U.S. patent application number 16/113621 was filed with the patent office on 2018-12-20 for exposure apparatus, exposure method, exposure apparatus maintenance method, exposure apparatus adjustment method and device manufacturing method.
This patent application is currently assigned to NIKON CORPORATION. The applicant listed for this patent is NIKON CORPORATION. Invention is credited to Katsushi NAKANO, Kenichi SHIRAISHI, Natsuko YAMAKAWA.
Application Number | 20180364597 16/113621 |
Document ID | / |
Family ID | 43558480 |
Filed Date | 2018-12-20 |
United States Patent
Application |
20180364597 |
Kind Code |
A1 |
YAMAKAWA; Natsuko ; et
al. |
December 20, 2018 |
EXPOSURE APPARATUS, EXPOSURE METHOD, EXPOSURE APPARATUS MAINTENANCE
METHOD, EXPOSURE APPARATUS ADJUSTMENT METHOD AND DEVICE
MANUFACTURING METHOD
Abstract
An exposure apparatus exposes a substrate using exposure light
via a liquid. The exposure apparatus comprises a substrate holding
part, which releasably holds and is capable of moving a substrate,
a management apparatus, which manages a status of usage of a dummy
substrate that the substrate holding part is capable of
holding.
Inventors: |
YAMAKAWA; Natsuko;
(Fukaya-shi, JP) ; NAKANO; Katsushi;
(Kumagaya-shi, JP) ; SHIRAISHI; Kenichi;
(Saitama-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
NIKON CORPORATION |
Tokyo |
|
JP |
|
|
Assignee: |
NIKON CORPORATION
Tokyo
JP
|
Family ID: |
43558480 |
Appl. No.: |
16/113621 |
Filed: |
August 27, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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13508630 |
Aug 23, 2012 |
10061214 |
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PCT/JP2010/070413 |
Nov 9, 2010 |
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16113621 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G03F 7/70975 20130101;
G03F 7/70541 20130101 |
International
Class: |
G03F 7/20 20060101
G03F007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 9, 2009 |
JP |
2009-256372 |
Claims
1. An exposure apparatus comprising: a projection system under
which a liquid immersion area is formed and from which an exposure
light is projected to a substrate; a substrate stage having a
holder part on which the substrate is releasably held, which is
movable below the projection system; a controller which selects one
of a plurality of dummy substrate for a maintenance operation,
based on a cumulative energy of exposure light irradiated to the
selected dummy substrates and/or a cumulative liquid contact time
of the selected dummy substrate.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional application of U.S.
application Ser. No. 13/508,630, filed Aug. 23, 2012, the contents
of which are incorporated herein by reference.
BACKGROUND
[0002] The present invention relates to an exposure apparatus, an
exposure method, an exposure apparatus maintenance method, an
exposure apparatus adjustment method and a device manufacturing
method.
[0003] Priority is claimed on Japanese Patent Application No.
2009/256372, filed Nov. 9, 2009, the contents of which are
incorporated herein by reference.
[0004] In exposure apparatuses used in lithography processes,
liquid immersion exposure apparatuses that expose a substrate using
exposure light via a liquid, such as that disclosed in the patent
document (U.S. Patent Application Publication No. 2006/0132737
specification), are known. The exposure apparatus comprises a
substrate holding part, which releasably holds a substrate, and
exposes a substrate held by that substrate holding part.
SUMMARY
[0005] In the case in which prescribed processing is performed
using a dummy substrate that the substrate holding part is able to
hold, for example, when a deteriorated dummy substrate is
continually used, there is a possibility that it will no longer be
possible to favorably execute that prescribed processing. As a
result, there is a possibility that exposure performance will drop,
such as in exposure defects occurring, and that defective devices
will occur.
[0006] A purpose of the modes of the present invention is to
provide an exposure apparatus that is able to favorably execute
processing that uses a dummy substrate and is able to restrict
decreases in exposure performance as well as an exposure method,
exposure apparatus maintenance method, and exposure apparatus
adjustment method. In addition, a purpose of the modes of the
present invention is to provide a device manufacturing method that
is able to restrict the occurrence of defective devices.
[0007] Provided according to the first aspect of the present
invention is an exposure apparatus that exposes a substrate using
exposure light via a liquid; comprising a substrate holding part,
which releasably holds and is capable of moving the substrate, a
management apparatus, which manages the status of usage of a dummy
substrate that the substrate holding part is capable of
holding.
[0008] Provided according to the second aspect of the present
invention is a device manufacturing method; including exposure of
the substrate using an exposure apparatus according to the first
aspect and development of the exposed substrate.
[0009] Provided according to the third aspect of the present
invention is an exposure method that exposes a substrate using
exposure light via a liquid; including exposure of the substrate
held by the substrate holding part with the exposure light, holding
of the dummy substrate by the substrate holding part and execution
of the prescribed processing using the dummy substrate, management
of the status of usage of the dummy substrate.
[0010] Provided according to the fourth aspect of the present
invention is a device manufacturing method; including exposure of
the substrate using an exposure method of the third aspect and
development of the exposed substrate.
[0011] Provided according to the fifth aspect of the present
invention is a maintenance method of an exposure apparatus that
exposes a substrate using exposure light via a liquid; including
holding of the dummy substrate at the substrate holding part, which
releasably holds the substrate, holding of a liquid between the
dummy substrate and a prescribed member to perform maintenance of
the prescribed member, management of the status of usage of the
dummy substrate.
[0012] Provided according to the sixth aspect of the present
invention is a device manufacturing method; including exposure of a
substrate using an exposure apparatus maintained by a maintenance
method of the fifth aspect and development of the exposed
substrate.
[0013] Provided according to the seventh aspect of the present
invention is an adjustment method of an exposure apparatus that
exposes a substrate using exposure light via a liquid; including
holding of a dummy substrate by a substrate holding part, which
releasably holds the substrate, adjustment of a prescribed position
in a status in which the dummy substrate has been held by the
substrate holding part, management of the status of usage of the
dummy substrate.
[0014] Provided according to the eighth aspect of the present
invention is a device manufacturing method; including exposing a
substrate using an exposure apparatus adjusted by an adjustment
method of the seventh aspect and developing the exposed
substrate.
[0015] Provided according to the seventh aspect of the present
invention is a dummy substrate which is releasably held by a
substrate holding part of an exposure apparatus that exposes a
substrate using exposure light via a liquid; wherein management
parameters corresponding to the description of usage in the
exposure apparatus.
[0016] According to the aspects of the present invention, it is
possible to restrict decreases in exposure performance and to
restrict the occurrence of defective devices.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] FIG. 1 is a schematic block diagram that shows an example of
an exposure apparatus.
[0018] FIG. 2 is a plan view that shows a part of FIG. 1.
[0019] FIG. 3 is a side cross-sectional view that shows an example
of a liquid immersion member.
[0020] FIG. 4 is a schematic view that shows an example of
operation of an exposure apparatus.
[0021] FIG. 5 is a side cross-sectional view that shows an example
of a dummy substrate.
[0022] FIG. 6 is a side cross-sectional view that shows an example
of a dummy substrate.
[0023] FIG. 7 is a flow chart that shows an example of operation of
an exposure apparatus.
[0024] FIG. 8 is a schematic view that shows an example of
operation of an exposure apparatus.
[0025] FIG. 9 is a schematic view that shows an example of
operation of an exposure apparatus.
[0026] FIG. 10 is a flow chart that shows an example of a device
manufacturing method.
DESCRIPTION OF THE REFERENCE SYMBOLS
[0027] 1 control apparatus [0028] 2 storage apparatus [0029] 3
management apparatus [0030] 5 mask holding part [0031] 6 mask stage
[0032] 7 substrate holding part [0033] 8 substrate stage [0034] 9
liquid immersion member [0035] 10 terminal optical element [0036]
11 emitting surface [0037] 13 accommodating apparatus [0038] 14
internal space [0039] 15 chamber apparatus [0040] 15A chamber
member [0041] 17 buffer part [0042] DP dummy substrate [0043] EL
exposure light [0044] EX exposure apparatus [0045] LQ liquid [0046]
P substrate [0047] PL projection optical system
DESCRIPTION OF EMBODIMENTS
[0048] An embodiment of the present invention will be described
below while referring to drawings, but the present invention is not
limited thereto. In the description below, an XYZ rectangular
coordinate system is set up, and the positional relationships of
the respective members will be described while referring to this
XYZ rectangular coordinate system. The prescribed directions within
the horizontal plane are the X axis directions, directions
orthogonal to the X axis directions within the horizontal plane are
the Y axis directions, and directions respectively orthogonal to
the X axis and the Y axis directions (that is, the vertical
directions) are the Z axis directions. In addition, the directions
of rotation (inclination) about the X axis, the Y axis and the Z
axis are the .theta.X, the .theta.Y and the .theta.Z directions
respectively.
