U.S. patent application number 16/511407 was filed with the patent office on 2020-04-02 for substrate separation system and method.
The applicant listed for this patent is PRINCO CORP.. Invention is credited to CHUN-HSIUNG CHOU, CHIN-HUANG HUANG, CHIH-KUANG YANG.
Application Number | 20200105716 16/511407 |
Document ID | / |
Family ID | 69946590 |
Filed Date | 2020-04-02 |
![](/patent/app/20200105716/US20200105716A1-20200402-D00000.png)
![](/patent/app/20200105716/US20200105716A1-20200402-D00001.png)
![](/patent/app/20200105716/US20200105716A1-20200402-D00002.png)
![](/patent/app/20200105716/US20200105716A1-20200402-D00003.png)
![](/patent/app/20200105716/US20200105716A1-20200402-D00004.png)
United States Patent
Application |
20200105716 |
Kind Code |
A1 |
CHOU; CHUN-HSIUNG ; et
al. |
April 2, 2020 |
SUBSTRATE SEPARATION SYSTEM AND METHOD
Abstract
A substrate separation system configured to remove a substrate
from a carrier is provided. The substrate separation system
includes a stage, an upper fixing portion, a suction portion, a
cutting portion and a blowing portion. The stage is configured to
carry the carrier. The upper fixing portion is disposed above the
stage so as to be movable up and down. The suction portion is
disposed above the stage so as to be movable up and down, and has a
hollow portion to accommodate the upper fixing portion. The cutting
portion is disposed on one side of the stage. The blowing portion
is disposed on another side of the stage, and is configured to
provide a blowing force to a position between the substrate and the
carrier.
Inventors: |
CHOU; CHUN-HSIUNG; (HSINCHU,
TW) ; HUANG; CHIN-HUANG; (HSINCHU, TW) ; YANG;
CHIH-KUANG; (HSINCHU, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
PRINCO CORP. |
Hsinchu |
|
TW |
|
|
Family ID: |
69946590 |
Appl. No.: |
16/511407 |
Filed: |
July 15, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
Y10T 156/1132 20150115;
H01L 2221/68386 20130101; H01L 21/6838 20130101; Y10S 156/941
20130101; Y10T 156/1184 20150115; B32B 43/006 20130101; Y10T
156/1939 20150115; Y10T 156/1978 20150115; Y10S 156/93 20130101;
Y10T 156/1137 20150115; Y10T 156/1967 20150115; H01L 21/6835
20130101; H01L 24/98 20130101; Y10T 156/1944 20150115; H01L 24/799
20130101; H01L 2221/68381 20130101; H01L 21/67092 20130101 |
International
Class: |
H01L 23/00 20060101
H01L023/00; H01L 21/683 20060101 H01L021/683 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 1, 2018 |
TW |
107134709 |
Claims
1. A substrate separation system configured to remove a substrate
from a carrier comprising: a stage configured to carry the carrier;
an upper fixing portion disposed above the stage so as to be
movable up and down; a suction portion disposed above the stage so
as to be movable up and down, the suction portion having a hollow
portion to accommodate the upper fixing portion; a cutting portion
disposed on one side of the stage; and a blowing portion disposed
on another side of the stage, and being configured to provide a
blowing force to a position between the substrate and the
carrier.
2. The substrate separation system as claimed in claim 1, further
comprising a lower fixing portion, wherein the lower fixing portion
is connected to an underside of the stage, and is configured to
provide a suction force to the carrier.
3. The substrate separation system as claimed in claim 2, wherein
the lower fixing portion is a vacuum suction device.
4. The substrate separation system as claimed in claim 1, wherein
the upper fixing portion is configured to fix the carrier and the
substrate on the carrier to the stage.
5. The substrate separation system as claimed in claim 1, wherein
the suction portion comprises a plurality of suction cups for
sucking the substrate.
