U.S. patent application number 16/864861 was filed with the patent office on 2021-10-07 for shielding for probing system.
The applicant listed for this patent is TECAT TECHNOLOGIES (SUZHOU) LIMITED. Invention is credited to CHOON LEONG LOU.
Application Number | 20210311111 16/864861 |
Document ID | / |
Family ID | 1000004852294 |
Filed Date | 2021-10-07 |
United States Patent
Application |
20210311111 |
Kind Code |
A1 |
LOU; CHOON LEONG |
October 7, 2021 |
SHIELDING FOR PROBING SYSTEM
Abstract
A probing system includes a chuck configured to support a device
under test (DUT); a probe card disposed above the chuck and
including a plurality of probes protruding from the probe card
toward the chuck; and a platen disposed between the chuck and the
probe card and configured to support the probe card, wherein the
chuck includes a shielding member disposed between the platen and
the chuck.
Inventors: |
LOU; CHOON LEONG;
(SINGAPORE, SG) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
TECAT TECHNOLOGIES (SUZHOU) LIMITED |
SUZHOU |
|
CN |
|
|
Family ID: |
1000004852294 |
Appl. No.: |
16/864861 |
Filed: |
May 1, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G01R 31/2865 20130101;
G01R 31/2886 20130101; G01R 1/06755 20130101 |
International
Class: |
G01R 31/28 20060101
G01R031/28; G01R 1/067 20060101 G01R001/067 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 7, 2020 |
CN |
202010263758.X |
Claims
1. A probing system comprising: a chuck configured to support a
device under test (DUT); a probe card disposed above the chuck and
including a plurality of probes protruding from the probe card
toward the chuck and the DUT; and a platen disposed between the
chuck and the probe card and configured to support the probe card,
wherein the chuck includes a shielding member disposed between the
platen and the chuck and surrounding the DUT.
2. The probing system of claim 1, wherein the shielding member
protrudes from the chuck toward the platen.
3. The probing system of claim 1, wherein the shielding member is
extendable from and retractable into the chuck.
4. The probing system of claim 1, wherein the chuck includes a slot
indented into the chuck and configured to allow the shielding
member to be wholly or partially disposed within the slot.
5. The probing system of claim 1, wherein the shielding member is
in contact with the platen.
6. The probing system of claim 1, wherein the shielding member is
substantially orthogonal to a surface of the chuck.
7. The probing system of claim 1, wherein a height of the shielding
member is substantially same as a distance between the chuck and
the platen.
8. The probing system of claim 1, wherein a height of the shielding
member is substantially greater than a thickness of the DUT.
9. The probing system of claim 1, wherein the DUT is disposed
within a chamber defined by the chuck, the shielding member, the
platen and the probe card.
10. The probing system of claim 1, wherein the shielding member
includes a first end and a second end opposite to the first end,
the first end is in contact with the platen, and the second end is
in contact with the chuck.
11. The probing system of claim 1, wherein the shielding member
contacts the probe card.
12. The probing system of claim 1, wherein the shielding member is
isolated from the probe card.
13. A method of operating a probing system, comprising: providing a
chuck including a shielding member extendable from the chuck and
disposed in the chuck; disposing a device under test (DUT) on the
chuck and surrounded by the shielding member; providing a probe
card above the DUT and the chuck, and disposing a platen disposed
between the probe card and the chuck; and extending the shielding
member from the chuck toward the platen, thereby the shielding
member contacts the platen or the probe card.
14. The method of claim 13, further comprising retracting the
shielding member into the chuck and away from the platen.
15. The method of claim 14, wherein the extension of the shielding
member is performed prior to the retraction of the shielding
member.
16. The method of claim 13, wherein a chamber defined by the chuck,
the shielding member, the platen and the probe card is formed after
the extension of the shielding member.
17. The method of claim 16, further comprising increasing or
decreasing a temperature of the chamber; or filling the chamber
with an inert gas.
18. The method of claim 13, further comprising moving the chuck
toward the probe card prior to the extension of the shielding
member.
