U.S. patent application number 16/707232 was filed with the patent office on 2020-04-09 for wafer level sensing module, manufacturing method thereof and electronic device using the same.
The applicant listed for this patent is LITE-ON SINGAPORE PTE. LTD.. Invention is credited to TECK-CHAI GOH, SIN-HENG LIM, GUANG-LI SONG.
Application Number | 20200111931 16/707232 |
Document ID | / |
Family ID | 67393668 |
Filed Date | 2020-04-09 |
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United States Patent
Application |
20200111931 |
Kind Code |
A1 |
GOH; TECK-CHAI ; et
al. |
April 9, 2020 |
WAFER LEVEL SENSING MODULE, MANUFACTURING METHOD THEREOF AND
ELECTRONIC DEVICE USING THE SAME
Abstract
A manufacturing method of wafer level sensing module includes:
providing a chip substrate formed with a first receptor and a
second receptor; disposing an emitter on the chip substrate;
disposing a shielding assembly on the top surface of the chip
substrate; and disposing a transparent shielding plate on the top
surface of the chip substrate and in positional correspondence with
the second receptor. The first lens is connected between the first
shielding member and the second shielding member, and the emitter
is arranged in a first space defined by the first shielding member,
the first lens, the second shielding member, and the chip
substrate. The second lens is connected between the second
shielding member and the third shielding member, and the first
receptor is arranged in a second space defined by the second
shielding member, the second lens, the third shielding member, and
the chip substrate.
Inventors: |
GOH; TECK-CHAI; (Singapore,
SG) ; LIM; SIN-HENG; (SINGAPORE, SG) ; SONG;
GUANG-LI; (SINGAPORE, SG) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LITE-ON SINGAPORE PTE. LTD. |
Singapore |
|
SG |
|
|
Family ID: |
67393668 |
Appl. No.: |
16/707232 |
Filed: |
December 9, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
16117939 |
Aug 30, 2018 |
|
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16707232 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G01S 7/4813 20130101;
G01S 17/48 20130101; G01S 7/4816 20130101; G01S 17/04 20200101;
G01S 7/4814 20130101; H01L 31/16 20130101; G01S 7/4811
20130101 |
International
Class: |
H01L 31/16 20060101
H01L031/16; G01S 17/48 20060101 G01S017/48; G01S 7/481 20060101
G01S007/481; G01S 17/04 20060101 G01S017/04 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 31, 2018 |
CN |
201810095657.9 |
Claims
1. A manufacturing method of wafer level sensing module,
comprising: providing a chip substrate formed with a first receptor
and a second receptor, wherein the first receptor and the second
receptor are exposed from a top surface of the chip substrate;
disposing an emitter on the chip substrate; disposing a shielding
assembly on the top surface of the chip substrate; and disposing a
transparent shielding plate on the top surface of the chip
substrate and in positional correspondence with the second
receptor.
2. The manufacturing method according to claim 1, wherein the step
of providing the chip substrate further includes forming a
plurality of conductive vias or side connection wires for
electrical conduction.
3. The manufacturing method according to claim 1, wherein the step
of providing the chip substrate further includes forming the first
receptor and the second receptor together and embedding in the chip
substrate.
4. The manufacturing method according to claim 1, further
comprising a step: disposing a plurality metal bumps and a
redistribution circuit layer on a bottom surface of the chip
substrate.
5. The manufacturing method according to claim 1, further
comprising a step: forming a coating layer on a surface of the
transparent shielding plate for serving as a visible light filter
or a three-primary color filter.
6. The manufacturing method according to claim 1, wherein the
shielding assembly is formed on the top surface of the chip
substrate by injection molding or replica molding.
7. The manufacturing method according to claim 1, wherein the
shielding assembly includes a first shielding member and a second
shielding member, which is disposed between the emitter and the
first receptor.
8. The manufacturing method according to claim 7, wherein the
shielding assembly further includes a first lens, which is
connected between the first shielding member and the second
shielding member and corresponding in position to the emitter.
9. The manufacturing method according to claim 1, wherein the
shielding assembly includes a first shielding member, a second
shielding member, a third shielding member, a first lens, and a
second lens, the first lens corresponds in position to the emitter,
and the second lens corresponds in position to the first receptor;
wherein the first lens is connected between the first shielding
member and the second shielding member, and the emitter is arranged
in a first space defined by the first shielding member, the first
lens, the second shielding member, and the chip substrate, wherein
the second lens is connected between the second shielding member
and the third shielding member, and the first receptor is arranged
in a second space defined by the second shielding member, the
second lens, the third shielding member, and the chip
substrate.
