U.S. patent application number 16/128628 was filed with the patent office on 2019-11-21 for resin compositon, removable adhesive layer, ic substrate, and ic packaging process.
The applicant listed for this patent is Qi Ding Technology Qinhuangdao Co., Ltd.. Invention is credited to MAO-FENG HSU, YU-CHENG HUANG, KUO-SHENG LIANG, MEI-JU PAN.
Application Number | 20190352548 16/128628 |
Document ID | / |
Family ID | 68532793 |
Filed Date | 2019-11-21 |
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United States Patent
Application |
20190352548 |
Kind Code |
A1 |
LIANG; KUO-SHENG ; et
al. |
November 21, 2019 |
RESIN COMPOSITON, REMOVABLE ADHESIVE LAYER, IC SUBSTRATE, AND IC
PACKAGING PROCESS
Abstract
A resin composition comprises a styrene-butadiene-styrene block
copolymer. The resin composition further comprises a plurality of
hydrated inorganic substances and/or a plurality of microcapsule
particles dispersed in the styrene-butadiene-styrene block
copolymer. The hydrated inorganic substances dehydration to form
anhydrous inorganic substances at a dehydration temperature greater
than 250 degrees Celsius. Each microcapsule particle comprises a
housing and an embedded object encapsulated in the housing. The
embedded object will largely volatilize from the housing at an
escaping temperature greater than 250 degrees Celsius. A removable
adhesive layer, an IC substrate, and an IC packaging process are
also provided.
Inventors: |
LIANG; KUO-SHENG; (Taoyuan,
TW) ; PAN; MEI-JU; (Taoyuan, TW) ; HSU;
MAO-FENG; (Taoyuan, TW) ; HUANG; YU-CHENG;
(Taoyuan, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Qi Ding Technology Qinhuangdao Co., Ltd. |
Qinhuangdao |
|
CN |
|
|
Family ID: |
68532793 |
Appl. No.: |
16/128628 |
Filed: |
September 12, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C08K 7/16 20130101; C08K
2201/007 20130101; H01L 2224/83005 20130101; C08K 9/10 20130101;
C08K 3/22 20130101; H01L 21/6835 20130101; H01L 23/3121 20130101;
C08K 2003/2227 20130101; C08L 53/02 20130101; C08L 53/02 20130101;
C08K 9/10 20130101; C08K 3/22 20130101; H01L 21/568 20130101; H01L
23/4985 20130101; C09J 153/02 20130101; C08K 2003/2224 20130101;
C08K 5/07 20130101; C08K 2201/003 20130101 |
International
Class: |
C09J 153/02 20060101
C09J153/02; H01L 21/56 20060101 H01L021/56; H01L 21/683 20060101
H01L021/683; C08K 7/16 20060101 C08K007/16; C08K 3/22 20060101
C08K003/22; C08K 5/07 20060101 C08K005/07 |
Foreign Application Data
Date |
Code |
Application Number |
May 15, 2018 |
TW |
107116384 |
Claims
1. A resin composition comprising: a styrene-butadiene-styrene
block copolymer; and a plurality of hydrated inorganic substances
and/or a plurality of microcapsule particles dispersed in the
styrene-butadiene-styrene block copolymer wherein the plurality of
hydrated inorganic substances dehydrate to form anhydrous inorganic
substances at a dehydration temperature greater than 250 degrees
Celsius, each of the plurality of microcapsule particle comprises a
housing and an embedded object encapsulated therein, the embedded
object will volatilize from the housing at an escaping temperature
greater than 250 degrees Celsius.
2. The resin composition of claim 1, wherein the resin composition
comprises 100 parts by weight of the styrene-butadiene-styrene
block copolymer, at least one of 1 parts by weight to 50 parts by
weight of the plurality of hydrated inorganic substances and 5
parts by weight to 50 parts by weight of the plurality of
microcapsule particles.
3. The resin composition of claim 1, wherein the
styrene-butadiene-styrene block copolymer has a chemical structural
formula of ##STR00002## a degree of polymerization x is about 30 to
about 90, a degree of polymerization y is about 10 to about 70, a
degree of polymerization m and a degree of polymerization n each is
a natural number greater than 1.
4. The resin composition of claim 1, wherein the plurality of
hydrated inorganic substances is selected from at least one of
aluminum hydroxide and magnesium hydroxide.
5. The resin composition of claim 1, wherein the embedded object is
cis-Jasmone.
6. The resin composition of claim 1, wherein each of the plurality
of microcapsule particles has a grain diameter of about 3 .mu.m to
about 12 .mu.m.
