U.S. patent application number 16/533407 was filed with the patent office on 2021-02-11 for port for heat sink on active cable end.
The applicant listed for this patent is International Business Machines Corporation. Invention is credited to John Ryan Harris, Phillip V. Mann, Karl Stathakis.
Application Number | 20210044044 16/533407 |
Document ID | / |
Family ID | 1000004257831 |
Filed Date | 2021-02-11 |
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United States Patent
Application |
20210044044 |
Kind Code |
A1 |
Stathakis; Karl ; et
al. |
February 11, 2021 |
PORT FOR HEAT SINK ON ACTIVE CABLE END
Abstract
A peripheral component interconnect includes a cable with a
header. The header includes a cable connector and a heat sink. The
heat sink has a cross-section that is reduced at an end that is
opposite of the cable connector. In addition or in the alternative,
a peripheral component interconnect card includes a circuit board
and a bracket, an electrical component, a board connector, and a
rail mounted to the circuit board. The bracket includes a port for
a cable to pass through, and the rail is configured to engage the
cable and define a pathway that rotates between the bracket and the
board connector. In addition or in the alternative an electrical
connection system includes a chassis with a guide, a card, and a
cable. The cable includes a guiding feature that engages the guide
which directs the cable connector from being misaligned to being
aligned with the board connector.
Inventors: |
Stathakis; Karl; (Rochester,
MN) ; Mann; Phillip V.; (Rochester, MN) ;
Harris; John Ryan; (Houston, TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
International Business Machines Corporation |
Armonk |
NY |
US |
|
|
Family ID: |
1000004257831 |
Appl. No.: |
16/533407 |
Filed: |
August 6, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01R 13/631 20130101;
H01R 39/64 20130101; H01R 13/665 20130101; H05K 7/1424 20130101;
H01R 12/75 20130101 |
International
Class: |
H01R 12/75 20060101
H01R012/75; H01R 13/66 20060101 H01R013/66; H01R 13/631 20060101
H01R013/631; H01R 39/64 20060101 H01R039/64; H05K 7/14 20060101
H05K007/14 |
Claims
1. A peripheral component interconnect comprising: a cable with a
header, the header comprising: a cable connector; and a heat sink
that has a cross-section that is reduced at an end that is opposite
of the cable connector, wherein the heat sink is reduced by
including a planar face instead of one corner; and a card extending
along a plane comprising: a board connector; and a bracket having a
width and including a port with a first size dimension that is
larger than a second size dimension of the port; wherein the heat
sink extends beyond the width of the bracket when the board
connector and the cable connector are connected; and wherein the
heat sink has a third size dimension that is larger than the second
size dimension and smaller than the first size dimension.
2. (canceled)
3. The peripheral component interconnect of claim 1, further
comprising: a guide positioned between the bracket and the board
connector, wherein the guide is shaped to direct the cable
connector from being misaligned with the board connector to being
aligned with the board connector.
4. The peripheral component interconnect of claim 3, wherein the
guide rotates ninety degrees.
5. The peripheral component interconnect of claim 3, wherein the
guide further comprises: a first rail extending from a first side
of the port towards the board connector; and a second rail
extending from a second side of the port, opposite of the first
side, towards the board connector; wherein the first rail and the
second rail form a helical structure.
6. The peripheral component interconnect of claim 3, wherein the
header further comprises: a guiding feature configured to engage
the guide and control the alignment of the cable connector.
7. The peripheral component interconnect of claim 1, wherein the
heat sink is positioned wholly on the board-side of the bracket
when the board connector and the cable connector are connected.
8. A peripheral component interconnect card comprising: a circuit
board extending from a front side to a back side; a bracket mounted
to the circuit board at the front side, the bracket including a
port for a cable to pass through; an electrical component mounted
to the circuit board; a board connector mounted to the board and
electrically connected to the electrical component; a first rail
configured to engage the cable, wherein the first rail defines a
first pathway that rotates between the bracket and the board
connector.
