U.S. patent application number 16/633375 was filed with the patent office on 2020-07-23 for history management pad of semiconductor test socket, manufacturing method thereof, and semiconductor test device including histo.
This patent application is currently assigned to TSE CO.,LTD. The applicant listed for this patent is TSE CO.,LTD.. Invention is credited to Bo Hyun KIM, Yoon Hyeong LEE.
Application Number | 20200233029 16/633375 |
Document ID | 20200233029 / US20200233029 |
Family ID | 63049333 |
Filed Date | 2020-07-23 |
Patent Application | download [pdf] |
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United States Patent
Application |
20200233029 |
Kind Code |
A1 |
KIM; Bo Hyun ; et
al. |
July 23, 2020 |
HISTORY MANAGEMENT PAD OF SEMICONDUCTOR TEST SOCKET, MANUFACTURING
METHOD THEREOF, AND SEMICONDUCTOR TEST DEVICE INCLUDING HISTORY
MANAGEMENT PAD
Abstract
The present invention relates to a history management pad of a
semiconductor test socket, a manufacturing method thereof, and a
semiconductor test device including the history management pad.
According to the present invention, a history management pad of a
semiconductor test socket is provided, the history management pad
which is installed on one side of the periphery of a socket frame
of a semiconductor test socket composed of a socket body and the
socket frame, is characterized by including: an insulating molded
film member provided with a plurality of electrode units in the
thickness direction; a guide film means which is formed above the
molded film member and guides and supports the mounting of a
tracking chip to the molded film member; the tracking chip which is
conductively connected to an upper end part of the electrode units
of the molded film member; and a fixing means for fixing the
tracking chip to the guide film means, wherein electrode unit lower
end parts protruding from socket frame holes formed at positions
corresponding to the electrode units are connected to a pad of a
socket printed circuit board.
Inventors: |
KIM; Bo Hyun; (Cheonan-si,
Chungcheongnam-do, KR) ; LEE; Yoon Hyeong;
(Cheonan-si, Chungcheongnam-do, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
TSE CO.,LTD. |
Cheonan-si, Chungcheongnam-do |
|
KR |
|
|
Assignee: |
TSE CO.,LTD
Cheonan-si, Chungcheongnam-do
KR
|
Family ID: |
63049333 |
Appl. No.: |
16/633375 |
Filed: |
July 23, 2018 |
PCT Filed: |
July 23, 2018 |
PCT NO: |
PCT/KR2018/008285 |
371 Date: |
January 23, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G01R 1/0441 20130101;
G01R 1/0408 20130101; G01R 31/2868 20130101; G01R 31/2875 20130101;
G01R 1/0458 20130101; G01R 31/2856 20130101; G01R 31/2867 20130101;
G01R 31/2891 20130101; G01R 31/2642 20130101; G01R 31/2874
20130101; G01R 31/2886 20130101; G01R 31/50 20200101 |
International
Class: |
G01R 31/28 20060101
G01R031/28; G01R 1/04 20060101 G01R001/04 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 7, 2017 |
KR |
10-2017-0167278 |
Claims
1. A history management pad of a semiconductor test socket, the pad
comprising: an insulative mold film member installed at an outer
portion of a socket frame of the semiconductor test socket
configured of a socket body and the socket frame, and provided with
a plurality of electrode units in a thickness direction; a guide
film means formed on a top of the mold film member to guide and
support a tracking chip when the tracking chip is mounted on the
mold film member; the tracking chip conductively contacting with a
top of the electrode units of the mold film member; and a fixing
means for fixing the tracking chip to the guide film means, wherein
lower portions of the electrode units contact with pads of a socket
printed circuit board through holes of the socket frame formed at
positions corresponding to the electrode units.
2. The history management pad according to claim 1, wherein the
socket body is an elastic conductive sheet including a conductive
unit, in which a plurality of conductive particles is distributed
in an insulative elastic material; and an insulative supporting
unit for disconnecting electrical contact with an adjacent
conductive unit while supporting each conductive unit.