19. The method of claim 13, further comprising probing the DUT
after the extension of the shielding member.
20. The method of claim 19, wherein the shielding member is
retracted into the chuck after the probing of the DUT.
Description
TECHNICAL FIELD
[0001] The present disclosure relates to a probing system including
a chuck configured to support a device under test (DUT) thereon,
and particularly relates to the chuck having a shielding member
extendable from the circumferential fixture of the chuck, disposed
in the chuck or being part of the chuck and surrounding the DUT.
Further, the present disclosure relates to a method of operating
the probing system for probing the DUT disposed on a chuck, and
particularly relates to a method of probing the DUT surrounded by
the shielding member extendable from and the chuck, disposed in the
chuck or being part of the chuck under wide varying temperature,
pressure, humidity, or gas filled environment. This shielding
member of the chuck minimizes the volume space of the chamber
required for purging with dry air, gases or any environment
required for testing.
DISCUSSION OF THE BACKGROUND
[0002] After fabrication, a semiconductor device, such as a wafer,
is tested by a probing system. During the testing or probing, the
semiconductor device has to be under specific conditions such as a
predetermined temperature, pressure, humidity, or gas filled
environment. However, such specific conditions may be difficult to
maintain consistency for the semiconductor wafer during the testing
or probing. Therefore, accuracy of the testing of the semiconductor
device may be decreased.
[0003] For example, an enclosure is used to surround and shield a
whole probing system. However, it is very difficult or in fact
technically impossible to shield such a large shielding chamber by
the probing system. In another example, an enclosure is used to
surround and shield a chuck and a semiconductor wafer on the chuck.
Although a space of such shielding chamber is smaller than the one
for the whole probing system, it is still difficult to securely
shield the chuck and the semiconductor wafer.
[0004] Accordingly, there is a continuous need to improve a
configuration of the probing system. Testing under different
environment is difficult to achieve with existing probing system or
may require high gas flow, equipment requiring high energy
consumption, use of high-volume gas, etc. to fill up or purge the
environment of the probing system with large chamber. The large
chamber is required for the entire operational movement of the
chuck inside the large chamber.
[0005] This Discussion of the Background section is provided for
background information only. The statements in this Discussion of
the Background are not an admission that the subject matter
disclosed in this Discussion of the Background section constitutes
prior art to the present disclosure, and no part of this Discussion
of the Background section may be used as an admission that any part
of this application, including this Discussion of the Background
section, constitutes prior art to the present disclosure.
SUMMARY
[0006] One aspect of the present disclosure provides a probing
system. The probing system includes a chuck configured to support a
device under test (DUT); a probe card disposed above the chuck and
including a plurality of probes protruding from the probe card
toward the chuck or plurality of probe manipulators with single
probe; and a platen disposed between the chuck and the probe card
or probe manipulator and configured to support the probe card or
probe manipulator, wherein the chuck includes a shielding member
encircling the DUT and disposed between the platen and the
chuck.
[0007] In some embodiments, the shielding member encircles and
protrudes from the surrounding of the chuck toward the platen.
[0008] In some embodiments, the shielding member is extendable from
and retractable into the chuck, and if application requires, will
have vacuum suction increasing the shielding between the DUT and
the surrounding environment.
[0009] In some embodiments, the chuck includes a slot indented into
the chuck edge and configured to allow part or all of the shielding
member to be disposed within the slot.
[0010] In some embodiments, the shielding member is in contact with
the platen to provide complete isolation of the DUT with the
surrounding environment.
[0011] In some embodiments, the shielding member is substantially
orthogonal to a surface of the chuck.
[0012] In some embodiments, a height of the shielding member can be
extended or depressed that is substantially same as a distance
between the chuck and the platen.
[0013] In some embodiments, a height of the shielding member is
substantially greater than a thickness of the DUT wafer ensuring
sufficient clearance between the wafer and the platen.
[0014] In some embodiments, the DUT is disposed within a chamber
defined by the chuck, the shielding member, the platen and the
probe card or probe manipulator.