6. A substrate separation method configured to be used in a
substrate separation system, the substrate separation system being
configured to remove a substrate from a carrier, the substrate
separation system comprising a stage, an upper fixing portion, a
suction portion, a cutting portion and a blowing portion, the upper
fixing portion being disposed above the stage so as to be movable
up and down, the suction portion being disposed above the stage so
as to be movable up and down, and having a hollow portion to
accommodate the upper fixing portion, the suction portion having a
hollow portion, the cutting portion being disposed on one side of
the stage, the blowing portion being disposed on another side of
the stage, the substrate separation method comprising: placing the
carrier and the substrate located on the carrier on the stage;
moving the upper fixing portion downwards to fix the substrate and
the carrier to the stage; utilizing the cutting portion to cut an
edge of the substrate; moving the suction portion downwards to suck
a periphery of an upper surface of the substrate; moving the
suction portion upwards to lift the periphery of the upper surface
of the substrate; providing a blowing force to a position between
the substrate and the carrier by the blowing portion; and moving
the upper fixing portion and the suction portion upwards to remove
the substrate from the carrier.
7. The substrate separation method as claimed in claim 6, wherein
the substrate separation system further comprises a lower fixing
portion connected to an underside of the stage, the substrate
separation method further comprises the following step after the
step of moving the upper fixing portion downwards to fix the
substrate and the carrier to the stage: providing a suction force
to the carrier by the lower fixing portion.
8. The substrate separation method as claimed in claim 6, wherein
an intermediate portion of the upper surface of the substrate is
fixed by the upper fixing portion in the step of moving the suction
portion upwards to lift the periphery of the upper surface of the
substrate.
9. The substrate separation method as claimed in claim 6, wherein a
height at which the substrate is lifted up is from 1 cm to 1.5 cm
in the step of moving the suction portion upwards to lift the
periphery of the upper surface of the substrate.
10. The substrate separation method as claimed in claim 6, wherein
the suction portion comprises a plurality of suction cups for
sucking the substrate.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to Taiwanese Application
No. 107134709, filed on Oct. 1, 2018. The entire disclosure of the
above application is incorporated herein by reference.
BACKGROUND
1. Field of the Invention
[0002] The present disclosure relates to the field of substrate,
more particularly, to a substrate separation system and a
method.
2. Description of the Related Art
[0003] A substrate can be used for manufacturing a package
substrate, a printed circuit board, a flexible package substrate,
and a flexible circuit board, etc. Integration into high-density
systems is an inevitable trend in the miniaturization of today's
electronic products, especially the utilization of flexible
substrates to fabricate flexible package structures. They can be
more effectively applied to various products to satisfy with the
needs of miniaturization.
[0004] When the substrate is manufactured, the substrate is first
fixed to a carrier, then circuits are formed on the substrate, and
a polyimide (PI) thin film is coated on the surface of the
substrate. The PI thin film is used as a protective layer. After
that, the substrate needs to be removed from the carrier, and a via
process and subsequent processes are performed on the
substrate.
[0005] In the related art, the substrate is removed from the
carrier manually or by using a laser method. Manually removing the
substrate from the carrier is inefficient. When a laser method is
used to remove the substrate from the carrier, the machine cost is
high.
[0006] Therefore, there is a need to provide a substrate separation
system and a method so as to resolve the problems that occur when
the substrate is removed from the carrier in the related art.
SUMMARY
[0007] One objective of the present disclosure is to provide a
substrate separation system and a method, which can resolve the
problems that occur when the substrate is removed from the carrier
in the related art.
[0008] The present disclosure provides a substrate separation
system configured to remove a substrate from a carrier. The
substrate separation system comprises a stage, an upper fixing
portion, a suction portion, a cutting portion and a blowing
portion. The stage is configured to carry the carrier. The upper
fixing portion is disposed above the stage so as to be movable up
and down. The suction portion is disposed above the stage so as to
be movable up and down, and has a hollow portion to accommodate the
upper fixing portion. The cutting portion is disposed on one side
of the stage. The blowing portion is disposed on another side of
the stage, and is configured to provide a blowing force to a
position between the substrate and the carrier.
[0009] The present disclosure further provides a substrate
separation method configured to be used in a substrate separation
system. The substrate separation system is configured to remove a
substrate from a carrier. The substrate separation system comprises
a stage, an upper fixing portion, a suction portion, a cutting
portion and a blowing portion. The upper fixing portion is disposed
above the stage so as to be movable up and down. The suction
portion is disposed above the stage so as to be movable up and
down, and has a hollow portion to accommodate the upper fixing
portion. The suction portion having a hollow portion. The cutting
portion is disposed on one side of the stage. The blowing portion
is disposed on another side of the stage. The substrate separation
method comprises: placing the carrier and the substrate located on
the carrier on the stage; moving the upper fixing portion downwards
to fix the substrate and the carrier to the stage; utilizing the
cutting portion to cut an edge of the substrate; moving the suction
portion downwards to suck a periphery of an upper surface of the
substrate; moving the suction portion upwards to lift the periphery
of the upper surface of the substrate; providing a blowing force to
a position between the substrate and the carrier by the blowing
portion; and moving the upper fixing portion and the suction
portion upwards to remove the substrate from the carrier.
