U.S. patent application number 16/543695 was filed with the patent office on 2019-12-05 for manufacturing method of light-emitting device.
The applicant listed for this patent is Genesis Photonics Inc.. Invention is credited to Cheng-Chuan Chen, Cheng-Wei Hung, Chin-Hua Hung, Yu-Feng Lin.
Application Number | 20190371983 16/543695 |
Document ID | / |
Family ID | 61997616 |
Filed Date | 2019-12-05 |
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United States Patent
Application |
20190371983 |
Kind Code |
A1 |
Hung; Chin-Hua ; et
al. |
December 5, 2019 |
MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE
Abstract
A manufacturing method of a light-emitting device is provided. A
substrate and a light-emitting component disposed on the substrate
are provided. A translucent layer is provided. The translucent
layer is connected with the light-emitting component by an adhesive
layer. A reflective layer is formed above the substrate, wherein
the reflective layer covers a lateral surface of the light-emitting
component, a lateral surface of the adhesive layer and a lateral
surface of the translucent layer. A translucent encapsulant is
formed on the substrate to encapsulate the light-emitting
component, the translucent layer and the reflective layer.
Inventors: |
Hung; Chin-Hua; (Tainan
City, TW) ; Hung; Cheng-Wei; (Tainan City, TW)
; Lin; Yu-Feng; (Tainan City, TW) ; Chen;
Cheng-Chuan; (Tainan City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Genesis Photonics Inc. |
Tainan City |
|
TW |
|
|
Family ID: |
61997616 |
Appl. No.: |
16/543695 |
Filed: |
August 19, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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15787811 |
Oct 19, 2017 |
10388838 |
|
|
16543695 |
|
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62410376 |
Oct 19, 2016 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 33/62 20130101;
H01L 25/0753 20130101; H01L 33/507 20130101; H01L 33/642 20130101;
H01L 33/0075 20130101; H01L 33/26 20130101; H01L 33/387 20130101;
H01L 33/56 20130101 |
International
Class: |
H01L 33/56 20060101
H01L033/56; H01L 25/075 20060101 H01L025/075; H01L 33/00 20060101
H01L033/00; H01L 33/38 20060101 H01L033/38; H01L 33/64 20060101
H01L033/64; H01L 33/26 20060101 H01L033/26 |
Claims
1. A manufacturing method of a light-emitting device, comprises:
providing a substrate and a light-emitting component disposed on
the substrate; providing a translucent layer; connecting the
translucent layer with the light-emitting component by an adhesive
layer; forming a reflective layer above the substrate, wherein the
reflective layer covers a lateral surface of the light-emitting
component, a lateral surface of the adhesive layer and a lateral
surface of the translucent layer; and forming a translucent
encapsulant on the substrate to encapsulate the light-emitting
component, the translucent layer and the reflective layer.
2. The manufacturing method according to claim 1, wherein before
the step of forming the reflective layer above the substrate, the
manufacturing method further comprises: forming a first singulation
path passing through the translucent layer to form the lateral
surface of the translucent layer; wherein after the step of forming
the reflective layer above the substrate, the manufacturing method
further comprises: forming a second singulation path passing
through the reflective layer to form a light-emitting chip;
disposing the light-emitting chip on the substrate; wherein in the
step of forming the translucent encapsulant on the substrate to
encapsulate the light-emitting component, the translucent layer and
the reflective layer, the translucent encapsulant encapsulates the
light-emitting chip.
3. The manufacturing method according to claim 2, wherein after the
step of forming the translucent encapsulant on the substrate to
encapsulate the light-emitting component, the translucent layer and
the reflective layer, the manufacturing method further comprises:
forming a third singulation path passing through the substrate.
4. The manufacturing method according to claim 2, wherein after the
step of forming the translucent encapsulant on the substrate to
encapsulate the light-emitting component, the translucent layer and
the reflective layer, the manufacturing method further comprises:
forming a third singulation path passing through the translucent
encapsulant and the substrate, wherein the translucent encapsulant
and the substrate each forms a lateral surface, and the lateral
surface of the translucent encapsulant and the lateral surface of
the substrate are substantially aligned or flush with each
other.
5. The manufacturing method according to claim 1, wherein before
the step of forming the reflective layer above the substrate, the
manufacturing method further comprises: forming a first singulation
path passing through the reflective layer to form the lateral
surface of the reflective layer; wherein after the step of forming
the reflective layer above the substrate, the manufacturing method
further comprises: forming a second singulation path passing
through the reflective layer and the adhesive layer to form a
light-emitting chip; disposing the light-emitting chip on the
substrate; wherein in the step of forming the translucent
encapsulant on the substrate to encapsulate the light-emitting
component, the translucent layer and the reflective layer, the
translucent encapsulant encapsulates the light-emitting chip.
6. The manufacturing method according to claim 5, wherein in the
step of forming the second singulation path passing through the
reflective layer and the adhesive layer to form the light-emitting
chip and remove the adhesive layer formed on the lateral surface of
the light-emitting component.
Description
[0001] This application is a divisional application of co-pending
U.S. application Ser. No. 15/787,811, filed Oct. 19, 2017, which
claims the benefits of U.S. provisional application Ser. No.
62/410,376, filed Oct. 19, 2016, the subject matters of which are
incorporated herein by reference.
TECHNICAL FIELD
[0002] The disclosure relates in general to a light-emitting device
and a manufacturing method thereof, and more particularly to a
light-emitting device having a reflective layer and a manufacturing
method thereof.
BACKGROUND
[0003] Conventional light-emitting device includes a phosphor glue
and a light-emitting component, wherein the phosphor glue covers an
upper surface and a lateral surface of the light-emitting
component. The high temperature generated by the light-emitting
component, when illuminating, will negatively affect the phosphor
glue, speed up the deterioration of the phosphor glue and change
the light color.
[0004] Therefore, it has become a prominent task for the industry
to slow the deterioration of the phosphor glue.
SUMMARY
[0005] Thus, the disclosure provides a light-emitting device
capable of relieving the deterioration of the phosphor glue and a
manufacturing method thereof.
[0006] According to one embodiment, a light-emitting device is
provided. The light-emitting device includes a substrate, a
light-emitting component, a translucent layer, an adhesive layer, a
reflective layer and translucent encapsulant. The light-emitting
component is disposed on the substrate. The adhesive layer is
formed between the light-emitting component and the translucent
layer. The reflective layer is formed above the substrate and
covering a lateral surface of the light-emitting component, a
lateral surface of the adhesive layer and a lateral surface of the
translucent layer. The translucent encapsulant is formed on the
substrate and encapsulating the light-emitting component, the
translucent layer and the reflective layer.
[0007] According to another embodiment, a manufacturing method of a
light-emitting device is provided. The manufacturing method
includes the following steps. A substrate and a light-emitting
component disposed on the substrate are provided; a translucent
layer is provided; the translucent layer is connected with the
light-emitting component by an adhesive layer; a reflective layer
is formed above the substrate, wherein the reflective layer covers
a lateral surface of the light-emitting component, a lateral
surface of the adhesive layer and a lateral surface of the
translucent layer; and a translucent encapsulant is formed on the
substrate to encapsulate the light-emitting component, the
translucent layer and the reflective layer.
