U.S. patent application number 15/865117 was filed with the patent office on 2019-07-11 for complementary metal-oxide-semiconductor (cmos) voltage-controlled resistor.
The applicant listed for this patent is QUALCOMM Incorporated. Invention is credited to Peter Graeme CLARKE, Sinan GOKTEPELI, Plamen Vassilev KOLEV.
Application Number | 20190214506 15/865117 |
Document ID | / |
Family ID | 66826052 |
Filed Date | 2019-07-11 |
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United States Patent
Application |
20190214506 |
Kind Code |
A1 |
KOLEV; Plamen Vassilev ; et
al. |
July 11, 2019 |
COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) VOLTAGE-CONTROLLED
RESISTOR
Abstract
A resistor may include a semiconductor layer having a source
region, a drain region, and a channel region. The channel region
may be between the source region and the drain region. The channel
region may have a same polarity as the source region and the drain
region. The resistor may further include a first inter-metal
dielectric (IMD) layer on the channel region. The resistor may
further include a front-side gate shield on the first IMD layer.
The front-side gate shield may overlap the channel region.
Inventors: |
KOLEV; Plamen Vassilev; (San
Diego, CA) ; GOKTEPELI; Sinan; (San Diego, CA)
; CLARKE; Peter Graeme; (San Diego, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
QUALCOMM Incorporated |
San Diego |
CA |
US |
|
|
Family ID: |
66826052 |
Appl. No.: |
15/865117 |
Filed: |
January 8, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 29/7833 20130101;
H01L 23/647 20130101; H01L 23/60 20130101; H01L 27/0296 20130101;
H01L 29/66083 20130101; H01L 29/8605 20130101; H01L 27/0292
20130101; H01L 28/20 20130101; H01L 23/528 20130101; H01L 23/552
20130101; H01L 29/86 20130101; H01L 29/66166 20130101; H01L 23/5225
20130101; H01L 21/02532 20130101; H01L 29/0649 20130101; H01L
27/0285 20130101; H01L 29/405 20130101; H01L 29/0684 20130101; H01L
23/5228 20130101 |
International
Class: |
H01L 29/86 20060101
H01L029/86; H01L 29/06 20060101 H01L029/06; H01L 23/552 20060101
H01L023/552; H01L 23/528 20060101 H01L023/528; H01L 21/02 20060101
H01L021/02; H01L 29/66 20060101 H01L029/66 |
Claims
1. A resistor, comprising: a semiconductor layer having a source
region, a drain region, and a channel region between the source
region and the drain region, the channel region having a same
polarity as the source region and the drain region; a first
inter-metal dielectric (IMD) layer on the channel region; and a
front-side gate shield on the first IMD layer and overlapping the
channel region.
2. The resistor of claim 1, in which the front-side gate shield is
arranged to at least partially overlap the source region and the
drain region.
3. The resistor of claim 1, in which the front-side gate shield
comprises a first back-end-of-line (BEOL) interconnect.
4. The resistor of claim 1, further comprising: a second IMD layer
on the first IMD layer, in which the front-side gate shield
comprises a second back-end-of-line (BEOL) interconnect on the
second IMD layer and overlapping the channel region, the source
region, and the drain region.
5. The resistor of claim 1, further comprising a backside gate
shield.
6. The resistor of claim 5, in which the backside gate shield
comprises a diffusion region supporting the semiconductor layer and
the diffusion region is inside the semiconductor layer, the
diffusion region having a polarity inverse to a polarity of the
semiconductor layer.
7. The resistor of claim 1, further comprising a terminal coupled
to the front-side gate shield and a backside gate shield.
8. The resistor of claim 1, further comprising a terminal coupled
to the front-side gate shield and a fixed voltage.
9. The resistor of claim 1, integrated into a mobile phone, a set
top box, a music player, a video player, an entertainment unit, a
navigation device, a computer, a hand-held personal communication
systems (PCS) unit, a portable data unit, and/or a fixed location
data unit.
10. A method of fabricating a resistor, comprising: fabricating a
semiconductor layer comprising a source region, a drain region, and
a channel region between the source region and the drain region;
doping the channel region to have a same polarity as the source
region and the drain region; depositing a first inter-metal
dielectric (IMD) layer on the channel region; and fabricating a
front-side gate shield on the first IMD layer, the front-side gate
shield overlapping the channel region.
11. The method of claim 10, further comprising: depositing a second
IMD layer on the first IMD layer, in which the front-side gate
shield comprises a second back-end-of-line (BEOL) interconnect on
the second IMD layer and overlapping the channel region, the source
region, and the drain region.
12. The method of claim 10, further comprising fabricating a
backside gate shield on a backside of the semiconductor layer.
13. The method of claim 10, in which the resistor is integrated
into a mobile phone, a set top box, a music player, a video player,
an entertainment unit, a navigation device, a computer, a hand-held
personal communication systems (PCS) unit, a portable data unit,
and/or a fixed location data unit.
14. A resistor, comprising: a semiconductor layer having a source
region, a drain region, and a channel region between the source
region and the drain region, the channel region having a same
polarity as the source region and the drain region; a first
inter-metal dielectric (IMD) layer on the channel region; and means
for shielding on the first IMD layer and overlapping the channel
region.
15. The resistor of claim 14, in which the shielding means at least
partially overlaps the source region and the drain region.
16. The resistor of claim 14, in which the shielding means
comprises a first back-end-of-line (BEOL) interconnect.
17. The resistor of claim 14, further comprising: a second IMD
layer on the first IMD layer, in which the shielding means
comprises a second back-end-of-line (BEOL) interconnect on the
second IMD layer and overlapping the channel region, the source
region, and the drain region.
18. The resistor of claim 14, further comprising a backside
shielding means.
19. The resistor of claim 18, in which the backside shielding means
comprises a diffusion region supporting the semiconductor layer and
the diffusion region is inside the semiconductor layer, the
diffusion region having a polarity inverse to a polarity of the
semiconductor layer.
