Saxod; Karine

Patent Applications and Registrations

Patent applications and USPTO patent grants for Saxod; Karine.The latest application filed is for "encapsulation cover for an electronic package and fabrication process".

Company Profile

21.18.30

Saxod; Karine - Les Marches FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Encapsulation cover for an electronic package and fabrication process Grant 11,437,527 - Saxod , et al. September 6, 2	2022-09-06
Method for fabricating an electronic device comprising forming an infused adhesive and a periperal ring Grant 11,244,910 - Saxod , et al. February 8, 2	2022-02-08
Encapsulation Cover For An Electronic Package And Fabrication Process App 20220029034 - SAXOD; Karine ; et al.	2022-01-27
Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover Grant 11,114,312 - Besancon , et al. September 7, 2	2021-09-07
Cover For An Electronic Circuit Package App 20210159985 - RIVIERE; Jean-Michel ; et al.	2021-05-27
Electronic Device Comprising A Carrier Substrate And An Encapsulating Cover Mounted On The Carrier Substrate, And Corresponding Mounting Process App 20210143294 - SAXOD; Karine ; et al.	2021-05-13
Electronic Device Comprising An Optical Chip And Method Of Fabrication App 20210135072 - MASTROMAURO; Nicolas ; et al.	2021-05-06
Cover for an electronic circuit package Grant 10,998,470 - Riviere , et al. May 4, 2	2021-05-04
Cover for an electronic circuit package Grant 10,965,376 - Riviere , et al. March 30, 2	2021-03-30
Electronic device comprising an optical chip and method of fabrication Grant 10,923,638 - Mastromauro , et al. February 16, 2	2021-02-16
Method For Manufacturing A Cover For An Electronic Package And Electronic Package Comprising A Cover App 20210043780 - SAXOD; Karine ; et al.	2021-02-11
Method for manufacturing a cover for an electronic package and electronic package comprising a cover Grant 10,833,208 - Saxod , et al. November 10, 2	2020-11-10
Encapsulation Cover For An Electronic Package And Fabrication Process App 20200303565 - SAXOD; Karine ; et al.	2020-09-24
Encapsulation cover for an electronic package and method of fabrication Grant 10,748,883 - Saxod , et al. A	2020-08-18
Method For Fabricating An Electronic Device And A Stacked Electronic Device App 20200258850 - A1	2020-08-13
Method for fabricating an electronic device and a stacked electronic device Grant 10,672,721 - Saxod , et al.	2020-06-02
Electronic Device Comprising An Optical Chip And Method Of Fabrication App 20200098958 - MASTROMAURO; Nicolas ; et al.	2020-03-26
Electronic Device Comprising An Optical Chip And Method Of Fabrication App 20200096720 - MASTROMAURO; Nicolas ; et al.	2020-03-26
Method For Manufacturing A Cover For An Electronic Package And Electronic Package Comprising A Cover App 20200020815 - SAXOD; Karine ; et al.	2020-01-16
Electronic package and fabrication method Grant 10,483,181 - Saxod , et al. Nov	2019-11-19
Method for making a cover for an electronic package and electronic package comprising a cover Grant 10,483,408 - Saxod , et al. Nov	2019-11-19
Electronic housing including a grooved cover Grant 10,480,994 - Saxod , et al. Nov	2019-11-19
Encapsulating Cover For An Electronic Package And Fabricating Process App 20190280130 - SAXOD; Karine ; et al.	2019-09-12
Method For Manufacturing A Plurality Of Electronic Units App 20190267349 - PIN; Marie-Astrid ; et al.	2019-08-29
Method For Manufacturing An Encapsulation Cover For An Electronic Package And Electronic Package Comprising A Cover App 20190252212 - BESANCON; Benoit ; et al.	2019-08-15
Electronic Circuit Package Cover App 20190189860 - RIVIERE; Jean-Michel ; et al.	2019-06-20
Cover For An Electronic Circuit Package App 20190190606 - RIVIERE; Jean-Michel ; et al.	2019-06-20
Cover For An Electronic Circuit Package App 20190189859 - RIVIERE; Jean-Michel ; et al.	2019-06-20
Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover Grant 10,325,784 - Besancon , et al.	2019-06-18
Encapsulation Cover For An Electronic Package And Fabrication Process App 20190157469 - SAXOD; Karine ; et al.	2019-05-23
Encapsulation Cover For An Electronic Package And Method Of Fabrication App 20190139947 - SAXOD; Karine ; et al.	2019-05-09
Method For Fabricating An Electronic Device And A Stacked Electronic Device App 20190103368 - SAXOD; Karine ; et al.	2019-04-04
Electronic Package And Fabrication Method App 20190027416 - SAXOD; Karine ; et al.	2019-01-24
Method for fabricating an electronic device and a stacked electronic device Grant 10,177,098 - Saxod , et al. J	2019-01-08
Method For Manufacturing A Cover For An Electronic Package And Electronic Package Comprising A Cover App 20180190511 - Mas; Alexandre ; et al.	2018-07-05
Method For Manufacturing An Encapsulation Cover For An Electronic Package And Electronic Package Comprising A Cover App 20180190512 - Besancon; Benoit ; et al.	2018-07-05
Method For Making A Cover For An Electronic Package And Electronic Package Comprising A Cover App 20180190838 - Saxod; Karine ; et al.	2018-07-05
Electronic Housing Including A Grooved Cover App 20180058920 - Saxod; Karine ; et al.	2018-03-01
Stacked electronic device including a protective wafer bonded to a chip by an infused adhesive Grant 9,773,740 - Saxod , et al. September 26, 2	2017-09-26
Method For Fabricating An Electronic Device And A Stacked Electronic Device App 20170133520 - Saxod; Karine ; et al.	2017-05-11
Electronic Device Equipped With A Heat Sink App 20170127567 - Besancon; Benoit ; et al.	2017-05-04
Process of fabrication of electronic devices and electronic device with a double encapsulation ring Grant 9,472,692 - Sorrieul , et al. October 18, 2	2016-10-18
Electronic device comprising a substrate board equipped with a local reinforcing or balancing layer Grant 9,420,685 - Riviere , et al. August 16, 2	2016-08-16
Process Of Fabrication Of Electronic Devices And Electronic Device With A Double Encapsulation Ring App 20160163884 - Sorrieul; Marika ; et al.	2016-06-09
Method For Fabricating An Electronic Device And A Stacked Electronic Device App 20160148879 - Saxod; Karine ; et al.	2016-05-26
Electronic component package with a heat conductor Grant 9,101,077 - Riviere , et al. August 4, 2	2015-08-04
Electronic Device Comprising A Substrate Board Equipped With A Local Reinforcing Or Balancing Layer App 20150036309 - Riviere; Jean-Michel ; et al.	2015-02-05
Package App 20130155620 - Riviere; Jean-Michel ; et al.	2013-06-20

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