U.S. patent application number 16/191009 was filed with the patent office on 2020-05-14 for heat sink assembly.
The applicant listed for this patent is International Business Machines Corporation. Invention is credited to Curtis E. Larsen, Karl Stathakis.
Application Number | 20200154607 16/191009 |
Document ID | / |
Family ID | 70285225 |
Filed Date | 2020-05-14 |
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United States Patent
Application |
20200154607 |
Kind Code |
A1 |
Larsen; Curtis E. ; et
al. |
May 14, 2020 |
HEAT SINK ASSEMBLY
Abstract
A heat sink assembly, includes: a first heat sink; an adhesive
thermal interface material applied to the first heat sink to mate
the first heat sink to a first heat-generating component; a second
heat sink; one or more support members connecting the first heat
sink and the second heat sink; and a non-adhesive thermal interface
material applied to the second heat sink to mate the second heat
sink to a second heat-generating component.
Inventors: |
Larsen; Curtis E.; (Eden
Valley, MN) ; Stathakis; Karl; (Rochester,
MN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
International Business Machines Corporation |
Armonk |
NY |
US |
|
|
Family ID: |
70285225 |
Appl. No.: |
16/191009 |
Filed: |
November 14, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06F 1/20 20130101; H01L
23/36 20130101; H01L 23/42 20130101; H05K 7/2049 20130101; H05K
7/20481 20130101; H05K 7/20418 20130101; H01L 23/4006 20130101 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A heat sink assembly, comprising: a first heat sink; an adhesive
thermal interface material applied to the first heat sink to mate
the first heat sink to a first heat-generating component; a second
heat sink; one or more support members connecting the first heat
sink and the second heat sink, wherein the one or more support
members apply a torque to the second heat sink in response to the
first heat sink being mated to the first heat-generating component;
and a non-adhesive thermal interface material applied to the second
heat sink to mate the second heat sink to a second heat-generating
component, wherein the torque from the one or more supporting
members mates the second heat sink to, and in contact with, the
second heat-generating component.
2. (canceled)
3. The heat sink assembly of claim 1, wherein the one or more
support members comprise one or more wires or one or more rods.
4. The heat sink assembly of claim 1, wherein the adhesive thermal
interface material comprises a thermal glue or a thermal tape.
5. The heat sink assembly of claim 1, wherein the non-adhesive
thermal interface material comprises a thermal grease or a
thermally conductive pad.
6. The heat sink assembly of claim 1, wherein the first
heat-generating component or the second heat-generating component
comprise a processor.
7. The heat sink assembly of claim 1, wherein the first
heat-generating component or the second heat-generating component
comprise a field programmable gate array.
8. A method for installing a heat sink assembly, comprising: mating
a first heat sink to a first heat-generating component using an
adhesive thermal interface material, wherein the first heat sink is
coupled to a second heat sink by one or more support members;
mating, by a torque from the one or more support members and
without using adhesive thermal interface materials, the second heat
sink to a second heat-generating component.
9. The method of claim 8, wherein mating the second heat sink to
the second heat-generating component comprises mating the second
heat sink to the second heat-generating component using a
non-adhesive thermal interface material.
10. The method of claim 8, wherein the one or more support members
comprise one or more wires or one or more rods.
11. The method of claim 8, wherein the adhesive thermal interface
material comprises a thermal glue or a thermal tape.
12. The method of claim 9, wherein the non-adhesive thermal
interface material comprises a thermal grease or a thermally
conductive pad.
13. The method of claim 8, wherein the first heat-generating
component or the second heat-generating component comprise a
processor.
14. The method of claim 8, wherein the first heat-generating
component or the second heat-generating component comprise a field
programmable gate array.
15. An apparatus, comprising: a first heat-generating component; a
second heat-generating component; a heat sink assembly, comprising:
a first heat sink; an adhesive thermal interface material applied
to the first heat sink to mate the first heat sink to the first
heat-generating component; a second heat sink; one or more support
members connecting the first heat sink and the second heat sink,
wherein the one or more support members apply a torque to the
second heat sink in response to the first heat sink being mated to
the first heat-generating component; and a non-adhesive thermal
interface material applied to the second heat sink to mate the
second heat sink to a second heat-generating component wherein the
torque from the one or more supporting members mates the second
heat sink to, and in contact with, the second heat-generating
component.