20. The resistor of claim 14, integrated into a mobile phone, a set
top box, a music player, a video player, an entertainment unit, a
navigation device, a computer, a hand-held personal communication
systems (PCS) unit, a portable data unit, and/or a fixed location
data unit.
Description
BACKGROUND
Field
[0001] Aspects of the present disclosure relate to semiconductor
devices and, more particularly, to resistors.
Background
[0002] Mobile radio frequency (RF) chips (e.g., mobile RF
transceivers) have migrated to a deep sub-micron process node due
to cost and power consumption considerations. Designing such mobile
RF transceivers becomes complex at this deep sub-micron process
node. Designing these mobile RF transceivers is further complicated
by added circuit functions for supporting communication
enhancements, such as carrier aggregation. Further design
challenges for mobile RF transceivers include analog/RF performance
considerations, including mismatch, noise, and other performance
considerations. Designs of these mobile RF transceivers may include
additional passive devices, for example, for biasing and
suppressing resonance, and/or for performing filtering, bypassing,
and coupling.
[0003] At the deep sub-micron process node, small-sized resistors
having large values are desired. Conventional resistors are prone
to severe bias interference from adjacent conductive layers and
also exhibit non-negligible voltage dependence from voltages
applied across the terminals. Therefore, there is a desire for
small-sized, large-valued resistors that overcome these
deficiencies.
SUMMARY
[0004] A resistor may include a semiconductor layer having a source
region, a drain region, and a channel region. The channel region
may be between the source region and the drain region. The channel
region may have a same polarity as the source region and the drain
region. The resistor may further include a first inter-metal
dielectric (IMD) layer on the channel region. The resistor may
further include a front-side gate shield on the first 1 MB layer.
The front-side gate shield may overlap the channel region.
[0005] A method of fabricating a resistor may include fabricating a
semiconductor layer having a source region, a drain region, and a
channel region between the source region and the drain region. The
method may further include doping the channel region to have a same
polarity as the source region and the drain region. The method may
further include depositing a first inter-metal dielectric (IMD)
layer on the channel region. The method may further include
fabricating a front-side gate shield on the first IMD layer. The
front-side gate shield may overlap the channel region.
[0006] A resistor may include a semiconductor layer having a source
region, a drain region, and a channel region. The channel region
may be between the source region and the drain region. The channel
region hay have a same polarity as the source region and the drain
region. The resistor may further include a first inter-metal
dielectric (IMD) layer on the channel region. The resistor may
further include means for shielding on the first IMD layer. The
shielding means may overlap the channel region.
[0007] Additional features and advantages of the disclosure will be
described below. It should be appreciated by those skilled in the
art that this disclosure may be readily utilized as a basis for
modifying or designing other structures for carrying out the same
purposes of the present disclosure. It should also be realized by
those skilled in the art that such equivalent constructions do not
depart from the teachings of the disclosure as set forth in the
appended claims. The novel features, which are believed to be
characteristic of the disclosure, both as to its organization and
method of operation, together with further objects and advantages,
will be better understood from the following description when
considered in connection with the accompanying figures. It is to be
expressly understood, however, that each of the figures is provided
for the purpose of illustration and description only and is not
intended as a definition of the limits of the present
disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] For a more complete understanding of the present disclosure,
reference is now made to the following description taken in
conjunction with the accompanying drawings.
[0009] FIG. 1 is a schematic diagram of a radio frequency (RF)
front end module.
[0010] FIGS. 2A to 2D show cross-sectional views of an integrated
radio frequency (RF) circuit structure during a layer transfer
process.
[0011] FIG. 3 is a cross-sectional view of an integrated radio
frequency (RF) circuit structure fabricated using a layer transfer
process.
[0012] FIG. 4 is a conventional thick oxide depletion mode
N-channel metal-oxide-semiconductor (NMOS) (TDN) transistor.
[0013] FIGS. 5A-5G illustrate N-type metal-oxide-semiconductor
(MOS) resistors, according to aspects of the present
disclosure.
[0014] FIG. 6 illustrates a method for fabricating an N-type
metal-oxide-semiconductor (MOS) resistor according to aspects of
the present disclosure.
[0015] FIG. 7 is a block diagram showing an exemplary wireless
communication system in which an aspect of the disclosure may be
advantageously employed.
[0016] FIG. 8 is a block diagram illustrating a design workstation
used for circuit, layout, and logic design of N-type
metal-oxide-semiconductor (MOS) resistors according to one
configuration.
DETAILED DESCRIPTION
[0017] The detailed description set forth below, in connection with
the appended drawings, is intended as a description of various
configurations and is not intended to represent the only
configurations in which the concepts described herein may be
practiced. The detailed description includes specific details for
the purpose of providing a thorough understanding of the various
concepts. It will be apparent, however, to those skilled in the art
that these concepts may be practiced without these specific
details. In some instances, well-known structures and components
are shown in block diagram form in order to avoid obscuring such
concepts.
[0018] As described herein, the use of the term "and/or" is
intended to represent an "inclusive OR", and the use of the term
"or" is intended to represent an "exclusive OR." As described
herein, the term "exemplary" used throughout this description means
"serving as an example, instance, or illustration," and should not
necessarily be construed as preferred or advantageous over other
exemplary configurations. The term "coupled" used throughout this
description means "connected, whether directly or indirectly
through intervening connections (e.g., a switch), electrical,
mechanical, or otherwise," and is not necessarily limited to
physical connections. Additionally, the connections can be such
that the objects are permanently connected or releasably connected.
The connections can be through switches. As described herein, the
term "proximate" used throughout this description means "adjacent,
very near, next to, or close to." As described herein, the term
"on" used throughout this description means "directly on" in some
configurations, and "indirectly on" in other configurations.
[0019] Mobile radio frequency (RF) chip designs (e.g., mobile RF
transceivers) have migrated to a deep sub-micron process node due
to cost and power consumption considerations. The design complexity
of mobile RF transceivers is further complicated by added circuit
functions to support communication enhancements, such as carrier
aggregation.