[0015] In some embodiments, the shielding member includes a first
end and a second end opposite to the first end, the first end is in
contact with the platen, and the second end is in contact with the
chuck.
[0016] In some embodiments, the shielding member is isolated from
the probe card or the platen.
[0017] In some embodiments, a cover enclosing the probe card or
probe manipulator ensures complete shielding of the DUT from the
surrounding environment.
[0018] Another aspect of the present disclosure provides a method
of operating a probing system. The method includes providing a
chuck including a shielding member extendable from and disposed in
circumferential fixture of the chuck; disposing a device under test
(DUT) on the chuck and surrounded by the shielding member;
providing a probe card above the DUT and the chuck; disposing a
platen between the probe card and the chuck, and extending the
shielding member from the chuck toward the platen, thereby the
shielding member contacts the platen or the probe card.
[0019] In some embodiments, the method further comprises retracting
the shielding member into the circumferential fixture of chuck and
away from the platen. This can either be done automatically or
through raising the chuck into the platen.
[0020] In some embodiments, the extension of the shielding member
is performed prior to the retraction of the shielding member.
[0021] In some embodiments, a chamber defined by the chuck, the
shielding member, the platen and the probe card or probe
manipulator with cover, is formed after the retraction of the
shielding member.
[0022] In some embodiments, the method further comprises increasing
or decreasing a temperature of the chamber, or filling the chamber
with an inert gas.
[0023] In some embodiments, the method further comprises increasing
or decreasing the humidity of the chamber by filling with air of
varying wetness.
[0024] In some embodiments, the method further comprises increasing
or decreasing a pressure of the chamber by filling with air or
gases of higher or lower pressure.
[0025] In some embodiments, the method further comprises moving the
chuck toward the probe card prior to the retraction of the
shielding member.
[0026] In some embodiments, the method further comprises probing
the DUT after the extension of the shielding member.
[0027] In some embodiments, the shielding member is retracted into
the chuck after the probing of the DUT.
[0028] The foregoing has outlined rather broadly the features and
technical advantages, especially in reducing the volume space of
the shielded chamber by greater than 90% of the present disclosure,
in order that the detailed description of the disclosure that
follows may be better understood. Additional features and
advantages of the disclosure will be described hereinafter, and
form the subject of the claims of the disclosure. It should be
appreciated by those skilled in the art that the conception and
specific embodiment disclosed may be readily utilized as a basis
for modifying or designing other structures or processes for
carrying out the same purposes of the present disclosure. It should
also be realized by those skilled in the art that such equivalent
constructions do not depart from the spirit and scope of the
disclosure as set forth in the appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0029] A more complete understanding of the present disclosure may
be derived by referring to the detailed description and claims when
considered in connection with the Figures, where like reference
numbers refer to similar elements throughout the Figures.
[0030] FIG. 1 is a schematic cross-sectional view of a first
probing system in accordance with some embodiments of the present
disclosure.
[0031] FIGS. 2 and 3 are exemplary embodiments of a cross-sectional
view of a shielding member along a line AA' in FIG. 1.
[0032] FIG. 4 is a schematic cross-sectional view of a second
probing system in accordance with some embodiments of the present
disclosure.
[0033] FIG. 5 is a flowchart representing a method of operating a
probing system according to aspects of the present disclosure in
one or more embodiments.
[0034] FIGS. 6 to 10 are schematic views of operating a probing
system by a method of FIG. 5 in accordance with some embodiments of
the present disclosure.
DETAILED DESCRIPTION
[0035] The following description of the disclosure accompanies
drawings, which are incorporated in and constitute a part of this
specification, and illustrate embodiments of the disclosure, but
the disclosure is not limited to the embodiments. In addition, the
following embodiments can be properly integrated to complete
another embodiment.
[0036] References to "one embodiment," "an embodiment," "exemplary
embodiment," "other embodiments," "another embodiment," etc.
indicate that the embodiment(s) of the disclosure so described may
include a particular feature, structure, or characteristic, but not
every embodiment necessarily includes the particular feature,
structure, or characteristic. Further, repeated use of the phrase
"in the embodiment" does not necessarily refer to the same
embodiment, although it may.