[0008] The above and other aspects of the invention will become
better understood with regard to the following detailed description
of the preferred but non-limiting embodiment (s). The following
description is made with reference to the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 illustrates a cross-sectional view of a
light-emitting device according to an embodiment of the
invention;
[0010] FIG. 2 illustrates a cross sectional view of a
light-emitting device according to another embodiment of the
invention;
[0011] FIG. 3 illustrates a cross sectional view of a
light-emitting device according to another embodiment of the
invention;
[0012] FIG. 4 illustrates a cross sectional view of a
light-emitting device according to another embodiment of the
invention;
[0013] FIGS. 5A to 5H illustrate manufacturing processes of the
light-emitting device of FIG. 1;
[0014] FIGS. 6A to 6C illustrate another manufacturing processes of
the light-emitting device of FIG. 1;
[0015] FIGS. 7A to 7C illustrate manufacturing processes of the
light-emitting device of FIG. 2;
[0016] FIGS. 8A to 8C illustrate manufacturing processes of the
light-emitting device of FIG. 3;
[0017] FIGS. 9A to 9F illustrate manufacturing processes of the
light-emitting device of FIG. 4;
[0018] FIG. 10 illustrates a cross sectional view of a
light-emitting device according to another embodiment of the
invention;
[0019] FIG. 11 illustrates a cross sectional view of a
light-emitting device according to another embodiment of the
invention;
[0020] FIG. 12 illustrates a cross sectional view of a
light-emitting device according to another embodiment of the
invention;
[0021] FIG. 13 illustrates a cross sectional view of a
light-emitting device according to another embodiment of the
invention;
[0022] FIG. 14 illustrates a cross sectional view of a
light-emitting device according to another embodiment of the
invention;
[0023] FIG. 15 illustrates a cross sectional view of a
light-emitting device according to another embodiment of the
invention;
[0024] FIG. 16 illustrates a cross sectional view of a
light-emitting device according to another embodiment of the
invention;
[0025] FIGS. 17A to 17G illustrate manufacturing processes of the
light-emitting device of FIG. 10;
[0026] FIG. 18 illustrates manufacturing process of the
light-emitting device of FIG. 11;
[0027] FIGS. 19A to 19F illustrate manufacturing processes of the
light-emitting device of FIG. 12;
[0028] FIGS. 20A to 20C illustrate manufacturing processes of the
light-emitting device of FIG. 13;
[0029] FIGS. 21A to 21C illustrate manufacturing processes of the
light-emitting device of FIG. 14;
[0030] FIG. 22 illustrates manufacturing process of the
light-emitting device of FIG. 15; and
[0031] FIG. 23 illustrates manufacturing process of the
light-emitting device of FIG. 16.
DETAILED DESCRIPTION
[0032] FIG. 1 illustrates a cross-sectional view of a
light-emitting device 100 according to an embodiment of the
invention. The light-emitting device 100 includes a substrate 110,
a light-emitting component 120, a wavelength conversion layer 130,
an adhesive layer 140 and a reflective layer 150.
[0033] The substrate 110 is, for example, a ceramic substrate. In
the present embodiment, the substrate 110 includes a base 111, a
third electrode 112, a fourth electrode 113, a first pad 114, a
second pad 115, a first conductive post 116 and a second conductive
post 117.
[0034] The base 111 is made of a material such as silicon-based
material. The base 111 has a first surface 111u and a second
surface 111b opposite to the first surface 111u. The third
electrode 112 and the fourth electrode 113 are formed on the first
surface 111u of the base 111, and the first pad 114 and the second
pad 115 are formed on the second surface 111b of the base 111. The
first conductive post 116 and the second conductive post 117 pass
through the base 111, wherein the first conductive post 116
connects the third electrode 112 to the first pad 114 for
electrically connecting the third electrode 112 to the first pad
114, and the second conductive post 117 connects the fourth
electrode 113 to the second pad 115 for electrically connecting the
fourth electrode 113 to the second pad 115.
[0035] The light-emitting device 100 may be disposed on a circuit
board (not illustrated), wherein the first pad 114 and the second
pad 115 of the substrate 110 are electrically connected to two
electrodes (not illustrated) of the circuit board, such that the
light-emitting component 120 is electrically connected to the
circuit board through the first pad 114 and the second pad 115.
[0036] The light-emitting component 120 is disposed on the
substrate 110. The light-emitting component 120 includes a first
electrode 121 and a second electrode 122, wherein the first
electrode 121 and the second electrode 122 are electrically
connected to the third electrode 112 and the fourth electrode 113
respectively.
[0037] The light-emitting component 120 is, for example, a
light-emitting diode. Although not illustrated, the light-emitting
component 120 may further comprise a first type semiconductor
layer, a second type semiconductor layer and a light emitting
layer, wherein the light emitting layer is formed between the first
type semiconductor layer and the second type semiconductor layer.
The first type semiconductor layer is realized by such as an N-type
semiconductor layer, and the second type semiconductor layer is
realized by such as an P-type semiconductor layer. Alternatively,
the first type semiconductor layer is realized by such as a P-type
semiconductor layer, and the second type semiconductor layer is
realized by such as an N-type semiconductor layer. The P-type
semiconductor is realized by a GaN-based semiconductor doped with
trivalent elements such as a gallium nitride based semiconductor
layer which is doped with Beryllium (Be), zinc (Zn), manganese
(Mn), chromium (Cr), magnesium (Mg), calcium (Ca), etc. The N-type
semiconductor is realized by a GaN-based semiconductor doped with
doped with silicon (Si), germanium (Ge), tin (Sn), sulfur (S),
oxygen (O), titanium (Ti) and or zirconium (Zr), etc. The light
emitting layer 122 may be realized, but is not limited to, by a
structure of I.sub.xAl.sub.yGa.sub.1-x-yN
(0.ltoreq.x.0.ltoreq.y.x+y.ltoreq.1) or a structure which is doped
with Boron (B), phosphorus (P) or arsenic (As). In addition, the
light emitting layer 122 may be a single-layered structure or
multi-layered structure.
[0038] The first electrode 121 may be realized by a single-layered
structure or a multi-layered structure which is made of at least
one of materials including gold, aluminum, silver, copper, rhodium
(Rh), ruthenium (Ru), palladium (Pd), iridium (Ir), platinum (Pt),
chromium, tin, nickel, titanium, tungsten (W), chromium alloys,
titanium tungsten alloys, nickel alloys, copper silicon alloy,
aluminum silicon copper alloy, aluminum silicon alloy, gold tin
alloy, but is not limited thereto. The second electrode 122 may be
realized by a single-layered structure or a multi-layered
structure. The second electrode 122 may be made of a material
similar to that of the first electrode 121.
[0039] The wavelength conversion layer 130 includes a high-density
phosphor layer 131 and a low-density phosphor layer 132. The
wavelength conversion layer 130 includes a plurality of phosphor
particles, wherein a region whose phosphor particle density is
higher is defined as the high-density phosphor layer 131, and a
region whose phosphor particle density is lower is defined as the
low-density phosphor layer 132. In an embodiment, a ratio of a
phosphor particle density of the high-density phosphor layer 131
and a phosphor particle density of the low-density phosphor layer
132 ranges between 1 and 10.sup.15, wherein the range may contain
or may not contain 1 and 10.sup.15.
[0040] In the present embodiment, the high-density phosphor layer
131 is located between the light-emitting component 120 and the
low-density phosphor layer 132. That is, the light emitted from the
light-emitting component 120 first passes through the high-density
phosphor layer 131, and then is emitted out of the wavelength
conversion layer 130 through the low-density phosphor layer 132.
Due the design of the high-density phosphor layer 131, the light
color of the light-emitting device 100 can be collectively
distributed in the chromaticity coordinate. As a result, the yield
of the light-emitting device 100 may be increased. The low-density
phosphor layer 132 may increase a light mixing probability. In
detail, for the light L1 which has not contacted the phosphor
particles within the high-density phosphor layer 131 yet, the
low-density phosphor layer 132 increases the probability of the
light L1 contacting the phosphor particles. In the present
embodiment, a thickness T2 of the low-density phosphor layer 132 is
larger than a thickness T1 of the high-density phosphor layer 131,
and accordingly the light mixing probability of the light L1 of the
light-emitting component 120 can be further increased. In an
embodiment, a ratio of the thickness T2 and the thickness T1 ranges
between 1 and 1000, wherein the range may contain or may not
contain 1 and 1000.
[0041] The wavelength conversion layer 130 covers the entire upper
surface 120u of the light-emitting component 120. That is, in the
present embodiment, the area of the wavelength conversion layer 130
viewed from the top view is larger than the area of the
light-emitting component 120 viewed from the top view. In an
embodiment, a ratio of the area of the wavelength conversion layer
130 viewed from the top view and the area of the light-emitting
component 120 viewed from the top view ranges between 1 and 1.35,
however less than 1 or larger than 1.35 is also feasible.
[0042] In an embodiment, the wavelength conversion layer 130 may be
made of a material including sulfide, Yttrium aluminum garnet
(YAG), LuAG, silicate, nitride, oxynitride, fluoride, TAG, KSF,
KTF, etc.
