U.S. patent application number 16/359983 was filed with the patent office on 2020-05-14 for non-volatile memory.
This patent application is currently assigned to IoTMemory Technology Inc.. The applicant listed for this patent is IoTMemory Technology Inc.. Invention is credited to Yu-Ming Cheng, Der-Tsyr Fan, I-Hsin Huang.
Application Number | 20200152646 16/359983 |
Document ID | / |
Family ID | 70461315 |
Filed Date | 2020-05-14 |
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United States Patent
Application |
20200152646 |
Kind Code |
A1 |
Fan; Der-Tsyr ; et
al. |
May 14, 2020 |
NON-VOLATILE MEMORY
Abstract
A non-volatile memory having memory cells is provided. The
memory cell includes a source region and a drain region, a select
gate, a dummy select gate, a floating gate, an erase gate, and a
control gate. The select gate is disposed on the substrate between
the source region and the drain region. The floating gate is
disposed on the substrate between the select gate and the source
region, and a top portion of the floating gate has corners in
symmetry. The height of the floating gate is lower than the height
of the select gate. The erase gate is provided on the source region
and covers the corner at the side of the source. The control gate
is disposed on the erase gate and the floating gate.
Inventors: |
Fan; Der-Tsyr; (Taoyuan
City, TW) ; Huang; I-Hsin; (Taoyuan City, TW)
; Cheng; Yu-Ming; (Yilan County, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
IoTMemory Technology Inc. |
Taipei City |
|
TW |
|
|
Assignee: |
IoTMemory Technology Inc.
Taipei City
TW
|
Family ID: |
70461315 |
Appl. No.: |
16/359983 |
Filed: |
March 20, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 29/785 20130101;
H01L 27/11519 20130101; H01L 29/517 20130101; H01L 29/42328
20130101; H01L 29/4933 20130101; H01L 29/7851 20130101; H01L
27/11521 20130101; H01L 29/0696 20130101; H01L 29/40114 20190801;
H01L 29/788 20130101 |
International
Class: |
H01L 27/11519 20060101
H01L027/11519; H01L 29/788 20060101 H01L029/788; H01L 29/78
20060101 H01L029/78; H01L 29/51 20060101 H01L029/51; H01L 29/423
20060101 H01L029/423; H01L 29/06 20060101 H01L029/06; H01L 29/49
20060101 H01L029/49; H01L 21/28 20060101 H01L021/28 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 9, 2018 |
TW |
107139903 |
Claims
1. A non-volatile memory, comprising: a first memory cell, disposed
on a substrate and comprising: a source region and a drain region,
respectively disposed in the substrate; a select gate, disposed on
the substrate between the source region and the drain region; a
dummy select gate, disposed on the substrate in the source region;
a floating gate, disposed on the substrate between the select gate
and the dummy select gate, wherein a height of the floating gate is
lower than a height of the select gate, and a top portion of the
floating gate has two corners in symmetry; an erase gate, disposed
on the dummy select gate and covering the corners; a control gate,
disposed on the erase gate and the floating gate; a tunneling
dielectric layer, disposed between the floating gate and the
substrate; an erase gate dielectric layer, disposed between the
erase gate and the floating gate; a select gate dielectric layer,
disposed between the select gate and the substrate; an insulating
layer, disposed between the select gate and the floating gate; and
an inter-gate dielectric layer, disposed between the control gate
and the floating gate and between the control gate and the erase
gate.
2. The non-volatile memory as claimed in claim 1, further
comprising: a second memory cell, disposed on the substrate,
wherein a structure of the second memory cell is the same as a
structure of the first memory cell, and the second memory cell and
the first memory cell are arranged in mirror symmetry and share the
source region or the drain region.
3. The non-volatile memory as claimed in claim 2, wherein the first
memory cell and the second memory cell share the erase gate, and
the erase gate fills an opening between the first memory cell and
the second memory cell.
4. The non-volatile memory as claimed in claim 3, wherein the first
memory cell and the second memory cell share the control gate, and
the control gate covers the erase gate.
5. The non-volatile memory as claimed in claim 1, wherein a
material of the control gate comprises polysilicon and metal
silicide.
6. The non-volatile memory as claimed in claim 1, wherein a
material of the select gate comprises polysilicon and metal
silicide.
7. The non-volatile memory as claimed in claim 1, wherein the
control gate fills an opening between the select gate and the erase
gate.
8. The non-volatile memory as claimed in claim 1, wherein a
material of the inter-gate dielectric layer comprises silicon
oxide/silicon nitride/silicon oxide, silicon nitride/silicon oxide,
or other high-k materials with a value of k greater than 4.
9. The non-volatile memory as claimed in claim 1, wherein a
material of the select gate dielectric layer comprises silicon
oxide or other high-k materials with a value of k greater than
4.
10. The non-volatile memory as claimed in claim 1, wherein an angle
of the corner is less than or equal to 90 degrees.
11. The non-volatile memory as claimed in claim 1, wherein a
material of the control gate comprises metal.
12. The non-volatile memory as claimed in claim 1, wherein a
material of the select gate comprises metal.
13. The non-volatile memory as claimed in claim 1, wherein the
erase gate replaces the entire dummy select gate above the source
region, and the erase gate covers the corners.
14. The non-volatile memory as claimed in claim 1, wherein the
non-volatile memory is arranged as a FinFET.
15. The non-volatile memory as claimed in claim 1, wherein the
floating gate has a notch.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 107139903, filed on Nov. 9, 2018. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of this
specification.
BACKGROUND OF THE INVENTION
Field of the Invention
[0002] The invention relates to a semiconductor device and a
manufacturing method thereof. More particularly, the invention
relates to a non-volatile memory and a manufacturing method
thereof.
Description of Related Art
[0003] A non-volatile memory allows multiple data writing, reading
and erasing operations, and the stored data is retained even after
power is cut off. With these characteristics, non-volatile memories
have been widely used in personal computers and electronic
equipment.
[0004] The typical design of a non-volatile memory includes a
stack-gate structure, and the stack-gate structure includes a
tunneling oxide layer, a floating gate, an inter-gate dielectric
layer, and a control gate that are sequentially disposed on a
substrate. To program data into or erase data from the non-volatile
memory device, a suitable voltage is applied to the source region,
the drain region and the control gate, respectively, so that
electrons are injected into a polysilicon floating gate or pulled
out from the polysilicon floating gate.
