U.S. patent application number 16/191625 was filed with the patent office on 2019-05-23 for encapsulation cover for an electronic package and fabrication process.
This patent application is currently assigned to STMicroelectronics (Grenoble 2) SAS. The applicant listed for this patent is STMicroelectronics (Grenoble 2) SAS. Invention is credited to Agnes BAFFERT, Veronique FERRE, Jean-Michel RIVIERE, Karine SAXOD.
Application Number | 20190157469 16/191625 |
Document ID | / |
Family ID | 61873393 |
Filed Date | 2019-05-23 |
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United States Patent
Application |
20190157469 |
Kind Code |
A1 |
SAXOD; Karine ; et
al. |
May 23, 2019 |
ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND FABRICATION
PROCESS
Abstract
An encapsulation cover for an electronic package includes a
frontal wall with a through-passage extending between faces. The
frontal wall includes an optical element that allows light to pass
through the through-passage. A cover body and a metal insert that
is embedded in the cover body, with the cover body being overmolded
over the metal insert, defines at least part of the frontal
wall.
Inventors: |
SAXOD; Karine; (Les Marches,
FR) ; FERRE; Veronique; (Le Pont-de-Claix, FR)
; BAFFERT; Agnes; (Moirans, FR) ; RIVIERE;
Jean-Michel; (Froges, FR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
STMicroelectronics (Grenoble 2) SAS |
Grenoble |
|
FR |
|
|
Assignee: |
STMicroelectronics (Grenoble 2)
SAS
Grenoble
FR
|
Family ID: |
61873393 |
Appl. No.: |
16/191625 |
Filed: |
November 15, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 21/565 20130101;
H01L 31/162 20130101; H01L 31/02322 20130101; H01L 31/0203
20130101 |
International
Class: |
H01L 31/0203 20060101
H01L031/0203; H01L 31/0232 20060101 H01L031/0232; H01L 21/56
20060101 H01L021/56 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 23, 2017 |
FR |
1761101 |
Claims
1. An encapsulation cover for an electronic package, comprising: a
cover body; a metal insert that is embedded in the cover body, the
cover body being overmolded over the metal insert; wherein the
cover body and embedded metal insert form a frontal wall having a
through-passage from a first face to a second face, the cover body
further including a peripheral wall that protrudes from the second
face of the frontal wall; and an optical element located within the
through-passage and configured to allow light to pass through the
through-passage.
2. The cover according to claim 1, wherein at least part of said
metal insert extends through the peripheral wall.
3. The cover according to claim 1, wherein said through-passage
extends through said metal insert.
4. The cover according to claim 1, wherein said metal insert at
least partly surrounds said optical element.
5. The cover according to claim 1, wherein said optical element is
attached to said metal insert in the through-passage.
6. The cover according to claim 1, wherein said through-passage
extends at least partly through said cover body.
7. The cover according to claim 6, wherein said cover body is at
least partly overmolded around said optical element.
8. The cover according to claim 1, wherein said through-passage at
least partly extends through said cover body and said metal
insert.
9. The cover according to claim 1, wherein an edge of said metal
insert at the through-passage is separated by a distance from said
optical element, said cover body comprising a portion positioned
between said optical element and said edge of the metal insert.
10. The cover according to claim 1, wherein the metal insert has at
least one face that is not covered by the cover body.
11. The cover according to claim 1, wherein said cover body
comprises a peripheral rim that surrounds the metal insert.
12. The cover according to claim 1, wherein said cover body
comprises at least one inner wall on the side of said peripheral
wall.
13. An electronic package, comprising: a substrate wafer; an
electronic component, including at least one of an optical sensor
or an optical emitter, mounted on top of a face of the substrate
wafer; and an encapsulation cover mounted on said face of the
substrate wafer so as to form a chamber in which the electronic
component is located, wherein the encapsulation cover comprises: a
cover body; a metal insert that is embedded in the cover body, the
cover body being overmolded over the metal insert; wherein the
cover body and embedded metal insert form a frontal wall having a
through-passage from a first face to a second face, the cover body
further including a peripheral wall that protrudes from the second
face of the frontal wall and is mounted to said face of the
substrate wafer; and an optical element located within the
through-passage and configured to allow light to pass through the
through-passage; wherein the frontal wall is positioned in front of
the electronic component with the through-passage aligned with the
optical sensor or an optical emitter of the electronic
component.