16. (canceled)
17. The apparatus of claim 15, wherein the one or more support
members comprise one or more wires or one or more rods.
18. The apparatus of claim 15, wherein the adhesive thermal
interface material comprises a thermal glue or a thermal tape.
19. The apparatus of claim 15, wherein the non-adhesive thermal
interface material comprises a thermal grease or a thermally
conductive pad.
20. The apparatus of claim 15, wherein the first heat-generating
component or the second heat-generating component comprise a
processor or a field programmable gate array.
Description
BACKGROUND
Field of the Invention
[0001] The field of the invention is a heat sink assembly, or, more
specifically, a heat sink assembly for mating a second heat sink to
a heat-generating component using support members anchoring the
second heat sink to a first heat sink.
Description Of Related Art
[0002] The development of the EDVAC computer system of 1948 is
often cited as the beginning of the computer era. Since that time,
computer systems have evolved into extremely complicated devices.
Today's computers are much more sophisticated than early systems
such as the EDVAC. Computer systems typically include a combination
of hardware and software components, application programs,
operating systems, processors, buses, memory, input/output devices,
and so on. As advances in semiconductor processing and computer
architecture push the performance of the computer higher and
higher, more sophisticated computer software has evolved to take
advantage of the higher performance of the hardware, resulting in
computer systems today that are much more powerful than just a few
years ago.
[0003] Electrical components, such as those found in computer
systems, can generate substantial heat when operating at high
speed. It may be desired to remove heat from heat-generating
components, such as processors and/or field programmable gate
arrays (FPGAs) using heat sinks. Heat sinks may include a base for
conducting the heat of a heat-generating component, and fins to
dissipate heat into ambient air.
SUMMARY
[0004] A heat sink assembly can comprise a first heat sink; an
adhesive thermal interface material applied to the first heat sink
to mate the first heat sink to a first heat-generating component; a
second heat sink; one or more support members connecting the first
heat sink and the second heat sink; and a non-adhesive thermal
interface material applied to the second heat sink to mate the
second heat sink to a second heat-generating component.
[0005] The foregoing and other objects, features and advantages of
the invention will be apparent from the following more particular
descriptions of exemplary embodiments of the invention as
illustrated in the accompanying drawings wherein like reference
numbers generally represent like parts of exemplary embodiments of
the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] FIG. 1 is a diagram of an example heat sink assembly.
[0007] FIG. 2 is a diagram of an example unmounted heat sink
assembly.
[0008] FIG. 3 is a diagram of an example mounted heat sink
assembly.
[0009] FIG. 4 is a flowchart of an example method.
DETAILED DESCRIPTION
[0010] Exemplary methods and products for a heat sink assembly in
accordance with the present invention are described with reference
to the accompanying drawings, beginning with FIG. 1. FIG. 1 sets
forth a diagram of a heat sink assembly 100 configured for mating a
second heat sink to a heat-generating component using support
members anchoring the second heat sink to a first heat sink
according to embodiments of the present invention.
[0011] The heat sink assembly 100 comprises a first heat sink 102
and a second heat sink 104. The first heat sink 102 and second heat
sink 104 each include a base 106. When the heat sink assembly 100
is mounted (e.g., to a circuit board or other component of an
apparatus), the base 106 of the first heat sink 102 and second heat
sink 104 mate to a first heat-generating component and second
heat-generating component (e.g., a processor, a field programmable
gate array (FPGA), or other heat-generating component as can be
appreciated). Accordingly, the base 106 is comprised of a heat
conducting material (e.g. metal).
[0012] The first heat sink 102 and second heat sink 104 also each
include a plurality of fins 108. Each of the fins 108 is attached
to the base 106 so as to conduct heat from the base 106 and pass
the conducted heat into ambient air. Thus, heat from a
heat-generating component is conducted to the fins 108 via the base
106 and dissipated into the ambient air. The fins 108 may be
attached to the base 106 through welding or soldering. The fins 108
may also be formed with the base 106 by metal extrusion, such as
aluminum extrusion. Although the fins 108 are shown in a "straight"
fin arrangement, it is understood that this is merely exemplary,
and that other arrangements may be used for the fins 108 (e.g., a
"pin" arrangement, a "flared" arrangement). Though not shown, the
first heat sink 102 and second heat sink 105 may also include
additional components in order to improve heat circulation and
dissipation through the fins 108, such as fans.