7. A removable adhesive layer formed by curing a resin composition,
the resin composition comprising: a styrene-butadiene-styrene block
copolymer; and a plurality of hydrated inorganic substances and/or
a plurality of microcapsule particles dispersed in the
styrene-butadiene-styrene block copolymer; wherein the plurality of
hydrated inorganic substances dehydrate to form anhydrous inorganic
substances at a dehydration temperature greater than 250 degrees
Celsius, each of the plurality of microcapsule particle comprises a
housing and an embedded object encapsulated therein, the embedded
object will largely volatilize from the housing at an escaping
temperature greater than 250 degrees Celsius.
8. The removable adhesive layer of claim 7, wherein the resin
composition comprises 100 parts by weight of the
styrene-butadiene-styrene block copolymer, at least one of 1 parts
by weight to 50 parts by weight of the plurality of hydrated
inorganic substances and 5 parts by weight to 50 parts by weight of
the plurality of microcapsule particles.
9. The removable adhesive layer of claim 7, wherein the
styrene-butadiene-styrene block copolymer has a chemical structural
formula of ##STR00003## a degree of polymerization x is about 30 to
about 90, a degree of polymerization y is about 10 to about 70, a
degree of polymerization m and a degree of polymerization n each is
a natural number greater than 1.
10. The removable adhesive layer of claim 7, wherein the plurality
of hydrated inorganic substances is selected from at least one of
aluminum hydroxide and magnesium hydroxide.
11. The removable adhesive layer of claim 7, wherein the embedded
object is cis-Jasmone.
12. The removable adhesive layer of claim 7, wherein each of the
plurality of microcapsule particles has a grain diameter of about 3
.mu.m to about 12 .mu.m.
13. An IC packaging process comprising: providing an IC substrate
comprising: a carrier; a circuit structure; and a removable
adhesive layer attached between the carrier and the circuit
structure a styrene-butadiene-styrene block copolymer, the
removable adhesive layer formed by curing a resin composition;
wherein the resin composition comprises a styrene-butadiene-styrene
block copolymer, and the resin composition further comprises a
plurality of hydrated inorganic substances and/or a plurality of
microcapsule particles dispersed in the styrene-butadiene-styrene
block copolymer, the plurality of hydrated inorganic substances
dehydrate to form anhydrous inorganic substances at a dehydration
temperature greater than 250 degrees Celsius, each of the plurality
of microcapsule particle comprises a housing and an embedded object
encapsulated therein, the embedded object will largely volatilize
from the housing at an escaping temperature greater than 250
degrees Celsius; mounting an integrated circuit on a side of the
circuit structure 13 facing away from the carrier by a surface
mount technology, the surface mount technology applying in a
mounting temperature, wherein each of the dehydration temperature
and the escaping temperature is greater than the mounting
temperature; encapsulating the integrated circuit on the IC
substrate by a packaging structure to form an intermediate
structure; and heating the intermediate structure at a heating
temperature greater than or equal to the dehydration temperature
and/or the escaping temperature, to cause gas to be produced by the
hydrated inorganic substances or the microcapsule particles and
release from the removable adhesive layer; peeling off the
removable adhesive layer from the circuit structure.
14. The IC packaging process of claim 13, wherein the resin
composition comprises 100 parts by weight of the
styrene-butadiene-styrene block copolymer, at least one of 1 parts
by weight to 50 parts by weight of the plurality of hydrated
inorganic substances and 5 parts by weight to 50 parts by weight of
the plurality of microcapsule particles.
15. The IC packaging process of claim 13, wherein the
styrene-butadiene-styrene block copolymer has a chemical structural
formula of ##STR00004## a degree of polymerization x is about 30 to
about 90, a degree of polymerization y is about 10 to about 70, a
degree of polymerization m and a degree of polymerization n each is
a natural number greater than 1.
16. The IC packaging process of claim 13, wherein the plurality of
hydrated inorganic substances is selected from at least one of
aluminum hydroxide and magnesium hydroxide.
17. The IC packaging process of claim 13, wherein the embedded
object is cis-Jasmone.
18. The IC packaging process of claim 13, wherein each of the
plurality of microcapsule particles has a grain diameter of about 3
.mu.m to about 12 .mu.m.
