U.S. patent application number 16/192448 was filed with the patent office on 2020-05-21 for dynamic generation of layout adaptive packaging.
This patent application is currently assigned to Applied Materials, Inc.. The applicant listed for this patent is Applied Materials, Inc.. Invention is credited to Uwe HOLLERBACH, Thomas L. LAIDIG.
Application Number | 20200159132 16/192448 |
Document ID | / |
Family ID | 70728200 |
Filed Date | 2020-05-21 |
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United States Patent
Application |
20200159132 |
Kind Code |
A1 |
HOLLERBACH; Uwe ; et
al. |
May 21, 2020 |
DYNAMIC GENERATION OF LAYOUT ADAPTIVE PACKAGING
Abstract
Aspects of disclosure provide a method for attaching wiring
connections to a component using both design and field measured
data of the component to produce accurate wiring connections.
Inventors: |
HOLLERBACH; Uwe; (Fremont,
CA) ; LAIDIG; Thomas L.; (Richmond, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Applied Materials, Inc. |
Santa Clara |
CA |
US |
|
|
Assignee: |
Applied Materials, Inc.
Santa Clara
CA
|
Family ID: |
70728200 |
Appl. No.: |
16/192448 |
Filed: |
November 15, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G03F 7/70991 20130101;
G03F 7/70508 20130101; H01L 21/0274 20130101; G03F 7/70291
20130101; G03F 7/70383 20130101; G03F 7/70475 20130101 |
International
Class: |
G03F 7/20 20060101
G03F007/20 |
Claims
1. A method for processing an apparatus in a maskless lithography
system, comprising: obtaining coordinate data on a component and a
connection pattern to the component in a designed state; placing
the component within range of at least one scanning device
associated with the maskless lithography system; scanning the
component with the at least one scanning device to develop a second
set of coordinate data for the component; comparing the obtained
coordinate data of the component to the second set of coordinate
data to determine an offset of the component scanned with the at
least one scanning device to the designed state; and augmenting the
connection pattern to the component based, at least in part, upon
one of the offset, visual images of the scanning of the component
used to develop the second set of coordinate data, and the second
set of coordinate data for the component, wherein the method is
performed in-situ in the maskless lithography system.
2. The method according to claim 1, wherein the component is placed
upon a substrate.
3. The method according to claim 2, wherein the substrate is placed
upon an indexing table of the maskless lithography system.
4. The method according to claim 1, wherein the augmenting of the
connection pattern is performed by computer analysis.
5. The method according to claim 1, wherein the comparing the
obtained coordinate data to the second set of coordinate data
further comprises comparing the offset to a threshold.
6. The method according to claim 5, further comprising: when the
offset is less than the threshold, setting the offset to zero.
7. The method according to claim 1, further comprising: comparing
the obtained coordinate data to the second set of coordinate data
further comprises comparing the offset to a threshold; and when the
comparing is greater than the threshold, generating a warning to a
user that the threshold has been exceeded.
8. The method according to claim 1, further comprising:
manufacturing the connection pattern based upon data of the
augmented connection pattern.
9. A method for processing an apparatus in a maskless
microlithography system, comprising: obtaining position data on a
component and an electrical connection pattern to the component for
a designed state; placing the component on a stage of the maskless
microlithography system; placing the stage within range of at least
one scanning device of the maskless microlithography system;
scanning the stage including the component with the at least one
scanning device to develop a second set of coordinate data for the
component and the electrical connection pattern; comparing the
obtained coordinate data of the component to the second set of
coordinate data to determine an offset of the component scanned
with the at least one scanning device to the designed state; and
augmenting the electrical connection pattern to the component
based, at least in part, upon the offset, wherein the method is
performed in-situ in the maskless microlithography system.
10. The method according to claim 9, further comprising:
manufacturing the electrical connection pattern based upon data of
the augmented connection pattern.
11. The method according to claim 9, wherein the component is
placed upon a substrate.
12. The method according to claim 9, wherein the augmenting of the
electrical connection pattern is performed by computer
analysis.