10. The manufacturing method according to claim 9, wherein the
first shielding member, the second shielding member, and the third
shielding member are formed by an infrared shielding material, and
the first lens and the second lens are formed by a UV-cured
material.
11. A wafer level sensing module formed by the manufacturing method
according to claim 1, wherein a position of the first receptor is
lower than the position of the emitter.
12. The wafer level sensing module according to claim 11, wherein
the shielding assembly includes a first shielding member and a
second shielding member, and the emitter is arranged in a first
space defined by the first shielding member, the second shielding
member, and the chip substrate.
13. The wafer level sensing module according to claim 12, wherein
the shielding assembly further includes a third shielding member,
and the second shielding member, the chip substrate and the third
shielding member define a second space arranging the first
receptor.
14. The wafer level sensing module according to claim 13, wherein
the shielding assembly further includes: a first lens corresponding
in position to the emitter; and a second lens corresponding in
position to the first receptor.
15. An electronic device, comprising a wafer level sensing module
forming according to claim 11, wherein the wafer level sensing
module is disposed behind a display screen.
16. The electronic device according to claim 15, wherein the
display screen includes two holes, and one of the two holes is
corresponding in position to the emitter and one of the two holes
is corresponding in position to the first receptor and the second
receptor.
17. The electronic device according to claim 16, wherein the chip
substrate has a plurality of conductive vias or side connection
wires passing through thereof.
18. The electronic device according to claim 16, wherein the
shielding assembly includes a first shielding member, a second
shielding member, and the emitter is arranged in a first space
defined by the first shielding member, the second shielding member,
and the chip substrate.
19. The electronic device according to claim 18, wherein the
shielding assembly further includes a first lens connected between
the first shielding member and the second shielding member and
corresponding in position to the emitter.
20. The electronic device according to claim 19, wherein the
shielding assembly further includes: a third shielding member; and
a second lens corresponding in position to the first receptor and
connected between the second shielding member and the third
shielding member; wherein the first receptor is arranged in a
second space defined by the second shielding member, the second
lens, the third shielding member, and the chip substrate.
Description
CROSS-REFERENCE TO RELATED PATENT APPLICATION
[0001] This application is a continuation application of U.S.
application Ser. No. 16/117,939, filed on Aug. 30, 2018, and
entitled "WAFER LEVEL SENSING MODULE", the entire contents of which
are hereby incorporated by reference.
FIELD OF THE DISCLOSURE
[0002] The present disclosure relates to a sensing module and a
manufacturing method thereof, and more particularly to a wafer
level sensing module and a manufacturing method thereof.
BACKGROUND OF THE DISCLOSURE
[0003] With the development of technology, it is a general trend to
incorporate a touch control screen on a mobile device. There is a
need in the market to provide a proximity sensor in a mobile device
that can detect the user's head or face so as to turn off the touch
control screen when the mobile device is in use, thereby preventing
the touch control screen from being mistouched by the user and
interfering with an ongoing call.
[0004] With smart phones as an example, the conventional sensing
module used therein includes an emitter, a proximity receptor, and
an ambient light receptor. The proximity receptor and the ambient
light receptor are disposed in different chambers of a package
casing to avoid crosstalk effects. The emitter is disposed on a
circuit substrate and the two receptors are chips disposed on the
circuit substrate. The package casing has a plurality of holes that
respectively correspond in position to the emitter, the proximity
receptor, and the ambient light receptor.
[0005] However, in current designs, the bulk of the package casing
causes the proximity sensing module to occupy a large volume of
space inside the smart phone. To meet miniaturization requirements
of electronic devices, the proximity sensing module also needs to
be miniaturized. In addition, to achieve a better sensing effect,
the sensor is preferably designed to have a wide sensing angle.
However, the crosstalk effect in the sensing module generally
increases with the increase of the sensing angle. Moreover, the
sensing angle of the sensor would be restricted by the height and
the thickness of the package casing. Furthermore, current market
demands require that the mobile devices be designed with smaller
and a reduced number of visible holes. In conclusion, there is
still need in the art to provide a replacement solution to the
conventional sensing module.