14. The electronic package according to claim 13, wherein at least
part of said metal insert extends through the peripheral wall to be
mounted to said face of the substrate wafer.
15. The electronic package according to claim 13, wherein said
through-passage extends through said metal insert.
16. The electronic package according to claim 13, wherein said
metal insert at least partly surrounds said optical element.
17. The electronic package according to claim 13, wherein said
optical element is attached to said metal insert in the
through-passage.
18. The electronic package according to claim 13, wherein said
through-passage extends at least partly through said cover
body.
19. The electronic package according to claim 18, wherein said
cover body is at least partly overmolded around said optical
element.
20. The electronic package according to claim 13, wherein said
through-passage at least partly extends through said cover body and
said metal insert.
21. The electronic package according to claim 13, wherein an edge
of said metal insert at the through-passage is separated by a
distance from said optical element, said cover body comprising a
portion positioned between said optical element and said edge of
the metal insert.
22. The electronic package according to claim 13, wherein the metal
insert has at least one face that is not covered by the cover
body.
23. The electronic package according to claim 13, wherein said
cover body comprises a peripheral rim that surrounds the metal
insert.
24. The electronic package according to claim 13, wherein said
cover body comprises at least one inner wall on the side of said
peripheral wall.
25. A process for fabricating at least one encapsulation cover for
an electronic package, comprising the following steps: placing,
into a cavity defined between opposite faces of two parts of a
mold, at least one optical element through which light is able to
pass and at least one metal insert, the optical element and the
metal insert making contact with a first face of the opposite faces
of the mold and the optical element making contact with a second
face of the opposite faces of the mold; injecting a coating
material into a remaining space of the cavity; hardening the
coating material to obtain a wall that is overmolded over said at
least one optical element and said at least one metal insert, so as
to produce at least one encapsulation cover including the at least
one metal insert and the at least one optical element and in which
said at least one optical element allows light to pass through from
one face to another face of said wall; and removing said produced
encapsulation cover from the mold.
26. The process according to claim 25, comprising a later step of
cutting through said overmolded wall at a distance from said
optical element and said metal insert.
27. The process according to claim 25, comprising a prior step of
mounting said at least one optical element in a through-passage in
said at least one metal insert.
28. The process according to claim 25, wherein the at least one
optical element is placed in the cavity of the mold at a distance
from the at least one metal insert.
29. The process according to claim 25, wherein said at least one
optical insert is placed in contact with said second face of the
mold.
30. An encapsulation cover for an electronic package, comprising: a
cover body; a metal insert that is embedded in the cover body, the
cover body being overmolded over the metal insert; wherein the
cover body forms at least part of a frontal wall; wherein the
embedded metal insert includes opposed walls; and a metal portion
that extends between the opposed walls of the embedded metal insert
parallel to a front surface of the frontal wall.
31. The cover according to claim 30, wherein the metal portion
includes a through-passage, and further comprising an optical
element located within the through-passage and configured to allow
light to pass through the through-passage.
32. The cover according to claim 31, wherein said optical element
is attached to said metal portion in the through-passage.
33. The cover according to claim 30, wherein the cover body forms a
peripheral wall and wherein the opposed walls of the embedded metal
insert extend through the peripheral wall.
34. The cover according to claim 30, the cover body being further
overmolded over the metal portion.
35. The cover according to claim 30, wherein the metal insert has
at least one face that is not covered by the cover body.
Description
PRIORITY CLAIM
[0001] This application claims the priority benefit of French
Application for Patent No. 1761101, filed on Nov. 23, 2017, the
content of which is hereby incorporated by reference in its
entirety to the maximum extent allowable by law.