[0037] In order to make the present disclosure completely
comprehensible, detailed steps and structures are provided in the
following description. Obviously, implementation of the present
disclosure does not limit special details known by persons skilled
in the art. In addition, known structures and steps are not
described in detail, so as not to unnecessarily limit the present
disclosure. Preferred embodiments of the present disclosure will be
described below in detail. However, in addition to the detailed
description, the present disclosure may also be widely implemented
in other embodiments. The scope of the present disclosure is not
limited to the detailed description, and is defined by the
claims.
[0038] In the present disclosure, a probing system is disclosed.
The probing system includes a chuck configured to support a device
under test (DUT) and a probe card disposed above the chuck. The
chuck includes a shielding member extendable from and retractable
into the chuck. The shielding member is extended from the chuck to
form a chamber surrounding the DUT. As such, the formation of the
chamber allows the DUT to be stably maintained under specific
conditions (e.g., a predetermined temperature or pressure) during
testing or probing. As a result, testing or probing of the DUT can
be improved. Furthermore, the chamber formed by the shielding
member is a very small chamber (e.g. compared with the shielding
chamber for the whole probing system, or the shielding chamber for
the chuck and the semiconductor wafer on the chuck), it would be
easier to control and maintain the DUT in specific conditions and
thus cost can also be reduced.
[0039] FIG. 1 is a schematic cross-sectional view of a first
probing system 100 in accordance with various embodiments of the
present disclosure. In some embodiments, the first probing system
100 is configured to perform testing on a device under test (DUT)
103. In some embodiments, the first probing system 100 includes a
housing 101, a chuck 102 disposed within the housing 101, and a
probe card 104 disposed over the chuck 102.
[0040] In some embodiments, the housing 101 defines a first chamber
101a, and the chuck 102 is disposed in the first chamber 101a. In
some embodiments, the housing 101 includes a platen 101b over the
top of the housing 101. In some embodiments, the platen 101b is a
platform for holding and supporting the probe card 104 thereon. In
some embodiments, the platen 101b includes a flat surface for
supporting the probe card 104 thereon. In some embodiments, the
platen 101b is disposed between the chuck 102 and the probe card
104.
[0041] In some embodiments, the chuck 102 is configured to hold and
support the DUT 103. In some embodiments, the chuck 102 is
rotatable about a center of the chuck 102 and is movable toward and
away from the probe card 104. In some embodiments, the chuck 102
has a circular, quadrilateral or polygonal shape. In some
embodiments, the chuck 102 includes a surface 102a facing toward
the probe card 104.
[0042] In some embodiments, the DUT 103 is disposed on the chuck
102 during probing or testing operations. In some embodiments, the
DUT 103 is held on the chuck 102 by using suction to draw the DUT
103 toward the chuck 102. In some embodiments, the DUT 103 includes
circuitry formed thereon. In some embodiments, several test pads
for testing operations are formed over the DUT 103.
[0043] In some embodiments, the DUT 103 includes a front side 103a
and a back side 103b opposite to the front side 103a. In some
embodiments, circuitry or device is formed over the front side
103a. In some embodiments, the test pads are formed over the front
side 103a. In some embodiments, the back side 103b of the DUT 103
contacts the chuck 102. In some embodiments, the back side 103b
contacts the surface 102a of the chuck 102. In some embodiments,
the back side 103b is a substantially planar surface. In some
embodiments, the DUT 103 is a semiconductor device, a semiconductor
structure, a wafer, a chip or the like.
[0044] In some embodiments, the probe card 104 is disposed over the
platen 101b and above the chuck 102 and the DUT 103. In some
embodiments, the probe card 104 includes a circuit board for
testing the DUT 103. In some embodiments, the probe card 104 is a
manipulator, a positioner or the like. In some embodiments, a
supporter is disposed on the circuit board, and several probes 104a
are fixed on the supporter with epoxy resin and protrude from the
probe card 104 toward the chuck 102. In some embodiments, the probe
card 104 includes several probe manipulators with a single probe.