[0005] In the operation of the non-volatile memory, in general, the
greater the gate-coupling ratio (GCR) between the floating gate and
the control gate, the lower the working voltage for the operation
thereof, in which case the operational speed and efficiency of the
non-volatile memory are greatly enhanced. A method of increasing
the gate-coupling ratio includes increasing an overlap area between
the floating gate and the control gate, reducing the thickness of
the dielectric layer between the floating gate and the control
gate, and increasing the dielectric constant (k) of the inter-gate
dielectric layer between the floating gate and the control gate,
etc.
[0006] In the operation of the non-volatile memory, in general, the
smaller the gate resistance, the faster the operational speed of
the non-volatile memory. A method of reducing the gate resistance
includes using a metal silicide, a metal gate, or the like.
[0007] With the continuous miniaturization of semiconductor devices
as the level of integration of integrated circuits increases, the
dimension of a memory cell of the non-volatile memory must also be
reduced in order to increase the level of integration. The
dimension of a memory cell can be reduced by reducing the gate
length of the memory cell, the interval of bit lines, etc. However,
when the gate length is reduced, the channel length under the
tunneling oxide layer is reduced correspondingly. Thus, an abnormal
punch through between the drain and the source may occur easily,
which greatly affects the electrical performance of the memory
cell. In addition, the electrons repetitively passing through the
tunneling oxide layer during programming or erasing of memory cells
may wear off the tunneling oxide layer and thus reduce the
reliability of the memory device.
SUMMARY OF THE INVENTION
[0008] The invention provides a non-volatile memory and a
manufacturing method thereof capable of being operated at a low
operational voltage, so as to facilitate the reliability of the
semiconductor device.
[0009] The invention provides a non-volatile memory and a
manufacturing method thereof capable of reducing the gate
resistance, so as to facilitate the operational speed of the
semiconductor device.
[0010] The invention provides a non-volatile memory and a
manufacturing method thereof capable of increasing the level of
integration of the device.
[0011] The invention provides a non-volatile memory having a first
memory cell. The memory cell is disposed on the substrate. The
first memory cell includes a source region and a drain region, a
select gate, a dummy select gate, a floating gate, an erase gate, a
control gate, a tunneling dielectric layer, an erase gate
dielectric layer, a select gate dielectric layer, an insulating
layer, and an inter-gate dielectric layer. The source region and
the drain region are respectively disposed in the substrate. The
select gate is disposed on the substrate between the source region
and the drain region. The dummy select gate is disposed between the
substrate and the erase gate. The floating gate is disposed on the
substrate between the select gate and the source region, and a top
portion of the floating gate has two corners. The height of the
floating gate is lower than the height of the select gate. The
erase gate is provided on the source region and covers the corner
at the side of the source. The control gate is disposed on the
erase gate and the floating gate. The tunneling dielectric layer is
disposed between the substrate and the floating gate. The erase
gate dielectric layer is disposed between the erase gate and the
floating gate. The select gate dielectric layer is disposed between
the select gate and the substrate. The insulating layer is disposed
between the select gate and the floating gate. The inter-gate
dielectric layer is disposed between the control gate and the
floating gate and between the control gate and the erase gate.
[0012] According to an embodiment of the invention, the
non-volatile memory further includes a second memory cell. The
second memory cell is disposed on the substrate. A structure of the
second memory cell is the same as a structure of the first memory
cell, and the second memory cell and the first memory cell are
arranged in mirror symmetry and share the source region or the
drain region.
[0013] According to an embodiment of the invention, the first
memory cell and the second memory cell share the erase gate, and
the erase gate fills an opening between the first memory cell and
the second memory cell.
[0014] According to an embodiment of the invention, the first
memory cell and the second memory cell share the control gate, and
the control gate covers the erase gate.
[0015] According to an embodiment of the invention, a material of
the control gate includes polysilicon and metal silicide.
[0016] According to an embodiment of the invention, a material of
the select gate includes polysilicon and metal silicide.
[0017] According to an embodiment of the invention, the control
gate fills an opening between the select gate and the erase
gate.
[0018] According to an embodiment of the invention, a material of
the inter-gate dielectric layer includes silicon oxide/silicon
nitride/silicon oxide, silicon nitride/silicon oxide, or other
high-k materials with a value of k greater than 4.
[0019] According to an embodiment of the invention, a material of
the control gate includes metal.
[0020] According to an embodiment of the invention, a material of
the select gate includes metal.
[0021] According to an embodiment of the invention, the
non-volatile memory further includes a dummy select gate. The dummy
select gate is disposed between the substrate and the erase gate.
The height of the FG adjacent to select gate is lower than the
select gate, and the height of the FG adjacent to dummy select gate
is higher than the dummy select gate.
[0022] According to an embodiment of the invention, the
non-volatile memory is arranged as a FinFET.
[0023] According to an embodiment of the invention, the floating
gate has a notch.
[0024] The invention provides a manufacturing method of a
non-volatile memory. Firstly, a substrate with a source region
formed in the substrate is provided. A first stacked structure and
a second stacked structure are formed on the substrate. The first
stacked structure and the second stacked structure sequentially
include a select gate dielectric layer, a select gate, and a cap
layer from the substrate. In addition, the second stacked structure
is located on the source region. A tunneling dielectric layer is
formed on the substrate between the first stacked structure and the
second stacked structure. A self-aligned floating gate is formed on
the substrate between the first stacked structure and the second
stacked structure. A height of the floating gate is lower than a
height of the select gate, and a top portion of the floating gate
adjacent to the first stacked structure and the second stacked
structure has two corners in symmetry. The cap layer is removed. At
least a portion of the select gate (i.e., the dummy select gate) of
the second stacked structure is removed, and the corner of the
floating gate is exposed. An erase gate dielectric layer is formed
on the floating gate including the corners. An erase gate is formed
on the substrate or a portion of the second stacked structure. The
erase gate covers the corner of the floating gate close to a side
of the source region. An inter-gate dielectric layer is formed on
the floating gate and the erase gate. A control gate is formed on
the floating gate.
[0025] According to an embodiment of the invention, forming the
floating gate on the substrate between the first stacked structure
and the second stacked structure includes: forming a conductive
spacer between the first stacked structure and the second stacked
structure, and patterning the conductive spacer to form the
floating gate.
