loadpatents
name:-0.28777098655701
name:-0.040988922119141
name:-0.006742000579834
Yang; Chih-kuang Patent Filings

Yang; Chih-kuang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Chih-kuang.The latest application filed is for "substrate separation system and method".

Company Profile
5.36.49
  • Yang; Chih-kuang - Hsinchu TW
  • Yang; Chih-Kuang - Hsin-Chu TW
  • YANG; CHIH-KUANG - Hsinchu City TW
  • Yang; Chih-kuang - Hsin-Chu City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Probe card device
Grant 11,221,351 - Yang , et al. January 11, 2
2022-01-11
Substrate separation system and method
Grant 10,622,332 - Chou , et al.
2020-04-14
Probe Card Device
App 20200103441 - YANG; CHIH-KUANG ;   et al.
2020-04-02
Substrate Separation System And Method
App 20200105716 - CHOU; CHUN-HSIUNG ;   et al.
2020-04-02
Array of point light sources contained within segmented reflective partitions
Grant 10,534,219 - Lee , et al. Ja
2020-01-14
Probe card device
Grant 10,451,654 - Yang , et al. Oc
2019-10-22
Light Source Module
App 20190004371 - Lee; Yu-Ching ;   et al.
2019-01-03
Probe Card Device
App 20170343582 - YANG; Chih-kuang ;   et al.
2017-11-30
Device For Integrating Position, Attitude, And Wireless Transmission
App 20170060268 - Chiu; Chen-Ping ;   et al.
2017-03-02
Time adjusting method and system for wristwatch
Grant 9,501,153 - Yang November 22, 2
2016-11-22
Manufacturing method of metal structure of flexible multi-layer substrate
Grant 9,398,704 - Yang July 19, 2
2016-07-19
Electrical system and core module thereof
Grant 9,379,089 - Yang , et al. June 28, 2
2016-06-28
Chip thermal dissipation structure
Grant 9,362,199 - Yang June 7, 2
2016-06-07
Method For Manufacturing Three-dimensional Integrated Circuit
App 20160126110 - YANG; Chih-kuang
2016-05-05
Wristwatch Structure With Physical Hands And Method For Offering Communication Function To Wristwatch
App 20160091864 - Yang; Chih-Kuang ;   et al.
2016-03-31
Wristwatch structure, electronic core for wristwatch, and method for manufacturing wristwatch
Grant 9,256,209 - Yang , et al. February 9, 2
2016-02-09
Wristwatch structure, electronic crown for wristwatch, and wristwatch having display
Grant 9,223,296 - Yang , et al. December 29, 2
2015-12-29
Barrier Structure
App 20150361249 - LIU; Ta-Jo ;   et al.
2015-12-17
Barrier Structure
App 20150360447 - LIU; Ta-Jo ;   et al.
2015-12-17
Timepiece And Power Saving Method Thereof
App 20150323906 - YANG; Chih-kuang ;   et al.
2015-11-12
Testing device and testing method thereof
Grant 9,182,443 - Shaue , et al. November 10, 2
2015-11-10
Chip Thermal Dissipation Structure
App 20150243577 - YANG; Chih-kuang
2015-08-27
Chip thermal dissipation structure
Grant 9,117,792 - Yang August 25, 2
2015-08-25
Via structure in multi-layer substrate
Grant 9,107,315 - Yang August 11, 2
2015-08-11
Time Adjusting Method And System For Wristwatch
App 20150205361 - YANG; Chih-kuang
2015-07-23
Wristwatch Structure, Electronic Crown For Wristwatch, And Wristwatch Having Display
App 20140328147 - YANG; Chih-kuang ;   et al.
2014-11-06
Wristwatch Structure, Electronic Core For Wristwatch, And Method For Manufacturing Wristwatch
App 20140328148 - YANG; Chih-Kuang ;   et al.
2014-11-06
Electrical System And Core Module Thereof
App 20140312490 - YANG; Chih-kuang ;   et al.
2014-10-23
Manufacturing method of metal structure in multi-layer substrate
Grant 8,815,333 - Yang August 26, 2
2014-08-26
Testing Device And Testing Method Thereof
App 20140167803 - SHAUE; Gan-how ;   et al.
2014-06-19
Chip Thermal Dissipation Structure
App 20140167244 - YANG; Chih-kuang
2014-06-19
Package Structure And Package Method
App 20140167255 - SHAUE; Gan-how ;   et al.
2014-06-19
Multi-layer via structure
Grant 8,405,223 - Yang March 26, 2
2013-03-26
Metal structure of flexible multi-layer substrate and manufacturing method thereof
Grant 8,373,070 - Yang February 12, 2
2013-02-12
Manufacturing Method Of Metal Structure Of Flexible Multi-layer Substrate
App 20120270158 - YANG; CHIH-KUANG
2012-10-25
Surface finish structure of multi-layer substrate and manufacturing method thereof
Grant 8,294,039 - Yang , et al. October 23, 2
2012-10-23
Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure
Grant 8,288,246 - Yang October 16, 2
2012-10-16
Multi-layer substrate and manufacturing method thereof
Grant 8,278,562 - Yang , et al. October 2, 2
2012-10-02
Method of manufacturing a multi-layer substrate
Grant 8,266,797 - Yang , et al. September 18, 2
2012-09-18
Manufacturing Method Of Metal Structure In Multi-layer Substrate
App 20120202159 - Yang; Chih-kuang
2012-08-09
Via Structure In Multi-layer Substrate And Manufacturing Method Thereof
App 20120107745 - YANG; CHIH-KUANG
2012-05-03