TECHNICAL FIELD
[0002] Embodiments of the present invention relate to the field of
packages, in particular to those which are intended to contain
electronic chips including light radiation emitters and/or light
radiation sensors, which may colloquially be referred to as
"electronic packages".
BACKGROUND
[0003] It is known practice to produce electronic packages that
comprise electronic chips mounted on substrate wafers and
encapsulation covers for the chips, which covers are mounted on the
substrate wafers. These encapsulation covers comprise prefabricated
cover bodies that have through-passages and shoulders around these
passages and are provided with optical elements allowing light to
pass through, which are generally made of glass and are added to
the shoulders and attached by means of layers of adhesive.
SUMMARY
[0004] According to one embodiment, an encapsulation cover for an
electronic package is provided, which cover comprises a frontal
wall having at least one through-passage from one face to the
other, in which said frontal wall is provided with an optical
element allowing light to pass through this through-passage and in
which the encapsulation cover includes a cover body and a metal
insert that is embedded in the cover body, the cover body being
overmolded over the metal insert.
[0005] Said frontal wall may comprise at least part of said metal
insert and/or at least part of said cover body.
[0006] Said through-passage may be at least partly made through
said metal insert.
[0007] Said metal insert may at least partly surround said optical
element.
[0008] Said optical element may be attached to said metal
insert.
[0009] Said through-passage may be at least partly made through
said cover body.
[0010] Said cover body may be at least partly overmolded around
said optical element.
[0011] Said through-passage may be at least partly made through
said cover body and said metal insert.
[0012] Said metal insert may be at a distance from said optical
element, said cover body comprising a portion between said optical
element and said metal insert.
[0013] Said metal insert may have at least one face.
[0014] Said cover body may comprise a peripheral wall that
protrudes from one side of said frontal wall.
[0015] Said cover body may comprise at least one inner wall on the
side of said peripheral wall.
[0016] An electronic package is also provided, which package
comprises a substrate wafer, at least one electronic component
including at least one optical sensor and/or one optical emitter,
mounted on top of a face of the substrate wafer, and said
encapsulation cover, mounted on said face of the substrate wafer so
as to form a chamber in which the electronic component is located,
the frontal wall of the encapsulation cover being in front of the
electronic component.
[0017] A process for fabricating at least one encapsulation cover
for an electronic package is also provided, which process comprises
the following steps:
[0018] a mold is obtained comprising two parts having opposite
faces between which a cavity is made;
[0019] placing, into said cavity, at least one optical element,
through which light is able to pass, and at least one metal insert,
the optical element and the metal insert making contact with one of
said faces of the mold and the optical element making contact with
the other of said faces of the mold;
[0020] injecting a coating material into the remaining cavity;
[0021] hardening the coating material to obtain a wall that is
overmolded over said optical element and said metal insert, so as
to produce at least one encapsulation cover including the metal
insert and the optical element and in which said optical element
allows light to pass through from one face to the other of said
wall; and
[0022] removing said produced encapsulation cover from the
mold.
[0023] The process may comprise a later step of cutting through
said overmolded wafer at a distance from said optical element and
said metal insert.
[0024] The process may comprise a prior step of mounting said
optical element in a through-passage in said metal insert.
[0025] Said optical element may be placed in the cavity of the mold
at a distance from the metal insert.
[0026] Said optical insert may be placed in contact with said other
face of the mold.
BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Electronic packages comprising encapsulation covers and
modes of fabrication will now be described by way of exemplary
embodiments illustrated by the appended drawing, in which:
[0028] FIG. 1 shows a longitudinal cross section of an electronic
package, along of FIG. 2;
[0029] FIG. 2 shows a horizontal cross section of the electronic
package of FIG. 1, along II-II of FIG. 1;
[0030] FIG. 3 shows a transverse cross section of the electronic
package of FIG. 1, along of FIG. 2;
[0031] FIG. 4 shows a view from above of the electronic package of
FIG. 1;
[0032] FIG. 5 shows a perspective view of a metal insert of the
electronic package of FIG. 1;
[0033] FIG. 6 shows a step of fabricating a wafer with inserts
viewed from above;
[0034] FIG. 7 shows a step of fabricating an encapsulation cover
for the package of FIG. 1, in a mold in cross section;
[0035] FIG. 8 shows another step of fabricating an encapsulation
cover in the mold of FIG. 4;
[0036] FIG. 9 shows a cross section of a collective wafer out of
the mold;
[0037] FIG. 10 shows one variant embodiment of the electronic
package of FIG. 1, in longitudinal cross section;
[0038] FIG. 11 shows a perspective view of a metal insert of the
electronic package of FIG. 10;
[0039] FIG. 12 shows a step of fabricating an encapsulation cover
for the electronic package of FIG. 10, in a mold in cross
section;
[0040] FIG. 13 shows a perspective view of another metal insert of
the electronic package of FIG. 10;
[0041] FIG. 14 shows another variant embodiment of the electronic
package of FIG. 1, in longitudinal cross section;
[0042] FIG. 15 shows a view from above of the electronic package of
FIG. 14;
[0043] FIG. 16 shows a step of fabricating an encapsulation cover
for the electronic package of FIG. 14, in a mold in cross
section;
[0044] FIG. 17 shows another variant embodiment of the electronic
package of FIG. 1, in longitudinal cross section;
[0045] FIG. 18 shows a view from above of the electronic package of
FIG. 17; and
[0046] FIG. 19 shows a perspective view of a metal insert of the
electronic package of FIG. 17.
DETAILED DESCRIPTION
[0047] FIGS. 1 to 4 illustrate an electronic package 1 that
comprises a substrate wafer 2 including a network of electrical
connections 3, from one face to the other of this wafer, and an
encapsulation cover 4 that is mounted on a front face 5 of the
substrate wafer 2.
[0048] The encapsulation cover 4 comprises a frontal wall 6 that is
located at a distance in front of the front face 5 of the substrate
wafer 2 and a back peripheral wall 7 that protrudes backwards with
respect to the frontal wall 6 and a back end edge 7a of which is
attached to a peripheral zone of the front face 5 of the substrate
wafer 2 by means of a bead of adhesive 8.
[0049] Thus, the substrate wafer 2 and the encapsulation cover 4
delimit a chamber 9 between them.
[0050] The electronic package 1 comprises an electronic chip 10
that is installed in the chamber 9 and has a back face 11 that is
bonded to the front face 5 of the substrate wafer 2, the
encapsulation cover 4 being at a distance from the chip 10, the
front wall 6 being in front of the electronic chip 10.
[0051] According to the example shown, the chip 10 comprises, in
its front face 12, two optical sensors 13 and 14 that are
longitudinally remote from one another. It will be understood that
the chip need not include optical sensors.
[0052] The encapsulation cover 4 comprises a transverse inner
separating partition 15 that protrudes backwards with respect to
the frontal wall 6 and joins two opposite sides of the peripheral
wall 7.
[0053] The inner separating partition 15 divides the chamber 9 into
two spaces 16 and 17 and straddles the chip 10 at a site such that
the sensors 13 and 14 are located on either side and at a distance
from the inner separating partition 15, inside the spaces 16 and
17.
[0054] The inner separating partition 15 has a back edge 18 that is
provided with a notch 19 through which the chip 10 passes. A bead
of adhesive 20 is interposed between the back edge 18 of the
separating partition 15 and the zones of the front face 5 of the
substrate wafer 2 that are located on either side of the chip 10
and between the notch 19 and zones of the front face 12 and flanks
12a of the chip 10.
[0055] The chip 10 is linked to the network of electrical
connections 3 of the substrate wafer 2 by means of electrical wires
21.
[0056] An electronic chip 22, which is, for example, bonded to the
front face 5 of the substrate wafer 2, beside the chip 10, is
installed inside the space 17. The chip 22 comprises, in its front
face 23, a light radiation emitter 24 and it is linked to the
network of electrical connections 3 by electrical wires 25.