[0049] FIG. 1 is a schematic block diagram that shows an example of
a device manufacturing system SYS that includes an exposure
apparatus EX in an embodiment relating to the present invention,
and FIG. 2 is a plan view that shows a part of FIG. 1. The exposure
apparatus EX of the present embodiment is a liquid immersion
exposure apparatus that exposes the substrate P using exposure
light EL via a liquid LQ. In the present embodiment, a liquid
immersion space LS is formed so that at least a part of the optical
path of the exposure light EL is filled with the liquid LQ. The
liquid immersion space is a portion (space, region) filled with a
liquid. The substrate P is exposed using the exposure light EL via
the liquid LQ of the liquid immersion space LS. In the present
embodiment, water (pure water) is used as the liquid LQ.
[0050] Moreover, the exposure apparatus EX of the present
embodiment is an exposure apparatus comprising a substrate stage
that holds a substrate P and is able to move and a measuring stage
that mounts measuring unit (measuring member), which, without
holding the substrate P, measures the exposure light EL, and is
able to move, such as those disclosed in, for example, the
specification of U.S. Pat. No. 6,897,963 and the specification of
European Patent Application Publication No. 1713113.
[0051] In FIG. 1 and FIG. 2, the exposure apparatus EX comprises a
mask stage 6 that has a mask holding part 5, which releasably holds
a mask M, and holds a mask M and is able to move, a substrate stage
8, which has a substrate holding part 7, which releasably holds a
substrate P, and holds a substrate P and is able to move, a
measuring stage 23, which mounts a measuring stage 24, which,
without holding the substrate P, measures exposure light EL, and is
able to move, a projection optical system PL, which projects the
image of the pattern of the mask M illuminated by the exposure
light EL to the substrate P, an interferometer system 16, which
measures the positions of the mask stage 6, the substrate stage 8
and the measuring stage 23, an alignment system 19, which detects
the alignment marks of the substrate P, a transport system 4, which
transports the substrate P, a liquid immersion member 9, which
holds a liquid LQ between itself and the substrate P so that the
optical path of the exposure light EL irradiated to the substrate P
is filled with the liquid LQ, a chamber apparatus 15, which has a
chamber member 15A which forms an interior space 14 in which the
substrate P is processed, a control apparatus 1 that controls the
operations of the entire exposure apparatus EX, and a storage
apparatus 2 that is connected to the control apparatus 1 and in
which various information relating to exposure is stored.
[0052] The mask M includes a reticle on which a device pattern to
be projected to the substrate P is formed. The mask M includes a
transmitting type mask, for example, which has a transparent plate
such as a glass plate and a pattern formed using a light shielding
material such as chrome on that transparent plate. Note that it is
also possible to use a reflecting type mask as the mask M.
[0053] The substrate P is a substrate for manufacturing devices.
The substrate P includes, for example, a base material such as a
semiconductor wafer such as a silicon wafer and a photosensitive
film formed on that base material. The photosensitive film is a
film of a photosensitive material (photoresist). In addition, the
substrate P may include other films in addition to the
photosensitive film. For example, the substrate P may also include
a reflection preventing film and may also include a protective film
(topcoat film) that protects the photosensitive film.
[0054] The exposure apparatus EX is connected to substrate
processing apparatus CD. In the present embodiment, the substrate
processing apparatus CD includes a coater developer apparatus. The
substrate processing apparatus CD includes a film forming apparatus
that is able to form a prescribed film on the substrate and a
developing apparatus that develops the post-exposure substrate P.
The film forming apparatus includes a coating apparatus that is
able to form a photosensitive film on the substrate by coating a
solution of the photosensitive material to the substrate based on
the spin coating method such as that disclosed in, for example, the
specification of U.S. Patent Application Publication No.
2006/0068110. The film forming apparatus is able to form not only
the photosensitive film but various films such as protective films
and reflection preventing films on the substrate.
[0055] In the present embodiment, an accommodating apparatus 13,
which is able to accommodate the substrate P, is connected to the
exposure apparatus EX. The accommodating apparatus 13 is connected
at a prescribed position of the chamber apparatus 15. In the
present embodiment, the accommodating apparatus 13 includes, for
example, a substrate accommodating apparatus called a FOUP (front
opening unified pod). The accommodating apparatus 13 is able to
accommodate, for example, one lot portion of substrates P (for
example, 50 units).
[0056] In addition, in the present embodiment, the accommodating
apparatus 13 is able to accommodate a dummy substrate DP. The dummy
substrate DP is a (clean) member that is separate from the
substrate P for exposure, is unlikely to emit foreign matter, and
has a high degree of cleanliness. In the present embodiment, the
dummy substrate DP is of an external shape that is nearly the same
as that of the substrate P. In the present embodiment, the
substrate P and the dummy substrate DP are circular plate-shaped
members. A substrate holding part 7 is able to hold the dummy
substrate DP. Accommodating apparatus 13 is able to accommodate a
plurality of dummy substrates DP. Accommodating apparatus 13 is
able to accommodate, for example, the same number (for example 50
units) of dummy substrates DP as the number of substrates P of one
lot portion.
[0057] In addition, in the present embodiment, the exposure
apparatus EX comprises an accommodating apparatus 17 arranged at at
least a part of the transport path of the transport system 4 and
accommodates the dummy substrate DP. In the present embodiment,
accommodating apparatus 17 accommodates a number of dummy
substrates DP smaller than the number of dummy substrates DP (for
example, 50 units) that accommodating apparatus 13 is able to
accommodate. In the present embodiment, accommodating apparatus 17
is able to accommodate two dummy substrates DP. Note that
accommodating apparatus 17 may also accommodate a number of dummy
substrates DP larger than the number of dummy substrates DP that
accommodating apparatus 13 is able to accommodate and may also
accommodate the same number of dummy substrates DP. In the
following description, accommodating apparatus 17 is referred to as
buffer part 17 as appropriate. The buffer part 17 is able to
temporarily store dummy substrates DP.
[0058] In the present embodiment, the transport system 4 is able to
transport the substrate P and the dummy substrate DP respectively.
The transport system 4 is able to transport the substrate P between
accommodating apparatus 13, the substrate stage 8 (substrate
holding part 7) and the substrate processing apparatus CD. In
addition, the transport system 4 is able to transport the dummy
substrate DP between accommodating apparatus 13, the buffer part 17
and the substrate stage 8 (substrate holding part 7).
[0059] In the present embodiment, the transport system 4 comprises
a first transport member 4A, which loads the substrate P to the
substrate stage 8, and a second transport member 4B, which unloads
the substrate P from the substrate stage 8. In the present
embodiment, the first transport member 4A is able to transport the
dummy substrate DP arranged in the buffer part 17 to the substrate
stage 8. The second transport member 4B is able to transport the
dummy substrate DP held by the substrate stage 8 to the buffer part
17. In addition, the second transport member 4B is able to
transport the dummy substrate DP accommodated in the buffer part 17
to accommodating apparatus 13. In addition, the second transport
member 4B is able to transport the dummy substrate DP accommodated
in accommodating apparatus 13 to the buffer part 17.
[0060] Note that the transport system 4 may also comprise a
transport member that is separate from the first and second
transport members 4A, 4B. In addition, the transport system 4 may
use a transport member that is different from the second transport
member 4B to execute transport of the dummy substrate DP between
accommodating apparatus 13 and the buffer part 17.
[0061] In addition, the exposure apparatus EX comprises a
management apparatus 3, which manages the status of usage of the
dummy substrate DP. The management apparatus 3 is able to manage
the statuses of usage of a respective plurality of dummy substrates
DP. Management apparatus 3 includes, for example, a timer, which
measures the time during which the dummy substrates DP are to be
used, and a counter, which measures the number of times the dummy
substrates DP are to be used. The management apparatus 3 is
connected to a control apparatus 1.
[0062] In addition, predetermined management parameters are stored
in the storage apparatus 2. The control apparatus 1 is able to
determine the appropriateness of usage of the dummy substrates DP
based on the output of the management apparatus 3 and management
parameters stored in the storage apparatus 2.
[0063] The illumination system IL irradiates exposure light EL to a
prescribed illumination region IR. The illumination region IR
includes a position that the exposure light EL that emerges from
the illumination system IL is able to irradiate. The illumination
system IL illuminates at least a part of the mask M arranged in the
illumination region IR with exposure light EL with a uniform
illumination intensity distribution. Used as the exposure light EL
that emerges from the illumination system IL is, for example, deep
ultraviolet light (DUV light) such as bright lines (g lines, h
lines, i lines) that emerge from a mercury lamp and KrF excimer
laser light (wavelength of 248 nm) or vacuum ultraviolet light (VUV
light) such as ArF excimer laser light (wavelength of 193 nm) and
F.sub.2 laser light (wavelength of 157 nm). In the present
embodiment, ArF excimer light, which is ultraviolet light (vacuum
ultraviolet light), is used as the exposure light EL.
