U.S. patent application number 16/691528 was filed with the patent office on 2020-03-19 for heat dissipation module.
This patent application is currently assigned to Acer Incorporated. The applicant listed for this patent is Acer Incorporated. Invention is credited to Cheng-Yu Cheng, Cheng-Wen Hsieh, Jau-Han Ke, Wen-Neng Liao, Shun-Ta Yu.
Application Number | 20200091038 16/691528 |
Document ID | / |
Family ID | 62951383 |
Filed Date | 2020-03-19 |
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United States Patent
Application |
20200091038 |
Kind Code |
A1 |
Yu; Shun-Ta ; et
al. |
March 19, 2020 |
HEAT DISSIPATION MODULE
Abstract
A heat dissipation module configured to dissipate heat from a
heat source of an electronic device is provided. The heat
dissipation module includes a heat pipe, a plurality of fins, and a
fan. One end of the heat pipe is in thermal contact with the heat
source. The fins are stacked up to be combined with one another and
structurally propped against another end of the heat pipe. The fins
form a plurality of flow inlets and a plurality of flow outlets.
The fan is disposed at the flow inlets, and air flow generated by
the fan flows in via the flow inlets and flows out via the flow
outlets. A portion of the fin at the flow outlet forms a bending,
and a pitch between any adjacent fins at the bending is less than
1mm to be qualified to achieve a safety certification.
Inventors: |
Yu; Shun-Ta; (New Taipei
City, TW) ; Liao; Wen-Neng; (New Taipei City, TW)
; Cheng; Cheng-Yu; (New Taipei City, TW) ; Ke;
Jau-Han; (New Taipei City, TW) ; Hsieh;
Cheng-Wen; (New Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Acer Incorporated |
New Taipei City |
|
TW |
|
|
Assignee: |
Acer Incorporated
New Taipei City
TW
|
Family ID: |
62951383 |
Appl. No.: |
16/691528 |
Filed: |
November 21, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
15828435 |
Dec 1, 2017 |
10529649 |
|
|
16691528 |
|
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|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28D 15/0275 20130101;
H01L 2924/0002 20130101; H01L 23/467 20130101; H01L 23/3672
20130101; F28D 15/0233 20130101; H01L 23/3677 20130101; F28F 1/325
20130101; H01L 23/427 20130101; F28F 2215/08 20130101 |
International
Class: |
H01L 23/467 20060101
H01L023/467; F28D 15/02 20060101 F28D015/02; H01L 23/427 20060101
H01L023/427; F28F 1/32 20060101 F28F001/32 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 22, 2017 |
TW |
106120958 |
Claims
1. A heat dissipation module, configured to dissipate heat from a
heat source of an electronic device, the electronic device having a
housing with a plurality of opening holes, the heat source disposed
in the housing, and the heat dissipation module comprising: a heat
pipe, one end of the heat pipe being in thermal contact with the
heat source; a plurality of fins, stacked up to be combined with
one another and structurally propped against another end of the
heat pipe, the fins forming a plurality of flow inlets and a
plurality of flow outlets; and a fan, disposed at the flow inlets,
air flow generated by the fan flowing in the fins via the flow
inlets and flowing out of the fins via the flow outlets, wherein
portions of the fins at the flow outlets form a plurality of
bendings adjacent to and facing toward the opening holes, the air
flow from the flow outlets flows out of the housing via the opening
holes, and a pitch between any adjacent fins at the bendings is
less than 1 mm to form a barrier preventing a foreign object
entering the housing via the flow outlets of the fins.
2. The heat dissipation module as claimed in claim 1, wherein an
orthogonal projection contour of the fins on a virtual plane where
the heat pipe is located on is divided into a first region, a
second region, and a third region, the second region is located
between the first region and the third region, the first region is
equipped with the flow inlets, the third region is equipped with
the flow outlets, the heat pipe is structurally propped against the
second region, and the bendings are located in the third
region.
3. The heat dissipation module as claimed in claim 2, wherein the
fins are orthogonal to the virtual plane, and a flow direction of
the air flow is parallel to the virtual plane.
4. The heat dissipation module as claimed in claim 1, wherein a
pitch between any adjacent portions of the fins that are not bent
is greater than 1 mm.
5. The heat dissipation module as claimed in claim 1, wherein each
of the fins has a breach at the bending.