[0043] The adhesive layer 140 includes, but is not limited to,
transparent resin, wherein the transparent resin includes, but is
not limited to, silicone, epoxy resin or other synthetic resin. The
adhesive layer 140 includes a first lateral portion 141 and a heat
resistance layer 142. The first lateral portion 141 covers a
portion of a lateral surface 120s of the light-emitting component
120, and another portion or the other portion of the lateral
surface 120s of the light-emitting component 120 is covered by the
reflective layer 150. Viewed from the direction of the top view of
FIG. 1, the first lateral portion 141 is shaped into a closed ring
shape which surrounds the entire lateral surface 120s of the
light-emitting component 120. In another embodiment, the first
lateral portion 141 may be shaped into an open ring shape.
[0044] As illustrated in an enlargement view of FIG. 1, the heat
resistance layer 142 of the adhesive layer 140 is formed between
the high-density phosphor layer 131 and the light-emitting
component 120, and accordingly it can increase the heat resistance
between the light-emitting component 120 and the wavelength
conversion layer 130 to slows the degrading speed of the wavelength
conversion layer 130. In detail, if the heat generated from the
light-emitting component 120 is easily transmitted to the
wavelength conversion layer 130, it will speed up the deterioration
of the phosphor particles within the wavelength conversion layer
130. In the present embodiment, due to the forming of the heat
resistance layer 142, the heat transmitted to the wavelength
conversion layer 130 can be decreased, and accordingly it can slow
the deterioration of the phosphor particles within the wavelength
conversion layer 130. In an embodiment, the thickness of the heat
resistance layer 142 may range between 1 and 1000, wherein the
range may contain or may not contain 1 and 1000.
[0045] The reflective layer 150 is formed above the substrate 110
and covers the lateral surface 120s of the light-emitting component
120, a lateral surface 141s of the first lateral portion 141 of the
adhesive layer 140 and a lateral surface 130s of the wavelength
conversion layer 130, and accordingly it can advantageously protect
the light-emitting component 120 and the wavelength conversion
layer 130 from being exposed to be damaged. The reflective layer
150 may reflect the light L1 emitted from the lateral surface 120s
of the light-emitting component 120 to the wavelength conversion
layer 130, and accordingly it can increase the luminous efficiency
of the light-emitting device 100.
[0046] As illustrated in FIG. 1, the reflective layer 150 further
covers a lateral surface of the first electrode 121, a lateral
surface of the second electrode 122, a lateral surface of the third
electrode 112 and a lateral surface of the fourth electrode 113. As
a result, it can prevent the first electrode 121, the second
electrode 122, the third electrode 112 and the fourth electrode 113
from being exposed and damaged by the environment, such as
oxidation, humidity, etc.
[0047] There is a first gap G1 between the first electrode 121 and
the second electrode 122, and there is a second gap G2 between the
third electrode 112 and the fourth electrode 113. The reflective
layer 150 includes a filling portion 152, and the first gap G1
and/or the second gap G2 is filled with the filling portion
152.
[0048] The reflective layer 150 includes a first reflective portion
151 which surrounds the lateral surface 120s of the light-emitting
component 120. The first reflective portion 151 has a first
reflective surface 151s facing the lateral surface 120s of the
light-emitting component 120 and/or the wavelength conversion layer
130 for reflecting the light L1 emitted from the lateral surface
120s of the light-emitting component 120 to the wavelength
conversion layer 130. In the present embodiment, the first
reflective surface 151s is a convex surface facing the lateral
surface 120s of the light-emitting component 120 and/or the
wavelength conversion layer 130. In another embodiment, the first
reflective surface 151s may be a concave surface.
[0049] As illustrated in FIG. 1, the convex first reflective
surface 151s connects a lower surface 130b of the wavelength
conversion layer 130 to the lateral surface 120s of the
light-emitting component 120. As a result, it can increase the
probability of the light L1 emitted from the light-emitting
component 120 contacting the convex surface, such that the light Li
emitted from the light-emitting component 120 almost or completely
is reflected by the reflective layer 150 to the wavelength
conversion layer 130 and then is emitted out of the light-emitting
device 100, and accordingly it can increase the luminous efficiency
of the light-emitting device 100.
[0050] In an embodiment, the reflective layer 150 has a
reflectivity larger than 90%. The reflective layer 150 may be made
of a material including Poly phthalic amide (PPA), polyamide (PA),
polyethylene terephthalate (PTT), polyethylene terephthalate (PET),
polyethylene terephthalate 1,4-cyclohexane dimethylene
terephthalate (POT), epoxy compound (EMC), silicone compound (SMC)
or other resin/ceramic material having high reflectivity. In
addition, the reflective layer 150 may be a white glue. For
example, the reflective layer 150 is made of silicone, epoxy or
other synthetic resins including white metal oxide powders. The
metal oxide includes, but is not limited to, titanium oxides.
[0051] As described above, in comparison with the conventional
light-emitting device, the luminous area of the light-emitting
device 100 can increase by 40% and the brightness of the
light-emitting device 100 can increase by 15%.
[0052] FIG. 2 illustrates a cross sectional view of a
light-emitting device 200 according to another embodiment of the
invention, The light-emitting device 200 includes the substrate
110, the light-emitting component 120, the wavelength conversion
layer 130, the adhesive layer 140 and the reflective layer 150,
[0053] In comparison with the light-emitting device 100, the
top-viewed area of the wavelength conversion layer 130 of the
light-emitting device 200 is substantially equal to the top-viewed
area of the light-emitting component 120 of the light-emitting
device 200, that is, the ratio of the top-viewed area of the
wavelength conversion layer 130 and the top-viewed area of the
light-emitting component 120 is about 1. Due the first lateral
portion 141 of the adhesive layer 140 being removed, the entire
lateral surface 120s of the light-emitting is component 120 and the
entire lateral surface 142s of the heat resistance layer 142 of the
adhesive layer 140 are exposed, and accordingly the entire lateral
surface 120s of the light-emitting component 120 and the entire
lateral surface 142s of the heat resistance layer 142 of the
adhesive layer 140 can be covered by the reflective layer 150.
Furthermore, since the lateral surface 120s of the light-emitting
component 120, the lateral surface 130s of the wavelength
conversion layer 130 and the lateral surface 142s of the heat
resistance layer 142 of the adhesive layer 140 can be formed in the
same singulation process, the lateral surface 120s, the lateral
surface 130s and the lateral surface 142s are substantially aligned
or flush with each other.
[0054] FIG. 3 illustrates a cross sectional view of a
light-emitting device 300 according to another embodiment of the
invention. The light-emitting device 300 includes the substrate
110, the light-emitting component 120, the wavelength conversion
layer 130, the adhesive layer 140 and the reflective layer 150.
[0055] In comparison with the light-emitting device 100, the
reflective layer 150 of the light-emitting device 300 further
covers a lateral surface 110s of the substrate 110, and accordingly
it can prevent or reduce the damage by the exterior environmental
factors (such as air, water, gas, etc.) through the lateral surface
110s of the substrate 110. Furthermore, due to the reflective layer
150 covering the lateral surface 110s of the substrate 110, it can
increase a length of a path P1 from the exterior environmental to
the electrode (the first electrode 121 and/or the second electrode
122) of the light-emitting is component 120 (in comparison with the
path P1 of FIG. 1, the length of the path P1 of the present
embodiment is longer), and accordingly it can reduce the
probability of the light-emitting component 120 being damaged by
the environmental factors for increasing the reliability and life
of the light-emitting device 300.
[0056] In another embodiment, the top-viewed area of the wavelength
conversion layer 130 of the light-emitting device 300 is
substantially equal to the top-viewed area of the light-emitting
component 120. Such structure is similar to the structure of the
light-emitting device 200, and the similarities are not
repeated.
[0057] FIG. 4 illustrates a cross sectional view of a
light-emitting device 400 according to another embodiment of the
invention. The light-emitting device 400 includes the substrate
110, a plurality of the light-emitting components 120, the
wavelength conversion layer 130, the adhesive layer 140 and the
reflective layer 150. The light-emitting components 120 are
disposed on the substrate 110. The adhesive layer 140 covers at
least a portion of the lateral surface 120s of each light-emitting
component 120.