13. The method according to claim 9, wherein the comparing the
obtained coordinate data to the second set of coordinate data
further comprises comparing the offset to a threshold.
14-15. (canceled)
16. A method for processing a substrate in a maskless
microlithography system, comprising: obtaining coordinate data in a
designed state pertaining to at least one component and at least
one wiring connection pattern to the at least one component,
wherein the at least one component is at least one of on and in the
substrate; placing the substrate on a stage within the maskless
microlithography system; moving the substrate on the stage to a
scanning device of the maskless microlithography system; scanning
the substrate including the at least one component with the
scanning device to develop a second set of coordinate data for the
at least one component; comparing the obtained coordinate data of
the at least one component of the stage to the second set of
coordinate data to determine an offset of the at least one
component scanned with the scanning device to the designed state;
and augmenting the at least one wiring connection pattern to the at
least one component based, at least in part, upon one of the
offset, visual images of the scanning of the at least one component
used to develop the second set of coordinate data, and the second
set of coordinate data for the at least one component, wherein the
method is performed in-situ in the maskless microlithography
system.
17. The method according to claim 16, further comprising:
manufacturing the at least one wiring connection pattern based upon
data of the augmented connection pattern.
18. The method according to claim 16, wherein the augmenting of the
at least one wiring connection pattern is performed by computer
analysis.
19. The method according to claim 16, wherein the comparing the
obtained coordinate data to the second set of coordinate data
further comprises comparing the offset to a threshold.
20. The method according to claim 16, wherein the at least one
component is a semiconductor component.
Description
BACKGROUND
Field
[0001] Embodiments of the present disclosure generally relate to
apparatuses, systems and methods for processing one or more
substrates, and more specifically to apparatuses, systems and
methods for performing photolithography processes. More
specifically, aspects of the disclosure relate to adaptive
packaging methods and apparatus.
Description of the Related Art
[0002] Photolithography is widely used in the manufacturing of
semiconductor devices and display devices, such as liquid crystal
displays (LCDs). Large area substrates are often utilized in the
manufacture of LCDs. LCDs, or flat panels, are commonly used for
active matrix displays, such as computers, touch panel devices,
personal digital assistants (PDAs), cell phones, television
monitors, and the like. Generally, flat panels include a layer of
liquid crystal material forming pixels sandwiched between two
plates. When power from a power supply is applied across the liquid
crystal material, an amount of light passing through the liquid
crystal material is controlled at pixel locations enabling images
to be generated. Other manufacturing techniques are used to produce
organic light emitting diode ("OLED") displays for use in
computers, monitors and other systems providing visual output.
[0003] Microlithography techniques have been employed to create
electrical features incorporated as part of the liquid crystal
material layer forming the pixels. According to these techniques, a
light-sensitive photoresist is applied to at least one surface of
the substrate. Then, a pattern generator exposes selected areas of
the light-sensitive photoresist as part of a pattern with light to
cause chemical changes to the photoresist in the selective areas to
prepare these selective areas for subsequent material removal
and/or material addition processes to create the electrical
features.
[0004] In order to continue to provide display devices and other
devices at the prices demanded by consumers, new apparatuses and
approaches are needed to precisely and cost-effectively create
patterns on substrates, such as large area substrates.
[0005] In digital lithography tools, images from a camera are used
to find a position of alignment marks so that processing may occur
across at a known location. In order to obtain the images, cameras
are calibrated and specially chosen for pixel size, orientation
(rotation) and uniformity.
[0006] One of the major challenges of microlithography systems is
placement of wiring between components. Often, arrangements of
concern involve a fixed outer periphery to a component placed on an
inside of a defined area. Wiring must be placed from the fixed
periphery (which may be a connection point to another component) to
individual connection points, such as die, of the component on the
inside of the defined area.
[0007] Placement of the component within this defined area is
critical. Generally, the connection wiring from the periphery to
the component is fixed (static). If the component is misaligned
regarding is intended position in the defined area, then the wiring
components will be misaligned when created. Great care must be made
such that the component is placed properly and does not shift
during processing. Such accurate placement of components is highly
problematic and misalignment can occur during processing. The
problems that this causes include components produced that are out
of specification, to components that do not work altogether.