[0026] According to an embodiment of the invention, the
manufacturing method of the non-volatile memory further includes
forming a drain region in the substrate at a side opposite to
another side of the first stacked structure adjacent to the
floating gate.
[0027] According to an embodiment of the invention, the
manufacturing method of the non-volatile memory further includes
forming a metal silicide layer in the select gate, the control
gate, and the drain region.
[0028] According to an embodiment of the invention, in at least
removing the portion of the select gate of the second stacked
structure, the entire select gate of the second stacked structure
is removed.
[0029] According to an embodiment of the invention, after the
entire select gate of the second stacked structure is removed, the
manufacturing method of the non-volatile memory further includes
forming a spacer and the erase gate dielectric layer on a sidewall
of the floating gate.
[0030] According to an embodiment of the invention, forming the
control gate on the floating gate includes: forming a conductive
material layer on the substrate, and patterning the conductive
material layer to form the control gate covering the floating gate
and the erase gate.
[0031] According to an embodiment of the invention, forming the
control gate on the floating gate includes: forming a conductive
material layer on the substrate, and performing a planarization
process to remove a portion of the conductive material layer and
patterning the conductive material layer to form the control gate
at a side of the erase gate and above the floating gate.
[0032] In the non-volatile memory and the manufacturing method
thereof of the invention, the floating gate has a notch, so the
area sandwiched between the control gate and the floating gate is
increased, and the coupling rate of the memory device is
increased.
[0033] In the non-volatile memory and the manufacturing method
thereof of the invention, the floating gate has the corner, and the
erase gate covers the corner. The angle of the corner is smaller
than or equal to 90 degrees. With the corner, the electrical field
is concentrated, so the erase voltage can be lowered to efficiently
pull electrons from the floating gate, thereby facilitating the
speed of erasing data.
[0034] In the non-volatile memory and the manufacturing method
thereof of the invention, the surfaces of the select gate, the
control gate, and the erase gate are coplanar. Therefore, the level
of integration of the memory device can be increased.
[0035] In the non-volatile memory and the manufacturing method
thereof of the invention, by performing the high-k metal gate
(HKMG) manufacturing process so that the select gate and/or the
control gate is formed as a high-k metal gate (HKMG), the
transistor capacitance (by which the current is driven) can be
increased, and the gate leakage and the threshold voltage can be
decreased. In this way, the device performance is facilitated.
[0036] In order to make the aforementioned and other features and
advantages of the invention comprehensible, several exemplary
embodiments accompanied with figures are described in detail
below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0037] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention.
[0038] FIG. 1A is a top view illustrating a non-volatile memory
according to an embodiment of the invention.
[0039] FIG. 1B is a schematic cross-sectional view illustrating a
non-volatile memory according to an embodiment of the
invention.
[0040] FIG. 1C is a schematic cross-sectional view illustrating a
non-volatile memory according to an embodiment of the
invention.
[0041] FIG. 1D is a top view illustrating a non-volatile memory
according to an embodiment of the invention.
[0042] FIG. 1E is a schematic cross-sectional view illustrating a
non-volatile memory according to an embodiment of the
invention.
[0043] FIG. 1F is a schematic cross-sectional view illustrating a
non-volatile memory according to an embodiment of the
invention.
[0044] FIG. 1G is a schematic cross-sectional view illustrating a
non-volatile memory according to an embodiment of the
invention.
[0045] FIG. 1H is a schematic cross-sectional view illustrating a
non-volatile memory according to an embodiment of the
invention.
[0046] FIG. 1I is a schematic cross-sectional view illustrating a
non-volatile memory according to an embodiment of the
invention.
[0047] FIG. 1J is a schematic cross-sectional view illustrating a
non-volatile memory according to an embodiment of the
invention.
[0048] FIG. 1K is a schematic cross-sectional view illustrating a
non-volatile memory according to an embodiment of the
invention.
[0049] FIG. 1L is a schematic cross-sectional view illustrating a
non-volatile memory according to an embodiment of the
invention.
[0050] FIGS. 2A to 2I are schematic cross-sectional views
illustrating a manufacturing process of a non-volatile memory
according to an embodiment of the invention.
[0051] FIG. 3 is a schematic cross-sectional view illustrating a
manufacturing process of a non-volatile memory according to an
embodiment of the invention.
[0052] FIGS. 4A to 4B are schematic cross-sectional views
illustrating a manufacturing process of a non-volatile memory after
a second stacked structure (i.e., a dummy select gate) is removed
according to an embodiment of the invention.
DESCRIPTION OF THE EMBODIMENTS
[0053] Reference will now be made in detail to the present
preferred embodiments of the invention, examples of which are
illustrated in the accompanying drawings. Wherever possible, the
same reference numbers are used in the drawings and the description
to refer to the same or like parts.
[0054] FIG. 1A is a top view illustrating a non-volatile memory
according to an embodiment of the invention. FIG. 1B is a schematic
cross-sectional view illustrating a non-volatile memory according
to an embodiment of the invention. FIG. 1B is a cross-sectional
view taken along a line A-A' as shown in FIG. 1A. FIG. 1C is a
schematic cross-sectional view illustrating a non-volatile memory
according to an embodiment of the invention. FIG. 1D is a top view
illustrating a non-volatile memory according to an embodiment of
the invention. FIG. 1E is a schematic cross-sectional view
illustrating a non-volatile memory according to an embodiment of
the invention. FIG. 1E is a cross-sectional view taken along a line
B-B' as shown in FIG. 1D. FIGS. 1F to 1J are schematic
cross-sectional views illustrating a non-volatile memory according
to embodiments of the invention. In FIGS. 1B to 1J, the same
components are represented with the same symbols, and the repeated
descriptions thereof are omitted.
[0055] Referring to FIGS. 1A and 1B, the non-volatile memory
includes a plurality of memory cells MC. The memory cells MC are
arranged into a row/column array. The non-volatile memory is
disposed on the substrate 100. In the substrate 100, a plurality of
isolation structures 101 regularly arranged, for example, are
disposed, so as to define a lattice-like active region 103. The
isolation structures 101 are shallow trench isolation structures,
for example.
[0056] Each of the memory cells MC includes a source region 102 and
a drain region 104, a select gate 106, a floating gate 108, an
erase gate 110, a control gate 112, a tunneling dielectric layer
114, an erase gate dielectric layer 116, a select gate dielectric
layer 118, an insulating layer 120, and an inter-gate dielectric
layer 122.