3. The history management pad according to claim 1, wherein the
electrode unit is an elastic electrode unit which forms a
conductive path as a plurality of conductive particles is arranged
in a thickness direction within an insulative elastic material.
4. The history management pad according to claim 1, wherein the
guide film means includes: a ball guide film member in which
position compensation holes for aligning balls of the tracking chip
are formed; and a chip guide film member in which a chip guide hole
for guiding and supporting the tracking chip is formed.
5. The history management pad according to claim 1, wherein the
fixing means is formed as a film cover covering the tracking
chip.
6. The history management pad according to claim 1, wherein the
fixing means is formed of an adhesive or silicon for fixing the
tracking chip.
7. A method of manufacturing a history management pad of a
semiconductor test socket, the method comprising: a first step of
forming, at an outer portion of a socket frame of the semiconductor
test socket, an insulative mold film member provided with a
plurality of electrode units for electrically connecting electrode
balls of the tracking chip to pad electrodes provided in a socket
printed circuit board; a second step of attaching a ball guide film
member, in which guide holes aligned with the electrode units are
formed, to a top surface of the mold film member; a third step of
attaching a chip guide film member, in which a chip guide hole for
guiding the tracking chip is formed, to a top surface of the ball
guide film member; a fourth step of contacting the balls of the
tracking chip to the electrode units of the mold film member
through the guide holes of the ball guide film member, while
guiding the tracking chip through the chip guide hole of the chip
guide film member; and a fifth step of fixing the tracking chip on
the mold film member.
8. The method according to claim 7, wherein the first step is
accomplished by attaching the insulative mold film member, in which
the plurality of electrode units is formed, to the socket frame in
which holes corresponding to the electrode units are formed at an
outer portion.
9. The method according to claim 7, wherein the first step is
accomplished by providing the mold film member in which holes for
forming the electrode units are formed and the socket frame in
which holes corresponding to the holes for forming the electrode
units are formed at an outer portion, attaching the mold film
member at an outer portion of the socket frame in one piece, and
filling the electrode units in the holes for forming the electrode
units and the holes of the socket frame.
10. The method according to claim 7, wherein at the fifth step, the
tracking chip is fixed by attaching a cover film around an area
including a top of the tracking chip.
11. The method according to claim 7, wherein at the fifth step, the
tracking chip is fixed using an adhesive or silicon.
12. A method of manufacturing a history management pad of a
semiconductor test socket, the method comprising: a first step of
providing an insulative mold film member provided with a plurality
of electrode units; a second step of attaching a ball guide film
member, in which guide holes aligned with the electrode units are
formed, to a top surface of the mold film member; a third step of
attaching a chip guide film member, in which a chip guide hole for
guiding the tracking chip is formed, to a top surface of the ball
guide film member; a fourth step of contacting the balls of the
tracking chip to the electrode units of the mold film member
through the guide holes of the ball guide film member, while
guiding the tracking chip through the chip guide hole of the chip
guide film member; a fifth step of fixing the tracking chip on the
mold film member; and a sixth step of attaching the mold film
member, which has completed gone through the process up to the
fifth step, at an outer portion of the socket frame of the
semiconductor test socket in which holes corresponding to the
electrode units are formed.
13. The method according to claim 12, wherein at the fifth step,
the tracking chip is fixed by attaching a cover film around an area
including a top of the tracking chip.
14. The method according to claim 12, wherein at the fifth step,
the tracking chip is fixed using an adhesive or silicon.
15. A semiconductor test device comprising: a socket frame provided
with the history management pad according to claim 1 at an outer
portion; and a socket guide member provided on a top of the
tracking chip and configured to press the tracking chip when a
semiconductor test socket is tested.