6. The heat dissipation module as claimed in claim 1, wherein each
of the fins has a first segment and at least one second segment at
the flow outlet, the at least one second segment forms the bending,
and a pitch between the fins at the first segment is greater than 1
mm.
7. The heat dissipation module as claimed in claim 1, wherein each
of the fins at the flow outlet has a first segment, at least one
second segment, and a third segment, the at least one second
segment is connected between the first segment and the third
segment and forms the bending, and pitches between the fins at the
first segment and pitches between the fins at the third segment are
greater than 1 mm respectively.
8. The heat dissipation module as claimed in claim 7, wherein
extending directions of each of the fins at the first segment and
at the third segment are identical, and the pitches are
identical.
9. The heat dissipation module as claimed in claim 7, wherein each
of the fins has a plurality of second segments and a fourth segment
at the flow outlets, the second segments are connected between the
first segment and the third segment, the fourth segment is
connected between the second segments, extending directions of each
of the fins at the first segment, at the third segment, and at the
fourth segment are identical, and the pitches are identical.
10. The heat dissipation module as claimed in claim 9, wherein the
first segment and the third segment are located on a same axis, and
the fourth segment is dislocated relative to the first segment and
the third segment in each of the fins.
11. The heat dissipation module as claimed in claim 1, wherein the
heat pipe is in contact with portions of fins that are not
bent.
12. The heat dissipation module as claimed in claim 1, wherein the
electronic module is further equipped with a housing, and a contour
of the fins at the flow outlets, a contour of the bendings, and a
contour of the housing are identical to one another.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation application of and claims
the priority benefit of a prior application Ser. No. 15/828,435,
filed on Dec. 1, 2017, now allowed. The prior application claims
the priority benefit of Taiwan application serial no. 106120958,
filed on Jun. 22, 2017. The entirety of the above-mentioned patent
application is hereby incorporated by reference herein and made a
part of this specification.
BACKGROUND
1. Technical Field
[0002] The disclosure relates to a heat dissipation module.
2. Description of Related Art
[0003] In a conventional heat dissipation module installed in an
electronic device, a fan and heat dissipation fins are mainly
included to constitute a structure of the heat dissipation module.
The heat dissipation fins are disposed at a flow outlet end of the
fan and are in contact with the fan. Moreover, the heat dissipation
fins are in contact with a heat source as well, such that, when a
thermal energy generated by the heat source is transmitted to the
heat dissipation fins, cooling wind generated by the fan is
directly blown to the heat dissipation fins, blown out through the
heat dissipation fins, and then expelled out of a housing through
flow outlets of the housing of the electronic device, and heat
dissipation is therefore achieved.
[0004] In certain electronic devices, for example, a notebook
computer, a safety certification is required to be complied.
Meaning that in the notebook computer, since an opening of the
housing acts as flow inlets or flow outlets of said heat
dissipation module, a caliber of the opening is required to be
maintained to be less than a certain value, so as to prevent a
foreign object from entering into the electronic device easily
through the opening of the housing, which may affect electronic
components or electrocircuits in the electronic device or even
cause short circuits. Nevertheless, in such a structure of the heat
dissipation module, a size of a flow channel of air flow is
limited, favorable heat dissipation effect may not be achieved as a
result.
SUMMARY
[0005] The disclosure provides a heat dissipation module which has
a flow channel size suitable for air flow to dissipate heat and
satisfies requirements for a safety certification.
[0006] A heat dissipation module of the embodiments of the
disclosure is configured to dissipate heat from a heat source of an
electronic device. The heat dissipation module includes a heat
pipe, a plurality of fins, and a fan. One end of the heat pipe is
in thermal contact with the heat source. The fins are stacked up to
be combined with one another and structurally propped against
another end of the heat pipe. The fins form a plurality of flow
inlets and a plurality of flow outlets. The fan is disposed at the
flow inlets, and air flow generated by the fan flows in the fins
via the flow inlets and flows out of the fins via the flow outlets.
Portions of the fins at the flow outlets form a plurality of
bendings, and a pitch between any adjacent fins at the bendings is
less than 1 mm to be qualified to achieve a safety
certification.
