 601-607 described herein form the
sub-pixel circuit 100 including two or more sub-pixels 106.
Operations 605-607 may be repeated for each addition sub-pixel,
e.g. for a third and/or a fourth sub-pixel.
[0067] In summation, described herein relate to sub-pixel circuits
and methods of forming sub-pixel circuits that may be utilized in a
display such as an organic light-emitting diode (OLED) display. The
adjacent inorganic overhang structures defining each sub-pixel of
the sub-pixel circuit of the display provide for formation of the
sub-pixel circuit using evaporation deposition and provide for the
inorganic overhang structures to remain in place after the
sub-pixel circuit is formed (e.g., utilizing the methods of the
fifth, sixth, or seventh exemplary embodiments). Evaporation
deposition may be utilized for deposition of an OLED material and
cathode. The inorganic overhang structures define deposition
angles, i.e., provide for a shadowing effect during evaporation
deposition, for each of the OLED material and the cathode such the
OLED material does not contact the lower portion (and assistant
cathode according to embodiments with the third and fourth
configurations) and the cathode contacts the lower portion
according to the first and second configurations or at least the
assistant cathode of the third and fourth configurations. The
encapsulation layer of a respective sub-pixel is disposed over the
cathode with the encapsulation layer extending under at least a
portion of each of the adjacent inorganic overhang structures and
along a sidewall of each of the adjacent inorganic overhang
structures.
[0068] While the foregoing is directed to embodiments of the
present disclosure, other and further embodiments of the disclosure
may be devised without departing from the basic scope thereof, and
the scope thereof is determined by the claims that follow.
* * * * *