Problems of these sort impact the overall economic viability of the
lithography process.
[0008] There is a need to allow for creation of wiring systems for
components such that the components may be misaligned to a
threshold amount during processing.
[0009] There is a further need to allow for more rapid processing
of components with maskless microlithography systems.
[0010] There is a still further need to allow for higher throughput
of processing of components with maskless microlithography
systems.
[0011] There is a still further need to allow for slight deviations
in the placement of components in a defined field such that during
processing, systems may adapt to the actual processing of
components "in-situ" rather than a hypothetical perfect alignment
that is difficult to achieve.
SUMMARY
[0012] Aspects of disclosure provide a method for attaching wiring
connections to a component using both design and field measured
data of the component to produce accurate wiring connections.
[0013] In one example embodiment, a method for processing an
apparatus in a lithography system is disclosed comprising obtaining
coordinate data on a component and a connection pattern to the
component in a designed state, placing the component within range
of at least one scanning device associated with the lithography
system, scanning the component with the at least one scanning
device to develop a second set of coordinate data for the
component, comparing the obtained coordinate data of the component
to the second set of coordinate data to determine an offset of the
component scanned with the scanning device to the designed state
and augmenting the connection pattern to the component based, at
least in part, upon one of the offset data, visual images of the
scanning of the component used to develop the second set of
coordinate data and the second set of coordinate data for the
component.
[0014] In another example embodiment, a method for processing an
apparatus in a microlithography system is disclosed comprising
obtaining position data on a component and an electrical connection
pattern to the component for a designed state, placing the
component on a stage of a microlithography system, placing the
stage within range of at least one scanning device of the
microlithography system, scanning the stage including the component
with the at least one scanning device to develop a second set of
coordinate data for the component and the electrical connection
pattern, comparing the obtained coordinate data of the component to
the second set of coordinate data to determine an offset of the
component scanned with the scanning device to the designed state
and augmenting the electrical connection pattern to the component
based, at least in part, upon the offset data.
[0015] In one example embodiment, a method for processing a
substrate in a microlithography system is disclosed comprising:
obtaining coordinate data in a designed state pertaining to at
least one component and at least one wiring connection pattern to
the at least one component, wherein the component is at least one
of on and in the substrate, placing the substrate on a stage within
the microlithography system, moving the substrate on the stage to a
scanning device of the lithography system, scanning the substrate
including the component with the scanning device to develop a
second set of coordinate data for the component, comparing the
obtained coordinate data of the component of the stage to the
second set of coordinate data to determine an offset of the
component scanned with the scanning device to the designed state
and augmenting the at least one wiring connection pattern to the
component based, at least in part, upon one of the offset data,
visual images of the scanning of the component used to develop the
second set of coordinate data and the second set of coordinate data
for the component.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] So that the manner in which the above recited features of
the present disclosure can be understood in detail, a more
particular description of the disclosure, briefly summarized above,
may be had by reference to embodiments, some of which are
illustrated in the appended drawings. It is to be noted, however,
that the appended drawings illustrate only exemplary embodiments
and are therefore not to be considered limiting of its scope, may
admit to other equally effective embodiments.
[0017] FIG. 1A is a perspective view of a photolithography system
according to embodiments disclosed herein.
[0018] FIG. 1B is a perspective view of a photolithography system
according to embodiments disclosed herein.
[0019] FIG. 2A is a perspective schematic view of an image
projection apparatus according to embodiments disclosed herein.
[0020] FIGS. 2B and 2C are perspective schematic views of an image
projection apparatus according to embodiments disclosed herein.
[0021] FIG. 3 is a schematic depiction of a device with
hypothetical connections.
[0022] FIG. 4 is a schematic depiction of the device of FIG. 3 in
an augmented position with modified wiring connections.
[0023] FIG. 5 is a method of creating a wiring connection to a
device.
[0024] FIG. 6 is a second method of creating a wiring connection to
a device.
[0025] FIG. 7 is a third method of creating a wiring connection to
a device.