[0064] The mask stage 6 is able to move on a guide surface 18G of a
base member 18 that includes the illumination region IR in a status
in which the mask M is held by the mask holding part 5. The mask
stage 6 is able to move in six directions on the guide surface 18G,
which are the X axis, Y axis, Z axis, .theta.X, .theta.Y and
.theta.Z directions, by means of operation of a drive system that
includes a planar motor such as that disclosed in, for example, the
specification of U.S. Pat. No. 6,452,292.
[0065] The projection optical system PL irradiates exposure light
EL to a prescribed projection region PR. The projection region PR
includes a position (exposure position) that the exposure light EL
emitted from the projection optical system PL is able to irradiate.
The projection optical system PL projects an image of the pattern
of the mask M to at least a part of the substrate P arranged in the
projection region PR at a prescribed projection magnification. The
projection optical system PL of the present embodiment is a
reduction system whose projection magnification is, for example, a
1/4, 1/5 or 1/8. Note that the projection optical system PL may
also be a unity magnification system or an enlargement system. In
the present embodiment, the optical axis of the projection optical
system PL is parallel to the Z axis. In addition, the projection
optical system PL may also be any of a dioptric system that does
not include a reflecting optical element, a catoptric system that
does not include a refracting optical element, or a catadioptric
system that includes both a reflecting optical element and a
refracting optical element. In addition, the projection optical
system PL may also form an erect image or an inverted image.
[0066] The projection optical system PL has an emitting surface 11
which emits the exposure light EL toward the image plane of the
projection optical system PL. The emitting surface 11 is arranged
at the terminal optical element 10 nearest the image plane of the
projection optical system PL from among the plurality of optical
elements of the projection optical system PL. The projection region
PR includes a position to which the exposure light EL that has
emitted from the emitting surface 11 is able to irradiate. In the
present embodiment, the emitting surface 11 faces the -Z direction
and is parallel to the XY plane. Note that the emitting surface 11
that faces the -Z direction may be a convex surface or a concave
surface.
[0067] In addition, the exposure apparatus EX comprises an imaging
characteristics adjustment system PLC that adjusts the imaging
characteristics of the projection optical system PL. Examples of
the imaging characteristics adjustment system PLC are disclosed in,
for example, the specification of U.S. Pat. No. 4,666,273, the
specification of U.S. Pat. No. 6,235,438, and the specification of
U.S. Patent Application Publication No. 2005/0206850. The imaging
characteristics adjustment system PLC of the present embodiment
includes a drive apparatus that is able to move some of the
plurality of optical elements of the projection optical system PL.
The drive apparatus is able to move a specific optical element from
among the plurality of optical elements of the projection optical
system PL in the optical axis directions (Z axis directions). In
addition, the drive apparatus is able to tilt a specific optical
element with respect to the optical axis. The imaging
characteristics adjustment system PLC adjusts imaging
characteristics including various aberrations (such as the
projection magnification, distortion and spherical operation) of
the projection optical system PL and the image plane position
(focus position) by moving specific optical elements of the
projection optical system PL. In addition, the imaging
characteristics adjustment system PLC is able to adjust the
exposure position (position of the projection region PR) by moving
the specific optical elements of the projection optical system PL.
Note that the imaging characteristics adjustment system may also
include a pressure adjusting apparatus that adjusts the pressure of
the gas of the space between some of the optical elements held in
the interior of the lens barrel that accommodates the optical
elements of the projection optical system PL. The imaging
characteristics adjustment system PLC is controlled by a control
apparatus 1.
[0068] The substrate stage 8 is able to move on a guide surface 20G
of the base member 20, which includes the projection region PR, in
a status in which the substrate P is held by the substrate holding
part 7. The substrate holding part 7 releasably holds the substrate
P at an exposure position (position of the projection region PR)
that the exposure light EL that emerges from the emitting surface
11 is able to irradiate. The substrate stage 8 is able to move in
six directions, which are the X axis, Y axis, Z axis, .theta.X,
.theta.Y and .theta.Z directions, on the guide surface 20G by means
of operation of a drive system that includes a planar motor such as
that disclosed in, for example, the specification of U.S. Pat. No.
6,452,292.
[0069] In the present embodiment, the surface of the substrate P
held by the substrate holding part 7 and the upper surface 22 of
the substrate stage 8 arranged in the vicinity (periphery,
circumference) of that substrate P are arranged within the same
plane (flush). The upper surface 22 is flat. In the present
embodiment, the surface of the substrate P held by the substrate
holding part 7 and the upper surface 22 of the substrate stage 8
are nearly parallel with the XY plane.
[0070] Note that the surface of the substrate P held by the
substrate holding part 7 and the upper surface 22 may also not be
arranged within the same plane, and at least one of the surface of
the substrate P and the upper surface 22 may also not be parallel
to the XY plane.
[0071] Note that the upper surface 22 of the substrate stage 8 may
also be the upper surface of a plate member releasably held by the
substrate stage as disclosed in, for example, the specification of
U.S. Patent Application Publication No. 2007/0177125 and the
specification of U.S. Patent Application Publication No.
2008/0049209.
[0072] The measuring stage 23 is able to move on the guide surface
20G of the base member 20 including the projection region PR in a
status in which a measuring unit 24 (measuring member) has been
mounted. The measuring stage 23 is able to move in six directions
on the guide surface 20G, which are the X axis, Y axis, Z axis,
.theta.X, .theta.Y and .theta.Z directions, by means of operation
of the drive system that includes a planar motor such as that
disclosed in, for example, the specification of U.S. Pat. No.
6,452,292.
[0073] The measuring unit 24 is able to measure the exposure light
EL. In the present embodiment, the measuring unit 24 is at least a
part of an aerial image measuring system, which measures an aerial
image (imaging characteristics of the projection optical system PL)
formed by the projection optical system PL such as that disclosed
in, for example, the specification of U.S. Patent Application
Publication No. 2002/0041377.
[0074] In addition, in the present embodiment, the measuring stage
23 mounts at least a part of an illumination nonuniformity
measuring system such as that disclosed in, for example, the
specification of U.S. Pat. No. 4,465,368. In addition, the
measuring stage 23 mounts at least a part of a measuring system
that is able to measure the amount of displacement of the
transmittance of the exposure light EL of a projection optical
system PL such as that disclosed in, for example, U.S. Pat. No.
6,721,039. In addition, the measuring stage 23 mounts at least a
part of an irradiation amount measuring system (illumination
intensity measuring system) such as that disclosed in, for example,
the specification of U.S. Patent Application Publication No.
2002/0061469. In addition, the measuring stage 23 mounts at least a
part of a wave front aberration measuring system such as that
disclosed in, for example, the specification of European Patent No.
1079223.
[0075] The chamber apparatus 15 comprises a chamber member 15A,
which forms an internal space 14 in which the substrate P is
processed, and an air conditioning apparatus 15B, which adjusts the
environment of that internal space 14. The environment of the
internal space 14 includes the temperature, humidity, pressure and
degree of cleanliness of the internal space 14. The chamber member
15A forms an internal space 14 that includes the exposure position
and is temperature regulated by the air conditioning apparatus 15B.
The substrate stage 8 moves in the internal space 14.
[0076] The positions of the mask stage 6, the substrate stage 8 and
the measuring stage 23 are measured by an interferometer system 16
that includes laser interferometer units 16A, 16B. Laser
interferometer unit 16A is able to measure the position of the mask
stage 6. Laser interferometer unit 16B is able to measure the
positions of the substrate stage 8 and the measuring stage 23. When
exposure processing of the substrate P is executed, or when the
prescribed measurement processing is executed, the control
apparatus 1 executes positional control of the mask stage 6 (mask
M), the substrate stage 8 (substrate P) and the measuring stage 23
(measuring unit 24) based on the measurement results of the
interferometer system 16.
[0077] Note that the exposure apparatus EX may also comprise an
encoder system that has a plurality of encoder heads that are able
to measure a scale arranged on the upper surface 22 of the
substrate stage 8 such as, for example, that disclosed in the
specification of U.S. Patent Application Publication No.
2007/0288121.
[0078] In addition, before exposure of the substrate P is executed,
an alignment mark of the substrate P is detected by an alignment
system 19. In the present embodiment, the alignment system 19 is an
FIA (field image alignment) type alignment system such as that
disclosed in, for example, the specification of U.S. Pat. No.