Description
TECHNICAL FIELD
[0001] The present invention relates to a history management pad of
a semiconductor test socket, a manufacturing method thereof, and a
semiconductor test device including the history management pad, and
more specifically, to a history management pad of a semiconductor
test socket, a manufacturing method thereof, and a semiconductor
test device including the history management pad, in which the
history management pad is provided in the semiconductor test
socket, and may obtain accurate data by managing history such as
lifespan and inventory of the socket, information on a device under
test, identification of a position and the like, and accurately
determine a time for replacing the socket.
BACKGROUND ART
[0002] Generally, a semiconductor package manufacturing process is
largely divided into a preprocess, a postprocess and a test
process. The preprocess is also referred to as a fabrication (FAB)
process, which is a process of forming an integrated circuit on a
wafer of a single crystal silicon material. The postprocess is also
referred to as an assembly process, which is a process of forming
an integrated circuit package (device under test) by dividing the
wafer into individual chips, connecting a conductive lead or ball
to the chips to make connection of electrical signals to external
devices possible, and molding the chips with resin such as epoxy
resin to protect the chips from the external environments. The test
process is a process of testing whether the integrated circuit
package normally operates, and separating good and bad
products.
[0003] One of core components applied to the test process is a
socket. The socket is mounted on a printed circuit board (PCB)
electrically connected to a tester for testing an integrated
circuit and is in charge of a function of electrically and
mechanically connecting the tester and a handler. Here, contact
pins of the socket are in charge of a function of electrically
connecting a lead of the integrated circuit package and a terminal
of the printed circuit board.
[0004] The tester creates an electrical signal for testing an
integrated circuit package that will be mounted on the socket,
outputs the electrical signal to the integrated circuit package,
and tests whether the integrated circuit package normally operates
using the electrical signal inputted through the integrated circuit
package. As a result, the integrated circuit package is determined
as a good or bad product.
[0005] The handler automatically mounts the integrated circuit
package on the socket, withdraws the integrated circuit package
from the socket according to a test result of the tester, and
disposes the integrated circuit package after determining the
package as a bad or good product.
[0006] Meanwhile, the price of testers increases recently due to
increase of devices under test (DUTs) simultaneously tested for the
sake of high speed, high functionality and high productivity of the
integrated circuits. To efficiently use the expensive testers, it
is very important to select and use an appropriate socket and
manage the lifespan of the socket.
[0007] If lifespan of a socket is exhausted and performance of the
socket is degraded while testing a large quantity of packages, the
cases of classifying a semiconductor package of a good quality as a
defective one gradually increase, and a very high defective rate is
maintained until the defective socket is replaced with a new
socket. In addition, as the expensive tester and the handler should
be stopped to replace the socket whenever a defective socket is
replaced, efficiency of the test is lowered, and as a result, and
this may affect the production yield.
[0008] To prevent this problem, in the semiconductor industry,
gradual increase of the defective rate is prevented by replacing a
defective socket with a new socket when a socket reaches a
predetermined number of times of using the socket, i.e., a
threshold use count, and an appropriate replacement time is managed
by grasping the number of good products and bad products, together
with the threshold use count. Meanwhile, the replaced socket may be
reused through a test after cleansing the socket.
[0009] The methods currently used in the semiconductor industry to
grasp the threshold use count, the number of good products and the
number of bad products as described above will be described below.
Although a method of approximately estimating the number of times
of using a socket by recording an initial use date on the socket
body and grasping the time elapsed from the date is used as a first
method, this method may not calculate an accurate data, and it is
impossible to grasp all the necessary items such as the number of
times of using the socket, the number of good products, the number
of bad products and the like. As a second method, there is a method
in which the tester or the handler memorizes the data processed by
each socket. However, this method may not acquire accurate data as
the position of a socket may not be recognized when the position of
the socket is changed, and there is a problem in that it is unable
to identify the number of times of using a socket reused through a
reproduction work such as a cleansing work or the like described
above.