SUMMARY OF THE DISCLOSURE
[0006] In response to the above-referenced technical inadequacies,
the present disclosure provides a wafer level sensing module and a
manufacturing method thereof. The wafer level sensing module,
compared to the conventional sensing module, has a smaller volume,
a wider ambient light sensing angle, a smaller size of the
proximity sensing hole, and a reduced crosstalk effect.
[0007] In one aspect, the present disclosure provides a
manufacturing method of wafer level sensing module, including:
providing a chip substrate formed with a first receptor and a
second receptor, wherein the first receptor and the second receptor
are exposed from a top surface of the chip substrate; disposing an
emitter on the chip substrate; disposing a shielding assembly on
the top surface of the chip substrate, wherein the shielding
assembly includes a first shielding member, a second shielding
member, a third shielding member, a first lens, and a second lens,
the first lens corresponds in position to the emitter, and the
second lens corresponds in position to the first receptor; and
disposing a transparent shielding plate on the top surface of the
chip substrate and in positional correspondence with the second
receptor. The first lens is connected between the first shielding
member and the second shielding member, and the emitter is arranged
in a first space defined by the first shielding member, the first
lens, the second shielding member, and the chip substrate, wherein
the second lens is connected between the second shielding member
and the third shielding member, and the first receptor is arranged
in a second space defined by the second shielding member, the
second lens, the third shielding member, and the chip substrate,
and wherein the first receptor is configured to receive signals
that are emitted from the emitter and reflected by an object.
[0008] One of the advantages of the instant disclosure is that the
light-projecting device can utilize the technical solution of "the
first receptor and the second receptor are exposed from a top
surface of the chip substrate" and "the shielding assembly includes
a first shielding member, a second shielding member, a third
shielding member, a first lens, and a second lens" to arrange the
emitter in a first space defined by the first shielding member, the
first lens, the second shielding member, and the chip substrate and
arrange the first receptor in a second space defined by the second
shielding member, the second lens, the third shielding member, and
the chip substrate.
[0009] These and other aspects of the present disclosure will
become apparent from the following description of the embodiment
taken in conjunction with the following drawings and their
captions, although variations and modifications therein may be
affected without departing from the spirit and scope of the novel
concepts of the disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The present disclosure will become more fully understood
from the detailed description and the accompanying drawings, in
which:
[0011] FIG. 1 is a side schematic view showing a wafer level
sensing module that is applied on an electronic device according to
an embodiment of the present disclosure.
[0012] FIG. 2 is a side schematic view showing the step S100 of a
manufacturing method of the wafer level sensing module according to
an embodiment of the present disclosure.
[0013] FIG. 3 is a side schematic view showing the step S102 of the
manufacturing method of the wafer level sensing module according to
an embodiment of the present disclosure.
[0014] FIG. 4 is a side schematic view showing the step S104 of the
manufacturing method of the wafer level sensing module according to
an embodiment of the present disclosure.
[0015] FIG. 5 is a side schematic view showing the step S106 of the
manufacturing method of the wafer level sensing module according to
an embodiment of the present disclosure.
[0016] FIG. 6 is a side schematic view showing the step S108 of the
manufacturing method of the wafer level sensing module according to
an embodiment of the present disclosure.
[0017] FIG. 7 is a flow diagram of the manufacturing method of the
wafer level sensing module according to an embodiment of the
present disclosure.
DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS
[0018] The present disclosure is more particularly described in the
following examples that are intended as illustrative only since
numerous modifications and variations therein will be apparent to
those skilled in the art. Like numbers in the drawings indicate
like components throughout the views. As used in the description
herein and throughout the claims that follow, unless the context
clearly dictates otherwise, the meaning of "a", "an", and "the"
includes plural reference, and the meaning of "in" includes "in"
and "on". Titles or subtitles can be used herein for the
convenience of a reader, which shall have no influence on the scope
of the present disclosure.
[0019] The terms used herein generally have their ordinary meanings
in the art. In the case of conflict, the present document,
including any definitions given herein, will prevail. The same
thing can be expressed in more than one way. Alternative language
and synonyms can be used for any term(s) discussed herein, and no
special significance is to be placed upon whether a term is
elaborated or discussed herein. A recital of one or more synonyms
does not exclude the use of other synonyms. The use of examples
anywhere in this specification including examples of any terms is
illustrative only, and in no way limits the scope and meaning of
the present disclosure or of any exemplified term. Likewise, the
present disclosure is not limited to various embodiments given
herein. Numbering terms such as "first", "second" or "third" can be
used to describe various components, signals or the like, which are
for distinguishing one component/signal from another one only, and
are not intended to, nor should be construed to impose any
substantive limitations on the components, signals or the like.