[0013] The first heat sink 102 and second heat sink 104 are
connected by one or more support members 110. Support members 110
are rigid or semi-rigid components to anchor the second heat sink
104 to the first heat sink 102. As shown in more detail in FIG. 2,
the support members 110 may be formed such that, when the first
heat sink 102 is mated to a first heat-generating component, the
support members 110 apply a torque to as to mate the second heat
sink 104 to a second heat-generating component. For the purpose of
this discussion, a heat sink is considered "mated" to a
heat-generating component when the heat sink is thermally coupled
to the heat-generating component.
[0014] The support members 110 may be formed with a curve or angle
such that the support members 110 are at least partially
straightened when the heat sink assembly 100 is mounted, thereby
providing the torque to mate the second heat sink 104 to a second
heat-generating component. The support member 110 may include
wires, rods, or other supports as can be appreciated. The support
members 110 may be comprised of thermally conductive material (e.g.
metal) to provide heat transfer between the first heat sink 102 and
second heat sink 104, and to provide for additional surface area
for heat dissipation into the ambient air. The support members 110
may also be comprised of thermally insulating material.
[0015] The underside (not shown) of the bases 106 may have a
thermal interface material applied to facilitate mating by the
first heat sink 102 and second heat sink 104 to the first and
second heat-generating components, respectively. A thermal
interface material serves to improve thermal coupling between a
heat source (e.g., a heat-generating component) and a heat sink
(e.g., the first heat sink 102 or second heat sink 104). The
thermal interface material improves the thermal coupling by filling
air gaps between a heat source and a heat sink that would otherwise
be present.
[0016] Thermal interface materials may include adhesive thermal
interface materials. Adhesive thermal interface materials provide
both adhesion and thermal coupling between a heat source and a heat
sink. Examples of adhesive thermal interface materials include
thermal tape and thermal glue. Thermal interface materials may also
include non-adhesive thermal interface materials, which have
little-to-no adhesive properties. Examples of non-adhesive thermal
interface materials include thermal grease, thermal gap filler, or
thermally conductive pads.
[0017] FIG. 2 shows a profile view of the heat sink assembly 100
unmounted relative to a first heat-generating component 202 and
second heat-generating component 204. The first heat-generating
component 202 and second heat-generating component 204 can each
comprise, for example, a processor, field programmable gate array,
or other component mounted on a printed circuit board or other
apparatus component. In this example, the first heat sink 102 has
an adhesive thermal interface material 206 (e.g., thermal glue or
thermal tape) applied to its base 106. The second heat sink 104 has
a non-adhesive thermal interface material 208 (e.g., thermal
grease, thermal gap filler, or a thermally conductive pad) applied
to its base 106. The support members 110 of the heat sink assembly
100 are formed with an angle such that, when the heat sink assembly
100 is mounted, a torque is generated to mate the second heat sink
104 to the second heat-generating component 204.
[0018] FIG. 3 shows a profile view of the heat sink assembly 100 in
a mounted position. When the heat sink assembly 100 is mounted, the
first heat-generating component 102 is mated to the first
heat-generating component 202, and the second heat-generating
component 104 is mated to the second heat-generating component 204.
Here, the first heat sink 102 is securely mated to the first
heat-generating component 202 using the adhesive thermal interface
material 206. As the support members 110 have been deformed into a
straightened shape, the support members 110 generate a torque by
virtue of their tendency to reform into their original shape. The
torque generated by the support members 110 forces the second heat
sink 104 into contact with the second heat-generating component
204, thereby mating the second heat sink 104 to the second
heat-generating component 204. The mating between the second heat
sink 102 and second heat-generating component 204 is facilitated by
the non-adhesive thermal interface material 208.
[0019] Though the first heat sink 102 is shown as being securely
mated to the first heat-generating component 202 using the adhesive
thermal interface material 206, it is understood that additional
components or combinations of components may also serve to mate the
first heat sink 102 to the first heat-generating component 202. For
example, one or more clamps, clips, screws, or other components to
immobilize the first heat sink 102 in place as mated to the first
heat-generating component 202. For example, the torque generated by
the support members 110 may be stronger than the adhesive
properties provided by the adhesive thermal interface material 206.