[0057] The source region 102 and the drain region 104 are
respectively disposed in the substrate 100. The source region 102
and the drain region 104 are, for example, doped regions containing
an N-type dopant or a P-type dopant, depending on the design of the
device.
[0058] The select gate 106 is disposed on the substrate 100 between
the source region 102 and the drain region 104, for example. The
select gate 106 extends in the Y-direction, for example. The
material of the select gate 106 includes a conductive material such
as doped polysilicon, etc. In an embodiment, the material of the
select gate 106 includes polysilicon and metal silicide. The
floating gate 108 is disposed on the substrate 100 between the
select gate 106 and the source region 102, for example. The height
of the floating gate 108 is lower than the height of the select
gate 106, and the top portion of the floating gate 108 at least has
a corner 126. The floating gate 108 has a recess. In other words,
the height of the floating gate gradually increases from the
center. The material of the floating gate 108 is, for example, a
conductive material such as doped polysilicon, etc. The floating
gate 108 may be formed by one or more conductive layers.
[0059] In the embodiment, the non-volatile memory further includes
a dummy select gate 106a. The dummy select gate 106a is disposed
between the substrate 100 and the erase gate 110, for example. The
insulating layer 120 is also disposed between the dummy select gate
106a and the floating gate 108, for example. The height of the side
of the floating gate 108 adjacent to the dummy select gate 106a is
higher than the height of the dummy select gate 106a, so as to
expose the corner 126 of the top portion.
[0060] The erase gate 110 is disposed on the source region 102, for
example, and the erase gate 110 covers the corner 126. The erase
gate 110 extends in the Y-direction, for example. The material of
the erase gate 110 is, for example, a conductive material such as
doped polysilicon, etc. The control gate 112 is disposed on the
erase gate 110 and the floating gate 108. The material of the
control gate 112 is, for example, a conductive material such as
doped polysilicon, etc. The tunneling dielectric layer 114 is
disposed between the floating gate 108 and the substrate 100, for
example. Moreover, the material of the tunneling dielectric layer
114 is, for example, silicon oxide. The thickness of the tunneling
dielectric layer 114 ranges from 60 angstroms to 200 angstroms, for
example. The erase gate dielectric layer 116 is disposed between
the erase gate 110 and the floating gate 108, for example. The
material of the erase gate dielectric layer 116 is silicon oxide,
for example. The thickness of the erase gate dielectric layer 116
ranges from 60 angstroms to 150 angstroms, for example.
[0061] The select gate dielectric layer 118 is disposed between the
select gate 106 and the substrate 100, for example. The material of
the select gate dielectric layer 118 is silicon oxide, for example.
The insulating layer 120 is disposed between the select gate 106
and the floating gate 108, for example. The inter-gate dielectric
layer 122 is disposed between the control gate 112 and the floating
gate 108 and between the control gate 112 and the erase gate 110,
for example. The material of the inter-gate dielectric layer 122
is, for example, silicon oxide/silicon nitride/silicon oxide,
silicon nitride/silicon oxide, or other high-k materials (k>4),
for example.
[0062] In the X-direction (row direction), the memory cells MC are
connected with each other in series through the source region 102
or the drain region 104. For example, the structure of a memory
cell 140 and the structure of a memory cell 142 are the same, and
the memory cell 140 and the memory cell 142 are arranged in mirror
symmetry and share the source region 102 or the drain region 104.
The structure of the memory cell 144 and the structure of the
memory cell 146 are the same, and the memory cell 144 and the
memory cell 146 are arranged in mirror symmetry and share the
source region 102 or the drain region 104. Meanwhile, the memory
cell 140, the memory cell 142, the memory cell 144, and the memory
cell 146 share the erase gate 110 and the control gate 112, and the
control gate 112 covers the erase gate 110.
[0063] In the Y-direction (column direction), the memory cells MC
are connected in series through the source region 102, the select
gate 106, the erase gate 110, and the control gate 112. In other
words, in the column direction, the memory cells MC share the same
source region 102, select gate 106, erase gate 110, and control
gate 112. For example, the structure of the memory cell 140 and the
structure of the memory cell 144 are the same, the structure of the
memory cell 142 and the structure of the memory cell 146 are the
same, the control gate 112 is filled between the memory cell 140
and the memory cell 144 and between the memory cell 142 and the
memory cell 146. The memory cells 140 and 144 in the same column
share the same source region 102, select gate 106, erase gate 110,
and control gate 112.
[0064] In the embodiment, a metal silicide layer 124 is further
formed on the control gate 112, the select gate 106, and the drain
region 104.
[0065] In another embodiment, as shown in FIG. 1C, the dummy select
gate 106a shown in FIGS. 1A and 1B is removed. An erase gate 110a
fills the opening between the memory cell 140 and the memory cell
142. An insulating layer formed by the erase gate dielectric layer
116a and a spacer 128 is disposed between the erase gate 110a and
the floating gate 108.
[0066] In another embodiment, as shown in FIGS. 1D and 1E, the
memory cell 140 and the memory cell 142 share the erase gate 110.
However, the memory cell 140 and the memory cell 142 are
respectively provided with a control gate 112a and a control gate
112b. In other words, in the X-direction, the adjacent memory cells
MC do not share the control gate.
[0067] In addition, as shown in FIG. 1E, the control gate 112a and
the control gate 112b are disposed in notches between the select
gate 106 and the erase gate 110. The surfaces of the select gate
106, the control gate 112a and the control gate 112b, and the erase
gate 110a are coplanar. Therefore, the level of integration of the
memory device can be increased.
[0068] In another embodiment, a non-volatile memory shown in FIG.
1F is a modified example of the non-volatile memory shown in FIG.
1E. In the following, the descriptions will only focus on the
differences. As shown in FIG. 1F, the material of a select gate
106b includes a metal material, such as aluminum, copper, tungsten,
cobalt, titanium, tantalum, niobium, or zirconium, etc. A high-k
dielectric layer 152 (with the value of k greater than 4) is
disposed between the select gate 106b and the control gate 112a (or
the control gate 112b), between the select gate 106b and the
floating gate 108, and between the select gate 106b and the
substrate 100. The high-k dielectric layer 152 may include HfO,
HfSiO, HfAlO, or HfTaO, for example.