[0026] To facilitate understanding, identical reference numerals
have been used, where possible, to designate identical elements
that are common to the figures. It is contemplated that elements
and features of one embodiment may be beneficially incorporated in
other embodiments without further recitation.
DETAILED DESCRIPTION
[0027] In the aspects described below, eye configurations,
alignment mark shapes, and cell codes are representative to give an
example. There might be any number of eyes and any number of steps
to capture alignment mark images. The shape of an alignment mark is
not limited by the cross shape. The alignment mark may be any
shape. A mark cell code may be implemented by either OCR, shape
changes or size changes. The mark cell code can also be embedded to
mark itself by changing the thickness of lines or adding additional
features to lines. The illustrated embodiments, therefore, are
merely descriptive in nature and should not be considered
limiting.
[0028] FIG. 1A is a perspective view of a photolithography system
100 according to embodiments disclosed herein. The system 100
includes a base frame 110, a slab 120, a stage 130, and a
processing apparatus 160. The base frame 110 rests on the floor of
a fabrication facility and supports the slab 120. Passive air
isolators 112 are positioned between the base frame 110 and the
slab 120. In one embodiment, the slab 120 is a monolithic piece of
granite, and the stage 130 is disposed on the slab 120. A substrate
140 is supported by the stage 130. A plurality of holes (not shown)
are formed in the stage 130 for allowing a plurality of lift pins
(not shown) to extend therethrough. In some embodiments, the lift
pins rise to an extended position to receive the substrate 140,
such as from one or more transfer robots (not shown). The one or
more transfer robots are used to load and unload a substrate 140
from the stage 130.
[0029] The substrate 140 comprises any suitable material, for
example, quartz used as part of a flat panel display. In other
embodiments, the substrate 140 is made of other materials. In some
embodiments, the substrate 140 has a photoresist layer formed
thereon. A photoresist is sensitive to radiation. A positive
photoresist includes portions of the photoresist, which when
exposed to radiation, will be respectively soluble to photoresist
developer applied to the photoresist after the pattern is written
into the photoresist. A negative photoresist includes portions of
the photoresist, which when exposed to radiation, will be
respectively insoluble to photoresist developer applied to the
photoresist after the pattern is written into the photoresist. The
chemical composition of the photoresist determines whether the
photoresist will be a positive photoresist or negative photoresist.
Examples of photoresists include, but are not limited to, at least
one of diazonaphthoquinone, a phenol formaldehyde resin,
poly(methyl methacrylate), poly(methyl glutarimide), and SU-8. In
this manner, the pattern is created on a surface of the substrate
140 to form the electronic circuitry.
[0030] The system 100 includes a pair of supports 122 and a pair of
tracks 124. The pair of supports 122 are disposed on the slab 120,
and the slab 120 and the pair of supports 122 are a single piece of
material. The pair of tracks 124 is supported by the pair of the
supports 122, and the stage 130 moves along the tracks 124 in the
X-direction. In one embodiment, the pair of tracks 124 is a pair of
parallel magnetic channels. As shown, each track 124 of the pair of
tracks 124 is linear. In other embodiments, one or more track 124
is non-linear. An encoder 126 is coupled to the stage 130 in order
to provide location information to a controller (not shown).
[0031] The processing apparatus 160 includes a support 162 and a
processing unit 164. The support 162 is disposed on the slab 120
and includes an opening 166 for the stage 130 to pass under the
processing unit 164. The processing unit 164 is supported by the
support 162. In one embodiment, the processing unit 164 is a
pattern generator configured to expose a photoresist in a
photolithography process. In some embodiments, the pattern
generator is configured to perform a maskless lithography process.
The processing unit 164 includes a plurality of image projection
apparatus (shown in FIGS. 2A and 2B). In one embodiment, the
processing unit 164 contains as many as 84 image projection
apparatus. Each image projection apparatus is disposed in a case
165. The processing apparatus 160 is useful to perform maskless
direct patterning.
[0032] During operation, the stage 130 moves in the X-direction
from a loading position, as shown in FIG. 1A, to a processing
position. The processing position is one or more positions of the
stage 130 as the stage 130 passes under the processing unit 164.