[0007] To sum up, in the heat dissipation module, the pitches are
adjusted through whether the fins are bent, such that the pitches
less than 1 mm are formed at the bendings through collocation
between different pitch sizes between the pins. As such, the
requirements for the safety certification are satisfied, and a
foreign object is thus prevented from entering into the electronic
device through the fins. Simultaneously, the pitches between the
portions of the fins that are not bent still maintain to be greater
than 1 mm, such that, the air flow generated by the fan to
dissipate heat may be maintained to pass through smoothly.
Accordingly, the heat dissipation module is able to provide
adaptability which satisfies the safety certification and at the
same time delivers heat dissipation performance.
[0008] To make the aforementioned and other features and advantages
of the invention more comprehensible, several embodiments
accompanied with drawings are described in detail as follows.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention.
[0010] FIG. 1 is a schematic view of a heat dissipation module
according to an embodiment of the disclosure.
[0011] FIG. 2 is a local top view of the heat dissipation module of
FIG. 1.
[0012] FIG. 3 is a local side view of the heat dissipation module
of FIG. 1.
[0013] FIG. 4A is a schematic local view illustrating a heat
dissipation module according to another embodiment of the
disclosure.
[0014] FIG. 4B illustrates a local top view of FIG. 4A.
[0015] FIG. 5 to FIG. 7 are local top views respectively
illustrating heat dissipation modules according to different
embodiments of the disclosure.
[0016] FIG. 8 is a local side view illustrating a heat dissipation
module according to another embodiment of the disclosure.
DESCRIPTION OF THE EMBODIMENTS
[0017] FIG. 1 is a schematic view of a heat dissipation module
according to an embodiment of the disclosure. FIG. 2 is a local top
view of the heat dissipation module of FIG. 1. FIG. 3 is a local
side view of the heat dissipation module of FIG. 1. A Cartesian
coordinate X-Y-Z is provided herein for ease of description.
[0018] Referring to FIG. 1 to FIG. 3, in the present embodiment, a
heat dissipation module 100 is adapted to be disposed in a housing
200 of an electronic device 10. The electronic device 10 is
exemplified as a notebook computer, and that heat dissipation is
performed to a heat source 300 (e.g., a processor or a display
chip) of the electronic device 10. The heat dissipation module 100
includes a heat pipe 110, a fan 120, a plurality of fins 130, and a
fixing member 140. As shown in FIG. 1, one end (right side of the
drawing) of the heat pipe 110 is in thermal contact with the heat
source 300 of the electronic device 10, for example, the heat pipe
110 is fixed on a printed circuit board (not shown) through the
fixing member 140, such that the heat pipe 110 is in structural
contact with the heat source 300 directly or indirectly. As such,
through a phase change of a working fluid in the heat pipe 110, a
quantity of heat is transmitted to another end (left side of the
drawing) of the heat pipe 110.
[0019] The fins 130 are stacked up horizontally to be combined with
one another along an X-axis so as to form a plurality of flow
channels arranged along the X-axis (and parallel to a Y-Z plane),
and thus a plurality of flow inlets 132 and a plurality of flow
outlets 133 are formed. The fan 120 is disposed at the flow inlets
132 and is configured to generate air flow (as shown by the dotted
line arrows in FIG. 2), which flows into the flow channels among
the fins 130 via the flow inlets 132 and flows out of the flow
channels via the flow outlets 133. In other words, after
transmitting the quantity of heat from the heat source 300 to the
fins 130 through the phase change (e.g., a conversion between a
liquid phase and a vapor phase) generated by the working fluid (not
shown) inside, the heat pipe 110 is able to dissipate heat for the
fins 130 through the air flow (as shown by the dotted line arrows
in FIG. 2 and FIG. 3) generated by the fan 120. Furthermore, the
quantity of heat is removed from the fins 130 and is dissipated out
of the electronic device 10 along with the air flow through opening
holes 210 (illustrated in FIG. 1) of the housing 200, so as to
achieve heat dissipation effect.
[0020] As described above, the notebook computer is required to
comply with a safety certification so as to prevent a foreign
object larger than a standard of the safety certification from
entering through pitches between the fins 130, damaging internal
electronic components of the fan 120, and affecting heat
dissipation performance. As such, in the present embodiment,
portions of the fins 130 at the flow outlets 133 form a plurality
of bendings 131, and pitches P2 between the adjacent fins 130 at
the bendings 131are less than 1 mm for being in line with the
safety certification. Accordingly, the foreign object is prevented
from entering into the electronic device 10 through the fins 130
which may lead to unfavorable influences. Here, the safety
certification refers to the IEC 60950.