[0057] The frontal wall 6 of the cover body 5 of the encapsulation
cover 4 has through-passages 26 and 27, from one face to the other,
that are provided with optical elements 28 and 29 allowing light to
pass through between the spaces 16 and 17 and the exterior,
respectively, from one face to the other of the frontal wall 6, the
opposite faces of the optical elements 28 and 29 being at least
partially uncovered.
[0058] The substrate wafer 2, the encapsulation cover 4, the bead
of adhesive 8 and the bead of adhesive 20 are made of opaque
materials.
[0059] The electronic package 1 may operate in the following
way.
[0060] The emitter 24 of the chip 22 emits light, for example
infrared, radiation outwards through the optical element 29. This
light radiation present in the space 17 is sensed by the sensor 14
of the chip 10. The sensor 13 of the chip 10 senses external light
radiation through the optical element 28.
[0061] The optical elements 28 and 29 may be made of glass and
either or both of them may be treated so as to form lenses and/or
light filters. For example, the optical element 28 may be treated
so as to form an infrared filter and an optical lens for focusing
light towards the sensor 13.
[0062] The optical elements 28 and 29 may have different outlines
and different thicknesses.
[0063] Advantageously, the electronic package 1 may constitute a
means for detecting the proximity of a body in front of the
encapsulation cover 4 by processing the signals arising from the
sensors 13 and 14.
[0064] The encapsulation cover 4 is formed by a cover body 30, made
of a molded material, and a metal insert 31 that is embedded in the
cover body 30, such that the cover body 30 is overmolded over the
metal insert 31, the metal insert 31 being located laterally with
respect to the optical elements 28 and 29. For example, the cover
body 30 is made of an epoxy resin and the metal insert is made of
copper or aluminum.
[0065] According to the exemplary embodiment illustrated in FIGS. 1
to 4, in order to form the frontal wall 6 of the encapsulation
cover 4, the cover body 30 comprises a plate-shaped portion 32 and
the metal insert 31 comprises a plate 33 that is provided with
protruding back portions 34 and 35 and that is embedded in a front
part of the portion 32. The front face 33a of the plate 33 is
uncovered and, optionally, the portion 32 of the cover body 30 has
a front peripheral rim 32a surrounding the plate 33. The portion 32
of the cover body 30 covers the back face of the plate 33 of the
metal insert 31. The portion 32 of the cover body 30 covers the
protruding back portions 34 and 35 of the metal insert 31.
[0066] The through-passages 26 and 27 in the frontal wall 6 are
formed by through-openings 36 and 37 in the plate 33 of the metal
insert 31, which pass through the protruding portions 34 and 35,
and by through-openings 38 and 39 in the portion 32 of the cover
body 30.
[0067] The optical elements 28 and 29 are inserted into the
through-openings 36 and 37 in the plate 33 of the metal insert 31
and are attached for example by bonding. The optical elements 28
and 29 allow light to pass from one face to the other of the
frontal wall 6.
[0068] The cover body 30 comprises a portion 40 that protrudes
backwards with respect to its portion 32, which forms the
peripheral wall 7 of the encapsulation cover 4, and additionally
comprises a portion 41 that protrudes backwards with respect to its
portion 32, which forms the transverse inner separating partition
15 of the encapsulation cover 4.
[0069] The metal insert 31 may contribute to holding and to
positioning the optical elements 28 and 29, may contribute to
transferring heat to the exterior, may form a shield against
electromagnetic fields and may contribute to strengthening the
encapsulation cover 4.
[0070] The encapsulation cover 4 may be the result of a wafer-scale
fabrication process, which will now be described.
[0071] As illustrated in FIGS. 5 and 6, a collective wafer with
inserts 42 is obtained, which wafer is formed by a plurality of
metal inserts 31, the plates 33 of which are located beside and at
a distance from one another, taking the form of a mosaic, and are
linked to one another by local branches 43, the protruding portions
34 and 35 being located on one and the same side.