First Embodiment
[0020] Referring to FIG. 1, a side schematic view of a wafer level
sensing module of the embodiments of the present disclosure that is
applied on an electronic device is shown. The wafer level sensing
module Z is disposed behind a display screen P. The wafer level
sensing module Z as shown in FIG. 1 includes a chip substrate 1, a
proximity sensing unit 2, and an ambient light sensing unit 3. The
proximity sensing unit 2 is disposed on the chip substrate 1 and
includes an emitter 21, a first receptor 22, and a shielding
assembly 23. The shielding assembly 23 includes a first shielding
member 231, a second shielding member 232, a third shielding member
233, a first lens 234, and a second lens 235. The ambient light
sensing unit 3 is disposed on the chip substrate 1 and is separate
from the proximity sensing unit 2. The ambient light sensing unit 3
includes a second receptor 31 and a transparent shielding plate
32.
[0021] Specifically, with reference to FIG. 1, the first lens 234
is connected between the first shielding member 231 and the second
shielding member 232. The emitter 21 is arranged in a first space
R1 defined by the first shielding member 231, the first lens 234,
the second shielding member 232, and the chip substrate 1. The
first receptor 22 is connected between the second shielding member
232 and the third shielding member 233. The first receptor 22 is
arranged in a second space R2 defined by the second shielding
member 232, the second lens 235, the third shielding member 233,
and the chip substrate 1.
[0022] More specifically, the first lens 234 is connected between
the first shielding member 231 and the second shielding member 232,
such that the emitter 21 can be packaged on the chip substrate 1 by
a package cover formed by the first shielding member 231, the first
lens 234, and the second shielding member 232. Similarly, the
second lens 235 is connected between the second shielding member
232 and the third shielding member 233, such that the first
receptor 22 can be packaged on the chip substrate 1 by another
package cover formed by the second shielding member 232, the second
lens 235, and the third shielding member 233.
[0023] As mentioned above, the wafer level sensing module Z employs
a structure in which the lens is connected between the shielding
members, such that it does not need to use the conventional package
casing for package. The lenses and the shielding members can not
only shield the infrared light, reduce crosstalk, and condense
light, but can also form a package structure to package the emitter
21 and the first receptor 22 so as to spare the space occupied by
the package casing in the conventional package enclosure.
Therefore, the wafer level sensing module Z can have a reduced size
to meet the trends of lighter and thinner electronic devices.
[0024] In the related art, the sensing hole of the ambient light
sensing unit is formed on the package casing. However, the sensing
angle of the ambient light sensing unit defined by the sensing hole
would be limited by structural factors of the package casing such
as height and thickness. It should be noted that the wafer level
sensing module Z replaces the conventional package casing with the
aforesaid structure, such that the sensing angle of the second
receptor 31 of the ambient light sensing unit 3 can be increased so
as to increase the sensing efficiency.
[0025] Specifically, with reference to FIG. 1, the first receptor
22 and the second receptor 31 are formed on the chip substrate 1
and are exposed from a top surface 101 of the chip substrate 1. The
transparent shielding plate 32 corresponds in position to the
second receptor 31. More specifically, the first receptor 22 and
the second receptor 31 are formed together and embedded in the chip
substrate 1. As shown in FIG. 1, only top surfaces of the first
receptor 22 and the second receptor 31 are exposed from the top
surface 101 of the chip substrate 1. The transparent shielding
plate 32 covers the second receptor 31 along a direction
perpendicular to the chip substrate 1.
[0026] In the conventional sensor having proximity and ambient
light sensing functions, the proximity receptor and the ambient
light receptor are generally disposed on a chip and the chip is
disposed on a circuit board together with an LED emitter (i.e., an
emitter). However, in the conventional design, the receptor is
disposed at a position that is higher than the position of the LED
emitter, which would result in an increase of the crosstalk effect.
For reducing the crosstalk effect, the proximity receptor cannot be
overly near the LED emitter and must be spaced apart from the LED
emitter at a predetermined distance. The display screen must have
two holes that respectively correspond in position to the emitter
and the receptor, and the holes for increasing sensing efficiency
cannot be reduced in size.