[0020] The design of these mobile RF transceivers may include the
use of silicon on insulator technology. Silicon on insulator (SOI)
technology replaces conventional silicon substrates with a layered
silicon-insulator-silicon substrate to reduce parasitic device
capacitance and improve performance. SOI-based devices differ from
conventional, silicon-built devices because the silicon junction is
above an electrical isolator, typically a buried oxide (BOX)
layer.
[0021] Conventional complementary metal-oxide-semiconductor (CMOS)
technology begins with a front-end-of-line (FEOL), in which a first
set of process steps are performed for fabricating active devices
(e.g., negative MOS (NMOS) or positive MOS (PMOS) transistors) on a
substrate (e.g., a silicon-on-insulator (SOI) substrate). A
middle-of-line (MOL) is performed next, which is a set of process
steps that connect the active devices to the back-end-of-line
(BEOL) interconnects (e.g., M1, M2, M3, M4, etc.) using
middle-of-line contacts. Unfortunately, interference between each
layer may result due to a close proximity of adjacent conductive
layers.
[0022] The front-end-of-line processes may include the set of
process steps that form the active devices (e.g., transistors). The
front-end-of-line processes include ion implantation, anneals,
oxidation, chemical vapor deposition (CVD) or atomic layer
deposition (ALD), etching, chemical mechanical polishing (CMP), and
epitaxy. The middle-of-line processes may include the set of
process steps that enable connection of the transistors to BEOL
interconnects. These steps include silicidation and contact
formation, as well as stress introduction. The back-end-of-line
processes may include the set of process steps that form the
interconnects that tie the independent transistors and form
circuits. Currently, copper and aluminum are materials to form the
interconnects, but with further development of the technology,
other conductive materials may be used.
[0023] Conventional metal-oxide-semiconductor
field-effect-transistors (MOSFETs) with source and drain regions
having a same low body doping are implemented as small-area,
high-value resistors, such as thick oxide depletion mode N-channel
metal-oxide-semiconductor (NMOS) (TDN) transistors. Unfortunately,
these devices are prone to large resistance variations due to a
variable bias of a handle wafer placed above a polysilicon gate and
interconnects. These shortcomings have caused chip designers to
abandon using these types of devices. Still, chip designers have a
strong interest in a scalable small-size resistor having a small
parasitic capacitance and inductance, a large resistance, and a
high linearity. Additionally, the scalable resistor should be
capable of being implemented with a layer-transfer SOI CMOS process
or other CMOS process, including standard SOI and bulk CMOS
processes. Furthermore, this device should also be capable of use
in RF circuits where its small size is expected to provide very low
parasitic capacitance and inductance, particularly in conjunction
with a standard SOI CMOS process and a layer-transfer SOI CMOS
process.
[0024] Aspects of the present disclosure provide a MOSFET device
with a high-resistivity body having source and drain regions with a
same type doping that may be available for gate control. For
example, a first level interconnect metal (e.g., an M1 layer)
instead of a typical polysilicon gate may be used in silicon (Si)
based CMOS processes. Due to a large distance between the first
level interconnect layer and a Si surface, similar devices have
very weak gate control and are prone to bias interference due to
electricity field sensitivity of a body region with low doping.
[0025] Nevertheless, operating near to a threshold voltage
increases an impact of the gate voltage on a device conductance.
Therefore, the proposed device may be constructed to have a nearly
zero threshold voltage with a low conductivity at a zero gate bias,
which may facilitate its use as a small-area, large-value resistor.
Because of the relatively thick configuration of dielectric
interconnects, the threshold voltage may be very high and the
device may operate in a linear regime even for a large bias between
the source and drain regions.
[0026] Because a desired geometry for resistors is generally a
long-length and a narrow-width, process variations in fabricating a
channel due to a lack of a self-aligned polysilicon gate, which is
typical for MOSFETs, are not expected to have significant
detrimental effects on the performance of the resistor. A backside
gate may be used to further improve resistance and voltage
regulation because a threshold voltage of the backside gate channel
may be substantially lower than that of a front-side gate, but
still much higher compared to a standard device with a polysilicon
gate. Therefore, one may trade off linearity for better gate
control by adding a backside gate.
[0027] A front-side gate may prevent interference from conductive
layers above the active portion of the device. In one
configuration, both front-side and a backside gates are large
enough to completely shield a resistor body from external electric
fields, thus significantly reducing interference and cross-talk in
complex, mixed-signal, and RF circuits. When only a front-side gate
is used, a bias interference from conductive layers above the
resistor, including a handle wafer in a layer-transfer SOI CMOS
device, may be avoided by a sufficient extension of a gate metal to
sufficiently cover an active Si layer.
[0028] Aspects of the present disclosure provide for a resistor
having a semiconductor layer including a source region, a drain
region, and a channel region between the source region and the
drain region. The channel region may have a same polarity as the
source region and the drain region. The resistor may further
include a first inter-metal dielectric (IMD) layer on the channel
region, and a front-side gate shield on the first IMD layer. The
front-side gate shield may overlap the channel region.
[0029] According to aspects of the present disclosure, a thick
oxide depletion mode N-channel metal-oxide-semiconductor (NMOS)
(TDN) transistor may be configured as a resistor. For example, the
TDN transistor may include source and drain regions having a same
low body doping. According to aspects of the present disclosure,
the TDN transistor may be an N-type MOS resistor.
[0030] It will be understood that the term "layer" includes film
and is not to be construed as indicating a vertical or horizontal
thickness unless otherwise stated. As described herein, the term
"substrate" may refer to a substrate of a diced wafer or may refer
to a substrate of a wafer that is not diced. Similarly, the terms
chip and die may be used interchangeably.
[0031] FIG. 1 is a schematic diagram of a wireless device 100
(e.g., a cellular phone or a smartphone) having an N-type
metal-oxide-semiconductor (MOS) resistor, according to aspects of
the present disclosure. The wireless device 100 may include a
wireless local area network (WLAN) (e.g., WiFi) module 150 and a RF
front end module 170 for a chipset 110. The WiFi module 150
includes a first diplexer 160 communicably coupling an antenna 162
to a wireless local area network module (e.g., WLAN module 152).