[0069] By arranging the select gate 106b to be a high-k metal gate
(HKMG), the transistor capacitance (by which the current is driven)
can be increased, and the gate leakage and the threshold voltage
can be decreased. In this way, the device performance is
facilitated.
[0070] In another embodiment, a non-volatile memory shown in FIG.
1G is a modified example of the non-volatile memory shown in FIG.
1E. In the following, the descriptions will only focus on the
differences. The material of the select gate 106b includes a metal
material, such as aluminum, copper, tungsten, cobalt, titanium,
tantalum, niobium, or zirconium, etc. The materials of a control
gate 112c and a control gate 112d include a metal material, such as
aluminum, copper, tungsten, cobalt, titanium, tantalum, niobium, or
zirconium, etc.
[0071] The high-k dielectric layer 152 (with the value of k greater
than 4) is disposed between the select gate 106b and the control
gate 112c (or the control gate 112d), between the select gate 106b
and the floating gate 108, and between the select gate 106b and the
substrate 100. The high-k dielectric layer 152 may include HfO,
HfSiO, HfAlO, or HfTaO, for example. By arranging the select gate
106b to be a high-k metal gate (HKMG), the transistor capacitance
(by which the current is driven) can be increased, and the gate
leakage and the threshold voltage can be decreased. In this way,
the device performance is facilitated.
[0072] A high-k dielectric layer 154 (with the value of k greater
than 4) is disposed between the control gate 112c (or the control
gate 112d) and the erase gate 110 and between the control gate 112c
(or the control gate 112d) and the floating gate 108. The high-k
dielectric layer 154 may include HfO, HfSiO, HfAlO, or HfTaO, for
example. By arranging the control gate 112c (or the control gate
112d) to be a high-k metal gate (HKMG), the gate-coupling ratio
(GCR) between the floating gate and the control gate is increased,
the working voltage required for the operation thereof is
decreased, and the operational speed and efficiency of the
non-volatile memory are greatly enhanced.
[0073] In another embodiment, as shown in FIG. 1H, the memory cell
140 and the memory cell 142 share the erase gate 110. However, the
memory cell 140 and the memory cell 142 are respectively provided
with the control gate 112a and the control gate 112b. In other
words, in the X-direction, the adjacent memory cells MC do not
share the control gate. In addition, the dummy select gate 106a
shown in FIGS. 1A and 1B is removed. The erase gate 110a fills the
opening between the memory cell 140 and the memory cell 142. The
insulating layer formed by the erase gate dielectric layer 116a and
the spacer 128 is disposed between the erase gate 110a and the
floating gate 108.
[0074] In another embodiment, a non-volatile memory shown in FIG.
1I is a modified example of the non-volatile memory shown in FIG.
1H. In the following, the descriptions will only focus on the
differences. As shown in FIG. 1I, the material of the select gate
106b includes a metal material, such as aluminum, copper, tungsten,
cobalt, titanium, tantalum, niobium, or zirconium, etc. The high-k
dielectric layer 152 (with the value of k greater than 4) is
disposed between the select gate 106b and the control gate 112a (or
the control gate 112b), between the select gate 106b and the
floating gate 108, and between the select gate 106b and the
substrate 100. The high-k dielectric layer 152 may include HfO,
HfSiO, HfAlO, or HfTaO, for example.
[0075] By arranging the select gate 106b to be a high-k metal gate
(HKMG), the transistor capacitance (by which the current is driven)
can be increased, and the gate leakage and the threshold voltage
can be decreased. In this way, the device performance is
facilitated.
[0076] In another embodiment, a non-volatile memory shown in FIG.
1J is a modified example of the non-volatile memory shown in FIG.
1H. In the following, the descriptions will only focus on the
differences. The material of the select gate 106b includes a metal
material, such as aluminum, copper, tungsten, cobalt, titanium,
tantalum, niobium, or zirconium, etc. The materials of the control
gate 112c and the control gate 112d include a metal material, such
as aluminum, copper, tungsten, cobalt, titanium, tantalum, niobium,
or zirconium, etc.
[0077] The high-k dielectric layer 152 (with the value of k greater
than 4) is disposed between the select gate 106b and the control
gate 112c (or the control gate 112d), between the select gate 106b
and the floating gate 108, and between the select gate 106b and the
substrate 100. The high-k dielectric layer 152 may include HfO,
HfSiO, HfAlO, or HfTaO, for example. By arranging the select gate
106b to be a high-k metal gate (HKMG), the transistor capacitance
(by which the current is driven) can be increased, and the gate
leakage and the threshold voltage can be decreased. In this way,
the device performance is facilitated.
[0078] The high-k dielectric layer 154 (with the value of k greater
than 4) is disposed between the control gate 112c (or the control
gate 112d) and the erase gate 110 and between the control gate 112c
(or the control gate 112d) and the floating gate 108. The high-k
dielectric layer 154 may include HfO, HfSiO, HfAlO, or HfTaO, for
example. By arranging the control gate 112c (or the control gate
112d) to be a high-k metal gate (HKMG), the gate-coupling ratio
(GCR) between the floating gate and the control gate is increased,
the working voltage required for the operation thereof is
decreased, and the operational speed and efficiency of the
non-volatile memory are greatly enhanced.
[0079] In addition, the descriptions of the non-volatile memories
in FIGS. 1B to 1J are made with reference to the bulk MOSFET as an
example, but of course these non-volatile memories may also be
arranged as FinFETs. FIGS. 1K and 1L are respectively schematic
cross-sectional views illustrating non-volatile memories as FinFETs
according to embodiments of the invention.
[0080] The non-volatile memories shown in FIGS. 1K and 1L are
respectively the modified examples of the non-volatile memories
shown in FIGS. 1G and 1J, and the following descriptions will only
focus on the differences. In FIG. 1K, CC', DD', and EE'
respectively show the cross-sectional views taken along lines C-C',
D-D', and E-E' in FIG. 1G. In FIG. 1L, FF', GG', and HH'
respectively show the cross-sectional views taken along lines F-F',
G-G', and H-H' in FIG. 1J.