[0072] Optical elements 28 and 29 are inserted into and bonded in
the through-openings 36 and 37 in the metal inserts 31.
[0073] As illustrated in FIG. 7, a mold 44 is obtained comprising a
lower part 45 and an upper part 46, delimiting between them a
cavity 44a having opposite faces.
[0074] The collective wafer 42 with inserts 31, provided with the
optical elements 28 and 29, has been installed on top of a face 47
of the lower part 45, by means of a temporary adhesive layer 47a,
in a position such that the metal inserts are at sites E. The faces
33a of the inserts 31 are bonded to this layer 47a and the
protruding portions 34 and 35 are oriented upwards.
[0075] When the lower part 45 and the upper part 46 of the mold 4
are joined together, the collective wafer 42 with inserts 31 and
the upper part 46 of the mold 44 delimit, in the cavity 44a, a
collective space 47a corresponding to a plurality of cover bodies
30 to be overmolded over the inserts 31 of the collective wafer
with inserts 42, which are linked to one another at their
peripheries.
[0076] The face 49 of the upper part 46 of the mold 44, delimiting
the space 48, has a surface 50 that is parallel to the face 47 of
the lower part 45 of the mold 44, corresponding to the back faces
of the cover bodies 30 to be produced.
[0077] In the surface 50, the upper part 46 of the mold 44 has
grooves 51 that cross one another, corresponding to the peripheral
walls 40 of the cover bodies 30 to be produced, and has grooves 52
corresponding to the inner walls 41 of the cover bodies 30 to be
produced. The surface 5 of the upper part 46 of the mold 44 is
provided with protruding local bosses 53, the ends of which make
contact with the optical elements 28 and 29, respectively, and
correspond to the through openings 38 in the cover bodies 30 to be
produced.
[0078] As illustrated in FIG. 8, a coating material has been
injected into the remaining collective space 47 of the mold 44, so
as to collectively produce cover bodies 30 at the sites E, which
are overmolded over the collective wafer with inserts 42.
[0079] As illustrated in FIG. 9, after cooling, removal from the
mold has been carried out. Next, singulation is carried out by
longitudinally and transversely cutting along cutting lines 54, for
example by sawing, through the linking zones of the cover bodies 30
and through the local branches 43, while passing between and at a
distance from the peripheral edges of the plates 33 of the inserts
31, so as to obtain a plurality of encapsulation covers 4.
[0080] FIGS. 10 and 11 illustrate one variant embodiment of the
electronic package 1, in which the encapsulation cover 4 is
modified, a metal insert 56 replacing the metal insert 31.
[0081] The metal insert 56 comprises a plate 57 that is equivalent
to the plate 33, provided with optical elements 28 and 29, and
further comprises protruding back plates 58 that extend backwards
from opposite edges of the plate 57. The back plates 58 extend into
and are embedded in the peripheral wall 40 of the cover body 30.
The back plates 58 have uncovered back end faces 58a, which are
located in the plane of the back end face 7a of the peripheral wall
40 of the cover body 30.
[0082] The beads of adhesive 9 and 20 may be made of a
heat-conducting material. The substrate wafer 2 may be provided
with metal through-vias 59 that are located in the zone of the bead
of adhesive 9, with a view to transferring heat to the back via the
back plates 58, the bead of adhesive 8 and the vias 58.
[0083] The encapsulation cover 4 thus modified may be the result of
a wafer-scale fabrication process that is equivalent to that
described above with reference to FIGS. 6 to 9, with the difference
that, as illustrated in FIG. 12, the back ends 58a of the back
plates 58 of the inserts that are installed in the mold 44 bear
against the bottoms of the grooves 51 of the upper part of the mold
44 when the latter is closed. In the cutting operation described
above, the cutting lines 54 pass between and at a distance from the
back plates 58.
[0084] FIG. 13 illustrates one variant embodiment of the metal
insert 56, in which the back plates 58 are provided with notches 60
from their back ends 58a. In this case, the overmolded cover body
30 fills these notches 60.