[0027] In the wafer level sensing module Z, in which the emitter
21, the first receptor 22, and the second receptor 31 are all
disposed on the chip substrate 1 and the chip substrate 1 is formed
with the first receptor 22 and the second receptor 31, a circuit
board can be omitted such that the first receptor 22 can be
disposed at a position lower than the position of the emitter 21.
Accordingly, the wafer level sensing module Z can have a reduced
crosstalk effect. Compared with the conventional proximity sensor,
the first receptor 22 can be disposed as close as desired to the
emitter 21 so as to share a proximity sensing hole, thereby
enabling the wafer level sensing module Z of the present disclosure
to meet the market requirements of smaller and a reduced number of
holes.
[0028] In the present embodiment, a coating layer is formed on a
surface of the transparent shielding plate 32 of the ambient light
sensing unit 3 to serve as a visible light filter or a
three-primary color filter. Specifically, the transparent shielding
plate 32 not only serves as a visible light filter or a
three-primary color filter, but also serves as a cover structure of
the second receptor 31 that corresponds in function to the
shielding assembly 23 of the proximity sensing unit 2. Therefore,
the wafer level sensing module Z can omit the conventional package
casing so that the ambient light sensing unit 3 of the present
disclosure, compared with that of the conventional configuration,
has an increased ambient light sensing angle.
[0029] More specifically, with reference to FIG. 1, the wafer level
sensing module Z further includes a plurality metal bumps 4 and a
redistribution circuit layer (not shown), and the redistribution
circuit layer is formed on a bottom surface 102 of the chip
substrate 1. The wafer level sensing module Z, in which the metal
bumps 4 and the redistribution circuit layer are disposed in place
of the conventional PCB, can be connected to an external substrate
by the metal bumps 4. Accordingly, the proximity sensing unit 2,
the ambient light sensing unit 3, and the emitter 21 can be
directly formed on the chip substrate 1 so as to reduce the volume
of the sensing module.
[0030] Referring to FIGS. 2 to 7, the following will describe the
manufacturing method of the wafer level sensing module Z. In the
embodiments of the present disclosure, the manufacturing method
includes a step S100 of providing a chip substrate 1 formed with a
first receptor 22, a second receptor 31, and a plurality of
conductive vias 11, wherein the first receptor 22 and the second
receptor 31 are exposed from a top surface 101 of the chip
substrate 1 and the conductive vias 11 passes through the chip
substrate 1. In the present disclosure, the first receptor 22, the
second receptor 31, and the conductive vias 11 are formed in the
chip substrate 1.
[0031] It should be noted that, in other embodiments, the chip
substrate 1, provided with side connection wires for electrical
conduction, can be formed without conductive vias 11. More
specifically, in other embodiments, the step S100 can be providing
a prefabricated chip including a chip substrate 1, a first receptor
22 formed on the chip substrate 1, and a second receptor 31 formed
on the chip substrate 1.
[0032] As shown in FIGS. 3 and 4, in the embodiments of the present
disclosure, the manufacturing method of the wafer level sensing
module Z further includes a step S102 of disposing an emitter 21 on
the chip substrate 1 and a step S104 of disposing a shielding
assembly 23 on the top surface 101 of the chip substrate 1. The
shielding assembly 23 includes a first shielding member 231, a
second shielding member 232, a third shielding member 233, a first
lens 234, and a second lens 235, wherein the first lens 234
corresponds in position to the emitter 21 and the second lens 235
corresponds in position to the first receptor 22.
[0033] More specifically, in the embodiments of the present
disclosure, the emitter 21 is disposed on the chip substrate 1 by
flip-chip bonding, but is not limited thereto. Furthermore, the
shielding assembly 23 is formed on the chip substrate 1 by
injection molding or replica molding. The first shielding member
231, the second shielding member 232, and the third shielding
member 233 are formed by an infrared shielding material. The first
lens 234 and the second lens 235 are formed by a UV-cured material,
and the first lens 234 is connected between the first shielding
member 231 and the second shielding member 232, and the second lens
235 is connected between the second shielding member 232 and the
third shielding member 233.
[0034] It should be noted that, the present disclosure is not
limited to the above description. In other embodiments, the
shielding assembly 23 can be a single shielding assembly and
disposed between the emitter 21 and the first receptor 22 to block
a crosstalk between the emitter 21 and the first receptor 22, so
that the first receptor 22 receives signals that are emitted from
the emitter 21 and reflected by an object.