[0010] The substrate separation system and the method according to
the present disclosure can automatically separate the substrate
from the carrier by means of blowing, and have the advantages of
high efficiency, not being easy to damage the substrate, and low
cost.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention.
[0012] FIG. 1 shows a substrate separation system according to one
embodiment of the present disclosure.
[0013] FIG. 2 shows a side view of the substrate separation
system.
[0014] FIG. 3A to FIG. 3F show a substrate separation method
according to one embodiment of the present disclosure.
DESCRIPTION OF THE EMBODIMENTS
[0015] In the description of this specification, the description of
the terms "one embodiment", "some embodiments", "examples",
"specific examples", or "some examples", and the like, means to
refer to the specific feature, structure, material or
characteristic described in connection with the embodiments or
examples being included in at least one embodiment or example of
the present disclosure. In the present specification, the term of
the above schematic representation is not necessary for the same
embodiment or example. Furthermore, the specific feature,
structure, material, or characteristic described may be in
combination in a suitable manner in any one or more of the
embodiments or examples. In addition, it will be apparent to those
skilled in the art that different embodiments or examples described
in this specification, as well as features of different embodiments
or examples, may be combined without contradictory
circumstances.
[0016] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
the invention. As used herein, the singular forms "a", "said" and
"the" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. It will be understood that the
term "and/or," when used in this specification, specify one or more
associated elements, alone or in combination, are provided. It will
be further understood that the terms "first," "second," "third,"
and "fourth," when used in this specification, claim and drawings,
are used to distinguish different objects, rather than to describe
a specific order. It will be further understood that the terms
"comprises" and/or "comprising," when used in this specification,
specify the presence of stated features, products, steps,
operations, elements, and/or components, but do not preclude the
presence or addition of one or more other features, products,
steps, operations, elements, components, and/or groups thereof.
[0017] A description is provided with reference to FIG. 1 and FIG.
2. FIG. 1 shows a substrate separation system according to one
embodiment of the present disclosure. FIG. 2 shows a side view of
the substrate separation system.
[0018] The substrate separation system according to the present
disclosure is configured to remove a substrate 10 from a carrier
20.
[0019] The substrate 10 comprises a plurality of circuit layers
formed thereon. The circuit layers comprise at least one metal
layer and at least one dielectric layer that are alternately
formed. The at least one metal layer comprises a surface metal
layer and at least one inner metal layer.
[0020] The substrate separation system comprises a stage 30, an
upper fixing portion 32, a suction portion 34, a cutting portion
36, and a blowing portion 38.
[0021] The stage 30 is configured to carry the carrier 20. The
stage 30 is rotatable.
[0022] In a preferred embodiment, the substrate separation system
further comprises a lower fixing portion 40. The lower fixing
portion 40 is connected to an underside of the stage 30 and is
configured to provide a suction force to the carrier 20 so as to
enhance the fixing of the carrier 20. The lower fixing portion 40
may be a vacuum suction device, and the lower fixing portion 40 is
rotatable.
[0023] The upper fixing portion 32 is disposed above the stage 30
so as to be movable up and down. The upper fixing portion 32 is
configured to fix the carrier 20 and the substrate 10 on the
carrier 20 to the stage 30.
[0024] The suction portion 34 is disposed above the stage 30 so as
to be movable up and down. The suction portion 34 has a hollow
portion 340 to accommodate the upper fixing portion 32. The suction
portion 34 comprises a plurality of suction cups 342 for sucking
the substrate 10.
[0025] The cutting portion 36 is disposed on one side of the stage
30. As mentioned previously, after circuits are formed on the
substrate 10, a PI thin film is coated on a surface of the
substrate 10 that has the circuits. However, the PI thin film is
formed on the surface and a side of the substrate 10. The PI thin
film formed on the side of the substrate 10 needs to be removed.