During operation, the stage 130 is be lifted by a plurality of air
bearings (not shown) and moves along the pair of tracks 124 from
the loading position to the processing position. A plurality of
vertical guide air bearings (not shown) are coupled to the stage
130 and positioned adjacent an inner wall 128 of each support 122
in order to stabilize the movement of the stage 130. The stage 130
also moves in the Y-direction by moving along a track 150 for
processing and/or indexing the substrate 140. The stage 130 is
capable of independent operation and can scan a substrate 140 in
one direction and step in the other direction.
[0033] A metrology system measures the X and Y lateral position
coordinates of each of the stage 130 in real time so that each of
the plurality of image projection apparatus can accurately locate
the patterns being written in a photoresist covered substrate. The
metrology system also provides a real-time measurement of the
angular position of each of the stage 130 about the vertical or
Z-axis. The angular position measurement can be used to hold the
angular position constant during scanning by means of a servo
mechanism or it can be used to apply corrections to the positions
of the patterns being written on the substrate 140 by the image
projection apparatus 270, shown in FIGS. 2A-2B. These techniques
may be used in combination.
[0034] FIG. 1B is a perspective view of a photolithography system
200 according to embodiments disclosed herein. The system 200 is
similar to the system 100; however, the system 200 includes two
stages 130. Each of the two stages 130 is capable of independent
operation and can scan a substrate 140 in one direction and step in
the other direction. In some embodiments, when one of the two
stages 130 is scanning a substrate 140, another of the two stages
130 is unloading an exposed substrate and loading the next
substrate to be exposed.
[0035] While FIGS. 1A-1B depict two embodiments of a
photolithography system, other systems and configurations are also
contemplated herein. For example, photolithography systems
including any suitable number of stages are also contemplated.
[0036] FIG. 2A is a perspective schematic view of an image
projection apparatus 270 according to one embodiment, which is
useful for a photolithography system, such as system 100 or system
200. The image projection apparatus 270 includes one or more
spatial light modulators 280, an alignment and inspection system
284 including a focus sensor 283 and a camera 285, and projection
optics 286. The components of image projection apparatus vary
depending on the spatial light modulator being used. Spatial light
modulators include, but are not limited to, microLEDs, digital
micromirror devices (DMDs) and liquid crystal displays (LCDs).
[0037] In operation, the spatial light modulator 280 is used to
modulate one or more properties of the light, such as amplitude,
phase, or polarization, which is projected through the image
projection apparatus 270 and to a substrate, such as the substrate
140. The alignment and inspection system 284 is used for alignment
and inspection of the components of the image projection apparatus
270. In one embodiment, the focus sensor 283 includes a plurality
of lasers which are directed through the lens of the camera 285 and
the back through the lens of the camera 285 an imaged onto sensors
to detect whether the image projection apparatus 270 is in focus.
The camera 285 is used to image the substrate, such as substrate
140, to ensure the alignment of the image projection apparatus 270
and photolithography system 100 or 200 is correct or within an
predetermined tolerance. The projection optics 286, such as one or
more lenses, is used to project the light onto the substrate, such
as the substrate 140.
[0038] FIG. 2B is an image project apparatus 271 according to
embodiments described herein. In the embodiment shown in FIG. 2B,
the image projection apparatus 271 includes one or more microLEDs
287 as the spatial light modulator(s), a focus sensor and camera
system 284 and projection optics 286. In one embodiment, the image
projection apparatus 271 further includes a beamsplitter (not
shown). MicroLEDs are microscopic (for example, less than about 100
.mu.m) light emitting diodes, which may be arranged in an array and
used to form the individual pixels of a substrate, such as a
display device. MicroLEDs include inorganic materials, such as an
inorganic Gallium Nitride (GaN) material. Since microLEDs are
self-emitting, an outside light source is not needed in the image
projection apparatus 271.
[0039] In embodiments using microLEDs, the camera 285 is also
useful to measure the image pixel pitch of the one or more
microLEDs to calibrate for any thermal expansion happening at the
microLED device.