Hybrid structure of multi-layer substrates and manufacture method thereof
Grant 8,111,519 - Yang February 7, 2
2012-02-07
Multi-layer Via Structure
App 20120007254 - YANG; Chih-kuang
2012-01-12
Substrate with multi-layer interconnection structure and method of manufacturing the same
Grant 8,051,557 - Yang November 8, 2
2011-11-08
Hybrid structure of multi-layer substrates and manufacture method thereof
Grant 8,023,282 - Yang September 20, 2
2011-09-20
Hybrid structure of multi-layer substrates and manufacture method thereof
Grant 8,014,164 - Yang September 6, 2
2011-09-06
Method To Decrease Warpage Of A Multi-layer Substrate And Structure Thereof
App 20110212257 - Yang; Chih-kuang
2011-09-01
Method To Decrease Warpage Of A Multi-layer Substrate And Structure Thereof
App 20110212307 - Yang; Chih-kuang
2011-09-01
Multi-layer Substrate And Manufacturing Method Thereof
App 20110198782 - Yang; Chih-Kuang ;   et al.
2011-08-18
Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure
Grant 7,993,973 - Yang August 9, 2
2011-08-09
Structure Combining An Ic Integrated Substrate And A Carrier, And Method Of Manufacturing Such Structure
App 20110129964 - Yang; Chih-kuang
2011-06-02
Hybrid Structure Of Multi-layer Substrates And Manufacture Method Thereof
App 20110124154 - Yang; Chih-kuang
2011-05-26
Hybrid Structure Of Multi-layer Substrates And Manufacture Method Thereof
App 20110124155 - Yang; Chih-kuang
2011-05-26
Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof
Grant 7,948,079 - Yang May 24, 2
2011-05-24
Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure
Grant 7,947,573 - Yang May 24, 2
2011-05-24
Manufacturing method of metal structure in multi-layer substrate and structure thereof
Grant 7,931,973 - Yang April 26, 2
2011-04-26
Metal Structure Of Flexible Multi-layer Substrate And Manufacturing Method Thereof
App 20110088929 - YANG; CHIH-KUANG
2011-04-21
Via Structure In Multi-layer Substrate And Manufacturing Method Thereof
App 20100108363 - Yang; Chih-kuang
2010-05-06
Method To Decrease Warpage Of Multi-layer Substrate And Structure Thereof
App 20100104889 - Yang; Chih-kuang
2010-04-29
Method of manufacturing hybrid structure of multi-layer substrates
Grant 7,687,312 - Yang March 30, 2
2010-03-30
Optical Carriage Structure of Inspection Apparatus and its Inspection Method
App 20100027869 - Wu; Chin-Lai ;   et al.
2010-02-04
Multi-layer substrate and manufacture method thereof
Grant 7,656,679 - Yang February 2, 2
2010-02-02
Manufacturing Method Of Metal Structure In Multi-layer Substrate And Structure Thereof
App 20090321115 - Yang; Chih-kuang
2009-12-31
Method Of Manufacturing Hybrid Structure Of Multi-layer Substrates And Hybrid Structure Thereof
App 20090314524 - Yang; Chih-kuang
2009-12-24
Method To Decrease Warpage Of Multi-layer Substrate And Structure Thereof
App 20090208712 - Yang; Chih-kuang
2009-08-20
Multi-layer Substrate And Manufacture Method Thereof
App 20090181496 - Yang; Chih-kuang
2009-07-16
Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure
Grant 7,545,042 - Yang June 9, 2
2009-06-09
Structure Combining An Ic Integrated Substrate And A Carrier, And Method Of Manufacturing Such Structure
App 20090061565 - Yang; Chih-kuang
2009-03-05
Multi-layer Substrate And Manufacturing Method Thereof
App 20080314629 - Yang; Chih-kuang ;   et al.
2008-12-25
Multi-layer Substrate And Manufacture Method Thereof
App 20080316726 - Yang; Chih-kuang
2008-12-25
Surface Finish Structure Of Multi-layer Substrate And Manufacturing Method Thereof
App 20080289863 - Yang; Chih-kuang ;   et al.
2008-11-27
Manufacturing Method Of Metal Structure In Multi-layer Substrate And Structure Thereof
App 20080292892 - Yang; Chih-kuang
2008-11-27
Substrate With Multi-layer Interconnection Structure And Method Of Manufacturing The Same
App 20080265405 - Yang; Chih-kuang
2008-10-30
Structure Combining An Ic Integrated Substrate And A Carrier, And Method Of Manufacturing Such Structure
App 20080213944 - Yang; Chih-kuang
2008-09-04
Method Of Manufacturing Hybrid Structure Of Multi-layer Substrates And Hybrid Structure Thereof
App 20080136021 - Yang; Chih-kuang
2008-06-12
Hybrid Structure Of Multi-layer Substrates And Manufacture Method Thereof
App 20080138575 - Yang; Chih-kuang
2008-06-12
Structure Combining An Ic Integrated Substrate And A Carrier, And Method Of Manufacturing Such Structure
App 20080023811 - Yang; Chih-Kuang
2008-01-31
Structure Combining an IC Integrated Substrate and a Carrier, and Method of Manufacturing such Structure
App 20070145602 - Yang; Chih-Kuang
2007-06-28
Substrate With Multi-layer Interconnection Structure And Method Of Manufacturing The Same
App 20070145587 - Yang; Chih-Kuang
2007-06-28

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