The cutting portion 36 is configured to remove the PI thin film
formed on the side of the substrate 10. Hence, the cutting portion
36 needs to be disposed on the side of the stage 30 and located at
a position where the side of the substrate 10 can be cut.
[0026] The blowing portion 38 is disposed on another side of the
stage 30, and is configured to provide a blowing force to a
position between the substrate 10 and the carrier 20. Hence, the
blowing portion 38 needs to be disposed on the another side of the
stage 30, and a height of the blowing portion 38 is between the
substrate 10 and the carrier 20.
[0027] The side on which the cutting portion 36 is disposed and the
another side on which the blowing portion 38 is disposed may be the
same side or different sides.
[0028] A description is provided with reference to FIG. 3A to FIG.
3F. FIG. 3A to FIG. 3F show a substrate separation method according
to one embodiment of the present disclosure. The substrate
separation method is configured to be used in the substrate
separation system shown in FIG. 1 and FIG. 2.
[0029] The substrate separation system comprises the stage 30, the
upper fixing portion 32, the suction portion 34, the cutting
portion 36, the blowing portion 38 and the lower fixing portion
40.
[0030] The upper fixing portion 32 is disposed above the stage 30
so as to be movable up and down. The suction portion 34 is disposed
above the stage 30 so as to be movable up and down and has a hollow
portion 340 to accommodate the upper fixing portion 32. The cutting
portion 36 is disposed on one side of the stage 30. The blowing
portion 38 is disposed on another side of the stage 30.
[0031] In FIG. 3A, the carrier 20 and the substrate 10 located on
the carrier are placed on the stage 30.
[0032] In FIG. 3B, the upper fixing portion 32 is moved downwards
to fix the substrate 10 and the carrier 20 to the stage 30. The
cutting portion 36 is utilized to cut an edge of the substrate 10
so as to remove a PI thin film formed at the edge of the substrate
10. In one embodiment, the lower fixing portion 40 rotates to drive
the stage 30, the carrier 20 and the substrate 10 to rotate. Then,
the edge of the substrate 10 is cut by the cutting portion 36 to
remove the PI thin film at the edge of the substrate 10.
[0033] In a preferred embodiment, the substrate separation system
further comprises the lower fixing portion 40 connected to an
underside of the stage 30. After the step of moving the upper
fixing portion 32 downwards to fix the substrate 10 and the carrier
20 to the stage 30, the substrate separation method further
comprises: The lower fixing portion 40 provides an suction force to
the carrier 20 so as to enhance the fixing of the carrier 20.
[0034] In FIG. 3C, the suction portion 34 is moved downwards to
suck a periphery of an upper surface of the substrate 10.
[0035] In FIG. 3D, the suction portion 34 is moved upwards to lift
the periphery of the upper surface of the substrate 10.
[0036] Since the suction portion 34 sucks only the periphery of the
upper surface of the substrate 10, only the periphery of the upper
surface of the substrate 10 is lifted, and an intermediate portion
of the upper surface of the substrate 10 is still fixed by the
upper fixing portion 32.
[0037] In a preferred embodiment, a height at which the substrate
10 is lifted up (that is, a distance between the substrate 10 and
the carrier 20) is from 1 centimeter (cm) to 1.5 cm.
[0038] In FIG. 3E, the blowing portion 38 provides a blowing force
to a position between the substrate 10 and the carrier 20 so as to
increase the distance between the substrate 10 and the carrier
20.
[0039] In FIG. 3F, the upper fixing portion 32 and the suction
portion 34 are moved upwards to remove the substrate 10 from the
carrier 20.
[0040] The substrate separation system and the method according to
the present disclosure can automatically separate the substrate
from the carrier by means of blowing, and have the advantages of
high efficiency, not being easy to damage the substrate, and low
cost.
[0041] The present disclosure is described in detail in accordance
with the above contents with the specific preferred examples.
However, this present disclosure is not limited to the specific
examples. For the ordinary technical personnel of the technical
field of the present disclosure, on the premise of keeping the
conception of the present disclosure, the technical personnel can
also make simple deductions or replacements, and all of which
should be considered to belong to the protection scope of the
present disclosure.
* * * * *