5,493,403. The alignment system 19 obtains an image of the
alignment mark of the substrate P and detects the position of the
substrate P (shot regions S1.about.S21). In addition, the alignment
system 19 is able to detect not only the alignment mark of the
substrate P but various marks.
[0079] FIG. 3 is a side cross-sectional view that shows an example
of the liquid immersion member 9 relating to the present
embodiment. The liquid immersion member 9 is able to form a liquid
immersion space LS so that at least a part of the optical path of
the exposure light EL is filled with the liquid LQ. At least a part
of the liquid immersion member 9 is arranged at at least a part of
the vicinity of the optical path of the exposure light EL that
emerges from the emitting surface 11. In the present embodiment,
the liquid immersion member 9 is an annular member as seen from the
Z axis direction. In the present embodiment, at least a part of the
liquid immersion member 9 is arranged in the vicinity of terminal
optical element 10 and the optical path of the exposure light
EL.
[0080] The liquid immersion space LS is formed so that the optical
path of the exposure light EL between the terminal optical element
10 and an object arranged at a position that the exposure light EL
that emerges from the terminal optical element 10 is able to
irradiate (the position of the projection region PR) is filled with
the liquid LQ. The liquid immersion member 9 has a lower surface 12
that that object is able to oppose. The liquid LQ is held between
the lower surface 12 and the object so that the optical path of the
exposure light EL between the emitting surface 11 and the object is
filled with the liquid LQ.
[0081] In the present embodiment, the object that can be arranged
in the projection region PR is an object that is able to move with
respect to the projection region PR at the image plane side of the
projection optical system PL (the emitting surface 11 side of the
terminal optical element 10) and is an object that is able to move
to a position that opposes the emitting surface 11 and the lower
surface 12. In the present embodiment, the object that is able to
move to a position that opposes the emitting surface 11 and a lower
surface 12 includes at least one of the substrate stage 8, the
substrate P held by the substrate stage 8, the dummy substrate DP
held by the substrate stage 8 and the measuring stage 23.
[0082] The lower surface 12 of the liquid immersion member 9 is
able to hold the liquid LQ between itself and the surface of the
object (at least one of the upper surface 22 of the substrate stage
8, the surface of the substrate P held by the substrate stage 8,
the surface of the dummy substrate DP held by the substrate stage
8, and the upper surface 50 of the measuring stage 23). The liquid
immersion member 9 forms a liquid immersion space LS by holding the
liquid LQ between the lower surface 12 and the surface of the
object so that the optical path of the exposure light EL between
the emitting surface 11 and the surface of the object (upper
surface) is filled with the liquid LQ. By means of the liquid LQ
being held between the emitting surface 11 and the lower surface 12
of one side and the surface (upper surface) of the object of the
other side, a liquid immersion space LS is formed so that the
optical path of the exposure light EL between the terminal optical
element 10 and the object is filled with the liquid LQ.
[0083] In the present embodiment, the liquid immersion space LS is
formed so that, when the exposure light EL is irradiated to the
substrate P, the region of a part of the surface of the substrate P
that includes the projection region PR is covered with the liquid
LQ. At least a part of the interface (meniscus, edge) LG of the
liquid LQ is formed between the lower surface 12 of the liquid
immersion member 9 and the surface of the substrate P.
Specifically, the exposure apparatus EX of the present embodiment
employs a local liquid immersion system.
[0084] Here, in a description that uses FIG. 3, the case in which
the substrate P is arranged in the projection region PR (a position
that opposes the terminal optical element 10 and the liquid
immersion member 9) will be described as an example, but, as
discussed above, at least one of the substrate stage 8, the dummy
substrate DP and the measuring stage 23 can be arranged.
[0085] As shown in FIG. 3, the liquid immersion member 9 has an
opening 30 at a position that opposes the emitting surface 11. The
exposure light EL that has emitted from the emitting surface 11
passes through the opening 30 and is able to irradiate to the
substrate P. In addition, the liquid immersion member 9 is arranged
in the vicinity of the opening 30 and has a flat surface 21 that is
able to oppose the surface of the substrate P. The flat surface 21
holds the liquid LQ between itself and the surface of the substrate
P. At least a part of the lower surface 12 of the liquid immersion
member 9 includes the flat surface 21.
[0086] The liquid immersion member 9 comprises a supply port 27,
which is able to supply the liquid LQ, and a recovery port 28,
which is able to recover the liquid LQ. The supply port 27 supplies
the liquid LQ in at least a part of the exposure of the substrate
P. The recovery port 28 recovers the liquid LQ in at least a part
of the exposure of the substrate P.
[0087] The supply port 27 is arranged in the vicinity of the
optical path of the exposure light EL so as to face that optical
path. The supply port 27 is connected to a liquid supply apparatus
31 via a supply passageway 34. The liquid supply apparatus 31 is
able to send out liquid LQ that is clean and has been temperature
regulated. The supply passageway 34 includes a passageway formed by
the internal passageway of the liquid immersion member 9 and a
supply tube that connects that internal passageway and the liquid
supply apparatus 31. The liquid LQ that has been sent from the
liquid supply apparatus 31 is supplied to the supply port 27 via
the supply passageway 34.
[0088] The recovery port 28 is able to recover at least a part of
the liquid LQ on the substrate P (object) that opposes the lower
surface 12 of the liquid immersion member 9. In the present
embodiment, the recovery port 28 is arranged in the vicinity of the
flat surface 21. The recovery port 28 is arranged at a prescribed
position of the liquid immersion member 9 that opposes the surface
of the substrate P. A plate-shaped porous member 29 that includes a
plurality of holes (holes, openings or pores) is arranged in the
recovery port 28. Note that a mesh filter, which is a porous member
in which many small holes are formed in a mesh shape, may also be
arranged in the recovery port 28. In the present embodiment, the
lower surface 12 of the liquid immersion member 9 includes the
lower surface of the porous member 29. In at least a part of the
exposure of the substrate P, the lower surface of the porous member
29 faces the substrate P. The liquid LQ on the substrate P is
recovered via the holes of the porous member 29.
[0089] The recovery port 28 is connected with the liquid recovery
apparatus 33 via the recovery passageway 35. The liquid recovery
apparatus 33 is able to connect the recovery port 28 to a vacuum
system and is able to suction the liquid LQ via the recovery port
28. The recovery passageway 35 includes a passageway formed by the
internal passageway of the liquid immersion member 9 and a recovery
tube that connects that internal passageway and the liquid recovery
apparatus 33. The liquid LQ recovered from the recovery port 28 is
recovered by the liquid recovery apparatus 33 via the recovery
passageway 35.
[0090] In the present embodiment, the control apparatus 1, by
executing the recovery operation of the liquid LQ from the recovery
port 28 in parallel with the supply operation of the liquid LQ from
the supply port 27, is able to form a liquid immersion space LS
with the liquid LQ between the terminal optical element 10 and
liquid immersion member 9 of one side and the object of the other
side.
[0091] Note that it is possible to use, for the liquid immersion
member 9, a liquid immersion member (nozzle member) such as that
disclosed in, for example, the specification of U.S. Patent
Application Publication No. 2007/0132976 and the specification of
European Patent Application Publication No. 1768170.
[0092] Next, an example of operation of the exposure apparatus EX
at the time of exposure of the substrate P will be described. FIG.
4 is a plan view of the substrate P held by the substrate stage 8.
In exposure of the substrate P, the substrate P is held by the
substrate holding part 7. In addition, the liquid LQ is held
between the liquid immersion member 9 and the substrate P so that
the optical path of the exposure light EL irradiated from the
substrate P is filled with the liquid LQ. As shown in FIG. 4, the
plurality of shot regions S1.about.S21, which are the regions
subject to exposure, are set in a matrix manner on the substrate P.
In addition, as shown in FIG. 4, in the present embodiment, the
projection region PR is a slit manner with the X axis directions as
the lengthwise directions.
[0093] The exposure apparatus EX of the present embodiment is a
scanning type exposure apparatus (a so-called scanning stepper)
that synchronously moves the mask M and the substrate P in
prescribed scanning directions while projecting the image of
patterns of the mask M to the substrate P. At the time of exposure
of the shot regions S1.about.S21 of the substrate P, the mask M and
the substrate P are moved in prescribed scanning directions within
the XY plane. In the present embodiment, the scanning directions of
the substrate P (synchronous movement directions) are the Y axis
directions, and the scanning directions (synchronous movement
directions) of the mask M are also the Y axis directions. The
control apparatus 1 synchronously moves the mask stage 6 (mask
holding part 5), which holds the mask M, and the substrate stage 8
(substrate holding part 7), which holds the substrate 8, in the Y
axis directions with respect to the optical path of the exposure
light EL.