19. An IC substrate comprising: a carrier; a circuit structure; and
a removable adhesive layer attached between the carrier and the
circuit structure a styrene-butadiene-styrene block copolymer, the
removable adhesive layer formed by curing a resin composition;
wherein the resin composition comprises a styrene-butadiene-styrene
block copolymer, and the resin composition further comprises a
plurality of hydrated inorganic substances and/or a plurality of
microcapsule particles dispersed in the styrene-butadiene-styrene
block copolymer, the plurality of hydrated inorganic substances
dehydrate to form anhydrous inorganic substances at a dehydration
temperature greater than 250 degrees Celsius, each of the plurality
of microcapsule particle comprises a housing and an embedded object
encapsulated therein, the embedded object will largely volatilize
from the housing at an escaping temperature greater than 250
degrees Celsius.
20. The IC substrate of claim 19, wherein the resin composition
comprises 100 parts by weight of the styrene-butadiene-styrene
block copolymer, at least one of 1 parts by weight to 50 parts by
weight of the plurality of hydrated inorganic substances and 5
parts by weight to 50 parts by weight of the plurality of
microcapsule particles.
Description
FIELD
[0001] The subject matter herein generally relates to a resin
composition, a removable adhesive layer, an integrated circuit (IC)
substrate, and an IC packaging process.
BACKGROUND
[0002] Because flexible circuit board is soft, the flexible circuit
board need to combine with a rigid substrate by an adhesive layer
to improve mechanical property before the integrated circuit is
mounted on the flexible circuit board by surface mount technology.
However, the conventional adhesive layer will peel off or even
become brittle at a temperature less than the temperature of the
surface mount technology.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] Implementations of the present technology will now be
described, by way of example only, with reference to the attached
figures.
[0004] FIG. 1 is a cross-sectional view of an embodiment of a
removable adhesive layer.
[0005] FIG. 2 is a cross-sectional view of an embodiment of an
integrated circuit (IC) substrate comprising the removable adhesive
layer of FIG. 1.
[0006] FIG. 3 is a flowchart of an embodiment of an IC packaging
process.
[0007] FIG. 4 is a cross-sectional view showing an integrated
circuit mounted on a side of the IC substrate of FIG. 2.
[0008] FIG. 5 is a cross-sectional view showing the integrated
circuit of FIG. 4 encapsulated on the IC substrate by a packaging
structure to form an intermediate structure.
[0009] FIG. 6 is a cross-sectional view showing an integrated
circuit package board formed.
[0010] FIG. 7 is a DSC diagram of the removable adhesive layer of
the example.
[0011] FIG. 8 is a DSC diagram of the adhesive layer of the
comparative example 1.
[0012] FIG. 9 is a DSC diagram of aluminum hydroxide.
DETAILED DESCRIPTION
[0013] It will be appreciated that for simplicity and clarity of
illustration, where appropriate, reference numerals have been
repeated among the different figures to indicate corresponding or
analogous elements. In addition, numerous specific details are set
forth in order to provide a thorough understanding of the
embodiments described herein. However, it will be understood by
those of ordinary skill in the art that the embodiments described
herein can be practiced without these specific details. In other
instances, methods, procedures, and components have not been
described in detail so as not to obscure the related relevant
feature being described. Also, the description is not to be
considered as limiting the scope of the embodiments described
herein. The drawings are not necessarily to scale, and the
proportions of certain parts may be exaggerated to better
illustrate details and features of the present disclosure.
[0014] The term "comprising," when utilized, means "including, but
not necessarily limited to"; it specifically indicates open-ended
inclusion or membership in the so-described combination, group,
series, and the like.
[0015] An exemplary embodiment of a resin composition comprises a
styrene-butadiene-styrene block copolymer. The resin composition
further comprises a plurality of hydrated inorganic substances
and/or a plurality of microcapsule particles dispersed in the
styrene-butadiene-styrene block copolymer. The hydrated inorganic
substances form anhydrous inorganic substances by chemical
dehydration at a dehydration temperature greater than 250 degrees
Celsius. Each microcapsule particle comprises a housing and an
embedded object encapsulated therein. The embedded object will
largely volatilize from the housing at an escaping temperature
greater than 250 degrees Celsius.
[0016] In at least one embodiment, the resin composition comprises
100 parts by weight of the styrene-butadiene-styrene block
copolymer, at least one of about 1 part by weight to about 50 parts
by weight of the hydrated inorganic substances and about 5 parts by
weight to about 50 parts by weight of the microcapsule
particles.
[0017] In at least one embodiment, the styrene-butadiene-styrene
block copolymer has a chemical structural formula of
##STR00001##
wherein the degree of polymerization x is about 30 to about 90, the
degree of polymerization y is about 10 to about 70, the degree of
polymerization m and the degree of polymerization n each is a
natural number greater than 1.