In some embodiments, a tip of each probe 104a is configured to
contact the test pad disposed over the DUT 103. In some
embodiments, the circuitry of the DUT 103 is electrically connected
to the circuit board of the probe card 104 through the probes 104a.
In some embodiments, a cover is disposed over the probe card 104 to
enclose the probe card 104 to ensure a complete shielding of the
chuck 102 and the DUT 103 from the surroundings.
[0045] In some embodiments, the chuck 102 includes a shielding
member 105 disposed between the platen 101b and the chuck 102. In
some embodiments, the shielding member 105 protrudes from the chuck
102 toward the platen 101b. In some embodiments, the shielding
member 105 protrudes from a surrounding of the chuck 102. In some
embodiments, the shielding member 105 protrudes from the surface
102a of the chuck 102. In some embodiments, the shielding member
105 is substantially orthogonal to the surface 102a of the chuck
102. In some embodiments, the shielding member 105 is in contact
with the platen 101b. In some embodiments, the shielding member 105
extends between the surface 102a of the chuck 102 and the platen
101b. In some embodiments, the shielding member 105 encircles the
chuck 102. In some embodiments, the probes 104a of the probe card
104 can touch the DUT 103. In some embodiments, the shielding
member 105 is in contact with the platen 101b to provide a complete
isolation of the chuck 102 from the surroundings.
[0046] In some embodiments, the shielding member 105 includes a
first end 105a and a second end 105b opposite to the first end
105a. The first end 105a is in contact with the platen 101b, and
the second end 105b is in contact with the chuck 102. In some
embodiments, the second end 105b is disposed under or on the
surface 102a of the chuck 102. In some embodiments, the shielding
member 105 is isolated from the probe card 104. In some
embodiments, the shielding member 105 is isolated from the platen
101b.
[0047] In some embodiments, a height H of the shielding member 105
is substantially same as a distance D between the chuck 102 and the
platen 101b. In some embodiments, the height H of the shielding
member 105 is substantially greater than a thickness T of the DUT
103. In some embodiments, the shielding member 105 is extendable or
depressible along its height. In some embodiments, the height H is
substantially greater than the thickness T in order to ensure a
sufficient clearance between the DUT 103 and the platen 101b. In
some embodiments, a cross section of the shielding member 105 along
a line AA' has a circular shape (as shown in FIG. 2), a
quadrilateral shape (as shown in FIG. 3) or a polygonal shape.
[0048] In some embodiments, a second chamber 106 is defined by the
chuck 102, the shielding member 105, the platen 101b and the probe
card 104. In some embodiments, the DUT 103 is disposed within the
second chamber 106 and surrounded by the shielding member 105. In
some embodiments, a temperature of the second chamber 106 is
substantially different from or greater than a temperature of the
first chamber 101a. In some embodiments, a pressure in the second
chamber 106 is substantially different from or greater than a
pressure of the first chamber 101a. In some embodiments, the first
chamber 101a and the second chamber 106 are isolated from each
other by the shielding member 105. In some embodiments (for
example, as illustrated in FIGS. 1, 4 and 6-10), the second chamber
106 is much smaller than the first chamber 101a.
[0049] In some embodiments, the shielding member 105 is moveable
relative to the chuck 102. In some embodiments, the shielding
member 105 is extendable from and retractable into the chuck 102.
In some embodiments, the shielding member 105 is extendable from
the chuck 102 toward the platen 101b until the shielding member 105
is in contact with the platen 101b and the second chamber 106 is
formed. In some embodiments, the shielding member 105 is
retractable to separate from the platen 101b until the shielding
member 105 is disposed in the chuck 102. In some embodiments, the
shielding member 105 is a circumferential fixture of the chuck 102.
In some embodiments, the shielding member 105 is a part of the
chuck 102.
[0050] In some embodiments, the chuck 102 includes a slot 102b
formed in the chuck 102 and configured to allow the shielding
member 105 to be wholly or partially disposed within the slot 102b.