DISCLOSURE OF INVENTION
Technical Problem
[0010] Therefore, the present invention has been made in view of
the above problems, and it is an object of the present invention to
provide a history management pad of a semiconductor test socket, a
manufacturing method thereof, and a semiconductor test device
including the history management pad, in which the history
management pad is provided in the semiconductor test socket, and
may obtain accurate data by managing history such as lifespan and
inventory of the socket, information on a device under test,
identification of a position and the like.
[0011] Another object of the present invention is to provide a
history management pad of a semiconductor test socket, a
manufacturing method thereof, and a semiconductor test device
including the history management pad, which can prevent a test
error caused by the socket by accurately determining a time for
replacing the socket, and maintain production yield by estimating
an accurate time for replacing the socket and replacing the socket
at an idle time.
Technical Solution
[0012] To accomplish the above objects, according to a first aspect
of the present invention, there is provided a history management
pad of a semiconductor test socket, the pad comprising: an
insulative mold film member installed at an outer portion of a
socket frame of the semiconductor test socket configured of a
socket body and the socket frame, and provided with a plurality of
electrode units in the thickness direction; a guide film means
formed on the top of the mold film member to guide and support a
tracking chip when the tracking chip is mounted on the mold film
member; the tracking chip conductively contacting with the top of
the electrode units of the mold film member; and a fixing means for
fixing the tracking chip to the guide film means, wherein lower
portions of the electrode units contact with pads of a socket
printed circuit board through holes of the socket frame formed at
the positions corresponding to the electrode units.
[0013] In the first aspect of the present invention, the socket
body is an elastic conductive sheet including a conductive unit, in
which a plurality of conductive particles is distributed in an
insulative elastic material; and an insulative supporting unit for
disconnecting electrical contact with an adjacent conductive unit
while supporting each conductive unit.
[0014] In the first aspect of the present invention, the electrode
unit is an elastic electrode unit which forms a conductive path as
a plurality of conductive particles is arranged in the thickness
direction within the insulative elastic material.
[0015] In the first aspect of the present invention, the guide film
means includes: a ball guide film member in which position
compensation holes for aligning balls of the tracking chip are
formed; and a chip guide film member in which a chip guide hole for
guiding and supporting the tracking chip is formed.
[0016] In the first aspect of the present invention, the fixing
means is formed as a film cover covering the tracking chip.
[0017] In the first aspect of the present invention, the fixing
means is formed of an adhesive or silicon for fixing the tracking
chip.
[0018] According to a second aspect of the present invention, there
is provided a method of manufacturing a history management pad of a
semiconductor test socket, the method comprising: a first step of
forming, at an outer portion of a socket frame of the semiconductor
test socket, an insulative mold film member provided with a
plurality of electrode units for electrically connecting electrode
balls of the tracking chip to pad electrodes provided in a socket
printed circuit board; a second step of attaching a ball guide film
member, in which guide holes aligned with the electrode units are
formed, on the top surface of the mold film member; a third step of
attaching a chip guide film member, in which a chip guide hole for
guiding the tracking chip is formed, on the top surface of the ball
guide film member; a fourth step of contacting the balls of the
tracking chip to the electrode units of the mold film member
through the guide holes of the ball guide film member, while
guiding the tracking chip through the chip guide hole of the chip
guide film member; and a fifth step of fixing the tracking chip on
the mold film member.
[0019] In the second aspect of the present invention, the first
step is accomplished by attaching the insulative mold film member,
in which the plurality of electrode units is formed, to the socket
frame in which holes corresponding to the electrode units are
formed at an outer portion.
[0020] In the second aspect of the present invention, the first
step is accomplished by providing the mold film member in which
holes for forming the electrode units are formed and the socket
frame in which holes corresponding to the holes for forming the
electrode units are formed at an outer portion, attaching the mold
film member at an outer portion of the socket frame in one piece,
and filling the electrode units in the holes for forming the
electrode units and the holes of the socket frame.