[0035] By the aforesaid method, the emitter 21 is arranged in a
first space R1 defined by the first shielding member 231, the first
lens 234, the second shielding member 235, and the chip substrate
1. The first receptor 22 is arranged in a second space R2 defined
by the second shielding member 232, the second lens 235, the third
shielding member 233, and the chip substrate 1. The first receptor
22 is configured to receive signals that are emitted from the
emitter 21 and reflected by the object. The first lens 234 and the
second lens 235 are configured to increase the concentration of the
signals. The present disclosure uses such structural configuration
in place of the conventional package enclosure, so that the first
receptor 22 can be disposed at a position that is lower than the
position of the emitter 21 to reduce the crosstalk effect.
Furthermore, the spacing between the emitter 21 and the first
receptor 22 can be reduced, and the hole corresponding in position
to the proximity sensing unit 2 can also be reduced in size.
[0036] As shown in FIG. 5, in the embodiments of the present
disclosure, the manufacturing method of the wafer level sensing
module Z further includes a step S106 of disposing a transparent
shielding plate 32 on the top surface 101 of the chip substrate 1
and in positional correspondence with the second receptor 31. The
transparent shielding plate 32 also serves as a cover structure of
the second receptor 31 that corresponds in function to the
shielding assembly 23 packaging the emitter 21 and the first
receptor 31. Furthermore, in the present embodiment, the
transparent shielding plate 32 is formed with a coating layer (not
shown) for serving as a visible light filter or a three-primary
color filter, such that the ambient light sensing unit 3 can serve
as a visible sensor or a three-primary color light sensor.
[0037] As shown in FIG. 6, in the embodiments of the present
disclosure, the manufacturing method of the wafer level sensing
module Z further includes a step S108 of disposing a plurality
metal bumps 4 and a redistribution circuit layer on a bottom
surface 102 of the chip substrate 1. Therefore, the wafer level
sensing module Z can utilize the conductive vias 11, the metal
bumps 4, and the redistribution circuit layer (not shown) in place
of the conventional PCB, and use the lenses, the transparent
shielding plate, and etc., in place of the conventional package
enclosure, so as to have a wafer level size.
[0038] Based on the above disclosure, the wafer level sensing
module Z uses a specific structural configuration in place of the
conventional package enclosure, so that it can has a reduced volume
compared to the conventional one. In the structural configuration,
the first lens 234 is connected between the first shielding member
231 and the second shielding member 232, the second lens 235 is
connected between the second shielding member 232 and the third
shielding member 233, and the transparent shielding plate 32 is
disposed on the chip substrate 1 and corresponds in position to the
second receptor 31. Furthermore, through the structural
configuration, the second receptor 31 of the ambient light sensing
unit 3 can have an increased sensing angle compared with the
sensing angle that is restricted by the hole of the conventional
package casing. In addition, the chip substrate 1 is formed with
the first receptor 22 and the second receptor 31, such that the
crosstalk effect of the proximity sensing unit 2 can be reduced. On
the other hand, the emitter 21 and the first receptor 22 can have a
reduced distance therebetween to share a hole formed on a display
screen, so as to meet the market requirements of smaller and a
reduced number of holes of the display screen.
[0039] One of the advantages of the instant disclosure is that the
light-projecting device can utilize the technical solution of "the
first receptor and the second receptor are exposed from a top
surface of the chip substrate" and "the shielding assembly includes
a first shielding member, a second shielding member, a third
shielding member, a first lens, and a second lens" to arrange the
emitter in a first space defined by the first shielding member, the
first lens, the second shielding member, and the chip substrate and
arrange the first receptor in a second space defined by the second
shielding member, the second lens, the third shielding member, and
the chip substrate.
[0040] The foregoing description of the exemplary embodiments of
the disclosure has been presented only for the purposes of
illustration and description and is not intended to be exhaustive
or to limit the disclosure to the precise forms disclosed. Many
modifications and variations are possible in light of the above
teaching.
[0041] The embodiments were chosen and described in order to
explain the principles of the disclosure and their practical
application so as to enable others skilled in the art to utilize
the disclosure and various embodiments and with various
modifications as are suited to the particular use contemplated.
Alternative embodiments will become apparent to those skilled in
the art to which the present disclosure pertains without departing
from its spirit and scope.
* * * * *