In some embodiments, the slot 102b indents into an edge of the
chuck 102. In some embodiments, the shielding member 105 is
extended almost entirely out of the slot 102b when the shielding
member 105 is in an extended status. In some embodiments, the
shielding member 105 is disposed entirely within the slot 102b when
the shielding member 105 is in a retracted status.
[0051] Because the second chamber 106 is isolated from the first
chamber 101a when the shielding member 105 is in the extended
status, the DUT 103 can be maintained in specific conditions (e.g.,
a predetermined temperature or pressure) during testing or probing
of the DUT 103. As a result, testing or probing of the DUT 103 can
be improved. Furthermore, since the second chamber 106 is a small
chamber (e.g. compared with the first chamber 101a), it would be
easier to control and maintain the DUT 103 in specific conditions
and thus cost can also be reduced. In some embodiments, if
application requires, a vacuum suction is applied in order to
increase shielding between the chuck 102 and the surroundings.
[0052] FIG. 4 is a schematic cross-sectional view of a second
probing system 200 in accordance with various embodiments of the
present disclosure. In some embodiments, the second probing system
200 is configured in a manner similar to that of the first probing
system 100 as illustrated in FIG. 1.
[0053] In some embodiments, the shielding member 105 of the second
probing system 200 is disposed between the probe card 104 and the
chuck 102. In some embodiments, the shielding member 105 is
extendable from the chuck 102 toward the probe card 104. In some
embodiments, the shielding member 105 is in contact with the probe
card 104. In some embodiments, a height H of the shielding member
105 is substantially greater than a distance D between the chuck
102 and the platen 101b.
[0054] In the present disclosure, a method S300 of operating a
probing system 100 or 200 is disclosed. The method S300 includes a
number of operations and the description and illustrations are not
deemed as a limitation of the sequence of the operations. FIG. 5 is
a flowchart depicting an embodiment of the method S300 of operating
the probing system 100 or 200. The method includes steps S301,
S302, S303 and S304.
[0055] In step S301, a chuck 102 including a shielding member 105
is provided as shown in FIG. 6. In some embodiments, the probing
system 100 includes the chuck 102 disposed within a housing 101 or
a first chamber 101a. In some embodiments, the shielding member 105
is in a retracted status and initially disposed within the chuck
102. In some embodiments, the shielding member 105 is disposed
within a slot 102b of the chuck 102.
[0056] In step S302, a DUT 103 is disposed on the chuck 102 as
shown in FIG. 6. In some embodiments, a semiconductor wafer
including a DUT 103 is disposed on the chuck 102. In some
embodiments, the DUT 103 is disposed by using suction to draw the
DUT 103 toward the chuck 102. In some embodiments, a back side 103b
of the DUT 103 is in contact with a surface 102a of the chuck
102.
[0057] In step S303, a probe card 104 is provided as shown in FIG.
6. In some embodiments, the probe card 104 or probe manipulator is
disposed on a platen 101b and above the DUT 103 and the chuck 102.
In some embodiments, the probe card 104 includes several probes
104a protruding from the probe card 104 and configured to probe the
DUT 103. In some embodiments, the probe card 104 is disposed above
the front side 103a of the DUT 103.
[0058] In some embodiments, the chuck 102 is moved toward the probe
card 104 after the disposing of the DUT 103 as shown in FIG. 7. In
some embodiments, after the disposing of the DUT 103 on the chuck
102, the chuck 102 is moved toward the probe card 104 so that the
chuck 102 and the DUT 103 are proximal to the probe card 104.
[0059] In step S304, the shielding member 105 is extended from the
chuck 102 toward the platen 101b as shown in FIG. 8. In some
embodiments, after the disposing of the DUT 103 or the movement of
the chuck 102, the shielding member 105 is extended from the chuck
102 toward the platen 101b. In some embodiments, the shielding
member 105 is extendable from and retractable into the chuck 102.