9. The peripheral component interconnect card of claim 8, further
comprising: a second rail configured to engage the cable, wherein
the second rail defines a second pathway that rotates between the
bracket and the board connector.
10. The peripheral component interconnect card of claim 9, further
comprising: a third rail configured to engage the cable, wherein
the third rail further defines the first pathway that rotates
between the bracket and the board connector; and a fourth rail
configured to engage the cable, wherein the fourth rail further
defines the second pathway that rotates between the bracket and the
board connector; wherein the first pathway and the second pathway
form a helical structure.
11. The peripheral component interconnect card of claim 8, wherein
the port has a first size dimension that is larger than a width of
the bracket.
12. The peripheral component interconnect card of claim 8, further
comprising: a door rotatably connected to the bracket to cover the
port.
13. The peripheral component interconnect card of claim 8, wherein
the first rail comprises a straight portion proximate to the board
connector and a curved portion proximate the bracket.
14. The peripheral component interconnect card of claim 13, wherein
the first rail extends beyond the bracket.
15. An electrical connection system comprising: a chassis
comprising a front wall, a rear wall, and a cavity divided into a
plurality of card bays; a card positioned in one of the plurality
of card bays and connected to the chassis, the card comprising: an
electrical component; a bracket mounted to the chassis, the bracket
including a port; a board connector electrically connected to the
electrical component; a guide that extends from the bracket towards
the board connector; and a cable comprising: a cord; and a header
at an end of the cord, the header comprising: an electronic
circuit; a heat sink; a cable connector configured to connect to
the board connector; and a guiding feature configured to engage the
guide; wherein the guide is shaped to direct the cable connector
from being misaligned with the board connector to being aligned
with the board connector.
16. The electrical connection system of claim 15, wherein the guide
comprises: a first rail extending from a first side of the port
towards the board connector; and a second rail extending from a
second side of the port, opposite of the first side, towards the
board connector; wherein the first rail and the second rail form a
helical structure that rotates ninety degrees.
17. The electrical connection system of claim 15, wherein: the
guide further comprises a third rail extending from the first side
of the port, adjacent to and spaced apart from the first rail; the
guiding feature comprises a lug extending from the header; and the
lug is configured to slide between the first rail and the third
rail.
18. The electrical connection system of claim 15, wherein the
guiding feature comprises: a first lug extending from a first side
of the header; and a second lug extending from a second side of the
header, opposite of the first side.
19. The electrical connection system of claim 18, wherein the heat
sink is positioned on a third side of the header between the first
side and the second side.
20. The electrical connection system of claim 15, wherein the heat
sink has a reduced cross-section at an end that is nearest the
cord.
Description
BACKGROUND
[0001] The present invention relates to computer hardware, and more
specifically, to a port that accommodates a heat sink.
[0002] Conventional peripheral component interconnects (PCIs) are
common structures used for attaching hardware devices in a
computer, such as a server. A PCI chassis typically has several
parallel connectors attached to a backplane into which PCI cards
are connected. There is a bay associated with each connector where
the bulk of the PCI card will reside. To conserve space, each bay
is directly adjacent to at least one other bay, which limits the
width of the PCI cards.
[0003] Some PCI cards can include a connector for connecting a
cable that originates outside of the PCI chassis. In some
instances, such a cable can be an active cable. Because an active
cable can have an electronic circuit in the header of the cable,
active cables can have heat sinks that must be accommodated by the
PCI card and the PCI chassis.
SUMMARY
[0004] According to an embodiment of the present disclosure, a
peripheral component interconnect includes a cable with a header.
The header includes a cable connector and a heat sink. The heat
sink has a cross-section that is reduced at an end that is opposite
of the cable connector.
[0005] According to an embodiment of the present disclosure, a
peripheral component interconnect card includes a circuit board
extending from a front side to a back side, a bracket mounted to
the circuit board at the front side including a port for a cable to
pass through, and an electrical component mounted to the circuit
board. Also included are a board connector mounted to the board and
electrically connected to the electrical component, and a first
rail configured to engage the cable. The first rail defines a first
pathway that rotates between the bracket to the board
connector.