[0040] FIG. 2C is an image project apparatus 281 according to
embodiments described herein. In the embodiment shown in FIG. 2B,
the image projection apparatus 281 uses one or more DMDs 289 as the
spatial light modulator(s). The image projection apparatus 281 is
part of an image projection system 290, which includes a light
source 272, an aperture 274, a lens 276, a frustrated prism
assembly 288, one or more DMDs 289 (one is shown), and a light dump
282, in addition to the alignment and inspection system 284 and the
projection optics 286. The light source 272 is any suitable light
source, such as a light emitting diode (LED) or a laser, capable of
producing a light having predetermined wavelength. In one
embodiment, the predetermined wavelength is in the blue or near
ultraviolet (UV) range, such as less than about 450 nm. The
frustrated prism assembly 288 includes a plurality of reflective
surfaces. The projection lens 286 is, as an example, a 10.times.
objective lens. During operation of the image projection apparatus
281 shown in FIG. 2C, a light beam 273 having a predetermined
wavelength, such as a wavelength in the blue range, is produced by
the light source 272. The light beam 273 is reflected to the DMD
289 by the frustrated prism assembly 288. The DMD includes a
plurality of mirrors, and the number of mirrors corresponds to the
number of pixels to be projected. The plurality of mirrors are
individually controllable, and each mirror of the plurality of
mirrors is at an "on" position or "off" position, based on the mask
data provided to the DMD 289 by the controller (not shown). When
the light beam 273 reaches the mirrors of the DMD 280, the mirrors
that are at "on" position reflect the light beam 273, i.e., forming
the plurality of write beams, to the projection lens 286. The
projection lens 286 then projects the write beams to the surface of
the substrate 140. The mirrors that are at "off" position reflect
the light beam 273 to the light dump 282 instead of the surface of
the substrate 140.
[0041] In processing of materials through the lithography system,
components with one or more dice are placed on a stage for
processing. While an ideal layout of the components may be achieved
for processing, various factors may impact such ideal layout.
Processing speed of the lithography system may slightly move the
components as the lithography system handles the components. These
slight movements, for components that are small, can have drastic
impact on the final product as wiring from an origination point to
ending point can be small. Each component, furthermore, may have
several dice, therefore many connections may be impacted by
incorrect alignment of the component compared to a "perfect" or
ideal layout.
[0042] Aspects of the disclosure provide that given an ideal
placement of one or more dice within a packaging layout as well as
actual placements that may involve some errors, the ideal placement
may be modified or distorted to match the actual placements,
thereby adaptively generating routing for packaging of dice into a
larger assembly.
[0043] Referring to FIG. 3, an ideal layout plot is provided. Such
ideal layout plot would occur if each of the components is placed,
as intended, on a substrate for processing. As will be understood,
placement of components with extremely high accuracy can be
difficult. To this end, even if the component is placed with high
accuracy, shifting may occur during processing, as digital
lithography systems move large substrates at fast speeds.
[0044] Referring to FIG. 4, an actual layout plot is provided of a
component. As can be seen, the component is shifted from the
position in FIG. 3. An altered wiring connection to the component
is therefore required in order for the component to operate
correctly. To this end an augmented wiring scheme is produced such
that the wiring is proper.
[0045] Referring to FIG. 5, a method 500 for processing an
apparatus in a lithography system is illustrated. In a first step
data may be obtained, such as coordinate data on a component as
well as a connection pattern to the component in a designed state
502. This data may be obtained from manufacturing drawings, for
example. The component may be any type of component that needs
wiring attachment, such as, but not limited by, processors. Wiring
may be, for example, from the component to a fixed external area,
such that when components are eventually separated, the wiring ends
at a predetermined location.
