loadpatents
Patent applications and USPTO patent grants for Stathakis; Karl.The latest application filed is for "port for heat sink on active cable end".
Patent | Date |
---|---|
Reconfigurable storage thermal dissipation Grant 11,089,717 - Stathakis , et al. August 10, 2 | 2021-08-10 |
Port for heat sink on active cable end Grant 10,923,841 - Stathakis , et al. February 16, 2 | 2021-02-16 |
Port For Heat Sink On Active Cable End App 20210044044 - Stathakis; Karl ;   et al. | 2021-02-11 |
Reconfigurable Storage Thermal Dissipation App 20200413568 - Stathakis; Karl ;   et al. | 2020-12-31 |
Cable connector housing attachment for protecting and directing a cable Grant 10,833,445 - Stathakis , et al. November 10, 2 | 2020-11-10 |
Port for heat sink ono active cable end Grant 10,749,304 - Stathakis , et al. A | 2020-08-18 |
Microfluidic relief valve Grant 10,738,903 - O'Connell , et al. A | 2020-08-11 |
Heat Sink Assembly App 20200154607 - Larsen; Curtis E. ;   et al. | 2020-05-14 |
Heat sink assembly Grant 10,631,436 - Larsen , et al. | 2020-04-21 |
Adhesive-bonded thermal interface structures Grant 10,607,859 - Stathakis , et al. | 2020-03-31 |
Microfluidic Relief Valve App 20200072372 - O'CONNELL; Kevin ;   et al. | 2020-03-05 |
Variable inlet vanes Grant 10,415,571 - Anderl , et al. Sept | 2019-09-17 |
Adhesive-bonded Thermal Interface Structures App 20190267254 - Stathakis; Karl ;   et al. | 2019-08-29 |
Adhesive-bonded Thermal Interface Structures App 20190267253 - Stathakis; Karl ;   et al. | 2019-08-29 |
Adhesive-bonded thermal interface structures Grant 10,319,609 - Stathakis , et al. | 2019-06-11 |
Adhesive-bonded thermal interface structures Grant 10,304,699 - Stathakis , et al. | 2019-05-28 |
Variable inlet vanes Grant 10,288,076 - Anderl , et al. | 2019-05-14 |
Adhesive-bonded thermal interface structures for integrated circuit cooling Grant 10,236,189 - Stathakis , et al. | 2019-03-19 |
Adhesive-bonded Thermal Interface Structures App 20180374716 - Stathakis; Karl ;   et al. | 2018-12-27 |
Adhesive-bonded Thermal Interface Structures App 20180374714 - Stathakis; Karl ;   et al. | 2018-12-27 |
Adhesive-bonded Thermal Interface Structures For Integrated Circuit Cooling App 20180374715 - Stathakis; Karl ;   et al. | 2018-12-27 |
Variable Inlet Vanes App 20180073510 - Anderl; William J. ;   et al. | 2018-03-15 |
Variable Inlet Vanes App 20180073511 - Anderl; William J. ;   et al. | 2018-03-15 |
Variable inlet vanes Grant 9,869,318 - Anderl , et al. January 16, 2 | 2018-01-16 |
Variable inlet vanes Grant 9,850,908 - Anderl , et al. December 26, 2 | 2017-12-26 |
Light pipe connector apparatus Grant 9,726,837 - Mann , et al. August 8, 2 | 2017-08-08 |
Alignment of three dimensional integrated circuit components Grant 9,721,855 - Kuczynski , et al. August 1, 2 | 2017-08-01 |
Variable inlet vanes Grant 9,695,829 - Anderl , et al. July 4, 2 | 2017-07-04 |
Light Pipe Connector Apparatus App 20170090129 - Mann; Phillip V. ;   et al. | 2017-03-30 |
Alignment of three dimensional integrated circuit components Grant 9,508,614 - Kuczynski , et al. November 29, 2 | 2016-11-29 |
Dual optical and electrical LGA contact Grant 9,494,752 - Mann , et al. November 15, 2 | 2016-11-15 |
Light pipe connector apparatus Grant 9,482,833 - Mann , et al. November 1, 2 | 2016-11-01 |
Thermal spreading for an externally pluggable electronic module Grant 9,414,528 - Mann , et al. August 9, 2 | 2016-08-09 |
Thermal spreading for an externally pluggable electronic module Grant 9,414,527 - Mann , et al. August 9, 2 | 2016-08-09 |
Variable Inlet Vanes App 20160219754 - Anderl; William J. ;   et al. | 2016-07-28 |
Variable Inlet Vanes App 20160215779 - Anderl; William J. ;   et al. | 2016-07-28 |
Variable Inlet Vanes App 20160215783 - Anderl; William J. ;   et al. | 2016-07-28 |
Dual optical and electrical LGA contact Grant 9,389,379 - Mann , et al. July 12, 2 | 2016-07-12 |
Dual Optical And Electrical Lga Contact App 20160187602 - Mann; Phillip V. ;   et al. | 2016-06-30 |
Dual Optical And Electrical Lga Contact App 20160187601 - Mann; Phillip V. ;   et al. | 2016-06-30 |
Alignment Of Three Dimensional Integrated Circuit Components App 20160172324 - Kuczynski; Joseph ;   et al. | 2016-06-16 |
Alignment Of Three Dimensional Integrated Circuit Components App 20160172252 - Kuczynski; Joseph ;   et al. | 2016-06-16 |
Thermal Spreading For An Externally Pluggable Electronic Module App 20160135332 - Mann; Phillip V. ;   et al. | 2016-05-12 |
Thermal Spreading For An Externally Pluggable Electronic Module App 20160135327 - Mann; Phillip V. ;   et al. | 2016-05-12 |
Managing Heat Transfer For Electronic Devices App 20160095254 - Mann; Phillip V. ;   et al. | 2016-03-31 |
Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars Grant 9,299,686 - Mann , et al. March 29, 2 | 2016-03-29 |
Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars Grant 9,299,591 - Mann , et al. March 29, 2 | 2016-03-29 |
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