[0006] According to an embodiment of the present disclosure, an
electrical connection system includes a chassis, a card, and a
cable. The chassis includes a front wall, a rear wall, and a cavity
divided into card bays. The card is positioned in one of the card
bays and is connected to the chassis. The card includes an
electrical component, a bracket mounted to the chassis including a
port, a board connector electrically connected to the electrical
component, and a guide that extends from the bracket towards the
board connector. The cable includes a cord, an electronic circuit,
a heat sink, a cable connector configured to connect to the
rotatable connector, and a guiding feature configured to engage the
guide. The guide is shaped to direct the cable connector from being
misaligned with the board connector to being aligned with the board
connector.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1A is an exploded, perspective view of a PCI assembly
according to an embodiment of the present disclosure.
[0008] FIG. 1B is a perspective view of the PCI assembly in an
assembled configuration.
[0009] FIG. 2 is a perspective view of an active cable according to
an embodiment of the present disclosure.
[0010] FIG. 3 is an exploded, perspective view of a rotatable
electrical connector assembly according to an embodiment of the
present disclosure.
[0011] FIG. 4 is a cross-sectional view of the PCI assembly as
indicated by line 4-4 in FIG. 1A according to an embodiment of the
present disclosure.
[0012] FIG. 5 is a perspective view from the inside of an alternate
embodiment PCI assembly according to an embodiment of the present
disclosure.
DETAILED DESCRIPTION
[0013] FIG. 1A is an exploded, perspective view of PCI assembly
100. FIG. 1B is a perspective view of PCI assembly 100 in an
assembled configuration. FIGS. 1A and 1B will now be discussed
together.
[0014] In the illustrated embodiment, PCI assembly 100 includes
chassis 102, card 104, and cable 106. Chassis 102 has a large
internal cavity with connectors (not shown) arranged in parallel
along the inside of rear wall 108. Chassis 102 also has a plurality
of threaded mounting holes 110 on front wall 109 for fasteners 112
to secure cover plates 114 and/or PCI cards, such as card 104.
Chassis 102 can be divided into bays (shown in FIG. 4) which can
be, for example, coincident with the edges of card 104 and cover
plates 114, such that FIGS. 1A and 1B show nine bays. In other
embodiments, the bays can be spaced apart and/or have additional
chassis in between (not shown).
[0015] In the illustrated embodiment, card 104 includes circuit
board 116 that has electrical components 118, card connector 120,
rotatable connector assembly 122, bracket (or tailstock) 124, and
board connector 126 mounted thereto. Rotatable connector assembly
122 includes rotatable connector 128 and leads 129 which
electrically connect board connector 126 and rotatable connector
128. In addition, conductors 130 extend between board connector
126, electrical components 118, and card connector 120,
respectively, to electrically connect those components. In turn,
card connector 120 electrically connects card 104 to the backplane
(not shown) of chassis 102, which can be connected to a greater
computing system, such as a server (not shown).
[0016] In the illustrated embodiment, cable 106 includes cord 132
and header 134. Bracket 124 includes a port 136 that has a shape
that corresponds with the shape of header 134. For example, if the
shape of header 134 is rectangular, then the shape of port 136
would also be a rectangle, although it would be of slightly larger
size as to accommodate header 134 as it passes through port 136.
Due to the size of header 134, the rectangular shape of port 136 is
oriented such that the longer portion extends along bracket 124 and
the shorter portion extends across bracket 124. Port 136 is aligned
front-to-back with rotatable connector 128, and header 134 is
configured to pass through port 136 and connect to rotatable
connector 128. After this has occurred, grommet 138 can be fit into
port 136 and/or around cord 132 to block electromagnetic
interference (EMI) leakage from the interior of chassis 102.
