loadpatents
Patent applications and USPTO patent grants for Hung; Chin-Hua.The latest application filed is for "light emitting device".
Patent | Date |
---|---|
Light Emitting Device App 20210159369 - Hung; Cheng-Wei ;   et al. | 2021-05-27 |
Manufacturing method Grant 10,957,674 - Hung , et al. March 23, 2 | 2021-03-23 |
Light emitting device Grant 10,910,523 - Hung , et al. February 2, 2 | 2021-02-02 |
Light emitting apparatus and manufacturing method thereof Grant 10,854,780 - Hung , et al. December 1, 2 | 2020-12-01 |
Light emitting device Grant 10,784,423 - Hung , et al. Sept | 2020-09-22 |
Manufacturing Method App 20200105725 - Hung; Cheng-Wei ;   et al. | 2020-04-02 |
Light Emitting Device And Manufacturing Method Thereof App 20200083419 - Wang; Yun-Han ;   et al. | 2020-03-12 |
Manufacturing Method Of Light-emitting Device App 20190371983 - Hung; Chin-Hua ;   et al. | 2019-12-05 |
Light-emitting device Grant 10,497,681 - Hung , et al. De | 2019-12-03 |
Light-emitting device and manufacturing method thereof Grant 10,388,838 - Hung , et al. A | 2019-08-20 |
Light Emitting Device App 20190165232 - Hung; Cheng-Wei ;   et al. | 2019-05-30 |
Light Emitting Apparatus And Manufacturing Method Thereof App 20190157503 - Hung; Cheng-Wei ;   et al. | 2019-05-23 |
Light Emitting Device App 20180294388 - Hung; Cheng-Wei ;   et al. | 2018-10-11 |
Package method and package Grant 10,090,445 - Hung , et al. October 2, 2 | 2018-10-02 |
Manufacturing Method Of Semiconductor Light-emitting Device App 20180261572 - Hung; Chin-Hua ;   et al. | 2018-09-13 |
Light-emitting Device App 20180211942 - Hung; Cheng-Wei ;   et al. | 2018-07-26 |
Light emitting diode package structure and manufacturing method thereof Grant 10,032,747 - Hung , et al. July 24, 2 | 2018-07-24 |
Light emitting device and manufacturing method thereof Grant 9,997,676 - Hung , et al. June 12, 2 | 2018-06-12 |
Light-emitting Device And Manufacturing Method Thereof App 20180138378 - Hung; Chin-Hua ;   et al. | 2018-05-17 |
Light-emitting device Grant 9,922,963 - Hung , et al. March 20, 2 | 2018-03-20 |
Package Method And Package App 20170288100 - Hung; Chin-Hua ;   et al. | 2017-10-05 |
Package method and package Grant 9,685,596 - Hung , et al. June 20, 2 | 2017-06-20 |
Light-emitting Device App 20170084587 - Hung; Cheng-Wei ;   et al. | 2017-03-23 |
Light Emitting Device And Manufacturing Method Thereof App 20170005238 - Hung; Cheng-Wei ;   et al. | 2017-01-05 |
Chip Package Structure And Method Of Manufacturing The Same App 20160276546 - Lee; Hao-Chung ;   et al. | 2016-09-22 |
Semiconductor Light-emitting Device And The Manufacturing Method Thereof App 20160276320 - Hung; Chin-Hua ;   et al. | 2016-09-22 |
Light Emitting Diode Package Structure And Manufacturing Method Thereof App 20160276543 - Hung; Chin-Hua ;   et al. | 2016-09-22 |
Method Of Forming A Layer Of Glue On A Work Piece App 20160067728 - Tsai; Tai-Cheng ;   et al. | 2016-03-10 |
Package Structure And Manufacturing Method Thereof App 20150325762 - Hsu; Shou-Wen ;   et al. | 2015-11-12 |
Package Method And Package App 20150318453 - Hung; Chin-Hua ;   et al. | 2015-11-05 |
Spray Coating Apparatus App 20140252118 - Tsai; Tai-Cheng ;   et al. | 2014-09-11 |
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