loadpatents
name:-0.0075769424438477
name:-0.0047061443328857
name:-0.0090680122375488
Goh; Teck-Chai Patent Filings

Goh; Teck-Chai

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goh; Teck-Chai.The latest application filed is for "optical sensor package and manufacturing method for the same".

Company Profile
7.10.13
  • Goh; Teck-Chai - Singapore SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Optical sensor package and manufacturing method for the same
Grant 11,437,539 - Huang , et al. September 6, 2
2022-09-06
Optical Sensor Package And Manufacturing Method For The Same
App 20220102576 - HUANG; CHIEN-HSIU ;   et al.
2022-03-31
Optical Sensing Apparatus
App 20220099571 - GOH; TECK-CHAI ;   et al.
2022-03-31
Proximity Sensor And Electronic Device Having The Same
App 20220043123 - ZHENG; RUI -TAO ;   et al.
2022-02-10
Manufacturing method of an optical module
Grant 11,049,991 - Nijaguna , et al. June 29, 2
2021-06-29
Manufacturing Method Of An Optical Module
App 20210074874 - Nijaguna; Suresh Basoor ;   et al.
2021-03-11
Infrared Proximity Sensor
App 20200150270 - GOH; TECK-CHAI ;   et al.
2020-05-14
Wafer Level Sensing Module, Manufacturing Method Thereof And Electronic Device Using The Same
App 20200111931 - GOH; TECK-CHAI ;   et al.
2020-04-09
Wafer level sensing module
Grant 10,608,135 - Goh , et al.
2020-03-31
Wafer Level Sensing Module And Manufacturing Method Thereof
App 20190237612 - GOH; TECK-CHAI ;   et al.
2019-08-01
Proximity sensor and mobile device using the same
Grant 10,107,911 - Goh , et al. October 23, 2
2018-10-23
Detection device and method of manufacturing the same
Grant 9,704,837 - Goh , et al. July 11, 2
2017-07-11
Method Of Manufacturing Proximity Sensor
App 20140223734 - SONG; GUANG-LI ;   et al.
2014-08-14
Method for manufacturing sensor unit
Grant 8,677,605 - Lim , et al. March 25, 2
2014-03-25
Integrated sensing package structure
Grant 8,587,103 - Wang , et al. November 19, 2
2013-11-19
Integrated Sensing Package Structure
App 20130105822 - WANG; YOU-FA ;   et al.
2013-05-02
Method For Manufacturing Sensor Unit
App 20130019459 - LIM; SIN-HENG ;   et al.
2013-01-24
Optical transceiver with reduced height
Grant 7,842,957 - Goh , et al. November 30, 2
2010-11-30
Optical Transceiver with Reduced Height
App 20080219673 - Goh; Teck Chai ;   et al.
2008-09-11

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