[0094] The control apparatus 1 controls the mask stage 6 and the
substrate stage 8 to move the shot regions S1.about.S21 of the
substrate P in the Y axis directions with respect to the projection
region PR while moving the pattern forming region of the mask M in
the Y axis directions with respect to the illumination region IR in
synchronization with movement of that substrate P in the Y axis
directions while irradiating the exposure light EL to the substrate
P via the projection optical system PL and the liquid LQ of the
liquid immersion space LS. Through this, the shot regions
S1.about.S21 of the substrate P held by the substrate holding part
7 are exposed with the exposure light EL that has emitted from the
emitting surface 11 of the projection optical system PL via the
liquid LQ, and the image of the pattern of the mask M is projected
to the shot regions S1.about.S21 of the substrate P.
[0095] When the respective shot regions S1.about.S21 are exposed,
the control apparatus 1 controls the substrate stage 8 to move the
substrate P in the Y axis directions with respect to the projection
region PR (terminal optical element 10). In addition, after
exposure of a certain shot region (for example, the first shot
region S1) has ended, in order to perform exposure of the next shot
region (for example, the second shot region S2), the control
apparatus 1 controls the substrate stage 8 to move the substrate P
in a prescribed direction within the XY plane with respect to the
terminal optical element 10 so that the projection region PR is
arranged at the exposure start position of the next shot region in
a status in which emergence of the exposure light EL from the
terminal optical element 10 is stopped.
[0096] In the present embodiment, the control apparatus 1 moves the
terminal optical element 10 and the substrate P (the substrate
stage 8) relatively so that the projection region PR moves along,
for example, arrow R1 in FIG. 4 while emitting the exposure light
EL from the emitting surface 11 of the terminal optical element 10
to irradiate the exposure light EL to the projection region PR and
sequentially expose the respective shot regions S1.about.S21 on the
substrate P.
[0097] In the following description, the movement trajectory of the
substrate stage 8 that moves along arrow R1 is called the movement
trajectory R1 as appropriate.
[0098] Next, FIG. 5 and FIG. 6 will be referred to describe the
dummy substrate DP. FIG. 5 and FIG. 6 are side cross-sectional
views that show an example of the dummy substrate DP relating to
the present embodiment. As discussed above, the dummy substrate DP
has nearly the same external shape as the substrate P. The
substrate holding part 7 is able to hold the dummy substrate DP.
When the dummy substrate DP is held by the substrate holding part
7, at least part of the surface of the dummy substrate DP opposes
the substrate holding part 7. In the description below, at least
the part of the surface of the dummy substrate DP that opposes the
substrate holding part 7 is referred to as the lower surface SB of
the dummy substrate DP as appropriate, and at least the part of the
surface of the dummy substrate DP that faces the direction opposite
lower surface SB is referred to as the upper surface SA of the
dummy substrate DP as appropriate. The substrate holding part 7
holds the lower surface SB of the dummy substrate DP.
[0099] In a status in which the dummy substrate DP is held by the
substrate holding part 7, the upper surface 22 of the substrate
stage 8 is arranged in the vicinity of the upper surface SA of the
dummy substrate DP. In a status in which the dummy substrate DP is
held by the substrate holding part 7, the upper surface SA of the
dummy substrate DP and the upper surface 22 of the substrate stage
8 are arranged in nearly the same plane (nearly flush). In
addition, in a status in which the dummy substrate DP is held by
the substrate holding part 7, the upper surface SA of the dummy
substrate DP is able to oppose the lower surface 11 of the terminal
optical element 10 and the lower surface 12 of the liquid immersion
member 9.
[0100] As shown in FIG. 5, in the present embodiment, the dummy
substrate DP includes a base material W and a film F formed at
least at a part of the surface of that base material W. In the
present embodiment, the upper surface SA and the lower surface SB
of the dummy substrate DP and the respective side surfaces SC that
join the upper surface SA and the lower surface SB are the surfaces
of the film F. Note that, as shown in FIG. 6, the upper surface SA
and the side surfaces SC may be the surface of the film F, and the
lower surface SB may be the surface of the base material W. Or, the
upper surface SA may be the surface of the film F, and the side
surfaces SC and the lower surface SB may be the surface of the base
material W.
[0101] In present embodiment, the base material W of the dummy
substrate DP is the same as the base material of the substrate P
for device manufacture. In the present embodiment, the base
material W of the dummy substrate DP is a silicon wafer (a
so-called bare wafer).
[0102] In the present embodiment, the film F is lyophobic with
respect to the liquid LQ. In the present embodiment, the film F is
formed by a resin that includes fluorine (fluorine group resin). In
the present embodiment, the film F is formed by Teflon.RTM.. Note
that, the film F may also be a silicon carbon nitride film (SiCN)
formed by the CVD method.
[0103] Next, an example of operation of an exposure apparatus EX
having the configuration discussed above will be described while
referring to the flow chart of FIG. 7 and the schematic views of
FIG. 8 and FIG. 9.
[0104] In the present embodiment, the prescribed processing is
executed using the dummy substrate DP. Processing that uses the
dummy substrate DP includes at least one of adjustment processing
that adjusts a prescribed apparatus (substrate stage 8, projection
optical system PL, etc.) of the exposure apparatus EX and
maintenance processing that maintains a prescribed member (liquid
immersion member 9, terminal optical element 10, etc.) of the
exposure apparatus EX.
[0105] In the present embodiment, prescribed processing that
includes adjustment processing and maintenance processing is
executed in a status in which the dummy substrate DP is held by the
substrate holding part 7.
[0106] In the present embodiment, adjustment processing includes at
least one of processing that adjusts the amount of irradiation of
the exposure light EL that emerges from the emitting surface 11 of
the projection optical system PL and processing that adjusts the
projection optical system PL in a status in which the dummy
substrate DP is held by the substrate holding part 7. In addition,
adjustment processing includes processing that adjusts synchronous
movement error of the mask stage 6 and the substrate stage 8 in a
status in which the dummy substrate DP is held by the substrate
holding part 7.
[0107] In the present embodiment, maintenance processing includes
at least one of processing that cleans at least a part of the
liquid immersion member 7 and processing that photo-cleans at least
a part of the projection optical system PL using the exposure light
EL in a status in which the dummy substrate DP is held by the
substrate holding part 7.
[0108] As shown in FIG. 7, the exposure method of the present
embodiment includes holding of the dummy substrate DP using the
substrate holding part 7 to use the dummy substrate DP to execute
adjustment processing of a prescribed apparatus (step SP1),
exposing of the substrate P held by the substrate holding part 7
with the exposure light EL (step SP2), and holding of the dummy
substrate DP using the substrate holding part 7 to use the dummy
substrate DP to execute maintenance processing of a prescribed
member (step SP3).
[0109] In the present embodiment, the dummy substrate DP is
accommodated in advance in the buffer part 17 prior to the
prescribed processing that uses the dummy substrate DP being
executed. The control apparatus 1 selects, from among a plurality
(for example, 50 units) of dummy substrates DP accommodated in the
accommodating apparatus 13, two dummy substrates DP and
accommodates those two dummy substrates DP in the buffer part 17
using the transport system 4.
[0110] In the present embodiment, usage of the dummy substrates DP
includes usage in a status in which holding by the substrate
holding part 17 has been performed. In the case in which the
prescribed processing that uses the dummy substrates DP is to be
executed, the control apparatus 1 uses the transport system 4 to
load the dummy substrates DP accommodated in the buffer part 17 to
the substrate holding part 7.
[0111] The control apparatus 1, in order to execute adjustment
processing that uses the dummy substrates DP, selects one dummy
substrate DP from among the two dummy substrates DP accommodated in
the buffer part 17 and loads the selected dummy substrate DP to the
substrate holding part 7 using the transport system 4. The
substrate holding part 7 holds that dummy substrate DP.
[0112] The control apparatus 1, after the dummy substrate DP has
been held by the substrate holding part 7, uses the dummy substrate
DP held by that substrate holding part 7 to start adjustment
processing (step SP1).