[0021] Referring to FIG. 2 and FIG. 3, the air flow generated by
the fan 120 is also required to dissipate heat for the fins 130
more effectively while the safety certification is required to be
satisfied at the same time. As such, in the present embodiment, all
of the pitches between the fins 130 are not required to be less
than 1 mm from the flow inlets 132 to the flow outlets 133. In
other words, in the present embodiment, the pitch P1 between
portions of the fins 130 that are not bent is still greater than 1
mm.
[0022] Accordingly, as the bendings 131 exist at the flow outlets
133 of the fins 130, meaning that the bendings 131 are adjacent to
the opening holes 210 of the housing 200, as such, the electronic
device 10 is able to provide favorable blocking effect from an
external foreign object. Simultaneously, except for the portions of
the fins 130 forming the bendings 131, the rest of the portions of
the fins 130 still maintain at a pitch configuration which provides
favorable heat dissipation effect, such that, through forming of
the bendings 131 by the fins 130 and collocation of the pitches P1
and P2, the heat dissipation module 100 of the present embodiment
100 is able to satisfy the requirements of heat dissipation as well
as safety certification.
[0023] Specifically, referring to FIG. 3, an orthogonal projection
contour of the fin 130 on a virtual plane (an X-Y plane as shown in
FIG. 3) where the heat pipe 110 is located on is divided into a
first region F1, a second region F2, and a third region F3. The
second region F2 is located between the first region F1 and the
third region F3, the first region F1 is equipped with the flow
inlet 132, and the third region F3 is equipped with the flow outlet
133. The heat pipe 110 is structurally propped against the second
region F2, for example, engaged with a recess of the fin 130, such
that the heat pipe 110 is able to penetrate through the fin 130.
The bending 131 is located in the third region F3. Here, the fin
130 stands on and is orthogonal to the virtual plane (the X-Y
plane), and a flow direction of the air flow (as shown by the
dotted line arrows) is parallel to the virtual plane (the X-Y
plane).
[0024] Corresponding relationships among the pitches P1 and P2, a
thickness t1, and bending angles .theta.1 of the fins 130 are
provided as follows in (Table 1), referring to FIG. 2 and (Table
1):
TABLE-US-00001 TABLE 1 Fin Thickness t1: 0.2 mm Fin Pitch P1 (mm)
1.2 1.4 1.6 1.8 Fin Pitch P2 (mm) Bending 25 -- -- -- 0.76 Angle
.theta.1 30 0.6 0.7 0.8 0.9 (.degree.) 35 0.69 0.8 0.92 1.03 40
0.77 0.9 1.03 -- 45 0.85 1.13 -- 50 0.92 1.07 1.23 -- 55 0.98 1.15
1.31 -- 60 1.04 1.21 1.39 --
[0025] Maximum bending angles required in order to correspond to
different pitches P1 between the fins 130 and enable the pitches P2
to be maintained are clearly obtained from the foregoing (Table 1).
For instance, as shown by the bold italic number "0.99" in (Table
1), when the pitch P1 between the fins 130 is 1.4 mm, under the
premise that the pitch P2 between the fins 130 is required to be
less than 1 mm, the bending angle 01 allowed is substantially
required to be less than 45 degrees. In this way, the corresponding
bending angles .theta.1 are thus generated according to the
different thicknesses tl of the fins 130 and the different pitches
P1 between the fins 130 for a user.
[0026] FIG. 4A is a schematic local view illustrating a heat
dissipation module according to another embodiment of the
invention. FIG. 4B illustrates a local top view of FIG. 4A.
Referring to FIG. 4A and FIG. 4B, different from the foregoing
embodiments, in the present embodiment, a portion of a fin forming
a bending further includes a breach 134, and an orthogonal
projection size of the breach 134 on the X-Y plane is less than 1
mm. As such, fins 130A are able to provide greater quantity of flow
at flow outlets, meaning that in addition to an air flow f1 flowing
out of bendings, an air flow f2 flowing out of the breaches 134
also exists. Thus, quantity of flow of an air flow F of the fins
130A at portions of the fins 130A that are not bent is a sum of the
air flow f1 and the air flow f2, such that the quantity of flow of
the air flow is increased. In other words, calibers of the fins
130A at the flow outlets are expanded, which is conducive to
increasing the quantity of flow of the air flow flowing through the
fins 130A.