[0058] In comparison with the aforementioned light-emitting device,
a portion of the adhesive layer 140 of the light-emitting device
400 is further formed between adjacent two light-emitting
components 120. For example, the adhesive layer 140 further
includes a second lateral portion 143 located between two
light-emitting components 120, and the second lateral portion 143
has a lower surface 143s, wherein the lower surface 143s is a
convex surface or a concave surface. The reflective layer 150 is
formed between adjacent two light-emitting components 120. For
example, the reflective layer 150 further includes a second
reflective portion 153, wherein the second reflective portion 153
is located between adjacent two light-emitting components 120. The
second reflective portion 153 has a second reflective surface 153s
complying with the lower surface 143s, and accordingly the second
reflective surface 153s is a concave surface. In another
embodiment, the lower surface 143s may be a concave surface, and
the second reflective surface 153s is a convex surface. The second
reflective surface 153s may reflect the light L1 emitted by the
light-emitting component 120 to the wavelength conversion layer
130, and accordingly it can increase the luminous efficiency of the
light-emitting device 400.
[0059] In another embodiment, the reflective layer 150 of the
light-emitting device 400 may further cover the lateral surface
110s of the substrate 110s. Such structure is similar to the
structure of the light-emitting device 300, and the similarities
are not repeated.
[0060] In another embodiment, the top-viewed area of the wavelength
conversion layer 130 of the light-emitting device 400 is
substantially equal to the top-viewed area of the light-emitting
component 120. Such structure is similar to the structure of the
light-emitting device 200, and the similarities are not
repeated.
[0061] FIGS. 5A to 5H illustrate manufacturing processes of the
light-emitting device 100 of FIG. 1.
[0062] As illustrated in FIG. 5A, a wavelength conversion resin
130' is formed on a carrier 10 by way of, for example, dispensing.
The wavelength conversion resin 130' contains a plurality of the
phosphor particles 133. The polarity of the carrier 10 and the
polarity of the wavelength conversion resin 130' are different, and
accordingly the wavelength conversion resin 130' and the carrier 10
may be easily detached. In addition, although not illustrated, the
carrier 10 may include a double-sided adhesive layer and a carrier
plate, wherein the double-sided adhesive layer is adhered to the
carrier plate for carrying the wavelength conversion resin
130'.
[0063] As illustrated in FIG. 5B, after the wavelength conversion
resin 130' is stood for a period such as 24 hours, most of the
phosphor particles 133 precipitate on a bottom of the wavelength
conversion resin 130' to form the high-density phosphor layer 131,
wherein the other of the phosphor particles 133 are distributed
within the other portion of the wavelength conversion layer
material 130' to form the low-density phosphor layer 132. The
high-density phosphor layer 131 and the low-density phosphor layer
132 form the wavelength conversion layer 130.
[0064] Then, the wavelength conversion layer 130 is cured. As a
result, the positions of the phosphor particles 133 can be fixed,
and accordingly it can prevent the density distribution of the
phosphor particles 133 within the wavelength conversion layer 130
from being easily changed.
[0065] Then, the carrier 10 and the wavelength conversion layer 130
are separated to expose the high-density phosphor layer 131 of the
wavelength conversion layer 130.
[0066] As illustrated in FIG. 50, the substrate 110 and at least
one light-emitting component 120 are provided, wherein the
light-emitting component 120 is disposed on the substrate 110. In
addition, the substrate 110 may be disposed on another carrier 10',
wherein the carrier 10' has a structure similar to that of the
carrier 10, and the similarities are not repeated.
[0067] Then, the high-density phosphor layer 131 of the wavelength
conversion layer 130 is adhered to the light-emitting component 120
by the adhesive layer 140. The following description will be made
with reference to the accompanying drawings.
[0068] As illustrated in FIG. 5D, the adhesive layer 140 is formed
on the upper surface 120u of the light-emitting component 120 by
way of, for example, applying or dispensing.
[0069] As illustrated in FIG. 5E, the wavelength conversion layer
130 is disposed on the adhesive layer 140, such that the adhesive
layer 140 adheres the light-emitting component 120 to the
high-density phosphor layer 131 of the wavelength conversion layer
130. Since the wavelength conversion layer 130 extrudes the
adhesive layer 140, the adhesive layer 140 flow toward two sides of
the light-emitting component 120 to form the first lateral portion
141. Due to surface tension, the lateral surface 141s of the first
lateral portion 141 forms a concave surface. Depending on the
amount of the adhesive layer 140 and/or the property of the
adhesive layer 140, the lateral surface 141s may form a convex
surface. In addition, depending on the amount of the adhesive layer
140 and/or the property of the adhesive layer 140, the first
lateral portion 141 may cover at least a portion of the lateral
surface 120s of the light-emitting component 120.
[0070] As illustrated in an enlargement view of FIG. 5E, a portion
of the adhesive layer 140 which remains on between the wavelength
conversion layer 130 and the light-emitting component 120 forms the
heat resistance layer 142. The heat resistance layer 142 may reduce
the heat of transmitting to the wavelength conversion layer 130
from the light-emitting component 120, and accordingly it can slow
the degrading speed of the wavelength conversion layer 130.
[0071] As illustrated in FIG. 5F, at least one first singulation
path W1 passing through the wavelength conversion layer 130 is
formed to cut off the wavelength conversion layer 130. In the
present embodiment, the first singulation path W1 does not pass
through the first lateral portion 141 of the adhesive layer 140. In
another embodiment, the first singulation path W1 may pass through
a portion of the first lateral portion 141. The lateral surface
130s of the wavelength conversion layer 130 is formed by the first
singulation path W1, wherein the lateral surface 130s may be a
plane or a curved surface.
[0072] The cutting width for forming the first singulation path W1
may be substantially equal to the width of the first singulation
path W1. Alternatively, after the first singulation path W1 is
formed, the double-sided adhesive layer (not illustrated) disposed
on the carrier 10' may be stretched to increase an interval between
adjacent two light-emitting components 120. Under such design, the
first singulation path W1 may be formed using a thin blade.
[0073] As illustrated in FIG. 5G, the fluid reflective layer 150 is
formed above the substrate 110 by way of, for example, compression
molding, wherein the reflective layer 150 covers a portion of the
lateral surface 120s of the light-emitting component 120, the
lateral surface 130s of the wavelength conversion layer 130, the
lateral surface 141s of the first lateral portion 141 of the
adhesive layer 140, the lateral surface of the third electrode 112
of the substrate 110, the lateral surface of the fourth electrode
113 of the substrate 110, the lateral surface of the first
electrode 121 of the light-emitting component 120 and the lateral
surface of the second electrode 122 of the light-emitting component
120.
[0074] In addition, the reflective layer 150 includes the first
reflective portion 151 surrounding the entire lateral surface 120s
of the light-emitting component 120. The first reflective portion
151 has the first reflective surface 151s, Due to the lateral
surface 141s of the adhesive layer 140 being a concave surface, the
first reflective surface 151s covering the lateral surface 141s is
a convex surface facing the wavelength conversion layer 130 and the
light-emitting component 120. The convex first reflective surface
151s can reflect the light L1 emitted from the lateral surface 120s
to the wavelength conversion layer 130, and accordingly it can
increase the luminous efficiency of the light-emitting device
100.
[0075] Since the first singulation path W1 of FIG. 5F does not pass
through the first lateral portion 141 of the adhesive layer 140,
the first reflective surface 151s of the reflective layer 150 can
contact the lower surface 130b of the wavelength conversion layer
130. As a result, the convex first reflective surface 151s connects
the lower surface 130b of the wavelength conversion layer 130 to
the lateral surface 120s of the light-emitting component 120, and
accordingly it can increase the contacting area of the light L1
emitted from the light-emitting component 120 and the convex
surface (the first reflective surface 151s).
[0076] Then, the reflective layer 150 is cured by way of
heating.
[0077] As illustrated in FIG. 5H, at least one second singulation
path W2 passing through the reflective layer 150 and the substrate
110 is formed to form the light-emitting device 100 of FIG. 1. The
first reflective surface 151s of the reflective layer 150 and the
lateral surface 110s of the substrate 110 are formed by the second
singulation path W2, wherein the first reflective surface 151s and
the lateral surface 110s are substantially aligned or flush with
each other.