In some embodiments, the shielding member 105 is extended from the
chuck 102 until the shielding member 105 is in contact with the
platen 101b to form a second chamber 106 defined by the chuck 102,
the shielding member 105, the platen 101b and the probe card
104.
[0060] In some embodiments, the shielding member 105 is extended
from the chuck 102 toward the probe card 104 as shown in FIG. 9. In
some embodiments, after the disposing of the DUT 103 or the
movement of the chuck 102, the shielding member 105 is extended
from the chuck 102 toward the probe card 104. In some embodiments,
the shielding member 105 is extended from the chuck 102 until the
shielding member 105 is in contact with the probe card 104 to form
a second chamber 106 defined by the chuck 102, the shielding member
105 and the probe card 104.
[0061] In some embodiments, the chuck 102 is further moved toward
the probe card 104 after the extension of the shielding member 105.
In some embodiments, the shielding member 105 does not move during
the further movement of the chuck 102. In some embodiments, by
further moving the chuck 102 toward the probe card 104, the probes
104a of the probe card 104 are caused to contact the DUT 103. In
some embodiments, the chuck 102 is moved towards the probe card 104
prior to the extension or retraction of the shielding member
105.
[0062] After the extension of the shielding member 105 and the
further movement of the chuck 102, the DUT 103 is probed by the
probes 104a. In some embodiments, the probes 104a contact the front
side 103a of the DUT 103 for testing the DUT 103. In some
embodiments, several test pads on the DUT 103 contact the
corresponding probes 104a. During the probing or testing, a testing
signal is transmitted to the DUT 103 through the probes 104a, and a
response signal from the DUT 103 is transmitted back to the probes
104a.
[0063] In some embodiments, after the formation of the second
chamber 106 and before the probing or testing of the DUT 103, a
temperature of the second chamber 106 is increased or decreased. In
some embodiments, a pressure of the second chamber 106 is increased
or decreased. In some embodiments, the second chamber 106 is filled
with an inert gas such as nitrogen. In some embodiments, the
pressure of the second chamber 106 is increased or decreased by
filling with air or gas(es) of higher or lower pressure relative to
the surroundings. In some embodiments, a humidity of the second
chamber 106 is increased or decreased by filling with air of
varying wetness. As such, the DUT 103 can be tested or probed under
specific conditions such as high temperature, high pressure, etc.
within the second chamber 106. The second chamber 106 can be easily
maintained in predetermined conditions.
[0064] In some embodiments, after the probing or testing of the DUT
103, the shielding member 105 is retracted into the chuck 102 as
shown in FIG. 10. In some embodiments, the shielding member 105
retracts until the shielding member 105 is disposed in the chuck
102 or the slot 102b. In some embodiments, the retraction of the
shielding member 105 is performed automatically. In some
embodiments, the retraction of the shielding member 105 is
performed by raising the chuck 102 towards or into the platen 101b.
In some embodiments, the chuck 102 is moved away from the probe
card 104 prior to the retraction of the shielding member 105. The
chuck 102 is moved away from the probe card 104 such that the
probes 104a no longer touch the DUT 103, and then the shielding
member 105 is retracted into the chuck 102.
[0065] Although the present disclosure and its advantages have been
described in detail, it should be understood that various changes,
substitutions and alterations can be made herein without departing
from the spirit and scope of the disclosure as defined by the
appended claims. For example, many of the processes discussed above
can be implemented through different methods, replaced by other
processes, or a combination thereof.
[0066] Moreover, the scope of the present application is not
intended to be limited to the particular embodiments of the
process, machine, manufacture, composition of matter, means,
methods and steps described in the specification. As one of
ordinary skill in the art will readily appreciate from the
disclosure of the present disclosure, processes, machines,
manufacture, compositions of matter, means, methods, or steps,
presently existing or later to be developed, that perform
substantially the same function or achieve substantially the same
result as the corresponding embodiments described herein, may be
utilized according to the present disclosure. Accordingly, the
appended claims are intended to include within their scope such
processes, machines, manufacture, compositions of matter, means,
methods, and steps.
* * * * *