[0081] As shown in FIGS. 1K and 1L, the substrate 100 has a fin
portion 100a. In addition, the substrate 100 has the isolation
structures 101. The isolation structures 101 are located between
the fin portion 100a. The isolation structures 101 are shallow
trench isolation (STI) structures, for example, to insulate or
isolate the fin portion 100a. The floating gate 108 is disposed
across the fin portion 100a, for example. In this way, the area
sandwiched between the floating gate 108 and the active region is
increased (the channel width of the memory cell is increased). In
addition, the control gate 112c is also disposed across the fin
portion 100a. In this way, the area sandwiched between the control
gate 112c and the floating gate 108 is increased, and the coupling
rate of the memory device is thus increased.
[0082] In the non-volatile memory, the thickness of the select gate
dielectric layer 118 is thinner. When the memory cell is being
operated, the channel region below the select gate 106 can be
turned on or off with a smaller voltage. In other words, the
operational voltage can be decreased. The floating gate 108 has a
notch that increases the area sandwiched between the control gate
112 and the floating gate 108 and thus increases the coupling rate
of the memory device. The floating gate 108 has the corner 126. The
erase gate 110 (110a) covers the corner 126, and the angle of the
corner 126 is smaller than or equal to 90 degrees. With the corner
126, the electrical field is concentrated, so the erase voltage can
be lowered to efficiently pull electrons from the floating gate
108, thereby facilitating the speed of erasing data.
[0083] In the non-volatile memory, the surfaces of the select gate
106, the control gate 112a and the control gate 112b, and the erase
gate 110 are coplanar. Therefore, the level of integration of the
memory device can be increased.
[0084] In the non-volatile memory, by arranging the select gate
106b and/or the control gate 112c (the control gate 112d) to be a
high-k metal gate (HKMG), the transistor capacitance (by which the
current is driven) can be increased, the gate leakage and the
threshold voltage can be decreased, and the gate-coupling ratio
(GCR) is increased. In this way, the device performance is
facilitated.
[0085] In the non-volatile memory, with the arrangement as a
FinFET, the floating gate 108 is disposed across the fin portion
100a, so the area sandwiched between the floating gate 108 and the
active region is increased (the channel width of the memory cell is
increased). In addition, the control gate 112c is also disposed
across the fin portion 100a. In this way, the area sandwiched
between the control gate 112c and the floating gate 108 is
increased, and the coupling rate of the memory device is thus
increased.
[0086] FIGS. 2A to 2I are schematic cross-sectional views
illustrating a manufacturing process of a non-volatile memory
according to an embodiment of the invention.
[0087] First, as shown in FIG. 2A, a substrate 200 is provided. A
source region 202 is formed in the substrate 200. The source region
202 may be formed by performing an ion implantation process, for
example. The implanted dopant may be an N-type dopant or a P-type
dopant, depending on the design of the device.
[0088] Then, a dielectric layer 204, a conductive layer 206, and a
sacrificial layer 207 are sequentially formed on the substrate 200.
The material of the dielectric layer 204 is, for example, silicon
oxide, and the dielectric layer is formed, for example, by thermal
oxidation. The material of the conductive layer 206 is, for
example, doped polysilicon or polycide, etc. When the material of
the conductive layer 206 is doped polysilicon, the conductive 206
layer may be formed by firstly forming an un-doped polysilicon
layer by performing a chemical vapor deposition (CVD) process and
then performing an ion implanting process. Alternatively, the
conductive layer 206 may be formed by conducting in-situ dopant
implantation in a CVD process. The material of the sacrificial
layer 207 includes one having a different etching selectivity from
that of the material of the dielectric layer 204, such as silicon
nitride, and the sacrificial layer 207 may be formed by performing
a CVD process.
[0089] Then, the sacrificial layer 207, the conductive layer 206,
and the dielectric layer 204 are patterned to at least form a
stacked structure 208a and a stacked structure 208b. The stacked
structure 208b is located on the source region 202. The stacked
structure 208a and the stacked structure 208b may be formed by, for
example, firstly forming a patterned photoresist layer (not shown)
on the substrate 200. The patterned photoresist layer is formed by,
for example, firstly forming a photoresist material layer on the
entire substrate 200, and then performing an exposure process and a
development process to form the patterned photoresist layer. Then,
using the patterned photoresist layer as a mask, the sacrificial
layer 207, the conductive layer 206, and the dielectric layer 204
are removed to form at least the stacked structure 208a and the
stacked structure 208b. Next, the patterned photoresist layer is
removed. The patterned photoresist layer may be removed by, for
example, performing a wet photoresist stripping process or a dry
photoresist stripping process. In addition, the dielectric layer
202 serves as a select gate dielectric layer, and the conductive
layer 206 serves as a select gate.
[0090] Referring to FIG. 2B, insulating layers 210 are formed on
the sidewalls of the stacked structure 208a and the stacked
structure 208B. The material of the insulating layer 210 is, for
example, silicon oxide/silicon nitride/silicon oxide or silicon
nitride/silicon oxide. The insulating layer 210 may be formed by,
for example, firstly forming a dielectric layer covering the
stacked structure 208a and the stacked structure 208b, and then
removing a portion of the dielectric layer to form the insulating
layers 210 on the sidewalls of the stacked structure 208a and the
stacked structure 208b. The dielectric layer is formed by
performing a CVD process, for example. The portion of the
dielectric layer may be removed by performing an anisotropic
etching process, for example.
[0091] Then, a tunneling dielectric layer 212 is formed on the
substrate 200 between the stacked structure 208a and the stacked
structure 208b. The material of the tunneling dielectric layer 212
is, for example, silicon oxide, and the formation method is, for
example, thermal oxidation.
[0092] Then, a conductive layer 214 is formed on the substrate 200.
The material of the conductive layer 214 is, for example, doped
polysilicon or polycide, etc. When the material of the conductive
layer is doped polysilicon, the conductive layer may be formed by
firstly forming an un-doped polysilicon layer by performing a CVD
process and then performing an ion implanting process.
Alternatively, the conductive layer may be formed by conducting
in-situ dopant implantation in a CVD process. Then, a portion of
the conductive layer is removed. The portion of the conductive
layer may be removed by performing an anisotropic etching process
or an etch back process, for example.