Therefore, grommet 138 can be comprised of, for example, an
elastomeric, polymer, and/or metal material. In addition to or
instead of grommet 138, bracket 124 can include door 140 (shown in
phantom in an opened position in FIG. 1A) that is rotatably
connected to bracket 124 and can be closed to cover port 136 when
cable 106 is not connected to card 104.
[0017] The components and configuration of PCI assembly 100 allow
for cable 106 to be connected to and disconnected from card 104
while card 104 is connected to chassis 102. In addition, cable 106
can be rotated with respect to card 104 while cable 106 is
connected to rotatable connector assembly 122.
[0018] FIGS. 1A and 1B show one embodiment of PCI assembly 100, to
which there are alternative embodiments. For example, card 104 can
have another format other than PCI that still includes bracket 124.
While only one card 104 is shown in FIGS. 1A and 1B, more cards 104
(not shown) can be connected to chassis 102. In such an embodiment,
the corresponding cover plates 114 would be removed and the cards
104 put in their places.
[0019] FIG. 2 is a perspective view of cable 106. Cable 106 is an
active cable, so it has electronic circuit 142 in header 134.
During operation, electronic circuit 142 can consume, for example 2
W to 5 W of electrical power, so electronic circuit 142 emanates a
corresponding amount of heat therefrom. Header 134 also includes
plug 144 and heat sink 146 with a plurality of fins 148.
[0020] Heat sink 146 can be an integral part of header 134,
although in other embodiments, heat sink 146 is permanently affixed
to header 134, for example, by brazing. Fins 148 can be, for
example, between 5 mm (0.20 in.) and 15 mm (0.59 in.) in height
dimension HF. In some such embodiments, for example, fins 148 can
be between 5 mm (0.20 in.) to 6 mm (0.24 in.) in height dimension
H.sub.F, and in other such embodiments, for example, fins 148 can
be between 10 mm (0.39 in.) to 15 mm (0.59 in.) in height dimension
H.sub.F. yes
[0021] In addition, there can be greater or fewer than nine fins
148. When electronic circuit 142 is operating, heat sink 146 can
extract heat from electronic circuit 142 where it can be
transferred to the ambient environment. Thereby, electronic circuit
142 can be cooled, for example, by forcing a cooling fluid, such as
air, through chassis 102 (shown in FIG. 1A).
[0022] FIG. 3 is an exploded, perspective view of rotatable
connector assembly 122. In the illustrated embodiment, rotatable
connector assembly 122 further includes front housing 150, rear
housing 152, receptacle disk 154, and lead disk 156. Receptacle
disk 154 has a loose fit in front housing 150 so relative rotation
is allowed therebetween, while lead disk 156 has a tight fit in
rear housing 152 to prevent relative rotation therebetween.
Furthermore, receptacle disk 154 and lead disk 156 are sandwiched
in contact with one another when front housing 150 and rear housing
152 are fastened together by fasteners 158. Receptacle disk 154
includes receptacle 160 and contacts 162, wherein each contact 162
corresponds to an electrical pin (not shown) in receptacle 160 and
plug 144. Lead disk 156 includes concentric rings 164 that are each
electrically insulated from one another and from housings 150 and
152.
[0023] In the assembled configuration, receptacle disk 154 can
still be rotated despite being in contact with lead disk 156. In
addition, each contact 162 is positioned to contact a different one
of rings 164, and each ring 164 is connected to only one of leads
129. Therefore, in the illustrated embodiment, four separate
electrical connections can be made and maintained between
receptacle 160 and leads 129 regardless of the rotational position
of receptacle disk 154.
[0024] FIG. 3 shows one embodiment of rotatable connector assembly
122, although there can be alternative embodiments. For example,
there can be a greater or fewer number of leads 129, contacts 162,
and rings 164. For another example, the connectors on card 104 and
cable 106 (shown in FIG. 1A) can be switched such that receptacle
160 can be positioned on header 134 (shown in FIG. 2), and plug 144
(shown in FIG. 2) can be positioned on receptacle disk 154. For
another example, housings 150 and 152 can be made of nonconductive
material such that rings 164 do not need to be insulated from
housings 150 and 152.