[0027] FIG. 5 to FIG. 7 are local top views respectively
illustrating heat dissipation modules according to different
embodiments of the invention. Appearance changes of the fins at the
flow outlets are described in detail herein, and the rest of the
omitted contents may be acquired from the foregoing embodiments and
thus will not be repeated hereinafter. Referring to FIG. 5, in the
present embodiment, fins 130B have a first segment S1 and a second
segment S2 at flow outlets, and portions of the fins 130B at the
second segment S2 form bendings. Pitches P1 between the fins 130B
at the first segment S1 are greater than 1 mm, and pitches P2 at
the second segment S2 are less than 1 mm.
[0028] Referring to FIG. 6, in the present embodiment, fins 130C
have a first segment S1, second segments S3 and S5, a third segment
S6, and a fourth segment S4. The second segment S3 is connected
between the first segment S1 and the third segment S6, the other
second segment S5 is connected between the third segment S6 and the
fourth segment S4, and the fourth segment S4 is connected between
the two second segments S3 and S5. Here, extending directions of
each of the fins 130C at the first segment S1, the third segment
S6, and the fourth segment S4 are identical, and pitches P1 between
the fins 130C are all identical and greater than 1 mm. The fourth
segment S4 is viewed as to be deviated in parallel to (horizontally
dislocated on) the first segment S1 and the third segment S6.
Similarly, pitches between the second segments S3 and S5 are all
less than 1 mm.
[0029] Referring to FIG. 7, in the present embodiment, fins 130D
have a first segment S1, two second segments S7, and a third
segment S8 at flow outlets. The two second segments S7 are
connected between the first segment S1 and the third segment S8 and
are adjacent to each other to form a bending. In the fins 130D,
pitches P1 at the first segment S1 and pitches P1 at the third
segment S8 are identical and are greater than 1 mm, and similarly,
since a bending is formed between the second segments S7, pitches
P2 are less than 1 mm.
[0030] FIG. 8 is a local side view illustrating a heat dissipation
module according to another embodiment of the invention. Here,
along with changes of a contour of a housing 200A of an electronic
device, in a heat dissipation module, contours of a fin 130E and a
bending 131E change as well, such that the heat dissipation module
is able to provide favorable adaptability, which is conducive to
usage of internal space in the housing 200A. Here, a contour C2 of
the fin 130E at a flow outlet, a contour C3 of the bending 131E,
and a contour C1 of the housing 200A are identical to one another
(chamfered fillets are illustrated as examples here, but the
invention is not limited thereto), such that air flow can be
smoothly blown out of the housing 200A through an opening hole
210A.
[0031] In view of the foregoing, as the heat dissipation module is
required to comply with the safety certification to be installed on
the electronic device and to be equipped with heat dissipation
performance of the heat dissipation module itself at the same time,
in the embodiments of the invention, the portions of the fins of
the heat dissipation module adjacent to the flow outlets form the
bendings, and that the pitches between the bent fins are less then
1 mm, so as to satisfy the requirements for the safety
certification. Simultaneously, the pitches between the portions of
the fins that are not bent still maintain to be greater than 1
mm.
[0032] To be more specifically, the heat pipe is configured to
penetrate through and be in contact with the portions of the fins
that are not bent, and the pitches between the fins at the flow
inlets maintain to be wider, as such, in terms of heat dissipation
performance, as greater quantity of flow of air flow passes through
the fins owing to the wider pitches, heat dissipation performance
is therefore enhanced. Furthermore, the flow outlets formed by the
fins are adjacent to the opening holes of the housing, such that,
in the electronic device, a foreign object outside of the housing
is prevented from entering into the electronic device easily
through the opening holes or the fins, which also enables the heat
dissipation module to comply with the safety certification. In
addition, suitable bending angles or breaches at the flow outlets
are adaptively provided in accordance with the thickness of and the
pitches between the fins, such that, the air flow generated by the
fan may smoothly pass through the fins so as to achieve heat
dissipation effect.
[0033] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
present invention cover modifications and variations of this
invention provided they fall within the scope of the following
claims and their equivalents.
* * * * *