The RF front end module 170 includes a second diplexer 190
communicably coupling an antenna 192 to the wireless transceiver
120 (WTR) through a duplexer 180 (DUP).
[0032] The wireless transceiver 120 and the WLAN module 152 of the
WiFi module 150 are coupled to a modem (MSM, e.g., a baseband
modem) 130 that is powered by a power supply 102 through a power
management integrated circuit (PMIC) 140. The chipset 110 also
includes capacitors 112 and 114, as well as an inductor(s) 116 to
provide signal integrity. The PMIC 140, the modem 130, the wireless
transceiver 120, and the WLAN module 152 each include capacitors
(e.g., 142, 132, 122, and 154) and operate according to a clock
118. The geometry and arrangement of the various inductor and
capacitor components in the chipset 110 may reduce the
electromagnetic coupling between the components.
[0033] The wireless transceiver 120 of the wireless device
generally includes a mobile RF transceiver to transmit and receive
data for two-way communication. A mobile RF transceiver may include
a transmit section for data transmission and a receive section for
data reception. For data transmission, the transmit section may
modulate a RF carrier signal with data to obtain a modulated RF
signal, amplify the modulated RF signal using a power amplifier
(PA) to obtain an amplified RF signal having the proper output
power level, and transmit the amplified RF signal via the antenna
192 to a base station. For data reception, the receive section may
obtain a received RF signal via the antenna 192 and may amplify the
received RF signal using a low noise amplifier (LNA) and process
the received RF signal to recover data sent by the base station in
a communication signal.
[0034] The wireless transceiver 120 may include one or more
circuits for amplifying these communication signals. The amplifier
circuits (e.g., LNA/PA) may include one or more amplifier stages
that may have one or more driver stages and one or more amplifier
output stages. Each of the amplifier stages includes one or more
transistors configured in various ways to amplify the communication
signals. Various options exist for fabricating the transistors that
are configured to amplify the communication signals transmitted and
received by the wireless transceiver 120.
[0035] The wireless transceiver 120 and the RF front end module 170
may be implemented using semiconductor on insulator (SOI)
technology for fabricating transistors of the wireless transceiver
120 and the RF front end module 170, which reduces high order
harmonics in the RF front end module 170. SOI technology replaces
conventional semiconductor substrates with a layered
semiconductor-insulator-semiconductor substrate for reducing
parasitic device capacitance and improving performance. SOI-based
devices differ from conventional, silicon-built devices because a
silicon junction is above an electrical isolator, typically a
buried oxide (BOX) layer. A reduced thickness BOX layer, however,
may not sufficiently reduce artificial harmonics caused by the
proximity of an active device on an SOI layer and an SOI substrate
supporting the BOX layer. A layer transfer process to further
separate the active device from an SOI substrate is shown in FIGS.
2A to 2D.
[0036] FIGS. 2A to 2D show cross-sectional views of an integrated
radio frequency (RF) circuit structure 200 during a layer transfer
process according to aspects of the present disclosure. As shown in
FIG. 2A, an RF silicon on insulator (SOI) device includes an active
device 210 on a buried oxide (BOX) layer 220 supported by a
sacrificial substrate 201 (e.g., a bulk wafer). The RF SOI device
also includes interconnects 250 coupled to the active device 210
within a front-side dielectric layer 206. As shown in FIG. 2B, a
handle substrate 202 is bonded to the front-side dielectric layer
206 of the RF SOI device. In addition, the sacrificial substrate
201 is removed. Removal of the sacrificial substrate 201 using the
layer transfer process enables high-performance, low-parasitic RF
devices by increasing the dielectric thickness. That is, a
parasitic capacitance of the RF SOI device is inversely
proportional to the dielectric thickness, which determines the
distance between the active device 210 and the handle substrate
202.
[0037] As shown in FIG. 2C, the RF SOI device is flipped once the
handle substrate 202 is secured and the sacrificial substrate 201
are removed. As shown in FIG. 2D, a post layer transfer
metallization process is performed using, for example, a regular
complementary metal-oxide-semiconductor (CMOS) process. The
integrated RF circuit structure 200 may be completed by depositing
a passivation layer, opening bond pads, depositing a redistribution
layer, and forming conductive bumps/pillars to enable bonding of
the integrated RF circuit structure 200 to a system board (e.g., a
printed circuit board (PCB)).
[0038] Referring again to FIG. 2A, the RF SOI device may include a
trap rich layer between the sacrificial substrate 201 and the BOX
layer 220. In addition, the sacrificial substrate 201 may be
replaced with the handle substrate, and a thickness of the BOX
layer 220 may be increased to improve harmonics. Although this
arrangement of the RF SOI device may provide improved harmonics
relative to a pure silicon or SOI implementation, the RF SOI device
is limited by the non-linear responses from the handle substrate,
especially when a silicon handle substrate is used. That is, in
FIG. 2A, the increased thickness of the BOX layer 220 does not
provide sufficient distance between the active device 210 and the
sacrificial substrate 201 relative to the configurations shown in
FIGS. 2B to 2D. Moreover, the RF SOI device is generally limited to
CMOS transistor formation on one side of the SOI layer.
[0039] FIG. 3 is a cross-sectional view of an integrated radio
frequency (RF) circuit structure 300 fabricated using a layer
transfer process according to aspects of the present disclosure.
Representatively, the integrated RF circuit structure 300 includes
an active device 310 having a gate, a body, and source/drain
regions formed on an isolation layer 320. In silicon on insulator
(SOI) implementations, the isolation layer 320 is a buried oxide
(BOX) layer, and the body and source/drain regions are formed from
an SOI layer including shallow trench isolation (STI) regions
supported by the BOX layer.