[0113] FIG. 8 shows an example of the status in which adjustment
processing of the amount of irradiation of the exposure light EL
that emerges from the emitting surface 11 of the projection optical
system PL is being executed. As shown in FIG. 8, adjustment
processing of the amount of irradiation of the exposure light EL is
executed in a status in which the emitting surface 11 of the
projection optical system PL and the dummy substrate DP held by the
substrate holding part 7 have been placed in opposition. The
control apparatus 1 emits the exposure light EL from the emitting
surface 11 while adjusting the amount of irradiation of the
exposure light EL that emerges from the emitting surface 11 in a
status in which the emitting surface 11 and the dummy substrate DP
have been placed in opposition. The exposure light EL that has
emitted from the emitting surface 11 is irradiated to the dummy
substrate DP. In the present embodiment, an irradiation amount
sensor that is able to measure the amount of irradiation of the
exposure light EL is arranged in the illumination system IL. The
exposure light EL that has emitted from the light source of the
exposure light EL and has passed through the illumination system IL
is incident to the projection optical system PL, is emitted from
the emitting surface 11 via a plurality of optical elements of that
projection optical system PL, and is irradiated to the dummy
substrate DP. The control apparatus 1 measures the amount of
irradiation of the exposure light EL that is being emitted from the
light source of the exposure light EL and passes through the
illumination system IL using an irradiation amount sensor arranged
in the illumination system IL. The control apparatus 1 is able to
derive the amount of irradiation of the exposure light EL that
emerges from the emitting surface 11 based on the measurement
results of that irradiation amount sensor. The control apparatus 1
is able to adjust the amount of irradiation of the exposure light
EL by, for example, adjusting the output of the light source (in
the present embodiment, the ArF excimer laser apparatus) based on
the measurement results of that irradiation amount sensor.
[0114] In this way, in the present embodiment, usage of the dummy
substrate DP includes usage in a status in which placing in
opposition with the emitting surface 11 has been performed. Usage
of the dummy substrate DP includes irradiating the exposure light
EL that has emitted from the emitting surface 11 to the dummy
substrate DP. In the present embodiment, in adjustment processing
of the amount of irradiation of the exposure light EL, the exposure
light EL is irradiated to the dummy substrate DP, so it is possible
to prevent the exposure light EL from unfortunately being
irradiated to an undesirable part of the exposure apparatus EX. For
example, in adjustment processing, when the exposure light EL is
unfortunately irradiated to the upper surface 22 of the substrate
stage 8 or the upper surface 50 of the measuring stage 23, there is
a possibility that these upper surfaces 22, 50 will unfortunately
deteriorate due to irradiation of the exposure light EL. In the
present embodiment, it is possible to restrict deterioration of
upper surfaces 22, 50, etc. due to irradiation of the exposure
light EL by irradiating the exposure light EL to the dummy
substrate DP.
[0115] In addition, as shown in FIG. 8, adjustment processing of
the amount of irradiation of the exposure light EL is executed in a
status in which the liquid LQ is held between the terminal optical
element 10 and liquid immersion member 9 and the dummy substrate DP
held by the substrate holding part 7. In this way, in the present
embodiment, usage of the dummy substrate DP includes holding of the
liquid LQ in the space with respect to the terminal optical element
10 and the liquid immersion member 9.
[0116] Next, an example of processing in which the dummy substrate
DP is used to adjust the projection optical system PL will be
described. Adjustment processing of the projection optical system
PL is executed in a status in which the emitting surface 11 of the
projection optical system PL and the dummy substrate DP held by the
substrate holding part 7 have been placed in opposition. The
control apparatus 1 moves the substrate stage 8 along the movement
trajectory R1 while emitting the exposure light EL from the
emitting surface 11 of the projection optical system PL as was
described while referring to FIG. 4, in a status in which the dummy
substrate DP is held by the substrate holding part 7. Specifically,
the control apparatus 1 moves the substrate stage 8 along the
movement trajectory R1 while emitting the exposure light EL from
the emitting surface 11 of the projection optical system PL in a
status in which the emitting surface 11 and the dummy substrate DP
held by the substrate holding part 7 have been placed in
opposition. The exposure light EL that has emitted from the
emitting surface 11 of the projection optical system PL is
irradiated to the dummy substrate DP. The control apparatus 1, in a
status in which the emitting surface 11 and the dummy substrate DP
have been placed in opposition so that the exposure light EL is
irradiated to the shot regions S1.about.S21 that have been
virtually set on the dummy substrate DP, moves that dummy substrate
DP along the movement trajectory R1 while emitting the exposure
light EL from the emitting surface 11. Specifically, the control
apparatus 1 sequentially exposes (dummy exposes) the shot regions
S1.about.S21 that have been virtually set on the dummy substrate
DP.
[0117] In the present embodiment, dummy exposure for adjustment
processing of the projection optical system PL is executed in a
status in which the liquid LQ is held between the terminal optical
element 10 and liquid immersion member 9 and a dummy substrate DP
held by the substrate holding part 7.
[0118] After dummy exposure has ended, the control apparatus 1
controls the positions of the substrate stage 8 and the measuring
stage 23 with respect to the projection optical system PL to
arrange the measuring unit 24 of the measuring stage 23 at a
position that opposes the emitting surface 11. The control
apparatus 1 emits the exposure light EL from the emitting surface
11 of the projection optical system PL to irradiate the exposure
light EL to the measuring unit 24. As discussed above, in the
present embodiment, the measuring unit 24 includes a spatial image
measuring system and is able to measure a spatial image (imaging
characteristics of the projection optical system PL) formed by the
projection optical system PL. The control apparatus 1 controls the
imaging characteristics adjustment system PLC based on the
measurement results of the measuring unit 24. Specifically, the
control apparatus 1 uses the imaging characteristics adjustment
system PLC to adjust the imaging characteristics of the projection
optical system PL based on the measuring results of the measuring
unit 24 so that projection optical system PL comes to have the
expected imaging characteristics.
[0119] In this way, in the present embodiment, usage of the dummy
substrate DP includes at least one of adjustment of the amount of
irradiation of the exposure light EL and adjustment of the
projection optical system PL in a status in which placing in
opposition with the emitting surface 11 has been performed.
[0120] In the case in which the imaging characteristics of the
projection optical system PL are measured using the measuring unit
24, the measuring stage 23 is arranged at a prescribed position
with respect to the terminal optical element 10 and the liquid
immersion member 9, the liquid LQ is held between the terminal
optical element 10 and liquid immersion member 22
[0121] In this way, in the present embodiment, usage of the dummy
substrate DP includes holding of the liquid LQ in the space with
respect to the terminal optical element 10 and the liquid immersion
member 9. In addition, as discussed above, in dummy exposure, the
dummy substrate DP moves along the movement trajectory R1 in a
status in which placing in opposition with the terminal optical
element 10 and the liquid immersion member 9 has been performed. In
this way, usage of the dummy substrate DP includes moving in a
status in which placing in opposition with the terminal optical
element 10 and the liquid immersion member 9 has been
performed.
[0122] In the present embodiment, in adjustment processing of the
projection optical system PL, measurement of the imaging
characteristics of the projection optical system PL is executed
after dummy exposure is executed using the dummy substrate DP, so
it is possible to accurately measure the imaging characteristics of
the projection optical system PL under the same exposure conditions
as exposure (actual exposure) with respect to the substrate P for
manufacturing devices. Therefore, it is possible to favorably
adjust the projection optical system PL to the expected imaging
characteristics based on those measurement results. In dummy
exposure, by using a dummy substrate DP rather than the substrate P
for manufacturing devices, it is possible to prevent the substrate
P from being used wastefully. In addition, as discussed above, in
dummy exposure, the dummy substrate DP comes into contact with the
liquid LQ. The dummy substrate DP is less likely to emit foreign
matter than the substrate P, so, in adjustment processing, it is
possible to restrict the liquid LQ from becoming polluted and the
terminal optical element 10 and the liquid immersion member 9, etc.
that come into contact with liquid LQ from becoming polluted.
[0123] Next, an example of processing in which synchronous movement
error between the mask stage 6 and the substrate stage 8 is
adjusted using the dummy substrate DP will be described. Adjustment
processing of synchronous movement error of the mask stage 6 and
the substrate stage 8 is also executed in a status in which the
emitting surface 11 of the projection optical system PL and the
dummy substrate DP held by the substrate holding part 7 have been
placed in opposition.
[0124] The control apparatus 1 executes processing that adjusts
synchronous movement error of the mask stage 6 and the substrate
stage 8 in a status in which the dummy substrate DP is held by the
substrate holding part 7. Specifically, the mask stage 6 and the
substrate stage 8 are synchronously moved under the same movement
conditions as during exposure of the substrate P in a status in
which a dummy substrate DP that has nearly the same external shape
and weight as the substrate P is held by the substrate holding part
7 while the mask M is held by the mask holding part 5. The control
apparatus 1 moves the substrate stage 8 along the movement
trajectory R1 in a status in which the dummy substrate DP is held
by the substrate holding part 7. The dummy substrate DP moves
within the XY plane in a status in which placing in opposition with
the terminal optical element 10 and the liquid immersion member 9
has been performed. The control apparatus 1 measures the position
of the mask stage 6 and the substrate stage 8 using an
interferometer system 16 while synchronously moving the mask stage
6 and the substrate stage 8. Through this, synchronous movement
error of the mask stage 6 and the substrate stage 8 is measured,
and it is possible to adjust (correct) synchronous movement error
based on those measurement results. An example of the technique of
adjusting the synchronous movement error is disclosed in, for
example, the WO 2005/036620 pamphlet.