[0078] In another embodiment, the second singulation path W2 may
pass through the wavelength conversion layer 130, the reflective
layer 150 and the substrate 110, such that the wavelength
conversion layer 130, the reflective layer 150 and the substrate
110 form the lateral surface 130s, the lateral surface 150s and
lateral surface 110s respectively, wherein the lateral surface
130s, the lateral surface 150s and lateral surface 110s are
substantially aligned or flush with each other.
[0079] In addition, the cutting width for forming the second
singulation path W2 may be substantially equal to the width of the
second singulation path W2. Alternatively, after the second
singulation path W2 is formed, the double-sided adhesive layer (not
illustrated) disposed on the carrier 10' may be stretched to
increase an interval between adjacent two light-emitting components
120. Under such design, the second singulation path W2 may be
formed using a thin blade.
[0080] FIGS. 6A to 6C illustrate another manufacturing processes of
the light-emitting device 100 of FIG. 1.
[0081] As illustrated in FIG. 6A, the adhesive layer 140 is formed
on the high-density phosphor layer 131 of the wavelength conversion
layer 130 by way of, for example, applying or dispensing.
[0082] As illustrated in FIG. 6B, the substrate 110 and the
light-emitting component 120 of FIG. 5C are disposed on the
adhesive layer 140, wherein the light-emitting component 120
contacts with the adhesive layer 140, such that the adhesive layer
140 adheres the light-emitting component 120 to the high-density
phosphor layer 131 of the wavelength conversion layer 130.
[0083] Due to the light-emitting component 120 extruding the
adhesive layer 140, the adhesive layer 140 flows toward two sides
of the light-emitting component 120 to form the first lateral
portion 141. Due to surface tension, the lateral surface 141s of
the first lateral portion 141 forms a concave surface. Depending on
the amount of the adhesive layer 140 and/or the property of the
adhesive layer 140, the first lateral portion 141 may cover at
least a portion of the lateral surface 120s of the light-emitting
component 120. In addition, as illustrated in an enlargement view
of FIG. 6B, a portion of the adhesive layer 140 which remains on
between the wavelength conversion layer 130 and the light-emitting
component 120 forms the heat resistance layer 142. The heat
resistance layer 142 may reduce the heat of transmitting to the
wavelength conversion layer 130 from the light-emitting component
120, and accordingly it can slow the degrading speed of the
wavelength conversion layer 130.
[0084] As illustrated in FIG. 6C, the light-emitting components
120, the wavelength conversion layer 130 and the substrate 110 are
inverted, such that the wavelength conversion layer 130 faces
upwardly.
[0085] The following steps are similar the corresponding steps of
FIGS. 5A to 5H, and the similarities are not repeated.
[0086] FIGS. 7A to 7C illustrate manufacturing processes of the
light-emitting device 200 of FIG. 2.
[0087] Firstly, the structure of FIG. 5E is formed by using the
processes of FIG. 5A to 5E, or the structure of FIG. 6C is formed
by using the processes of FIG. 6A to 6C.
[0088] Then, as illustrated in FIG. 7A, at least one first
singulation path W1 passing through the wavelength conversion layer
130 and the first lateral portion 141 which covers the lateral
surface 120s of the light-emitting component 120 is formed, by way
of cutting, to cut off the wavelength conversion layer 130 and
remove the first lateral portion 141. Since formation of the first
singulation path W1 cuts off the first lateral portion 141, such
that the entire lateral surface 120s of the light-emitting
component 120 and the entire lateral surface 142s of the heat
resistance layer 142 are be formed and exposed.
[0089] As illustrated in FIG. 7B, the fluid reflective layer 150 is
formed above the substrate 110 by way of, for example, compression
molding, wherein the reflective layer 150 covers the entire lateral
surface 120s of the light-emitting component 120, the entire
lateral surface 142s of the heat resistance layer 142, the entire
lateral surface 130s of the wavelength conversion layer 130, the
lateral surface of the third electrode 112 of the substrate 110,
the lateral surface of the fourth electrode 113 of the substrate
110, the lateral surface of the first electrode 121 of the
light-emitting component 120 and the lateral surface of the second
electrode 122 of the light-emitting component 120.
[0090] Then, the reflective layer 150 is cured by way of
heating.
[0091] As illustrated in FIG. 70, at least one second singulation
path W2 passing through the reflective layer 150 and the substrate
110 is formed, by way of cutting, to form the light-emitting device
200 of FIG. 2. The lateral surface 150s of the reflective layer 150
and the lateral surface 110s of the substrate 110 are formed by the
second singulation path W2, wherein the lateral surface 150s and
the lateral surface 110s are substantially aligned or flush with
each other.
[0092] FIGS, 8A to 8C illustrate manufacturing processes of the
light-emitting device 300 of FIG. 3.
[0093] Firstly, the structure of FIG, 5E is formed by using the
processes of FIG. 5A to 5E, or the structure of FIG, 60 is formed
by using the processes of FIG, 6A to 6C.
[0094] Then, as illustrated in FIG. 8A, at least one first
singulation path W1 passing through the wavelength conversion layer
130 and the substrate 110 is formed, by way of cutting, to cut off
the wavelength conversion layer 130 and the substrate 110. The
lateral surface 130s of the wavelength conversion layer 130 and the
lateral surface 110s of the substrate 110 are formed by the first
singulation path W1, wherein the lateral surface 130s and the
lateral surface 110s are substantially aligned or flush with each
other.
[0095] As illustrated in FIG. 8B, the fluid reflective layer 150 is
formed above the substrate 110 by way of, for example, dispensing,
wherein the reflective layer 150 covers a portion of the lateral
surface 120s of the light-emitting component 120, the lateral
surface 130s of the wavelength conversion layer 130, the lateral
surface 141s of the first lateral portion 141 of the adhesive layer
140, the lateral surface 110s of the substrate 110, the lateral
surface of the third electrode 112 of the substrate 110, the
lateral surface of the fourth electrode 113 of the substrate 110,
the lateral surface of the first electrode 121 of the
light-emitting component 120 and the lateral surface of the second
electrode 122 of the light-emitting component 120,
[0096] Then, he reflective layer 150 is cured by way of
heating.
[0097] As illustrated in FIG. 8C, at least one second singulation
path W2 passing through the reflective layer 150 is formed to form
the light-emitting device 300 of FIG. 3, wherein the lateral
surface 150s and the reflective layer 150 is formed by the second
singulation path W2.
[0098] In another embodiment, the second singulation path W2 may
pass through the wavelength conversion layer 130, the reflective
layer 150 and the substrate 110, such that the wavelength
conversion layer 130, the reflective layer 150 and the substrate
110 form the lateral surface 130s, the lateral surface 150s and
lateral surface 110s respectively, wherein the lateral surface
130s, the lateral surface 150s and lateral surface 110s are
substantially aligned or flush with each other.
[0099] FIGS. 9A to 9F illustrate manufacturing processes of the
light-emitting device 400 of FIG. 4.
[0100] As illustrated in FIG. 9A, the substrate 110 and a plurality
of the light-emitting components 120 are provided, wherein the
light-emitting components 120 are disposed on the substrate
110.
[0101] As illustrated in FIG, 9A, the substrate 110 and the
light-emitting components 120 are disposed on the carrier 10'.
[0102] As illustrated in FIG. 9B, the adhesive layer 140 is formed
on the upper surface 120u of the light-emitting component 120 by
way of, for example, applying or dispensing.
[0103] As illustrated in FIG. 90, the wavelength conversion layer
130 is disposed on the adhesive layer 140, such that the adhesive
layer 140 adheres each light-emitting component 120 to the
high-density phosphor layer 131 of the wavelength conversion layer
130. Since the wavelength conversion layer 130 extrudes the
adhesive layer 140, the adhesive layer 140 flow toward two sides of
the light-emitting component 120 to form the first lateral portion
141. The first lateral portion 141 has the lateral surface 141s.
Due to surface tension, the lateral surface 141s is a concave
surface. However, depending on the amount of the adhesive layer 140
and/or the property of the adhesive layer 140, the lateral surface
141s may form a convex surface facing substrate 110. In addition,
depending on the amount of the adhesive layer 140 and/or the
property of the adhesive layer 140, the first lateral portion 141
may cover at least a portion of the lateral surface 120s of the
light-emitting component 120.