[0021] In the second aspect of the present invention, at the fifth
step, the tracking chip is fixed by attaching a cover film around
an area including the top of the tracking chip.
[0022] In the second aspect of the present invention, at the fifth
step, the tracking chip is fixed using an adhesive or silicon.
[0023] According to a third aspect of the present invention, there
is provided a method of manufacturing a history management pad of a
semiconductor test socket, the method comprising: a first step of
providing an insulative mold film member provided with a plurality
of electrode units; a second step of attaching a ball guide film
member, in which guide holes aligned with the electrode units are
formed, on the top surface of the mold film member; a third step of
attaching a chip guide film member, in which a chip guide hole for
guiding the tracking chip is formed, on the top surface of the ball
guide film member; a fourth step of contacting the balls of the
tracking chip to the electrode units of the mold film member
through the guide holes of the ball guide film member, while
guiding the tracking chip through the chip guide hole of the chip
guide film member; a fifth step of fixing the tracking chip on the
mold film member; and a sixth step of attaching the mold film
member, which has completed gone through the process up to the
fifth step, at an outer portion of the socket frame of the
semiconductor test socket in which holes corresponding to the
electrode units are formed.
[0024] In the third aspect of the present invention, at the fifth
step, the tracking chip is fixed by attaching a cover film around
an area including the top of the tracking chip.
[0025] In the third aspect of the present invention, at the fifth
step, the tracking chip is fixed using an adhesive or silicon.
[0026] According to a fourth aspect of the present invention, there
is provided a semiconductor test device comprising: a socket frame
provided with the history management pad according to any one of
claims 1 to 6 at an outer portion; and a socket guide member
provided on the top of the tracking chip and configured to press
the tracking chip when a semiconductor test socket is tested.
Advantageous Effects
[0027] A history management pad of a semiconductor test socket, a
manufacturing method thereof, and a semiconductor test device
including the history management pad according to the present
invention provides the effects described below.
[0028] First, as the history management pad is provided in the
semiconductor test socket, the present invention has an effect of
obtaining accurate data by managing history such as lifespan and
inventory of the socket, information on a device under test,
identification of a position and the like.
[0029] Second, the present invention has an effect of preventing a
device under test of a good quality from being treated as a
defective due to the socket, by accurately determining a time for
replacing the socket.
[0030] Third, the present invention is effective in that production
yield is not be affected by estimating an accurate time for
replacing a socket and replacing the socket at an idle time.
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] FIG. 1 is a view showing a semiconductor test socket
provided with a history management pad of the semiconductor test
socket according to the present invention.
[0032] FIG. 2 is a view showing the configuration of a history
management pad of a semiconductor test socket according to the
present invention.
[0033] FIG. 3 is a view showing a configuration provided with a
socket guide for pressing a history management pad in a
semiconductor test socket according to the present invention.
[0034] FIG. 4 is a view showing the manufacturing process of a
history management pad of a semiconductor test socket according to
an embodiment of the present invention.
[0035] FIG. 5 is a view showing a process following the process of
FIG. 4.
BEST MODE FOR CARRYING OUT THE INVENTION
[0036] Additional objects, features and advantages of the present
invention can be understood more clearly from the following
detailed description and accompanying drawings.
[0037] Before the detailed description of the present invention, it
should be understood that as the present invention may make diverse
changes and have various embodiments, the examples described below
in detail and shown in the drawings are not intended to limit the
present invention to a specific embodiment, but include all
changes, equivalents, and substitutes included in the spirit and
technical scope of the present invention.
[0038] It will be understood that when an element is referred to as
being "connected" or "coupled" to another element, it may be
directly connected or coupled to another element or intervening
elements may exist. In contrast, when an element is referred to as
being "directly connected" or "directly coupled" to another
element, there are no intervening elements.
[0039] The terms used herein are used only to describe particular
embodiments and are not intended to limit the present invention.