[0085] FIGS. 14 and 15 illustrate one variant embodiment of the
electronic package 1, in which the encapsulation cover 4 is
modified such that the metal insert 31 is at a distance from the
optical elements 28 and 29.
[0086] More particularly, the through-openings 36 and 37 in the
plate 33 of the metal insert 31 are facing and at a distance from
the flanks of the optical elements 28 and 29.
[0087] In this case, the overmolded cover body 30 comprises
ring-shaped portions 32b and 32c that fill the gaps between the
optical elements 28 and 29 and the through-openings 36 and 37 and
protrude forwards from the portion 32 of the cover body 30.
[0088] The ring-shaped portions 32b and 32c link the optical
elements 28 and 29 to the plates 33 and aid in the mounting
thereof. Advantageously, the distances between the optical elements
28 and 29 and the through-openings 36 and 37 in the plate 33 are
small, such that the optical elements are correctly placed.
[0089] The wafer-scale fabrication of encapsulation covers 4 thus
modified is modified in the following manner.
[0090] As illustrated in FIG. 16, a collective wafer with inserts
42, without optical elements 28 and 29, is put in place on the
adhesive layer 47 of the lower part 45 of the mold 44. Next, the
optical elements 28 and 29 are put in place in the through-openings
36 and 37, making contact with the adhesive layer 47a of the lower
part 45 of the mold 44, leaving gaps 36a and 37a. As above, the
bosses 53 of the mold 44 make contact with the optical elements 28
and 29.
[0091] During the operation of injecting the coating material, the
gaps 36a and 37a will be filled so as to produce the ring-shaped
portions 32b and 32c.
[0092] FIGS. 17 to 19 illustrate one variant embodiment of the
electronic package 1, in which the encapsulation cover 4 is
modified, the metal insert 31 being replaced by a metal insert
62.
[0093] By replacing the plate 33, the metal insert 62 comprises an
apertured plate formed by a plurality of front branches 63 that are
linked to one another, and that are located at a distance from the
flanks of the optical elements 28 and 29. Additionally, the metal
insert 62 comprises a plurality of back branches 64 that are linked
to the branches 36 and that extend backwards.
[0094] In a way equivalent to that which has been described above,
the branches 63 and 64 are embedded in the cover body 30, by
overmolding of the latter. The cover body 30 and the front branches
63 of the metal insert 62 have frontal faces 65 and 66 that are
located in one and the same plane. The back branches extend up to
the back ends of the peripheral wall of the cover body 30.
[0095] According to this variant embodiment, branches 64a of the
plurality of branches 64 extend facing and a small distance from
the optical elements 28 and 29, for example on three of their
sides.
[0096] In a wafer-scale fabrication process, equivalent to those
described above, for fabricating encapsulation covers 4 thus
modified, the metal inserts 62, and then the optical elements 28
and 29, are put in place on top of the lower part 45 of the mold
44. When the mold 44 is closed, the branches 63 and the optical
elements 28 and 29 make contact with the lower part 45 of the mold
44, via the adhesive layer 47a, and the back ends of the back
branches 64 make contact with the upper part 46 of the mold 44.
[0097] Although the optical elements 28, 29 are shown, it will be
understood that the electronic package with metal insert 62 may
omit the optical elements 28, 29 when not required by the circuit
or system application.
[0098] According to one variant embodiment of the electronic
package 1, an equivalent electronic package comprises separate
chips that are respectively entirely located within spaces
delimited by an inner wall of an encapsulation cover that includes,
by overmolding, a metal insert and is provided with optical
elements allowing light to pass into and out of the spaces.
[0099] According to one variant embodiment of the electronic
package 1, an equivalent electronic package comprises an
encapsulation cover for a chip provided with an emitter or with a
sensor of light radiation, this encapsulation cover including, by
overmolding, a metal insert and being provided with a single
optical element.
[0100] According to variant embodiments, the described arrangements
may be combined.
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