[0018] In at least one embodiment, the hydrated inorganic
substances can be selected from at least one of aluminum hydroxide
and magnesium hydroxide. The embedded object can be selected from
at least one of essence and essential oil. For example, the
embedded object can be cis-Jasmone.
[0019] Each microcapsule particle has a diameter of about 3 .mu.m
to about 12 .mu.m.
[0020] FIG. 1 illustrates an embodiment of a removable adhesive
layer 15 made by curing the resin composition. At least one
embodiment, the resin composition is cured for 15 mins at 110
degrees Celsius to form the removable adhesive layer 15. The
removable adhesive layer 15 is a semi-cured layer.
[0021] In at least one embodiment, the resin composition comprises
the hydrated inorganic substances or the microcapsule particles.
When a temperature of the removable adhesive layer 15 is less than
the dehydration temperature or the escaping temperature, the
styrene-butadiene-styrene block copolymer in the removable adhesive
layer 15 further will react with each other, to reduce an adhesion
of the removable adhesive layer 15 and prevent the removable
adhesive layer 15 from becoming brittle. When the temperature of
the removable adhesive layer 15 is greater than or equal to the
dehydration temperature or the escaping temperature, gas is
produced from the hydrated inorganic substances in the removable
adhesive layer 15 and/or the microcapsule particles in the
removable adhesive layer 15. The gas is released from the removable
adhesive layer 15, to cause the removable adhesive layer 15 to be
peeled off more easily, and prevent residue of the removable
adhesive layer 15 from remaining.
[0022] In another embodiment, the resin composition comprises the
hydrated inorganic substances and the microcapsule particles. When
a temperature of the removable adhesive layer 15 is less than the
dehydration temperature and/or the escaping temperature, the
styrene-butadiene-styrene block copolymer in the removable adhesive
layer 15 further will react with each other, to reduce an adhesion
of the removable adhesive layer 15 and prevent the removable
adhesive layer 15 from becoming brittle. When the temperature of
the removable adhesive layer 15 is greater than or equal to the
dehydration temperature and the escaping temperature, gas is
produced from the hydrated inorganic substances in the removable
adhesive layer 15 and/or the microcapsule particles in the
removable adhesive layer 15. The gas is released from the removable
adhesive layer 15, to cause the removable adhesive layer 15 to be
peeled off more easily, and prevent residue of the removable
adhesive layer 15 from remaining.
[0023] FIG. 2 illustrates an embodiment of an integrated circuit
(IC) substrate 1. The IC substrate 1 comprises a carrier 10, a
circuit structure 13, and the removable adhesive layer 15 attached
between the carrier 10 and the circuit structure 13.
[0024] FIG. 3 illustrates a flowchart of an IC packaging process
using the resin composition in accordance with an exemplary
embodiment. The exemplary IC packaging process is provided by way
of example, as there are a variety of ways to carry out the method.
Each block shown in the figure represents one or more processes,
methods, or subroutines, carried out in the exemplary method.
Furthermore, the illustrated order of blocks is by example only,
and the order of the blocks can change. Additional blocks may be
added, or fewer blocks may be utilized, without departing from this
disclosure. The exemplary IC packaging process can begin at block
301.
[0025] At block 301, referring to FIG. 2, an IC substrate 1 is
provided. The IC substrate 1 comprises a carrier 10, a circuit
structure 13, and the removable adhesive layer 15 attached between
the carrier 10 and the circuit structure 13.
[0026] At block 302, referring to FIG. 4, an integrated circuit 2
is mounted on a side of the circuit structure 13 facing away from
the carrier 10 by surface mount technology. The surface mount
technology applies in a mounting temperature of about 250 degrees
Celsius, and each of the dehydration temperature and the escaping
temperature is greater than the mounting temperature of the surface
mount technology. So that, the styrene-butadiene-styrene block
copolymer in the removable adhesive layer 15 further will react
with each other, to reduce an adhesion of the removable adhesive
layer 15 and prevent the removable adhesive layer 15 from becoming
brittle.
[0027] At block 303, referring to FIG. 5, the integrated circuit 2
is encapsulated on the IC substrate 1 by a packaging structure 3,
thereby forming an intermediate structure 6.
[0028] In at least one embodiment, the packaging structure 3 is
formed on the side of the IC substrate 1 with the integrated
circuit 2 directly by a molding techniques.