[0104] As illustrated in an enlargement view of FIG, 9C, a portion
of the adhesive layer 140 which remains on between the wavelength
conversion layer 130 and the light-emitting component 120 forms the
heat resistance layer 142. The heat resistance layer 142 can
increase the heat resistance between the light-emitting component
120 and the wavelength conversion layer 130, and accordingly it can
slow the degrading speed of the wavelength conversion layer
130.
[0105] In addition, the adhesive layer 140 further includes the
second lateral portion 143 which is formed between adjacent two
light-emitting components 120. The second lateral portion 143 has
the lower surface 143s. Due to surface tension, the lower surface
143s forms a concave surface facing the substrate 110. However,
depending on the amount of the adhesive layer 140 and/or the
property of the adhesive layer 140, the lower surface 143s may be a
concave surface facing the substrate 110.
[0106] As illustrated in FIG. 9D, at least one first singulation
path W1 is passing through the wavelength conversion layer 130 is
formed to cut off the wavelength conversion layer 130. In the
present embodiment, the first singulation path W1 does not pass
through the first lateral portion 141 of the adhesive layer 140. In
another embodiment, the first singulation path W1 may pass through
a portion of the first lateral portion 141 or the entire first
lateral portion 141.
[0107] As illustrated in FIG. 9E, the fluid reflective layer 150 is
formed above the substrate 110 by way of, for example, dispensing,
wherein the reflective layer 150 covers a portion of the lateral
surface 120s of the light-emitting component 120, the lateral
surface 130s of the wavelength conversion layer 130, the lateral
surface 141s of the first lateral portion 141 of the adhesive layer
140, the lower surface 143s of the second lateral portion 143, the
lateral surface of the third electrode 112 of the substrate 110,
the lateral surface of the fourth electrode 113 of the substrate
110, the lateral surface of the first electrode 121 of the
light-emitting component 120 and the lateral surface of the second
electrode 122 of the light-emitting component 120 through the first
singulation path W1.
[0108] In addition, the reflective layer 150 includes the first
reflective portion 151 and the second reflective portion 153,
wherein the first reflective portion 151 covers the first lateral
portion 141, and the second reflective portion 153 covers the
second lateral portion 143. The first reflective portion 151 has
the first reflective surface 151s complying with the lateral
surface 141s, and the first reflective surface 151s is a convex
surface due to the lateral surface 141s being a concave surface.
The second reflective portion 153 has the second reflective surface
153s complying with the lower surface 143s, and the second
reflective surface 153s is a concave surface due to the lateral
surface 141s being a convex surface.
[0109] Then, the reflective layer 150 is cured by way of
heating.
[0110] As illustrated in FIG. 9F, at least one second singulation
path W2 passing through the reflective layer 150 and the substrate
110 is formed to form the light-emitting device 400 of FIG. 4. The
lateral surface 150s of the reflective layer 150 and the lateral
surface 110s of the substrate 110 are formed by the second
singulation path W2, wherein the lateral surface 150s and the
lateral surface 110s are substantially aligned or flush with each
other.
[0111] In another embodiment, the second singulation path W2 may
pass through the wavelength conversion layer 130, the reflective
layer 150 and the substrate 110, such that the wavelength
conversion layer 130, the reflective layer 150 and the substrate
110 form the lateral surface 130s, the lateral surface 150s and
lateral surface 110s respectively, wherein the lateral surface
130s, the lateral surface 150s and lateral surface 110s are
substantially aligned or flush with each other.
[0112] In other embodiment, the reflective layer 150 of the
light-emitting device 400 may cover the lateral surface 120s of at
least one light-emitting component 120, the lateral surface 142s of
the heat resistance layer 142 and the lateral surface 130s of the
wavelength conversion layer 130 by using processes of FIGS. 7A to
7C.
[0113] In other embodiment, the reflective layer 150 of the
light-emitting device 400 may cover the lateral surface 110s of the
substrate 110 by using processes of FIGS. 8A to 8B.
[0114] FIG. 10 illustrates a cross sectional view of a
light-emitting device 500 according to another embodiment of the
invention. The light-emitting device 500 includes the substrate
110, the light-emitting component 120, the wavelength conversion
layer 130, the adhesive layer 140, the reflective layer 150 and a
translucent encapsulant 560, wherein the light-emitting component
120, the wavelength conversion layer 130, the adhesive layer 140,
the reflective layer 150 forms a light-emitting chip 500'.
[0115] It is different from the aforementioned light-emitting
device is that the reflective layer 150 of the light-emitting
device 500 does not cover the electrodes (for example, the first
electrode 121 and the second electrode 122) of the light-emitting
component 120. In addition, the reflective layer 150 and the
light-emitting components 120 have a lower surface 150b and a lower
surface 120b, respectively, wherein the lower surface 150b does not
project from lower surface 120b. For example, the lower surface
150b and the surface 120b are substantially aligned or flush with
each other. In another embodiment, the lower surface 150b is
recessed with respect to the lower surface 120b.
[0116] It is different from the light-emitting device 100 is that
the light-emitting device 500 further include the translucent
encapsulant 560 formed on the substrate 110 and encapsulating the
entire light-emitting chip 500', wherein the translucent
encapsulant 560 further encapsulates the first electrode 121 and
the second electrode 122. In comparison with the light-emitting
device 100 of FIG. 1, the translucent encapsulant 560 of the
present embodiment makes the light L1 emitted from the
light-emitting chip 500' more uniform. In addition, as illustrated
in figure, the translucent encapsulant 560 has a light-emitting
surface 560s. The light-emitting surface 560s is formed by way of,
for example, dispensing, such that the light-emitting surface 560s
forms an arc light emitting surface. The arc light-emitting surface
560s may concentrate the light L1 passing through the
light-emitting surface 560s in the direction of the optical axis to
increase the concentration of the light. In the present embodiment,
the light-emitting surface 560s may extend continuously to the
substrate 110. The light-emitting surface 560s is formed by way of
dispensing and not cut, such that it can maintain intact arc
surface extending to the substrate 110.
[0117] The translucent encapsulant 560 includes, but is not limited
to, silicone, epoxy resin or other synthetic resin suitable for
packaging. The translucent encapsulant 560 may be an encapsulant
without wavelength conversion property. That is, the translucent
sealant 560 does not contain fluorescent particles. In another
embodiment, the translucent encapsulant 560 may contain fluorescent
particles to convert the wavelength of the light passing
therethrough.
[0118] FIG. 11 illustrates a cross sectional view of a
light-emitting device 600 according to another embodiment of the
invention. The light-emitting device 600 includes the substrate
110, the light-emitting component 120, the wavelength conversion
layer 130, the adhesive layer 140, the reflective layer 150 and a
translucent encapsulant 660, wherein the light-emitting component
120, the wavelength conversion layer 130, the adhesive layer 140,
the reflective layer 150 form a light-emitting chip 500'.
[0119] It is different from the light-emitting device 500 is that
the translucent encapsulant 660 of the light-emitting device 600
has a light-emitting surface 560s and a lateral surface 660s
connecting the lateral surface 110s of the substrate 110 with the
light-emitting surface 560s. Due to the lateral surface 660s of the
translucent encapsulant 660 and the lateral surface 110s of the
substrate 110 being formed in the same singulation process, the
lateral surface 660s and the lateral surface 110s are plane, and
the lateral surface 660s and the lateral surface 110s are
substantially aligned or flush with each other. In addition, the
translucent encapsulant 660 may be made of a material similar to
that of the translucent encapsulant 560, and the similarities are
not repeated herein again.
[0120] FIG. 12 illustrates a cross sectional view of a
light-emitting device 700 according to another embodiment of the
invention. The light-emitting device 700 includes the substrate
110, the light-emitting component 120, the wavelength conversion
layer 130, the heat resistance layer 142 of the adhesive layer 140,
the reflective layer 150 and the translucent encapsulant 560,
wherein the light-emitting component 120, the wavelength conversion
layer 130, the heat resistance layer 142 of the adhesive layer 140
and the reflective layer 150 form a light-emitting chip 600'.
[0121] It is different from the light-emitting device 200 is that
the reflective layer 150 of the light-emitting device 700 does not
encapsulate the electrodes (for example, the first electrode 121
and the second electrode 122) of the light-emitting component 120.