Singular expressions include plural expressions, unless the context
clearly indicates otherwise. It will be further understood that the
terms "include", "have" and the like used herein is to specify the
presence of stated features, integers, steps, operations, elements,
and/or components, but do not preclude in advance the presence or
addition of one or more other features, integers, steps,
operations, elements, components, and/or groups thereof.
[0040] In addition, the terms such as "section", "unit", "module"
and the like stated in the specification mean a unit of processing
at least a function or an operation, and they can be implemented as
hardware, software or a combination of hardware and software.
[0041] In addition, in describing with reference to the
accompanying drawings, like reference symbols will be assigned to
like constitutional elements regardless of drawing symbols, and
duplicated descriptions thereof will be omitted. In describing the
present invention, when it is determined that specific description
of known techniques related to the present invention unnecessarily
blurs the gist of the present invention, the detailed description
will be omitted.
[0042] Hereinafter, a history management pad of a semiconductor
test socket, a manufacturing method thereof, and a semiconductor
test device including the history management pad according to a
preferred embodiment of the present invention will be described
with reference to the accompanying drawings.
[0043] First, a history management pad of a semiconductor test
socket according to the present invention will be described in
detail with reference to FIGS. 1 and 2. FIG. 1 is a view showing a
semiconductor test socket provided with a history management pad of
the semiconductor test socket according to the present invention,
FIG. 2 is a view showing the configuration of a history management
pad of a semiconductor test socket according to the present
invention, and FIG. 3 is a view showing a configuration provided
with a socket guide for pressing a history management pad in a
semiconductor test socket according to the present invention.
[0044] As shown in FIGS. 1 to 3, a history management pad P of a
semiconductor test socket according to the present invention is
provided at an outer portion of a socket frame 200 of the
semiconductor test socket provided with a socket body C (an elastic
conductive sheet or a pogo pin body) for electrically contacting a
lead of a device under test and a terminal of the printed circuit
board of the socket, and the history management pad includes an
insulative mold film member 100 provided with a plurality of
conductive electrode units 110 in the thickness direction (vertical
direction); an insulative mold socket frame 200 having a plurality
of holes 210 formed for the lower portions (bumps) 111 of the
electrode units 110 to pass through, on the top surface of which
the insulative mold film member 100 is attached; a guide film means
300 formed on the top of the mold film member 100 to provide
contact stability of a tracking chip 400 by resting the tracking
chip 400 on the mold film member 100 while the tracking chip 400
conductively contacts with the electrode units 110 of the mold film
member 100; the tracking chip 400 conductively contacting with the
electrode units 110 of the mold film member 100 through the guide
film means 300; and a fixing means 500 for firmly fixing the
tracking chip 400 to the guide film means 300.
[0045] The socket body electrically connects a terminal of a device
under test and a pad of a test device (socket printed circuit
board) and may be an elastic conductive sheet having elasticity or
a pogo pin body.
[0046] However, the elastic conductive sheet is preferable since
smooth contact is possible by absorbing mechanical impacts or
deformation. The elastic conductive sheet like this is configured
of a conductive unit, in which a plurality of conductive particles
is distributed in an insulative elastic material, and an insulative
supporting unit for disconnecting electrical contact with an
adjacent conductive unit while supporting each conductive unit.
[0047] Although the mold film member 100 is preferably formed of,
for example, polyimide, it is not limited thereto, and any
insulative (nonconductor) material, in which the electrode units
110 can be stably provided, can be used.
[0048] The electrode units 110 of the mold film member 100
electrically connect the balls 420 provided in the tracking chip
400 to the pad electrodes 11 provided in the socket printed circuit
board 10 (see FIG. 3).
