Qi Ding Technology Qinhuangdao Co., Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Qi Ding Technology Qinhuangdao Co., Ltd..The latest application filed is for "packaged circuit structure and method for manufacturing the same".

Company Profile

4.13.5

Qi Ding Technology Qinhuangdao Co., Ltd. - Qinhuangdao CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged Circuit Structure And Method For Manufacturing The Same App 20220240385 - HUANG; CHUN-CHIEH ; et al.	2022-07-28
Circuit Board And Method Of Making Circuit Board App 20200163229 - HUANG; SHIH-FU ; et al.	2020-05-21
Resin compositon, removable adhesive layer, IC substrate, and IC packaging process Grant 10,501,664 - Liang , et al. Dec	2019-12-10
Resin Compositon, Removable Adhesive Layer, Ic Substrate, And Ic Packaging Process App 20190352548 - LIANG; KUO-SHENG ; et al.	2019-11-21
Package substrate Grant 10,412,835 - Huang Sept	2019-09-10
Package Substrate App 20180235085 - HUANG; YU-CHENG	2018-08-16
Method of manufacturing a package substrate Grant 9,992,873 - Huang June 5, 2	2018-06-05
Package structure Grant 9,905,508 - Su February 27, 2	2018-02-27
Heat sink, method for making the same, and electronic device having the same Grant 9,855,629 - Huang January 2, 2	2018-01-02
Package Structure App 20170365540 - SU; WEI-SHUO	2017-12-21
Package substrate, method for making the same, and package structure having the same Grant 9,735,097 - Chen August 15, 2	2017-08-15
Printed circuit board with embedded component and method for manufacturing same Grant 9,730,328 - Hsu August 8, 2	2017-08-08
Package structure and method for manufacturing same Grant 9,548,427 - Huang January 17, 2	2017-01-17

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