[0093] Referring to FIG. 2C, a portion of the conductive layer 214
is removed to form a conductive spacer between the stacked
structure 208a and the stacked structure 208b. The portion of the
conductive layer may be removed by performing an anisotropic
etching process or an etch back process, for example. The height of
the conductive spacer is lower than the height of the conductive
layer 206 in the stacked structure 208a (or the stacked structure
208b). Then, the conductive spacer is patterned to form a floating
gate 216. The conductive spacer may be patterned according to the
following. A patterned photoresist (not shown) is formed on the
substrate 200. The patterned photoresist layer may be formed by,
for example, forming a photoresist material layer on the entire
substrate 200, and then performing an exposure process and a
development process to form the patterned photoresist layer. Using
the patterned photoresist layer as a mask, a portion of the
conductive spacer is removed to make the conductive spacer
block-shaped, and the conductive spacer between the stacked
structure 208a and the stacked structure 208b is retained. The
block-shaped conductive spacer between the stacked structure 208a
and the stacked structure 208b serves as the floating gate 216. The
floating gate 216 has a notch, and is provided with corners 218 at
the top portion adjacent to the stacked structure 208a and the
stacked structure 208b.
[0094] Then, the sacrificial layer 207 is removed. The sacrificial
layer 207 may be removed by performing a wet etching process or a
dry etching process.
[0095] Referring to FIG. 2D, an insulating layer 219 is formed on
the substrate 200. The material of the insulating layer 219 is, for
example, silicon oxide, etc. The insulating layer 219 may be formed
by performing a CVD process, for example. A planarization process
is performed on the insulating layer 219. For example, a portion of
the insulating layer 219 is removed by performing a chemical
mechanical polishing process until the conductive layer 206 is
exposed. Then, a patterned photoresist layer (not shown) is formed
on the substrate 200 to expose the conductive layer of the stacked
structure 208. The patterned photoresist layer may be formed by,
for example, forming a photoresist material layer on the entire
substrate 200, and then performing an exposure process and a
development process to form the patterned photoresist layer. Then,
using the patterned photoresist layer as a mask, a portion of the
conductive layer 206 of the stacked structure 208b is removed, so
that the height of the conductive layer 206 of the stacked
structure 208b is lower than the height of the floating gate 216.
In other words, at least the corner 218 of the floating gate 216 is
exposed. Next, the patterned photoresist layer is removed. The
patterned photoresist layer may be removed by, for example,
performing a wet photoresist stripping process or a dry photoresist
stripping process.
[0096] Referring to FIG. 2E, the insulating layer 219 is removed to
expose the corner 218 of the floating gate 216. The insulating
layer 219 may be removed by performing a wet etching process or a
dry etching process, for example. In this process, a portion of the
insulating layer 210 is also removed together.
[0097] A dielectric layer 222 is formed on the substrate 200. The
material of the dielectric layer 222 is, for example, silicon
oxide. Then, a conductive layer 224 is formed on the substrate 200.
The material of the conductive layer 224 is, for example, doped
polysilicon or polycide, etc. When the material of the conductive
layer 224 is doped polysilicon, the conductive 224 layer may be
formed by firstly forming an un-doped polysilicon layer by
performing a CVD process and then performing an ion implanting
process. Alternatively, the conductive layer 224 may be formed by
conducting in-situ dopant implantation in a CVD process.
[0098] Referring to FIG. 2F, the conductive layer 224 is patterned
to form an erase gate 224a. The erase gate 224a is located on the
source region 202. The patterned conductive layer 224 is formed by,
for example, forming a patterned photoresist layer (not shown) on
the substrate 200. The patterned photoresist layer is formed by,
for example, forming a photoresist layer on the entire substrate
200, and then performing an exposure process and a development
process to form the patterned photoresist layer. Then, using the
patterned photoresist layer as a mask, the conductive layer 224 is
removed to form at least the erase gate 224a. Next, the patterned
photoresist layer is removed. The patterned photoresist layer may
be removed by, for example, performing a wet photoresist stripping
process or a dry photoresist stripping process. In this process,
the dielectric layer 222 not covered by the erase gate 224a may
also be removed together. The dielectric layer 222 between the
erase gate 224a and the floating gate 216 serves as an erase gate
dielectric layer.
[0099] Then, an inter-gate dielectric layer 236 is formed on the
substrate 200. The inter-gate dielectric layer 236 at least covers
the floating gate 216 and the erase gate 224a. The material of the
inter-gate dielectric layer 236 includes silicon oxide/silicon
nitride/silicon oxide, for example. The inter-gate dielectric layer
236 may be formed by, for example, sequentially forming a silicon
oxide layer, a silicon nitride layer, and another silicon oxide
layer by performing a CVD process. The material of the inter-gate
dielectric layer 236 may also be silicon nitride/silicon oxide or
other high-k materials (k>4).
[0100] Then, a conductive layer 230 is formed on the substrate 200.
The material of the conductive layer 230 is, for example, doped
polysilicon or polycide, etc. When the material of the conductive
layer 230 is doped polysilicon, the conductive 230 layer may be
formed by firstly forming an un-doped polysilicon layer by
performing a CVD process and then performing an ion implanting
process. Alternatively, the conductive layer 230 may be formed by
conducting in-situ dopant implantation in a CVD process.
[0101] Referring to FIG. 2G, a planarization process is performed
on the conductive layer 230. For example, portions of the
conductive layer 230 and the inter-gate dielectric layer 236 are
removed by performing a chemical mechanical polishing process until
the erase gate 224a is exposed. Then, the conductive layer 230 is
patterned to form a control gate 230a. The inter-gate dielectric
layer 236 is formed between the erase gate 224a and the floating
gate 216. The control gate 230a is formed in the notch between the
conductive layer 206 (the select gate) and the erase gate 224a.
[0102] Then, a drain region 232 is formed in the substrate 200 at a
side opposite to the floating gate 216 of the select gate (the
conductive gate 206). The drain region 232 may be formed by
performing an ion implantation process, for example. The implanted
dopant may be an N-type dopant or a P-type dopant, depending on the
design of the device. The dopants and dopant concentrations of the
source regions 202 and the drain region 232 may be the same or
different.
[0103] Then, spacers 234 are formed on the sidewalls of the select
gate (the conductive layer 206). The material of the spacers 234 is
silicon nitride, for example. The spacers 234 may be formed by, for
example, forming an insulating layer on the substrate 200, and
removing a portion of the insulating layer by performing an
anisotropic etching process or an etch back process. When the
spacers 234 are formed, the inter-gate dielectric layer 236 not
covered by the spacers 234 is also removed.
[0104] In another embodiment, after FIG. 2G, the processes as shown
in FIGS. 2H to 2I may be optionally performed to manufacture the
non-volatile memory shown in FIG. 1F.