[0049] Here, the electrode unit 110 of the mold film member 100 is
preferably formed as an elastic electrode unit which forms a
conductive path, in which a plurality of conductive particles is
distributed to be arranged in the thickness direction within an
insulative elastic material such as silicon. The reason that the
elastic electrode unit is preferable like this is that if the top
of the tracking chip 400 of the history management pad of the
semiconductor test socket is pressed through a socket guide member
G (see FIG. 3) in association with a test operation of a device
under test when the device under test is tested, the electrode unit
110 may smoothly contact with the pad electrode while being
elastically deformed.
[0050] However, if the electrode units 110 of the mold film member
100 are configured to flow current between the balls 420 of the
tracking chip 400 and the pad electrodes 11 of the socket printed
circuit board 10, they are not specially limited.
[0051] In addition, the socket frame 200 is for supporting the
elastic conductive sheet or the pogo pin body and aligning the
socket in a lubber socket for testing or a socket for pogo pin and
is formed of a material such as stainless steel, polyimide or the
like, and in the present invention, the history management pad P
may be attached at an outer portion of the socket frame 200.
[0052] Next, the guide film means 300 includes a ball guide film
member 310 in which a plurality of position compensation holes 311
is formed at the positions corresponding to the balls 420 of the
tracking chip 400, and a chip guide film member 320 in which a chip
guide hole 321 for guiding the body 410 of the tracking chip 400 is
formed.
[0053] As the guide film means 300 including the ball guide film
member 310 and the chip guide film member 320 like this is
configured, contact stability of the tracking chip 400 can be
achieved.
[0054] Subsequently, the tracking chip 400 is designed to obtain
data on the information related to history management and test of
the socket, such as information on the inventory and lifespan of
the socket and information on the device under test, and the
detailed configuration of the tracking chip may be designed through
a publicized method, and detailed description thereof will be
omitted to clarify the target of the present invention.
[0055] Next, a fixing means for fixing the tracking chip 400 to the
guide film member 300 is not specially limited if the fixing means
is a configuration which can fix the guide film member 300 and the
tracking chip 400.
[0056] For example, as shown in the figure, the fixing means may be
configured as a cover film 500 attached to cover the top surface of
the tracking chip 400 (specifically, together with the top surface
of the chip guide film member 320 of the guide film means 300). In
addition, as another example, the fixing means may fix the tracking
chip 400 by using an adhesive, silicon or the like.
[0057] The history management pad of a semiconductor test socket
according to the present invention configured as described above is
attached and fixed at an outer portion of the socket frame 200 of
the semiconductor test socket in which penetration holes are formed
to expose the electrode units 110 of the mold film member 100
toward the bottom.
[0058] Next, a method of manufacturing a history management pad of
a semiconductor test socket according to an embodiment of the
present invention will be described in detail with reference to
FIGS. 4 and 5. FIGS. 4 and 5 are views showing the manufacturing
process of a history management pad of a semiconductor test socket
according to an embodiment of the present invention. In the
description of the manufacturing process of the history management
pad of the semiconductor test socket described below, the same
numerals and symbols are assigned to the elements the same as the
elements described in the description of the history management pad
of a semiconductor test socket, and repeated description will be
omitted to simplify the description of the present invention.
[0059] As shown in FIGS. 4 and 5, the method of manufacturing a
history management pad of a semiconductor test socket according to
an embodiment of the present invention includes: a first step of
forming a plurality of electrode units 110 at an outer portion of
the socket frame 200 of the semiconductor test socket by attaching
an insulative mold film member 100 to a socket frame 200, in which
holes 210 are formed to electrically connect the balls 420 of the
tracking chip 400 and the pad electrodes 11 of the socket printed
circuit board (FIG. 4(a)); a second step of attaching a ball guide
film member 310, in which position compensation holes (or guide
holes) 311 aligned with the electrode units 110 are formed, on the
top surface of the mold film member 100; a third step of attaching
the chip guide film member 320, in which a chip guide hole 321 for
guiding the tracking chip 400 is formed, on the top surface of the
ball guide film member 310; a fourth step of positioning the balls
of the tracking chip 400 to the electrode units 110 of the mold
film member 100 through the position compensation holes 311 of the
ball guide film member 310, while guiding the tracking chip 400
through the chip guide hole 321 of the chip guide film member 320;
and a fifth step of fixing the tracking chip 400.