In addition, the reflective layer 150 and the light-emitting
components 120 have the lower surface 150b and the lower surface
120b, respectively, wherein the lower surface 150b does not project
from lower surface 120b. For example, the lower surface 150b and
the surface 120b are substantially aligned or flush with each
other. In another embodiment, the lower surface 150b is recessed
with respect to the lower surface 120b.
[0122] It is different from the light-emitting device 200 is that
the light-emitting device 700 further include the translucent
encapsulant 560 formed on the substrate 110 and encapsulating the
entire light-emitting chip 600'. The translucent encapsulant 560
may make the light L1 emitted from the light-emitting chip 600'
more uniform. As illustrated in figure, the translucent encapsulant
560 has the light-emitting surface 560s. The translucent
encapsulant 560 is formed by way of, for example, dispensing, such
that the light-emitting surface 560s forms an arc light emitting
surface. The arc light-emitting surface 560s can concentrate the
light L1 passing through the light-emitting surface 560s in the
direction of the optical axis to increase the concentration of the
light. In the present embodiment, the light-emitting surface 560s
may extend continuously to the substrate 110. The light-emitting
surface 560s is formed by way of dispensing and not cut, such that
it can maintain intact arc surface extending to the substrate
110.
[0123] In another embodiment, the translucent encapsulant 560 of
the light-emitting device 700 may have similar lateral surface
similar to the lateral surface 660s substantially aligned or flush
with the substrate lateral of the substrate.
[0124] FIG. 13 illustrates a cross sectional view of a
light-emitting device 800 according to another embodiment of the
invention. The light-emitting device 800 includes the substrate
110, the light-emitting component 120, the wavelength conversion
layer 130, the heat resistance layer 142 of the adhesive layer 140,
the reflective layer 150 and the translucent encapsulant 660.
[0125] It is different from the light-emitting device 600 is that
the translucent encapsulant 660, the reflective layer 150 and the
substrate 110 of the light-emitting device 800 have the lateral
surface 660s, a first lateral surface 150s1 and the lateral surface
110s respectively. Due to the lateral surface 660s, the first
lateral surface 150s1 and the lateral surface 110s being formed in
the same singulation process, the lateral surface 660s, the first
lateral surface 150s1 and the lateral surface 110s are
substantially aligned or flush with each other. In addition, the
reflective layer 150 further has a second lateral surface 150s2,
wherein the second lateral surface 150s2 is recessed with respect
to the first lateral surface 150s1, and the translucent encapsulant
660 further covers the second lateral surface 150s2.
[0126] It is different from the light-emitting device 600 in that
the light-emitting device 800 of the present embodiment is formed
on the substrate 110 and encapsulates the electrode (for example,
the first electrode 121 and the second electrode 122) of the
light-emitting component 120.
[0127] FIG. 14 illustrates a cross sectional view of a
light-emitting device 900 according to another embodiment of the
invention. The light-emitting device 900 includes the substrate
110, the light-emitting component 120, the wavelength conversion
layer 130, the reflective layer 150 and the translucent encapsulant
660.
[0128] It is different from the light-emitting device 800 is that
the lateral surface 660s of the translucent encapsulant 660 and the
lateral surface 110s of the substrate 110 are substantially aligned
or flush with each other. In addition, the reflective layer 150 has
the first lateral surface 150s1 extending to the substrate 110, and
the translucent encapsulant 660 covers the second lateral surface
150s2 of the reflective layer 150.
[0129] FIG. 15 illustrates a cross sectional view of a
light-emitting device 1000 according to another embodiment of the
invention. The light-emitting device 1000 includes the substrate
110, a plurality of the light-emitting chips 500' and a plurality
of the translucent encapsulants 560. It is different from the
light-emitting device 500 is that the number of the light-emitting
chips 500' of the light-emitting device 1000 is more than one. As
illustrated in figure, each light-emitting chip 500' is
encapsulated by one translucent encapsulant 560. In addition, as
viewed in top view of the structure of FIG. 15, the light-emitting
chips 500' may be arranged in an array of 2.times.2. In another
embodiment, the light-emitting chips 500' may be arranged in an
array of n.times.m, where n and m are positive integers greater
than 1, and n and m may be the same or different. In other
embodiment, the light-emitting chips 500' may be irregularly
arranged or arranged according to a light-emitting requirement, The
embodiment of the present invention is not limited to the
arrangement of the light-emitting chips 500'.
[0130] FIG. 16 illustrates a cross sectional view of a
light-emitting device 1100 according to another embodiment of the
invention. The light-emitting device 1100 includes the substrate
110, a plurality of the light-emitting chips 600' and a plurality
of the translucent encapsulants 560. It is different from the
light-emitting device 700 is that the number of the light-emitting
chips 600' of the light-emitting device 1100 is more than one. As
illustrated in figure, each light-emitting chip 600' is
encapsulated by one translucent encapsulant 560. In addition, as
viewed in top view of the structure of FIG. 16, the light-emitting
chips 600' may be arranged in an array of 2.times.2. In another
embodiment, the light-emitting chips 600' may be arranged in an
array of n.times.m, where n and m are positive integers greater
than 1, and n and m may be the same or different. In other
embodiments, the light-emitting chips 600' may be irregularly
arranged or arranged according to a light-emitting requirement. The
embodiment of the present invention is not limited to the
arrangement of the light-emitting chips 600'.
[0131] In addition, in another embodiment, the wavelength
conversion layer 130 (translucent layertranslucent layer) of each
aforementioned embodiment may be replaced by glass layer
(translucent layer), wherein the glass layer may be signal-layered
glass structure or multi-layered glass structure.
[0132] FIGS, 17A to 17G illustrate manufacturing processes of the
light-emitting device 500 of FIG. 10.
[0133] Firstly, the structure of FIG, 6A may be formed by the steps
of FIGS. 5A, 5B and 6A.
[0134] Then, as illustrated in FIG. 17A, the light-emitting
components 120 are disposed on the corresponding adhesive layer
140. In an embodiment, the wavelength conversion layer 130 of FIG.
6A may be disposed on the carrier 10, and then the adhesive layer
140 is formed.
[0135] As illustrated in FIG. 17B, at least one first singulation
path W1 passing through the wavelength conversion layer 130 is
formed, by way of laser or cutting tool, to cut off the wavelength
conversion layer 130. In the present embodiment, the first
singulation path W1 does not pass through the adhesive layer 140.
In another embodiment, the first singulation path W1 may pass
through the adhesive layer 140. Due to the wavelength conversion
layer 130 being formed on the carrier 10, the cut off wavelength
conversion layer 130 does not come off from the carrier 10.
[0136] As illustrated in FIG. 17C, the reflective layer 150 in
fluid state is formed above the carrier 10 by way of, for example,
compression molding, wherein the reflective layer 150 covers a
portion of the lateral surface 120s of the light-emitting component
120, the lateral surface 130s of the wavelength conversion layer
130 and the lateral surface 141s of the first lateral portion 141
of the adhesive layer 140 through the first singulation path W1 (as
illustrated in FIG. 17B), but not covers the first electrode 121
and the second electrode 122 of the light-emitting component 120
for exposing the first electrode 121 and the second electrode
122.
[0137] As illustrated in FIG. 17D, at least one second singulation
path W2 passing through the reflective layer 150 is formed, by way
of laser or cutting tool, to form at least one light-emitting chip
500', wherein the light-emitting chip 500' includes the
light-emitting component 120, the wavelength conversion layer 130,
the adhesive layer 140 and the reflective layer 150.
[0138] As illustrated in FIG. 17E, a plurality of the
light-emitting chips 500' of FIG. 17D may be disposed on the
substrate 110 by using, for example, Surface Mount Technology
(SMT). Before disposing the light-emitting chip 500' on the
substrate 110, the substrate 110 is adhered to another carrier 10',
and then the light-emitting chips 500' are disposed on the
substrate 110. Due to the first electrode 121 and the second
electrode 122 being exposed in the step of FIG. 17C, the exposed
first electrode 121 and the second electrode 122 may be
electrically connected to the substrate 110 in the step of FIG.
17E.
[0139] As illustrated in FIG. 17F, a plurality of the translucent
encapsulants 560 are formed to cover the light-emitting chips 500'
by using a dispensing technique, wherein one translucent
encapsulant 560 encapsulates one light-emitting chip 500'. Then,
the translucent encapsulants 560 is heated to be solidified.
