TSE CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for TSE CO., LTD..The latest application filed is for "test socket and test apparatus having the same".

Company Profile

4.8.9

TSE CO., LTD. - Chungcheongnam-do KR
TSE CO.,LTD - Cheonan-si, Chungcheongnam-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Test Socket And Test Apparatus Having The Same App 20220099730 - Oh; Chang Su	2022-03-31
Test Socket And Test Apparatus Having The Same App 20220057433 - Oh; Chang Su	2022-02-24
Electro-conductive part protecting member for signal transmission connector Grant 11,233,352 - Oh , et al. January 25, 2	2022-01-25
Electroconductive Particles And Signal-transmitting Connector Having Same App 20220005626 - Oh; Chang Su ; et al.	2022-01-06
Test socket and test apparatus having the same, manufacturing method for the test socket Grant 11,199,577 - Oh , et al. December 14, 2	2021-12-14
Conductor Part Protection Member For Signal Transmission Connector And Manufacturing Method Therefor, And Signal Transmission Connector Having Same And Manufacturing Method Therefor App 20210313730 - Oh; Chang Su ; et al.	2021-10-07
Test Socket And Test Apparatus Having The Same, Manufacturing Method For The Test Socket App 20210302494 - Oh; Chang Su	2021-09-30
Test Apparatus For Semiconductor Package App 20210302468 - Oh; Chang Su ; et al.	2021-09-30
Test socket and test apparatus having the same, manufacturing method for the test socket Grant 11,131,707 - Oh September 28, 2	2021-09-28
Test Socket And Test Apparatus Having The Same, Manufacturing Method For The Test Socket App 20210293880 - Oh; Chang Su ; et al.	2021-09-23
History Management Pad Of Semiconductor Test Socket, Manufacturing Method Thereof, And Semiconductor Test Device Including Histo App 20200233029 - KIM; Bo Hyun ; et al.	2020-07-23
History management pad of semiconductor test socket, manufacturing method thereof, and semiconductor test device including history management pad Grant 10,718,809 - Kim , et al.	2020-07-21

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