[0046] As can be understood, the component is positioned within a
defined field for processing. The actual (x, y) components may vary
slightly from various factors, including the ability of locating
such components accurately during initial processing of the platen
(indexing table) before loading of the platen into the
microlithography machine. Other factors may also cause the
component to move, such as handling of the components during
microlithography steps. To achieve a wiring connection to the
component that extends to the fixed outer field, the "in-situ"
positioning of the components on the platen are scanned with at
least one scanning device to be able to ascertain the exact
positioning of each component 504. The platen, therefore, is moved
into a position in the lithography system such that the scanning
occurs for processing of coordinate data. As will be understood,
scanning of the actual condition may also be accomplished by a
separate process, if needed, and the data fed to the
microlithography machine for use. The data obtained, a second set
of data, may be stored, if required. The second set of coordinate
data may be compared to the obtained coordinate data ("the as
designed data") to determine any offsets that may present in the
actual placement of the components compared to the ideal-designed
positioning 506. An offset may be calculated in 508 to allow the
microlithography machine to understand the exact placement of the
components. The connection pattern from the ideal designed
condition may then be augmented using data from the offset
calculation, for example 510. As will be understood, visual image
data may also be used to determine the difference that is needed
for the connection pattern.
[0047] Computer analysis of the data may be performed to determine
the required offset. The computer analysis may not only calculate
the offset, but also provide new connection wiring locations
between the component and the fixed perimeter, therefore speeding
processing.
[0048] In embodiments, hardware architects may determine that
slight variations from ideal placement are allowable. The deviation
for the wiring connection and the component may be determined to be
within acceptable levels. In those instances, no alteration of the
wiring connection may be required.
[0049] When deviations from these acceptable levels are found, a
warning may be generated to the processors to allow for
notification that alterations/modification of the wiring are
necessary. In other embodiments, if the location and orientation of
the components is outside of a maximum threshold, connections
cannot be effectively made to the component. A separate warning may
be made to the processors that the components are out of tolerance
and that even with modification of the wiring connection, such
connections will be compromised.
[0050] As will be understood, designs for wiring connections may
take into account not only placement accuracy of the starting and
ending points of the connection, but also wiring connection length.
If a length of wire would be too long for effective operation and
would cause, for example, excessive latency, then a warning may be
generated to the processor that such wiring, if produced, would be
out of specification. In the embodiments, connections are
understood to mean electrical connections that are established with
a component, such as a die of a microprocessor.
[0051] Referring to FIG. 6, a method 600 for processing an
apparatus in a microlithography system is disclosed. In one
embodiment, position data is obtained on a component and an
electrical connection pattern to the component for a designed state
602. Next, at 604, the component is placed on a stage of a
microlithography system. At 606, the stage is scanned including the
component with the at least one scanning device to develop a second
set of coordinate data for the component and the electrical
connection pattern. At 608, the obtained coordinate data of the
component is compared to the second set of coordinate data to
determine an offset of the component scanned with the scanning
device to the designed state. At 610, the electrical connection
pattern to the component based is augmented, at least in part, upon
the offset data. At 612, the electrical connection pattern is
manufactured.
[0052] Referring to FIG. 7, a method 700 for processing a substrate
in a microlithography system is disclosed. In one embodiment,
coordinate data is obtained 702 for a designed state pertaining to
at least one component and at least one wiring connection pattern
to the at least one component, wherein the component is at least
one of on and in the substrate. At 704, the method continues with
placing the substrate on a stage within the microlithography
system. The method then continues with moving the substrate on the
stage to a scanning device of the lithography system at 706. At
708, the method continues with scanning the substrate including the
component with the scanning device to develop a second set of
coordinate data for the component. At 710, the method continues
with comparing the obtained coordinate data of the component of the
stage to the second set of coordinate data to determine an offset
of the component scanned with the scanning device to the designed
state. The method then continues at 712 with augmenting the at
least one wiring connection pattern to the component based, at
least in part, upon one of the offset data, visual images of the
scanning of the component used to develop the second set of
coordinate data and the second set of coordinate data for the
component. At 714, the at least one wiring connection pattern is
manufactured.
[0053] In one example embodiment, a method for processing an
apparatus in a lithography system is disclosed comprising obtaining
coordinate data on a component and a connection pattern to the
component in a designed state, placing the component within range
of at least one scanning device associated with the lithography
system, scanning the component with the at least one scanning
device to develop a second set of coordinate data for the
component, comparing the obtained coordinate data of the component
to the second set of coordinate data to determine an offset of the
component scanned with the scanning device to the designed state
and augmenting the connection pattern to the component based, at
least in part, upon one of the offset data, visual images of the
scanning of the component used to develop the second set of
coordinate data and the second set of coordinate data for the
component.