[0140] As illustrated in FIG. 17G, at least one third singulation
path W3 passing through the wavelength conversion layer 130 is
formed, by way of laser or cutting tool, to form at least one
light-emitting device 500 of FIG. 10.
[0141] FIG. 18 illustrates manufacturing process of the
light-emitting device 600 of FIG. 11. As illustrated in figure, at
least one third singulation path W3 passing through the translucent
encapsulant and the substrate 110 of FIG. 17F is formed, by way of
laser or cutting tool, to form at least one light-emitting device
600 of FIG. 11. After singulating, the translucent encapsulant 660
and the substrate 110 form the lateral surface 660s and the lateral
surface 110s respectively, wherein the lateral surface 660s and the
lateral surface 110s are substantially aligned or flush with each
other. Due to the substrate 110 being adhered to the carrier 10',
the cut off light-emitting device 600 does not come off the carrier
10.
[0142] The following steps of the light-emitting device 600 are
similar the corresponding steps of the light-emitting device 500,
and the similarities are not repeated.
[0143] FIGS. 19A to 19F illustrate manufacturing processes of the
light-emitting device 700 of FIG. 12.
[0144] Firstly, as illustrated in FIG. 19A, at least one first
singulation path
[0145] W1 passing through the wavelength conversion layer 130 and
the first lateral portion 141 of the adhesive layer 140 of FIG. 17A
is formed, by way of laser or cutting tool. Due the wavelength
conversion layer 130 being adhered to the carrier 10, the cut off
wavelength conversion layer 130 does not come off the carrier
10.
[0146] As illustrated in FIG. 19B, the reflective layer 150 in a
fluid state is formed above the carrier 10 by way of, for example,
compression molding, wherein the reflective layer 150 covers the
lateral surface 120s of the light-emitting component 120 and the
lateral surface 130s of the wavelength conversion layer 130 through
the first singulation path W1 (as illustrated in FIG. 19A), but not
covers the first electrode 121 and the second electrode 122 of the
light-emitting component 120 for exposing the first electrode 121
and the second electrode 122.
[0147] As illustrated in FIG. 19C, at least one second singulation
path W2 passing through (cut off) the reflective layer 150 is
formed, by way of laser or cutting tool, to form at least one
light-emitting chip 600', wherein the light-emitting chip 600'
includes the light-emitting component 120, the wavelength
conversion layer 130, the heat resistance layer 142 (not
illustrated in FIG. 190) of the adhesive layer 140 and the
reflective layer 150.
[0148] As illustrated in FIG. 19D, a plurality of the
light-emitting chips 600' of FIG. 190 are disposed on the substrate
110 by using, for example, SMT. Before disposing the light-emitting
chip 600' on the substrate 110, the substrate 110 may be adhered to
another carrier 10', and then the light-emitting chips 600' are
disposed on the substrate 110. Due to the first electrode 121 and
the second electrode 122 being exposed in the step of FIG. 19B, the
exposed first electrode 121 and the second electrode 122 may be
electrically connected to the substrate 110 in the step of FIG.
19D.
[0149] As illustrated in FIG. 19E, a plurality of the translucent
encapsulants 560 encapsulating the light-emitting chips 600' are
formed by using a dispensing technique, wherein one translucent
encapsulant 560 encapsulates one light-emitting chip 600'. Then,
the translucent encapsulants 560 is heated to be solidified.
[0150] As illustrated in FIG. 19F, at least one third singulation
path W3 passing through (cut off) the substrate 110 is formed, by
way of laser or cutting tool, to form at least one light-emitting
device 700 of FIG. 12.
[0151] FIGS. 20A to 20C illustrate manufacturing processes of the
light-emitting device 800 of FIG. 13.
[0152] Firstly, as illustrated in FIG. 20A, after the step of FIG.
5G, at least one second singulation path W2 passing through a
portion of the reflective layer 150 of FIG. 5G, that is, the
reflective layer 150 is not cut off. After singulating, the
reflective layer 150 forms the second lateral surface 150s2.
[0153] Then, as illustrated in FIG. 20B, a plurality of the
translucent encapsulants 660 in fluid state are formed, by way of,
for example, compression molding, to encapsulant an upper surface
130u of the wavelength conversion layer 130 and the second lateral
surface 150s2 of the reflective layer 150. Due to the translucent
encapsulant 660 being in the fluid state, adjacent two translucent
encapsulants 660 are connected with each other through the second
singulation path W2.
[0154] Then, as illustrated in FIG. 200, at least one third
singulation path W3 passing through the translucent encapsulant
660, the reflective layer 150 and the substrate 110 is formed, by
way of laser or cutting tool, to form at least one light-emitting
device 800 of FIG. 13. After singulating, the translucent
encapsulant 660, the reflective layer 150 and the substrate 110
form the lateral surface 660s, the first lateral surface 150s1 and
the lateral surface 110s, respectively, wherein the lateral surface
660s, the first lateral surface 150s1 and the lateral surface 110s
are substantially aligned or flush with each other. Due to the
third singulation path W3 having a width less than that of the
second singulation path W2, formation of the third singulation path
W3 does not cut the second lateral surface 150s2 of the reflective
layer 150, such that the first lateral surface 150s1 and the second
lateral surface 150s2 form a step structure.
[0155] In addition, when the wavelength conversion layer 130 is
replaced by glass layer, in the aforementioned manufacturing
processes of the light-emitting devices, the wavelength conversion
layer 130 of FIG. 5A may be replaced by glass, and the step of FIG.
5B may be omitted.
[0156] FIGS. 21A to 21C illustrate manufacturing processes of the
light-emitting device 900 of FIG. 14.
[0157] Firstly, as illustrated in FIG. 21A, after the step of FIG.
5G, at least one second singulation path W2 passing through the
entire reflective layer 150 of FIG. 5G to cut off the reflective
layer 150. After singulating, the reflective layer 150 forms the
first lateral surface 150s1 extending to the substrate 110.
[0158] Then, as illustrated in FIG. 21B, a plurality of the
translucent encapsulants 660 in fluid state are formed, by way of,
for example, compression molding, to encapsulate the upper surface
130u of the wavelength conversion layer 130 and the first lateral
surface 150s1 of the reflective layer 150. Due to the translucent
encapsulant 660 being in the fluid state, adjacent two translucent
encapsulants 660 are connected with each other through the second
singulation path W2.
[0159] Then, as illustrated in FIG. 210, at least one third
singulation path W3 passing through the translucent encapsulant 660
and the substrate 110 is formed, by way of laser or cutting tool,
to form at least one light-emitting device 900 of FIG. 14. After
singulating, the translucent encapsulant 660 and the substrate 110
form the lateral surface 660s and the lateral surface 110s,
respectively, wherein the lateral surface 660s and the lateral
surface 110s are substantially aligned or flush with each other.
Due to the third singulation path W3 having a width less than that
of the second singulation path W2, formation of the third
singulation path W3 does not cut the first lateral surface 150s1 of
the reflective layer 150.
[0160] FIG. 22 illustrates manufacturing process of the
light-emitting device 1000 of FIG. 15. At least one third
singulation path W3 passing through the substrate 110 of FIG. 17F
is formed, by way of laser or cutting tool, to form at least one
light-emitting device 1000 of FIG. 15. After singulating, the
light-emitting device 1000 includes a plurality of the
light-emitting chips 500' and a plurality of the translucent
encapsulants 560, wherein one translucent encapsulant 560
encapsulates one light-emitting chip 500'.
[0161] FIG. 23 illustrates manufacturing process of the
light-emitting device 1100 of FIG. 16. At least one third
singulation path W3 passing through the substrate 110 of FIG. 19E
is formed, by way of laser or cutting tool, to form at least one
light-emitting device 1100 of FIG. 16. After singulating, the
light-emitting device 1100 includes a plurality of the
light-emitting chips 600' and a plurality of the translucent
encapsulants 560, wherein one translucent is encapsulant 560
encapsulates one light-emitting chip 600'.
[0162] It will be apparent to those skilled in the art that various
modifications and variations can be made to the disclosed
embodiments. It is intended that the specification and examples be
considered as exemplary only, with a true scope of the disclosure
being indicated by the following claims and their equivalents.
* * * * *