[0060] The first step may be accomplished in two methods described
below.
[0061] As a first method of the first step, an insulative mold film
member 100 in which electrode units 110 are formed may be
integrated with a socket frame 200 (FIG. 4(a-3)) in one piece by
attaching an insulative mold film member 100, in which the
electrode units 110 are formed in the holes 101 for forming the
electrode units 110 (FIG. 4(a-1)), to a socket frame 200 in which
holes 210 corresponding to the electrode units 110 are formed at an
outer portion (FIG. 4(a-1')).
[0062] As a second method of the first step, the history management
pad may be formed by providing a mold film member 100 in which
holes 101 for forming the electrode units are formed as shown in
FIG. 4(a-2) and a socket frame 200 in which holes 210 corresponding
to the holes 101 for forming the electrode units 110 are formed at
an outer portion, attaching the mold film member 100 and the socket
frame 200 in one piece, and filling the electrode units 110 in the
holes 101 and 210 (FIG. 4(a-3)).
[0063] The mold film member 100 may be formed of, for example, a
polyimide material, and the socket frame 200 may be formed of a
stainless steel material.
[0064] The lower portion of the electrode unit 110 may be formed to
protrude from the bottom surface of the socket frame 200 to some
extent (i.e., to form a bump 111).
[0065] The electrode unit 110 is preferably formed as, for example,
an elastic electrode unit which forms a conductive path as a
plurality of conductive particles is distributed to be arranged in
the thickness direction within an insulative elastic material such
as silicon.
[0066] Subsequently, the second step (the step of forming a ball
guide film member), the third step (the step of forming a chip
guide film member) and the fourth step (the step of installing a
tracking chip) align positions of the balls of the tracking chip
400 when the tracking chip 400 is installed and guide and stably
support the tracking chip 400 to stably accomplish contact of the
tracking chip 400.
[0067] Next, the fifth step is a step of fixing the tracking chip
400, and if a method may fix the tracking chip, it is not specially
limited.
[0068] For example, the fifth step may fix the tracking chip by
attaching a cover film 500 on the top of the tracking chip 400 and
the chip guide film member 320, and as another example, the
tracking chip 400 may be fixed using an adhesive, silicon or the
like.
[0069] In addition, as still another example, a method of
manufacturing a history management pad P by applying the second to
fifth steps to the insulative mold film member 100 (FIG. 4(a-1)),
in which the electrode units 110 are formed in the holes 101 for
forming the electrode units 110 as described above, and attaching
the history management pad at an outer portion of the socket frame
200 is also possible. According to the embodiment like this, since
the history management pad P may be manufactured in advance, an
effect of enhancing work productivity may be obtained.
[0070] The present invention as described above may obtain accurate
data by managing history such as lifespan management and inventory
management of the socket, information on the device under test,
identification of the position and the like, and has an advantage
of preventing a device under test of a good quality from being
treated as a defective one due to the socket, by accurately
determining a time for replacing the socket.
[0071] In addition, the present invention is advantageous in that
production yield is not be affected by estimating an accurate time
for replacing a socket and replacing the socket at an idle
time.
[0072] The embodiments described in this specification and the
attached drawings merely illustrate part of the technical spirit
included in the present invention. Accordingly, since the
embodiments disclosed in this specification are intended not to
limit, but to describe the spirit of the present invention, it is
apparent that the scope of the technical spirit of the present
invention is not limited by the embodiments. It should be
interpreted that all modifications and specific embodiments, which
can be easily inferred by those skilled in the art within the scope
of the technical spirit included in the specification and drawings
of the present invention, are included in the scope of the present
invention.
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