[0040] The integrated RF circuit structure 300 also includes
middle-of-line (MOL)/back-end-of-line (BEOL) interconnects coupled
to the source/drain regions of the active device 310. As described,
the MOL/BEOL layers are referred to as front-side layers. By
contrast, the layers supporting the isolation layer 320 may be
referred to as backside layers. According to this nomenclature, a
front-side interconnect 350 is coupled to the source/drain regions
of the active device 310 through front-side contacts 312 in a
front-side dielectric layer 304. In addition, a handle substrate
302 is coupled to the front-side dielectric layer 304. In this
configuration, a backside dielectric layer 340 is adjacent to and
possibly supports the isolation layer 320. In addition, a backside
metallization 330 is coupled to the front-side interconnect
350.
[0041] As shown in FIG. 3, a layer transfer process increases
separation between the active device 310 and the handle substrate
302 to improve the harmonics of the integrated RF circuit structure
300. Various aspects of the disclosure provide techniques for layer
transfer and post transfer metallization to provide access to a
backside of devices of an integrated radio frequency (RF)
integrated structure. By contrast, access to devices, formed during
a front-end-of-line (FEOL) process, is conventionally provided
during a middle-of-line (MOL) processing that provides contacts
between the gates and source/drain regions of the devices and
back-end-of-line (BEOL) interconnect layers (e.g., M1, M2,
etc.).
[0042] FIG. 4 is a conventional thick oxide depletion mode
N-channel metal-oxide-semiconductor (NMOS) (TDN) transistor 400,
that may be configured as a resistor. The TDN transistor 400
includes a gate 402, a source 404, a drain 406, and a channel 408.
A gate oxide 410 is between the gate 402 and the channel 408. A
buried oxide layer 420 supports the TDN transistor 400. Contacts
430 couple the source 404 and the drain 406 to an M1 interconnect
layer through an inter-metal dielectric layer 440. A silicide layer
432 couples the contacts 430 to the source 404 and the drain 406.
The TDN transistor 400 is further coupled to a handle wafer 460
through back-end-of-line (BEOL) layers 450. BEOL metals, however,
are not placed over the channel 408.
[0043] Disadvantages of the TDN transistor 400 include field
effects from the handle wafer 460, which is due to the handle wafer
460 being too far away and shielded by the gate 402. Additionally,
conventional diffusion and polysilicon resistors are prone to
severe bias interference from adjacent conductive layers and also
exhibit non-negligible voltage dependence from voltages applied
across the terminals. Therefore, there is a desire for small-sized,
large-valued resistors that overcome these deficiencies.
[0044] Aspects of the present disclosure address these issues by
providing a resistor having a semiconductor layer with a source
region, a drain region, and a channel region between the source
region and the drain region. The channel region may have a same
polarity as the source region and the drain region. The resistor
may further include a first inter-metal dielectric (IMD) layer on
the channel region, and a front-side gate shield on the first IMD
layer. The front-side gate shield may overlap the channel region.
For example, the front-side gate shield may at least partially
overlap the source region and the drain region.
[0045] According to aspects of the present disclosure, thick oxide
depletion mode N-channel metal-oxide-semiconductor (NMOS) (TDN)
transistors may be configured as voltage-controlled resistors. For
example, the TDN transistors may have source and drain regions that
are doped the same. According to aspects of the present disclosure,
the TDN transistors may be implemented as N-type MOS resistors.
[0046] FIGS. 5A-5G illustrate N-type metal-oxide-semiconductor
(MOS) resistors, according to aspects of the present disclosure.
The N-type MOS resistors described herein either include a floating
poly-Si gate or omit the poly-Si gate, in contrast to the
conventional TDN transistors described above.
[0047] FIG. 5A illustrates an N-type MOS resistor 500-1 having a
front-side gate shield 510, according to aspects of the present
disclosure. The MOS resistor 500-1 may include a semiconductor
layer 580 having a source 504, a drain 506, and a channel 502. The
source 504 and the drain 506 may be N+ doped silicon (Si) and the
channel 502 may be N- doped Si. Of course, this doping is exemplary
only, and the source 504, drain 506, and channel 502 may be
alternatively doped in other configurations, as shown in FIG.
5G.
[0048] The channel 502 is between the source 504 and the drain 506.
The semiconductor layer 580 may support a first inter-metal
dielectric (IMD) layer 540. An M1 interconnect layer 582 (e.g., a
first back-end-of-line (BEOL) interconnect (M1)) may be supported
by the first IMD layer 540. For example, the M1 interconnect layer
582 may include M1 contacts 512 and the front-side gate shield
510.
[0049] Vias 530 may couple the source 504 and the drain 506 to the
M1 contacts 512 (e.g., a first terminal and a second terminal). In
one example, a silicide 532 couples the vias 530 to the source 504
and the drain 506. A buried oxide (BOX) layer 520 may support the
semiconductor layer 580. A handle wafer 560 may be coupled to the
M1 interconnect layer 582 through additional back-end-of-line
(BEOL) layers 550.
[0050] According to an aspect of the present disclosure, the
front-side gate shield 510 may laterally extend to substantially
cover the channel 502. In this way, the front-side gate shield 510
may shield the MOS resistor 500-1 from bias interference coming
from the BEOL layers 550 and above.
[0051] According to aspects of the present disclosure, a channel
doping may be adjusted to achieve a nearly zero threshold voltage
to make the MOS resistor 500-1 a depletion type or enhancement type
transistor.
[0052] According to an additional aspect of the present disclosure,
a third terminal may be coupled to the front-side gate shield 510.
For example, the third terminal may tune a resistivity of the MOS
resistor 500-1. The third terminal may also be coupled to a fixed
voltage.
[0053] Advantages of the MOS resistor 500-1 include a small size
and a large resistance value due to a low body conductance. The
resistor also exhibits high linearity due to a very high threshold
voltage. Manufacturing the resistor is simplified because a gate
oxide and a polysilicon layer are removed from a TDN transistor
fabrication process. The front-side gate shield contrasts with
conventional devices that typically avoid placing BEOL
interconnects over the channel region.