Accordingly, additional components may be required to immobilize
the first heat sink 102 as mated to the first heat-generating
component 202. In an alternative embodiment, the first heat sink
102 can be mated to the first heat-generating component 202 using
only mechanical immobilization (e.g., only using screws, clamps,
clips, etc.). The first heat sink 102 can also be mated to the
first heat-generating component 202 using a combination of
mechanical immobilization (e.g., using screws, clamps, clips, etc.)
and non-adhesive thermal interface materials 208.
[0020] As the second heat sink 104 is anchored to the first heat
sink 102 by the support members 110, and because the first heat
sink 102 is securely mated to the first heat-generating component
202, the second heat sink 104 need not be mechanically or
adhesively coupled to the second heat-generating component 204.
This provides several advantages. Non-adhesive thermal interface
materials 208 may provide better thermal conductivity when compared
to adhesive thermal interface materials 206. However, a heat sink
using non-adhesive thermal interface materials 208 would typically
need to be physically immobilized using screws, clamps, etc., each
of which takes up space on a circuit board that could otherwise be
used for circuity. Here, as no mechanical components are required
to immobilize the second heat sink 102, circuit board space that
would be otherwise used for latches, clamps, screws, etc. can
instead be used for additional circuitry or other functional
components.
[0021] For further explanation, FIG. 4 sets forth a flow chart
illustrating an exemplary method for mounting a heat sink assembly
according to embodiments of the present invention that includes
mating 402 a first heat sink 102 to a first heat-generating
component 202 using an adhesive thermal interface material 206. The
first heat sink 102 can be physically coupled to a second heat sink
104 using one or more support members 110. The support members 110
can comprise rods, wires, or other components as can be
appreciated. The support members 110 can be formed to provide a
torque to the second heat sink 102 to mate the second heat sink 102
to a second heat-generating component 204. Accordingly, the support
members 110 can be formed with a curve, angle, or other formation
such that, when deformed, the support members 110 provide the
torque.
[0022] Mating the first heat sink 102 to a first heat-generating
component 202 using an adhesive thermal interface material 206 may
include applying thermal glue or thermal tape to a base 106 of the
first heat-generating component 202 and adhering the first heat
sink 102 to the first heat-generating component 202. Mating the
first heat sink 102 to a first heat-generating component 202 using
an adhesive thermal interface material 206 may include physically
immobilizing the first heat sink 102 using one or more clamps,
clips, latches, screws, etc.
[0023] The method of FIG. 4 may also include mating 404, by a
torque from one or more support members 110 and without using
adhesive thermal interface materials 206, the second heat sink 104
to the second heat-generating component 204. Mating 404, by a
torque from one or more support members 110 and without using
adhesive thermal interface materials 206, the second heat sink 104
to the second heat-generating component 204 may include deforming
(e.g., straightening) the support members 110 such that the support
members 110 attempt to return to their original shape (e.g., curved
or angled), thereby providing a torque to the second heat sink 104.
As the first heat sink 102 is securely mated to the first
heat-generating component 202 (using adhesive thermal interface
materials 206 and/or physical immobilization), the torque forces
the base 106 of the second heat sink 102 into a thermally coupled
position with the second heat-generating component 202, thereby
mating the second heat sink 102 to the second heat-generating
component 202. Mating 404, by a torque from one or more support
members 110 and without using adhesive thermal interface materials
206, the second heat sink 104 to the second heat-generating
component 204 may include mating the second heat sink 102 to the
second heat-generating component 202 using non-adhesive thermal
interface materials 208. For example, non-adhesive thermal
interface materials 208 such as thermal grease, thermally
conductive pads, or thermal gap fillers can facilitate thermal
coupling between a base 106 of the second heat sink 104 and the
second heat-generating component 202.
[0024] In view of the explanations set forth above, readers will
recognize that the benefits of the heat sink assembly according to
embodiments of the present invention include:
[0025] Increased thermal conductivity using non-adhesive thermal
interface materials
[0026] Freeing circuit board space that would otherwise be used for
clamps, latches, screws, etc. to secure heat sinks
[0027] It will be understood from the foregoing description that
modifications and changes may be made in various embodiments of the
present invention without departing from its true spirit. The
descriptions in this specification are for purposes of illustration
only and are not to be construed in a limiting sense. The scope of
the present invention is limited only by the language of the
following claims.
* * * * *