[0025] FIG. 4 is a cross-sectional view of PCI assembly 100 as
indicated by line 4-4 in FIG. 1A. In the illustrated embodiment,
card 104 is installed in its own bay 166 in chassis 102 (shown in
FIG. 1A), and header 134 is in an installed position with fins 148
extending perpendicularly outward from circuit board 116. This is
in contrast with the connecting position, which would be the
orientation of header 134 as shown in FIG. 1A (albeit with cable
106 being connected to rotatable connector assembly 122), with fins
148 extending parallel alongside circuit board 116, ninety degrees
away from the installed position.
[0026] When in the connecting position, header 134 extends a
relatively short distance from circuit board 116 so that header 134
can pass through port 136 in bracket 124 (both indicated in
phantom). But in the installed position, heat sink 146 extends a
relatively long distance from circuit board 116 such that heat sink
146 extends beyond the side edge of bracket 124 and its own bay
166A (because, in the illustrated embodiment, bay 166A is the same
size as bracket width dimension W.sub.B). Thereby, heat sink 146
extends into the adjacent bay 166B. While this precludes the
adjacent bay 166B from having any components in the space swept and
occupied by heat sink 146, heat sink 146 can extend farther from
circuit board 116 than would be possible with a conventional design
that had a cable connecting to a fixed connector on a card. In some
embodiments, for example, a height dimension H.sub.H of header 134
can be wider than a width dimension W.sub.B of bracket 124. For
another example, a height dimension H.sub.H to width dimension
W.sub.H (H.sub.H/W.sub.H) ratio of header 134 can be greater than
1.0/1.0, specifically between 1.5/1.0 to 3.0/1.0, as opposed to a
conventional design of between 1.0/1.5 to 1.0/1.0. This results in
heat sink 146 being exposed to about 340 linear meters per minute
(1100 linear feet per minute) of air speed, as opposed to about 150
linear meters per minute (500 linear feet per minute) with a
conventional design. Thereby, heat sink 146 is exposed to more air
in chassis 102 which increases the efficiency of cooling cable 106
(including electronic circuit 142, shown in FIG. 2).
[0027] FIG. 5 is a perspective view from the inside of an alternate
embodiment PCI assembly 200. Shown in FIG. 5 are card 204 and cord
206 which can be used with a chassis (not shown) that can be
similar to chassis 102. Although there may be only one cord 206
used with a given card 204, cord 206 appears twice in FIG. 5 for
explanatory purposes (once in an engaged position (top left) and
again in a connected position (bottom right)). Card 204 and cord
206 can also be similar to card 104, and cord 106, respectively,
albeit with some differences. For example, card 204 does not
include a rotary connector assembly, so plug 244 on cord 206
connects with receptacle 260 that is directly on board connector
226.
[0028] In such an embodiment, card 204 includes guide 267 and cord
206 includes lugs 268. Guide 267 comprises two pairs of rails 270
that begin slightly in front of bracket 224, with one pair being on
one side of port 236 and the other pair being on the opposite side
of port 236. The pairs of rails 270 define a helical structure
(e.g., a double helix) of pathways that extend towards board
connector 226. In the illustrated embodiment, guide 267 (as well as
rails 270 and the pathways) is shaped such that guide 267 rotates
ninety degrees between bracket 224 and board connector 226.
[0029] Lugs 268 are guiding features that are configured to fit
into guide 267 and allow for guide 267 to direct the rotation of
header 234. Thereby, guide 267 controls the alignment of plug 244
with receptacle 260. In the illustrated embodiment, one lug 268 is
positioned on each side of header 234, opposite of each other, with
heat sink 246 on the side in between.