[0125] In this way, usage of the dummy terminal DP includes
adjusting the synchronous movement error of the mask stage 6 (mask
holding part 5) and the substrate stage 8 (substrate holding part
7) in a status in which the dummy substrate DP is held by the
substrate holding part 7.
[0126] Note that, for adjustment processing, the exposure light EL
may be emitted from the emitting surface 11 in a status in which
the emitting surface 11 and the dummy substrate DP have been placed
in opposition while, for example, the environment of the internal
space 14 that uses the chamber apparatus 15 is adjusted.
[0127] After adjustment processing has ended, the control apparatus
1 starts exposure of the substrate P (step SP2). The control
apparatus 1 uses the transport system 4 to unload the dummy
substrate DP from the substrate holding part 7 and load the
pre-exposure substrate P to the substrate holding part 7. The dummy
substrate DP that has been unloaded from the substrate holding part
7 is transported to at least one of the buffer part 17 and the
accommodating apparatus 13.
[0128] After the pre-exposure substrate P has been loaded to the
substrate stage 8, the control apparatus 1 moves the substrate
stage 8 to the projection region PR and holds the liquid LQ between
at least a part of the lower surface 12 of the liquid immersion
member 9 and the surface of the substrate P so that the optical
path of the exposure light EL that emerges from the emitting
surface 11 is filled with the liquid LQ to form a liquid immersion
space LS. In the present embodiment, as disclosed in, for example,
the specification of U.S. Patent Application Publication No.
2006/0023186 and the specification of U.S. Patent Application
Publication No. 2007/0127006, the control apparatus 1 places in
opposition at least one of the upper surface 22 of the substrate
stage 8 and the upper surface 50 of the measuring stage 23 and the
emitting surface 11 of the terminal optical element 10 and the
lower surface 12 of the liquid immersion member 9 while being able
to synchronously move the substrate stage 8 and the measuring stage
23 in the XY directions with respect to the terminal optical
element 10 and the liquid immersion member 9 in a status in which
the upper surface 22 of the substrate stage 8 and the upper surface
50 of the measuring stage 23 have been caused to approach or to
come in contact so that a space that is able to hold the liquid LQ
between at least one of the substrate stage 8 and the measuring
stage 23 and the terminal optical element 10 and liquid immersion
member 9 continues to be formed. Through this, the control
apparatus 1 is able to change from one of the status in which a
liquid immersion space LS can be formed between the terminal
optical element 10 and liquid immersion member 9 and the substrate
stage 8 and a status in which a liquid immersion space LS can be
formed between the terminal optical element 10 and liquid immersion
member 9 and the measuring stage 23 to the other. Specifically, the
control apparatus 1 is able to move the substrate stage 8 and the
measuring stage 23 with respect to the liquid immersion member 9 so
that leakage of the liquid LQ is restricted while the liquid
immersion space LS formed at the lower surface 12 side of the
liquid immersion member 9 moves in the space with respect to above
the upper surface 22 of the substrate stage 8 and above the upper
surface 50 of the measuring stage 23.
[0129] In the description below, operation in which the substrate
stage 8 and the measuring stage 23 are caused to synchronously move
in the XY directions with respect to the terminal optical element
10 and the liquid immersion member 9 in a status in which the upper
surface 22 of the substrate stage 8 and the upper surface 50 of the
measuring stage 23 are caused to approach or come into contact is
called scrum movement as appropriate.
[0130] After the liquid immersion space LS is formed between the
terminal optical element 10 and liquid immersion member 9 and the
substrate stage 8 (the substrate P) so that scrum movement is
executed and the optical path of the exposure light EL that emerges
from the emitting surface 11 is filled with the liquid LQ, the
control apparatus 1 starts exposure processing of the substrate P.
When exposure processing of the substrate P is executed, the
control apparatus 1 places the terminal optical element 10 and the
liquid immersion member 9 in opposition with the substrate stage 8
and forms a liquid immersion space LS so that the optical path of
the exposure light EL between the terminal optical element 10 and
the substrate P is filled with the liquid LQ. The control apparatus
1 irradiates the exposure light EL from the mask M that has been
illuminated by the exposure light EL by means of the illumination
system IL to the substrate P via the projection optical system PL
and the liquid LQ of the liquid immersion space LS. Through this,
the substrate P is exposed using the exposure light EL, and the
image of the pattern of the mask M is projected to the substrate P.
In exposure of the substrate P, the control apparatus 1, as shown
in FIG. 4, moves the substrate stage 8 along the movement
trajectory R1 while sequentially exposing the respective shot
regions S1.about.S21 of the substrate P.
[0131] After exposure processing of the substrate P has ended, the
control apparatus 1 executes scrum movement to form the liquid
immersion space LS between the terminal optical element 10 and
liquid immersion member 9 and the measuring stage 23 and moves the
substrate stage 8 to the substrate exchange position. The control
apparatus 1 unloads post-exposure substrate P from the substrate
stage 8, which has moved to the substrate exchange position, and
loads a pre-exposure substrate P to the substrate stage 8.
[0132] Thereafter, the control apparatus 1 repeats the processing
discussed above to sequentially expose a plurality of substrates
P.
[0133] The control apparatus 1 starts maintenance processing using
the dummy substrate DP at a prescribed timing (step SP3).
[0134] An example of the case in which maintenance processing of
the liquid immersion member 9 is executed will be described below.
In exposure of the substrate P, there is a possibility that a
substance (for example, an organic substance such as a
photosensitive material) generated (eluted) from the substrate P
will mix into the liquid LQ of the liquid immersion space LS as
foreign matter (pollutants, particles). In addition, there is also
a possibility that not only substances generated from the substrate
P but, for example, foreign matter that floats in the air will mix
into the liquid LQ of the liquid immersion space LS. When foreign
matter mixes into the liquid LQ of the liquid immersion space LS,
there is a possibility that foreign matter will adhere to at least
the part of the lower surface 12 of the liquid immersion member 9
that comes into contact with that liquid LQ.
[0135] Therefore, in the present embodiment, the control apparatus
1, during non-exposure of the substrate P, uses a dummy substrate
DP to execute maintenance processing of at least a part of the
lower surface 12 of the liquid immersion member 9. Maintenance
processing includes cleaning processing of at least a part of the
liquid immersion member 9 in a status in which the liquid immersion
member 9 and the dummy substrate DP held by the substrate holding
part 7 have been placed in opposition.
[0136] The control apparatus 1, in order to execute maintenance
processing that uses the dummy substrate DP, selects one dummy
substrate DP from among the two dummy substrates DP accommodated in
the buffer part 17 and loads that selected dummy substrate DP to
the substrate holding part 7 using the transport system 4. The
substrate holding part 7 holds that dummy substrate DP.
[0137] The control apparatus 1, after the dummy substrate DP has
been held by the substrate holding part 7, uses that dummy
substrate DP held by the substrate holding part 7 to start
maintenance processing.
[0138] An example of processing that cleans the liquid immersion
member 9 as maintenance processing will be described below. The
cleaning processing of the liquid immersion member 9 is executed in
a status in which the lower surface 12 of the liquid immersion
member 9 and the dummy substrate DP held by the substrate holding
part 7 have been placed in opposition. In the present embodiment,
in order to clean at least a part of the liquid immersion member 9,
a first cleaning mode and a second cleaning mode are put into
place.
[0139] First, the first cleaning mode will be described. The first
cleaning mode is a mode that cleans at least a part of the liquid
immersion member 9 by moving the substrate stage 8 within the XY
plane in a status in which the liquid LQ is held between the
terminal optical element 10 and liquid immersion member 9 and the
dummy substrate DP held by the substrate holding part 7 to form a
liquid immersion space LS. The control apparatus 1 executes the
recovery operation of the liquid LQ from a recovery port 28 in
parallel with the supply operation of the liquid LQ from a supply
port 27 and moves, for example, the substrate stage 8 along a
movement trajectory R1 in a status in which the liquid LQ is held
between the terminal optical element 10 and liquid immersion member
9 and the dummy substrate DP held by the substrate holding part 7
to form a liquid immersion space LS. Through this, cleaning of at
least a part of the lower surface 12 of the liquid immersion member
9 is performed. In addition, foreign matter that has been peeled
from the lower surface 12 is recovered from the recovery port 28
along with the liquid LQ.