[0054] According to an aspect of the present disclosure of the
present disclosure, as illustrated in FIG. 5B, an N-type MOS
resistor 500-2 may further include a backside gate shield 570. For
example, the backside gate shield 570 may be fabricated on a
backside surface of the BOX layer 520. The backside gate shield 570
may laterally extend to substantially cover the channel 502 for
shielding the MOS resistor 500-2 from bias interference coming from
below the BOX layer 520. The MOS resistor 500-2 is otherwise
substantially similar to the MOS resistor 500-1 of FIG. 5A.
[0055] According to additional aspects of the present disclosure,
the backside gate shield 570 may be partially embedded in the BOX
layer 520. For example, the backside gate shield 570 may be formed
beneath the active layer by thinning the BOX layer 520 and
depositing a post layer-transfer metal (e.g., lower metal 1 (LM1)).
According to an aspect of the present disclosure, the backside gate
shield 570 may be implemented in an SOI process as a well region
with a doping opposite to that of the carrier wafer.
[0056] According to an aspect of the present disclosure, the BOX
layer 520 may be thinned for substantially increasing control of
the backside gate shield 570 by increasing an electrical field
strength in an SOI CMOS process. For example, placing the backside
gate shield 570 closer to the semiconductor layer 580 than the
front-side gate shield 510 may provide more control and better
conductance regulation. Additionally, the overlap of the backside
gate shield 570 may be significant enough to shield the channel 502
from conductive layers beneath the MOS resistor 500-2. In some
configurations, the backside gate primarily provides control
whereas the front-side gate primarily provides shielding.
[0057] According to an aspect of the present disclosure, the
backside gate shield 570 and the front-side gate shield 510 are
coupled together to further improve shielding and enhance
conductance control. For example, the front-side gate shield 510
may have a dual function of controlling a resistance of the MOS
resistor 500-2, while also providing electrical shielding from the
BEOL layers 550. This results in increased gate control.
[0058] According to an additional aspect of the present disclosure,
as illustrated in FIG. 5C, an N-type MOS resistor 500-3 may further
include a polysilicon gate 508 (e.g., a floating polysilicon gate).
The polysilicon gate 508 may provide accurate channel length
definition via self-alignment during a process flow. The
polysilicon gate 508 may be left floating, or may be connected to
at least one of the source 504 or the drain 506. For example, the
polysilicon gate 508 may be coupled to the channel 502 through a
gate oxide layer 514. The BOX layer 520 may have a first surface
adjacent to the semiconductor layer 580 and a second surface
opposite the first surface that is coupled to the backside gate
shield 570. The MOS resistor 500-3 is otherwise substantially
similar to the MOS resistor 500-2 of FIG. 5B.
[0059] According to an aspect of the present disclosure, the
front-side gate shield 510 may laterally extend to substantially
cover the polysilicon gate 508 and the channel 502. The polysilicon
gate 508 may be the same width as the channel 502, or narrower than
the channel 502. The gate oxide layer 514 may be substantially the
same width as the channel 502. For example, the polysilicon gate
508 may be self-aligned with the channel 502.
[0060] Advantages of the polysilicon gate 508 include a better
channel length definition, while also allowing for a shorter
channel length. Additionally, no special mask is used for the
threshold voltage adjustment. There is also improvement in the
quality of gate oxide-to-silicon interface, which improves
low-frequency flicker noise.
[0061] FIG. 5D illustrates an N-type MOS resistor 500-4 having an
M2 layer front-side gate shield 511 formed in an M2 interconnect
584 layer (e.g., a second back-end-of-line (BEOL) interconnect
(M2)) instead of the M1 interconnect layer 582, according to
aspects of the present disclosure. For example, in place of a gate
shield on the M1 interconnect layer, a second IMD layer 542 may be
supported by the first IMD layer 540. For example, a first
interconnect metal M1 may be replaced with a conductive layer. The
M2 layer front-side gate shield 511 may then be formed over the
second IMD layer 542. According to an aspect of the present
disclosure, the M2 layer front-side gate shield 511 may extend
laterally to substantially cover the source 504, the channel 502,
and the drain 506. The MOS resistor 500-4 is otherwise
substantially similar to the MOS resistor 500-1 of FIG. 5A.
[0062] Advantages include higher linearity compared to devices with
an M1 level gate shield due to a reduced field strength.
Additionally, the M2 layer front-side gate shield 511 provides more
complete shielding because it covers all the contacts and M1
terminals of the MOS resistor 500-4.
[0063] Aspects of the present disclosure are applicable to bulk
semiconductor processing, in addition to SOI processing. FIG. 5E
illustrates an N-type MOS resistor 500-5 having a front-side gate
shield 510 with a well 524 supporting the semiconductor layer 580,
according to aspects of the present disclosure. For example, the
well 524 may at least partially surround the semiconductor layer
580. According to an aspect of the present disclosure, the well 524
is a P-well. Of course, the doping of the well 524 is exemplary
only, and other alternative doping is possible. The well 524 may
provide isolation through doping opposite from the semiconductor
layer 580, as well as control. For example, a P-well may be used
for control. Isolation may also be obtained from trenches.
[0064] An isolation region 522 may at least partially surround the
well 524. For example, the isolation region 522 may be a bulk
N-type wafer or an N-type triple well configured for providing well
isolation. Alternatively, the isolation region 522 may be a bulk
P-type wafer or a P-type triple well. The MOS resistor 500-5 is
otherwise substantially similar to the MOS resistor 500-1 of FIG.
5A.
[0065] According to an additional aspect of the present disclosure,
the well 524 may support the semiconductor layer 580 without
surrounding the semiconductor layer 580, as illustrated by an
N-type MOS resistor 500-6 in FIG. 5F. The isolation region 522 may
also support the well 524 without surrounding the well 524 for
providing trench isolation. The well 524 and the isolation region
522 may be P-doped or N-doped, according to aspects of the present
disclosure.
[0066] According to aspects of the present disclosure, the backside
gate shield 570 may include the well 524 (e.g., a diffusion
region). For example, the diffusion region may be inside the
semiconductor layer 580. The diffusion region may have a polarity
inverse to a polarity of the semiconductor layer 580.