[0029] At block 304, when the removable adhesive layer 15 comprises
the hydrated inorganic substances or the microcapsule particles,
the intermediate structure 6 is heated by a temperature greater
than or equal to the dehydration temperature or the escaping
temperature. Gas is produced by the hydrated inorganic substances
or the microcapsule particles, and releases from the removable
adhesive layer 15, to cause the removable adhesive layer 15 to be
peeled off more easily, and prevent residue of the removable
adhesive layer 15 from remaining. When the removable adhesive layer
15 comprises the hydrated inorganic substances and the microcapsule
particles, the intermediate structure 6 is heated by a temperature
greater than or equal to the dehydration temperature and the
escaping temperature, so gas is produced by the hydrated inorganic
substances and the microcapsule particles, and releases from the
removable adhesive layer 15, to cause the removable adhesive layer
15 to be peeled off more easily, and prevent residue of the
removable adhesive layer 15 from remaining.
[0030] At block 305, referring to FIG. 6, the removable adhesive
layer 15 is peeled off from the circuit structure 13 to obtain an
integrated circuit package board 5. The circuit package board 5
comprises the circuit structure 13, the integrated circuit 2, and
the packaging structure 3.
[0031] Depending on the embodiment, certain of the steps of methods
described may be removed, others may be added, and the sequence of
steps may be altered. It is also to be understood that the
description and the claims drawn to a method may include some
indication in reference to certain steps. However, the indication
used is only to be viewed for identification purposes and not as a
suggestion as to an order for the steps.
EXAMPLE
[0032] A resin composition was made by adding 100 g of the
styrene-butadiene-styrene block copolymer (Manufacturer: Kraton
Polymers, Model: D1101) and 20 g of the microcapsule particles
containing cis-Jasmone (Manufacturer: New Prismatic Enterprise Co.
Ltd., Model: SS-PD 41104-1) into toluene, and stirring until the
styrene-butadiene-styrene block copolymer was dissolved.
[0033] A removable adhesive layer 15 was made by coating the resin
composition on a surface of a copper foil and heating the resin
composition for 15 mins at 110 degrees Celsius. The removable
adhesive layer 15 was attached to the copper foil.
Comparative Example 1
[0034] A resin composition was made by adding 100 g of the
styrene-butadiene-styrene block copolymer (Manufacturer: Kraton
Polymers, Model: D1101) into toluene, and stirring until the
styrene-butadiene-styrene block copolymer was dissolved.
[0035] An adhesive layer 15 was made by coating the resin
composition on a surface of a copper foil and heating the resin
composition for 15 mins at 110 degrees Celsius. The adhesive layer
15 was attached to the copper foil.
Comparative Example 2
[0036] A resin composition (Manufacturer: Eternal Chemical Industry
Co. Ltd., Model: ETERAC 7735P) was coated on a surface of a copper
foil and heated to formed an adhesive layer.
[0037] A copper peeling strength of the removable adhesive layer of
the example, the adhesive layers of comparative the examples 1 and
2 at normal temperature were tested, respectively. The same tests
were carried out on the same subjects after heating for 5 mins at
230 degrees Celsius. The same tests were carried out on the same
subjects after heating for 30 mins at 270 degrees Celsius. The test
results are shown in Table 1.
TABLE-US-00001 TABLE 1 Copper Products peeling strength Comparative
Comparative (kgf/cm) Example example 1 example 2 At normal
temperature 0.5 0.8 0.7 After heating for 5 mins 0.3 0.5 embrittled
and at 230 degrees Celsius residue remaining After heating for 30
mins less than 0.1 0.15 embrittled and at 270 degrees Celsius
residue remaining
[0038] FIG. 7 is a DSC diagram of the removable adhesive layer 15
of the example. FIG. 8 is a DSC diagram of the adhesive layer of
the comparative example 1. FIG. 9 is a DSC diagram of aluminum
hydroxide.
[0039] According to Table 1 and FIGS. 7, 8 and 9, the removable
adhesive layer 15 of the example retains copper peeling strength
after heated at 230 degrees Celsius and 270 degrees Celsius, which
is less than the copper peeling strength of the adhesive layer of
the comparative example 1 after heated at 230 degrees Celsius and
270 degrees Celsius. So that the removable adhesive layer 15 of the
example can be removed more easily and without residue. The
removable adhesive layer 15 of the example will not be peeled off
when at a mounting temperature about 250 degrees Celsius of surface
mount technology, but the adhesive layer of the comparative example
2 will be peeled off when at the mounting temperature about 250
degrees Celsius of surface mount technology.
[0040] It is to be understood, even though information and
advantages of the present embodiments have been set forth in the
foregoing description, together with details of the structures and
functions of the present embodiments, the disclosure is
illustrative only; changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the present embodiments to the full extent indicated
by the plain meaning of the terms in which the appended claims are
expressed.
* * * * *