[0054] In another non-limiting embodiment, the method may be
performed wherein the component is placed upon a substrate.
[0055] In another non-limiting embodiment, the method may be
performed wherein the substrate is placed upon an indexing table of
the lithography system.
[0056] In another non-limiting embodiment, the method may be
performed wherein the augmenting of the connection pattern is
performed by computer analysis.
[0057] In another non-limiting embodiment, the method may be
performed wherein the comparing the obtained coordinate data to the
second set of coordinate data further comprises comparing the
offset to a threshold.
[0058] In another non-limiting embodiment, the method may be
further comprised when the offset is less than the threshold,
setting the offset to zero.
[0059] In another non-limiting embodiment, the method may further
comprise comparing the obtained coordinate data to the second set
of coordinate data further comprises comparing the offset to a
threshold and when the comparing is greater than the threshold,
generating a warning to a user that the threshold has been
exceeded.
[0060] In another non-limiting embodiment, the method may further
comprise manufacturing the connection pattern based upon data of
the augmented connection pattern.
[0061] In another example embodiment, a method for processing an
apparatus in a microlithography system is disclosed comprising
obtaining position data on a component and an electrical connection
pattern to the component for a designed state, placing the
component on a stage of a microlithography system, placing the
stage within range of at least one scanning device of the
microlithography system, scanning the stage including the component
with the at least one scanning device to develop a second set of
coordinate data for the component and the electrical connection
pattern, comparing the obtained coordinate data of the component to
the second set of coordinate data to determine an offset of the
component scanned with the scanning device to the designed state
and augmenting the electrical connection pattern to the component
based, at least in part, upon the offset data.
[0062] In one example embodiment, the method may further comprise
manufacturing the connection pattern based upon data of the
augmented connection pattern.
[0063] In another example embodiment, the method may be performed
wherein the component is placed upon a substrate.
[0064] In another example embodiment, the method may be performed
wherein the augmenting of the connection pattern is performed by
computer analysis.
[0065] In another example embodiment, the method may be performed
wherein the comparing the obtained coordinate data to the second
set of coordinate data further comprises comparing the offset to a
threshold.
[0066] In another example embodiment, the method may be performed
wherein the microlithography system is a maskless system.
[0067] In another example embodiment, the method may be performed
wherein the comparing the obtained coordinate data to the second
set of coordinate data further comprises comparing the offset to a
threshold.
[0068] In one example embodiment, a method for processing a
substrate in a microlithography system is disclosed comprising
obtaining coordinate data in a designed state pertaining to at
least one component and at least one wiring connection pattern to
the at least one component, wherein the component is at least one
of on and in the substrate, placing the substrate on a stage within
the microlithography system, moving the substrate on the stage to a
scanning device of the lithography system, scanning the substrate
including the component with the scanning device to develop a
second set of coordinate data for the component, comparing the
obtained coordinate data of the component of the stage to the
second set of coordinate data to determine an offset of the
component scanned with the scanning device to the designed state
and augmenting the at least one wiring connection pattern to the
component based, at least in part, upon one of the offset data,
visual images of the scanning of the component used to develop the
second set of coordinate data and the second set of coordinate data
for the component.
[0069] In another example embodiment, the method may further
comprise manufacturing the at least one wiring connection pattern
based upon data of the augmented connection pattern.
[0070] In another example embodiment, the method may be performed
wherein the augmenting of the connection pattern is performed by
computer analysis.
[0071] In a still further example embodiment, the method may be
performed wherein the comparing the obtained coordinate data to the
second set of coordinate data further comprises comparing the
offset to a threshold.
[0072] While embodiments have been described herein, those skilled
in the art, having benefit of this disclosure will appreciate that
other embodiments are envisioned that do not depart from the
inventive scope of the present application. Accordingly, the scope
of the present claims or any subsequent related claims shall not be
unduly limited by the description of the embodiments described
herein.
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