[0067] An advantage is that fabrication of the well 524 and the
isolation region 522 may be produced through a standard bulk CMOS
process. For example, front-gate control may be added along with
appropriate adjustment of the doping in the active device channel
of the MOS resistor 500-6.
[0068] FIG. 5G illustrates an N-type MOS resistor 500-7 having a
front-side gate shield 510 with an alternative doping of the
semiconductor layer 580, according to aspects of the present
disclosure. For example, the MOS resistor 500-7 may be
substantially similar to the MOS resistor 500-1 of FIG. 5A, except
the semiconductor layer 580 is P- doped. In this example, the
source 504 and the drain 506 may be P+ doped Si, and the channel
502 may be P- doped Si.
[0069] An advantage of having a P-type doping is that it is easier
to achieve higher intrinsic resistance in the active channel region
due to a lower hole mobility. Another advantage is higher
linearity.
[0070] FIG. 6 illustrates a method of fabricating a resistor (e.g.,
N-type MOS resistor) according to aspects of the present
disclosure. The method 600 begins at block 602, in which a
semiconductor layer is fabricated. For example, as shown in FIG.
5A, the semiconductor layer may include a source region (e.g.,
504), a drain region (e.g., 506), and a channel region (e.g., 502).
The channel region may be created between the source region and the
drain region.
[0071] At block 604, the channel region is doped with a same
polarity as the source region and the drain region. For example, as
shown in FIG. 5A, the source 504 and the drain 506 may be N+ doped
silicon (Si) and the channel 502 may be N- doped Si. Of course,
this doping is exemplary only, and the source 504, drain 506, and
channel 502 may be alternatively doped, as described in FIG.
5G.
[0072] At block 606, a first inter-metal dielectric (IMD) layer is
deposited on the channel region. For example, as shown in FIG. 5A,
the first IMD layer 540 may be on the semiconductor layer 580.
[0073] At block 608, a front-side gate shield is fabricated on the
first IMD layer, the front-side gate shield overlapping the channel
region. For example, as shown in FIG. 5A, the front-side gate
shield 510 may be fabricated in an M1 interconnect layer 582.
Alternatively, as shown in FIG. 5D, the front-side gate shield 511
may be fabricated in an M2 interconnect layer 584.
[0074] According to an aspect of the present disclosure, an N-type
MOS resistor is described. In one configuration, the MOS resistor
includes means for shielding. For example, the shielding means may
be the front-side gate shield 510, 511 of FIGS. 5A-5G. In one
configuration, the MOS resistor includes backside shielding means.
For example, the backside shielding means may be the backside gate
shield 570 of FIGS. 5B and 5C. In another aspect, the
aforementioned means may be any module or any apparatus or material
configured to perform the functions recited by the aforementioned
means.
[0075] FIG. 7 is a block diagram showing an exemplary wireless
communication system 700 in which an aspect of the disclosure may
be advantageously employed. For purposes of illustration, FIG. 7
shows three remote units 720, 730, and 750 and two base stations
740. It will be recognized that wireless communication systems may
have many more remote units and base stations. Remote units 720,
730, and 750 include IC devices 725A, 725B, and 725C that include
the disclosed MOS resistor. It will be recognized that other
devices may also include the disclosed MOS resistor, such as the
base stations, switching devices, and network equipment. FIG. 7
shows forward link signals 780 from the base station 740 to the
remote units 720, 730, and 750 and reverse link signals 790 from
the remote units 720, 730, and 750 to base station 740.
[0076] In FIG. 7, remote unit 720 is shown as a mobile telephone,
remote unit 730 is shown as a portable computer, and remote unit
750 is shown as a fixed location remote unit in a wireless local
loop system. For example, the remote units may be a mobile phone, a
hand-held personal communication systems (PCS) unit, a portable
data unit such as a personal data assistant, a GPS enabled devices,
a navigation device, a set top box, a music player, a video player,
an entertainment unit, a fixed location data unit such as meter
reading equipment, or other devices that store or retrieve data or
computer instructions, or combinations thereof. Although FIG. 7
illustrates remote units according to the aspects of the
disclosure, the disclosure is not limited to these exemplary
illustrated units. Aspects of the disclosure may be suitably
employed in many devices, which include the disclosed MOS
resistor.
[0077] FIG. 8 is a block diagram illustrating a design workstation
used for circuit, layout, and logic design of an IC structure, such
as the MOS resistor disclosed above. A design workstation 800
includes a hard disk 801 containing operating system software,
support files, and design software such as Cadence or OrCAD. The
design workstation 800 also includes a display 802 to facilitate
design of a circuit 810 or an IC device 812 including the disclosed
MOS resistor. A storage medium 804 is provided for tangibly storing
the design of the circuit 810 or the IC device 812. The design of
the circuit 810 or the IC device 812 may be stored on the storage
medium 804 in a file format such as GDSII or GERBER. The storage
medium 804 may be a CD-ROM, DVD, hard disk, flash memory, or other
appropriate device. Furthermore, the design workstation 800
includes a drive apparatus 803 for accepting input from or writing
output to the storage medium 804.
[0078] Data recorded on the storage medium 804 may specify logic
circuit configurations, pattern data for photolithography masks, or
mask pattern data for serial write tools such as electron beam
lithography. The data may further include logic verification data
such as timing diagrams or net circuits associated with logic
simulations. Providing data on the storage medium 804 facilitates
the design of the circuit 810 or the IC device 812 including the
disclosed MOS resistor by decreasing the number of processes for
designing semiconductor wafers.
[0079] For a firmware and/or software implementation, the
methodologies may be implemented with modules (e.g., procedures,
functions, and so on) that perform the functions described herein.
Machine-readable medium tangibly embodying instructions may be used
in implementing the methodologies described herein. For example,
software codes may be stored in a memory and executed by a
processor unit. Memory may be implemented within the processor unit
or external to the processor unit. As used herein, the term
"memory" refers to types of long term, short term, volatile,
nonvolatile, or other memory and is not to be limited to a
particular type of memory or number of memories, or type of media
upon which memory is stored.