[0105] Referring to FIG. 2H, a blocking layer 250 is formed on the
substrate 200. The blocking layer 250 covers the control gate 230a
and the erase gate 224a. In other words, at least the conductive
layer 206 (the select gate) is exposed. The blocking layer 250 may
be formed according to the following. A dielectric layer is formed
on the substrate 200. Then, a photoresist material layer is formed
on the substrate 200. An exposure process and a development process
are performed on the photoresist material layer to form a patterned
photoresist layer. Using the patterned photoresist layer as a mask,
a portion of the dielectric layer is removed to form the blocking
layer 250. The patterned photoresist layer is then removed.
[0106] Then, using the blocking layer 250 as a mask, the conductive
layer 206 (the select gate) is removed to form an opening 252.
[0107] Referring to FIG. 2I, the blocking layer 250 is removed. The
blocking layer 250 may be removed by performing a wet etching
process, for example. Then, a high-k metal gate (HKMG)
manufacturing process is performed. In other words, a high-k
dielectric layer and a metal layer are sequentially formed on the
substrate 200, and the metal layer 252 fills the opening 252. The
high-k dielectric layer may be formed by performing a CVD process,
for example. The metal layer may be formed by performing a physical
vapor deposition process or a CVD process. A planarization process
is performed on the metal layer. For example, a chemical mechanical
polishing process is performed to remove a portion of the metal
layer until the erase gate 224a is exposed, so as to form the
high-k dielectric layer 254 and the select gate 256.
[0108] In another embodiment, the non-volatile memory shown in FIG.
1G is manufactured. In FIG. 2H, the blocking layer 250 only covers
the erase gate 224a. Using the blocking layer 250 as a mask, the
conductive layer 206 (the select gate) and the control gate 230a
are removed.
[0109] In FIG. 2I, when the high-k metal gate manufacturing process
is performed, a control gate made of metal and the high-k
dielectric layer 254 are also formed at the position where the
control gate 230 is originally located.
[0110] In another embodiment, in FIG. 3 which follows FIG. 2F, the
conductive layer 230 is directly patterned to form a control gate
230b covering the erase gate 224a. Then, the drain region 232, the
spacers 234, and the metal silicide layer 228 are formed to
manufacture the non-volatile memory shown in FIG. 1B.
[0111] In another embodiment, to manufacture the non-volatile
memory shown in FIG. 1H, the processes shown in FIGS. 4A to 4B are
performed after FIG. 2C.
[0112] Referring to FIG. 4A, the insulating layer 219 is formed on
the substrate 200. The material of the insulating layer 219 is, for
example, silicon oxide, etc. The insulating layer 219 may be formed
by performing a CVD process, for example. A planarization process
is performed on the insulating layer 219. For example, a portion of
the insulating layer 219 is removed by performing a chemical
mechanical polishing process until the conductive layer 206 is
exposed. Then, a patterned photoresist layer (not shown) is formed
on the substrate 200 to expose the conductive layer of the stacked
structure 208. The patterned photoresist layer may be formed by,
for example, forming a photoresist material layer on the entire
substrate 200, and then performing an exposure process and a
development process to form the patterned photoresist layer. Then,
using the patterned photoresist layer as a mask, the conductive
layer 206 of the stacked structure 208b is completely removed to
form a notch. Next, the patterned photoresist layer is removed. The
patterned photoresist layer may be removed by, for example,
performing a wet photoresist stripping process or a dry photoresist
stripping process.
[0113] Referring to FIG. 4B, the insulating layer 219 is removed to
expose the corner 218 of the floating gate 216. The insulating
layer 219 may be removed by performing a wet etching process or a
dry etching process, for example. In this process, a portion of the
insulating layer 210 is also removed together.
[0114] Then, the spacers 238 are formed on the sidewalls of the
floating gate 216. The material of the spacers 238 is silicon
oxide, for example. The spacers 238 may be formed by, for example,
forming an insulating layer on the substrate 200, and removing a
portion of the insulating layer by performing an anisotropic
etching process or an etch back process. The dielectric layer 222
is formed on the substrate 200. The material of the dielectric
layer 222 is, for example, silicon oxide. Then, the conductive
layer 224 is formed on the substrate 200. The material of the
conductive layer 224 is, for example, doped polysilicon or
polycide, etc. When the material of the conductive layer 224 is
doped polysilicon, the conductive 224 layer may be formed by
firstly forming an un-doped polysilicon layer by performing a CVD
process and then performing an ion implanting process.
Alternatively, the conductive layer 224 may be formed by conducting
in-situ dopant implantation in a CVD process.
[0115] The subsequent processes may be referred to the descriptions
of FIGS. 2F to 2G. After the erase gate filling the notch is
formed, the inter-gate dielectric layer 236, the control gate 230a,
the drain region 232, and the spacer 234 are sequentially formed,
so as to manufacture the non-volatile memory shown in FIG. 1H.
[0116] In another embodiment, the subsequent processes may be
referred to the descriptions of FIGS. 2H and 2I. The high-k metal
gate (HKMG) manufacturing process is performed, and the material of
the select gate and/or the control gate is further replaced with
metal.
[0117] In the manufacturing process of the non-volatile memory, the
control gate formed accordingly covers the side surface and the
upper surface of the floating gate. In this way, the area
sandwiched between the control gate and the floating gate is
increased, so the coupling rate of the memory device is increased.
The floating gate has the corner. The erase gate covers the corner,
and the angle of the corner is smaller than or equal to 90 degrees.
With the corner, the electrical field is concentrated, so the erase
voltage can be lowered to efficiently pull electrons from the
floating gate, thereby facilitating the speed of erasing data.
[0118] In the manufacturing method of the non-volatile memory, the
surfaces of the select gate, the control gate, and the erase gate
formed accordingly are coplanar. Therefore, the level of
integration of the memory device can be increased.
[0119] In the non-volatile memory and the manufacturing method
thereof, by performing the high-k metal gate (HKMG) manufacturing
process so that the select gate and/or the control gate are/is
formed as a high-k metal gate (HKMG), the transistor capacitance
(by which the current is driven) can be increased, the gate leakage
and the threshold voltage can be decreased, and the gate-coupling
ratio (GCR) is increased. In this way, the device performance is
facilitated.
[0120] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
present invention cover modifications and variations of this
invention provided they fall within the scope of the following
claims and their equivalents.
* * * * *