[0030] Each lug 268 fits between a pair of rails 270. At the
entrance to guide 267, lugs 268 engage rails 270 at straight
portion 272 of guide 267. At straight portion 272, plug 244 is
misaligned ninety degrees from receptacle 260. Adjacent to straight
portion 272 is curved portion 274. As header 234 is moved along
curved portion 274 of guide 267 towards board connector 226, plug
244 is aligned with receptacle 260. Plug 244 then connects with
receptacle 260 as header 234 is moved along another straight
portion 276 of guide 267 that is adjacent to curved portion 274.
Each pair of rails 270 is joined at the end of straight portion 276
and can limit the inward travel of header 234 such that board
connector 226 is not excessively stressed during insertion of plug
244 into receptacle 260. In other embodiments, each pair of rails
270 may be open at the end of straight portion 276 since board
connector 226 can limit the inward travel of header 234 and prevent
header 234 from going beyond rails 270. In other embodiments, the
first straight portion 272 is absent, and guide 267 begins at
curved portion 274.
[0031] When plug 244 and receptacle 260 are connected, heat sink
246 is positioned wholly within the chassis (i.e., wholly on the
board-side of bracket 224). Because header 234 is taller than it is
wide and port 236 has a corresponding shape, heat sink 246 is
relieved adjacent the cord-side of header 234. More specifically,
the cross-section of heat sink 246 is reduced in order to provide
clearance from the edges of port 236 as header 234 translates and
rotates along guide 267. In the illustrated embodiment, the
reduction is in the form of two planar faces 278A and 278B opposite
one another instead of pointed corners that would have been present
due to the generally rectangular shape that header 234 otherwise
has. In some embodiments, the planar faces 278 are the same size,
but in other embodiments (such as the illustrated one), planar face
278A on heat sink 246 is significantly larger than planar face
278B. In other embodiments, there is only one planar face 278, for
example, planar face 278A.
[0032] In other embodiments, the reduction of header 234 is in the
form of a curved ribbon surface. In such an embodiment, the
reduction can be shaped according to a trigonometric function that
depends on the size of port 236, the axis of rotation of guide 267,
the rate of twist of guide 267, and where the twisting of guide 267
begins (e.g., the beginning of curved portion 274). While the shape
of header 234 would be complex, the size of header 234 would be
maximized, which would maximize the heat transfer of heat sink
246.
[0033] In other embodiments, guide 267 and lugs 268 can be
positioned ninety degrees from where they are shown in FIG. 5, such
that one lug 268 would protrude from the heat sink. While a
connected header 234 is positioned in the bay that is adjacent to
the bay that card 204 is affixed in, in these such embodiments,
guide 267 would always be positioned in the adjacent bay. In other
embodiments, lugs 268 can have shapes other than that of round
pegs. For example, lugs 268 can have a square shape, a T-shape, or
an L-shape, and guide 267 would be shaped correspondingly. In some
of these alternate embodiments, the orientation of header 234 may
be sufficiently controlled using one lug 268, so there may only be
one side to guide 267 (as opposed to the two sides formed by the
two pairs of rails 270 in FIG. 5). In other embodiments, the
guiding features on header 234 (e.g., lugs 268) can be positioned
on guide 267. In such an embodiment, header 234 can include slots
and/or rails to interface therewith.
[0034] The components and configuration of PCI assembly 200 allow
for increased cooling due to the increased size of heat sink 246
while employing a simple, stationary board connector 226.
Furthermore, guide 267 may be added to some existing cards without
requiring full card redesigns.
[0035] The descriptions of the various embodiments of the present
invention have been presented for purposes of illustration, but are
not intended to be exhaustive or limited to the embodiments
disclosed. Many modifications and variations will be apparent to
those of ordinary skill in the art without departing from the scope
and spirit of the described embodiments. The terminology used
herein was chosen to best explain the principles of the
embodiments, the practical application or technical improvement
over technologies found in the marketplace, or to enable others of
ordinary skill in the art to understand the embodiments disclosed
herein.
* * * * *