[0080] If implemented in firmware and/or software, the functions
may be stored as one or more instructions or code on a
computer-readable medium. Examples include computer-readable media
encoded with a data structure and computer-readable media encoded
with a computer program. Computer-readable media includes physical
computer storage media. A storage medium may be an available medium
that can be accessed by a computer. By way of example, and not
limitation, such computer-readable media can include RAM, ROM,
EEPROM, CD-ROM or other optical disk storage, magnetic disk storage
or other magnetic storage devices, or other medium that can be used
to store desired program code in the form of instructions or data
structures and that can be accessed by a computer; disk and disc,
as used herein, includes compact disc (CD), laser disc, optical
disc, digital versatile disc (DVD), floppy disk and Blu-ray disc
where disks usually reproduce data magnetically, while discs
reproduce data optically with lasers. Combinations of the above
should also be included within the scope of computer-readable
media.
[0081] In addition to storage on non-transitory computer-readable
medium, instructions and/or data may be provided as signals on
transmission media included in a communication apparatus. For
example, a communication apparatus may include a transceiver having
signals indicative of instructions and data. The instructions and
data are configured to cause one or more processors to implement
the functions outlined in the claims.
[0082] Although the present disclosure and its advantages have been
described in detail, it should be understood that various changes,
substitutions, and alterations can be made herein without departing
from the technology of the disclosure as defined by the appended
claims. For example, relational terms, such as "above" and "below"
are used with respect to a substrate or electronic device. Of
course, if the substrate or electronic device is inverted, above
becomes below, and vice versa. Additionally, if oriented sideways,
above and below may refer to sides of a substrate or electronic
device. Moreover, the scope of the present application is not
intended to be limited to the particular configurations of the
process, machine, manufacture, and composition of matter, means,
methods, and steps described in the specification. As one of
ordinary skill in the art will readily appreciate from the
disclosure, processes, machines, manufacture, compositions of
matter, means, methods, or steps, presently existing or later to be
developed that perform substantially the same function or achieve
substantially the same result as the corresponding configurations
described herein may be utilized according to the present
disclosure. Accordingly, the appended claims are intended to
include within their scope such processes, machines, manufacture,
compositions of matter, means, methods, or steps.
[0083] Those of skill would further appreciate that the various
illustrative logical blocks, modules, circuits, and algorithm steps
described in connection with the disclosure herein may be
implemented as electronic hardware, computer software, or
combinations of both. To clearly illustrate this interchangeability
of hardware and software, various illustrative components, blocks,
modules, circuits, and steps have been described above generally in
terms of their functionality. Whether such functionality is
implemented as hardware or software depends upon the particular
application and design constraints imposed on the overall system.
Skilled artisans may implement the described functionality in
varying ways for each particular application, but such
implementation decisions should not be interpreted as causing a
departure from the scope of the present disclosure.
[0084] The various illustrative logical blocks, modules, and
circuits described in connection with the disclosure herein may be
implemented or performed with a general-purpose processor, a
digital signal processor (DSP), an application specific integrated
circuit (ASIC), a field programmable gate array (FPGA) or other
programmable logic device, discrete gate or transistor logic,
discrete hardware components, or any combination thereof designed
to perform the functions described herein. A general-purpose
processor may be a microprocessor, but in the alternative, the
processor may be any conventional processor, controller,
microcontroller, or state machine. A processor may also be
implemented as a combination of computing devices (e.g., a
combination of a DSP and a microprocessor, multiple
microprocessors, one or more microprocessors in conjunction with a
DSP core, or any other such configuration).
[0085] The steps of a method or algorithm described in connection
with the disclosure may be embodied directly in hardware, in a
software module executed by a processor, or in a combination of the
two. A software module may reside in RAM, flash memory, ROM, EPROM,
EEPROM, registers, hard disk, a removable disk, a CD-ROM, or any
other form of storage medium known in the art. An exemplary storage
medium is coupled to the processor such that the processor can read
information from, and write information to, the storage medium. In
the alternative, the storage medium may be integral to the
processor. The processor and the storage medium may reside in an
ASIC. The ASIC may reside in a user terminal. In the alternative,
the processor and the storage medium may reside as discrete
components in a user terminal.
[0086] In one or more exemplary designs, the functions described
may be implemented in hardware, software, firmware, or any
combination thereof. If implemented in software, the functions may
be stored on or transmitted over as one or more instructions or
code on a computer-readable medium. Computer-readable media
includes both computer storage media and communication media
including any medium that facilitates transfer of a computer
program from one place to another. A storage media may be any
available media that can be accessed by a general purpose or
special purpose computer. By way of example, and not limitation,
such computer-readable media can include RAM, ROM, EEPROM, CD-ROM
or other optical disk storage, magnetic disk storage or other
magnetic storage devices, or any other medium that can be used to
carry or store specified program code means in the form of
instructions or data structures and that can be accessed by a
general-purpose or special-purpose computer, or a general-purpose
or special-purpose processor. In addition, any connection is
properly termed a computer-readable medium. For example, if the
software is transmitted from a website, server, or other remote
source using a coaxial cable, fiber optic cable, twisted pair,
digital subscriber line (DSL), or wireless technologies such as
infrared, radio, and microwave, then the coaxial cable, fiber optic
cable, twisted pair, DSL, or wireless technologies such as
infrared, radio, and microwave are included in the definition of
medium. Disk and disc, as used herein, includes compact disc (CD),
laser disc, optical disc, digital versatile disc (DVD), and Blu-ray
disc where disks usually reproduce data magnetically, while discs
reproduce data optically with lasers. Combinations of the above
should also be included within the scope of computer-readable
media.
[0087] The previous description of the disclosure is provided to
enable any person skilled in the art to make or use the disclosure.
Various modifications to the disclosure will be readily apparent to
those skilled in the art, and the generic principles defined herein
may be applied to other variations without departing from the
spirit or scope of the disclosure. Thus, the disclosure is not
intended to be limited to the examples and designs described herein
but is to be accorded the widest scope consistent with the
principles and novel features disclosed herein.
* * * * *