[0140] Next, the second cleaning mode will be described. The second
cleaning mode is a mode that cleans at least a part of the liquid
immersion member 9 by holding a cleaning liquid LC between the
terminal optical element 10 and liquid immersion member 9 and the
dummy substrate DP held by the substrate holding part 7 to form a
liquid immersion space LSC using that cleaning liquid LC. In the
present embodiment, the supply port 27 is able to supply a cleaning
liquid LC that is different from the liquid LQ. In the present
embodiment, an alkali cleaning solution is used as the cleaning
liquid LC. In the present embodiment, an alkali aqueous solution is
used as the cleaning liquid LC. In the present embodiment, the
cleaning liquid LC includes a tetramethyl ammonium hydroxide (TMAH)
aqueous solution. Note that the cleaning liquid LC may also be an
alcohol. For example, the cleaning liquid LC may also be at least
one of ethanol, isopropyl alcohol (IPA) and pentanol.
[0141] FIG. 9 is a schematic view that shows an example of the
second cleaning mode. The control apparatus 1 executes the
operation of recovery of the cleaning liquid LC from the recovery
port 28 in parallel with the operation of supply of the cleaning
liquid LC from the supply port 27 to form a liquid immersion space
LSC using the cleaning liquid LC between the terminal optical
element 10 and liquid immersion member 9 and the dummy substrate DP
held by the substrate holding part 7. Through this, at least a part
of the lower surface 12 of the liquid immersion member 9 is
cleaned. In addition, foreign matter that has been peeled from the
lower surface 12 is recovered from the recovery port 28 along with
the cleaning liquid LC.
[0142] In addition, the control apparatus 1 is able to adjust at
least one of the supply operation that uses the supply port 27 and
the recovery operation that uses the recovery port 28 so that the
size (the size within the XY plane parallel to the lower surface
12) of the liquid immersion space LSC formed by the cleaning liquid
LC during cleaning processing of the liquid immersion member 9
becomes larger than the size of the liquid immersion space LS
formed by the liquid LQ during exposure of the substrate P. For
example, the control apparatus 1 is able to increase the size of
the liquid immersion space LSC formed by the cleaning liquid LC by
making the supply amount per unit time of cleaning liquid LC
supplied from the supply port 27 during cleaning processing of the
liquid immersion member 9 larger than the supply amount per unit
time of the liquid LQ supplied from the supply port 27 during
exposure of the substrate P. Or, the control apparatus 1 is able to
increase the size of the liquid immersion space LSC formed by the
cleaning liquid LC by making the recovery amount per unit time of
the cleaning liquid LC recovered from the recovery port 28 during
cleaning processing of the liquid immersion member 9 smaller than
the recovery amount per unit time of the cleaning liquid LC
recovered from the recovery port 28 during exposure of the
substrate P. Of course, the control apparatus 1 may also increase
the size of the liquid immersion space LSC formed by the cleaning
liquid LC by making the supply amount per unit time of the cleaning
liquid LC supplied from the supply port 27 larger while making the
recovery amount per unit time of the cleaning liquid LC recovered
from the recovery port 28 smaller.
[0143] In addition, the control apparatus 1, in the second cleaning
mode, may also move the substrate stage 8 within the XY plane in a
status in which a liquid immersion space has been formed by the
cleaning liquid LC between the terminal optical element 10 and
liquid immersion member 9 and the dummy substrate DP held by the
substrate holding part 7.
[0144] In this way, usage of the dummy substrate DP includes
cleaning of at least part of the liquid immersion member 9 in a
status in which the dummy substrate DP has been placed in
opposition with the liquid immersion member 9. In addition, not
only the lower surface 12 of the liquid immersion member 9 but the
emitting surface 11 of the terminal optical element 10 is cleaned
by the cleaning processing discussed above.
[0145] In addition, in the present embodiment, processing that
performs photo-cleaning of at least a part of the projection
optical system PL using the exposure light EL is executed as
maintenance processing. An example of processing that photo-cleans
at least a part of the projection optical system PL as maintenance
processing will be described below. The photo-cleaning processing
of the projection optical system PL is executed in a status in
which the emitting surface 11 of the terminal optical element 10
and the dummy substrate DP held by the substrate holding part 7
have been placed in opposition.
[0146] In addition, in the present embodiment, photo-cleaning
processing of the projection optical system PL is executed in a
status in which a liquid immersion space LS has been formed by
holding the liquid LQ between the terminal optical element 10 and
liquid immersion member 9 and the dummy substrate DP held by the
substrate holding part 7.
[0147] The control apparatus 1 emits the exposure light EL from the
illumination system IL. The exposure light EL that has been emitted
from the illumination system IL is emitted from the emitting
surface 11 after it is incident to the projection optical system PL
and has passed through a plurality of optical elements of the
projection optical system PL. In the present embodiment, the
exposure light EL is ultraviolet light that has a photo-cleaning
effect. Therefore, the optical elements of the projection optical
system PL are photo-cleaned by the exposure light EL being
irradiated.
[0148] In the aforementioned way, in exposure of the substrate P,
there is a possibility that a substance (for example, an organic
substance such as a photosensitive material) generated (eluted)
from the substrate P will mix into the liquid LQ of the liquid
immersion space LS. When foreign matter mixes into the liquid LQ of
the liquid immersion space LS, there is a possibility that foreign
matter will adhere to the emitting surface 11 of the terminal
optical element 10 that comes into contact with that liquid LQ. In
the present embodiment, the exposure light EL is irradiated to the
emitting surface 11 in a status in which the dummy substrate DP,
which has restricted generation of foreign matter, and the emitting
surface 11 have been placed in opposition, so the emitting surface
11 is photo-cleaned well. In addition, the exposure light EL is
irradiated to that emitting surface 11 in a status in which the
liquid LQ and the emitting surface 11 have come to contact, so it
is possible to obtain a high photo-cleaning effect. In addition, in
the present embodiment, the operation of supplying the liquid LQ
from the supply port 27 and the operation of recovering the liquid
LQ from the recovery port 28 are executed while the exposure light
EL is irradiated to the emitting surface 11. Through this, foreign
matter that has peeled from the emitting surface 11 is recovered
from the recovery port 28.
[0149] In this way, maintenance processing includes processing that
photo-cleans at least a part of projection optical system PL with
the exposure light EL in a status in which the emitting surface 11
and the dummy substrate DP have been placed in opposition, and
usage of the dummy substrate DP includes photo-cleaning of at least
a part of the projection optical system PL using the exposure light
EL. In photo-cleaning of the projection optical system PL, the
exposure light EL that has emitted from the emitting surface 11 is
irradiated to the dummy substrate DP by arranging the dummy
substrate DP at a position that opposes the emitting surface 11.
Through this, in photo-cleaning of the projection optical system
PL, for example, it is possible to prevent the exposure light EL
from being irradiated to the upper surface 22 of the substrate
stage 8, the upper surface 50 of the measuring stage 23, etc., and
it is possible to restrict deterioration of upper surfaces 22, 50,
etc. due to irradiation of the exposure light EL.
[0150] Note that, in the present embodiment, it is possible to
execute not only the adjustment processing and maintenance
processing discussed above but various processing that uses the
dummy substrate DP. For example, in a status in which the sequences
of adjustment processing, exposure processing, maintenance
processing, etc. are not being executed (a so-called idling
status), there is a possibility that the environment (temperature,
etc.) of the internal space 14 will unfortunately fluctuate due to
a status (at least one of the position, movement conditions and
drive conditions) of the substrate stage 8 of the internal space
14. Specifically, there is a possibility that, depending on the
status of the substrate stage 8, the environment of the internal
space 14 in the idling status will unfortunately change from the
expected environment. As a result, even if an attempt were made to
start exposure of the substrate P from the idling status, there
would be a possibility that drawbacks would occur, such as time
being unfortunately required until the internal space 14 is
adjusted to the expected conditions by means of the chamber
apparatus 15 and a reduction in the operation rate of the exposure
apparatus EX is invited.
[0151] In the present embodiment, usage of the dummy substrate DP
includes holding by a substrate holding part 7 arranged at a
prescribed position in the internal space 14. Specifically, the
control apparatus 1, in the idling status, arranges the substrate
holding part 7 that holds the dummy substrate DP at a prescribed
position within the internal space 14. The control apparatus 1, in
the idling status as well, arranges the substrate holding part 7,
which holds the dummy substrate DP, at a prescribed position within
the internal space 14 so that the internal space 14 does not change
greatly with respect to the expected environment. Or, the control
apparatus 1, in the idling status, moves the substrate holding part
7 (substrate stage 8), which holds the dummy substrate DP, along
the movement trajectory R1. Through this, even in the idling
status, it is possible to restrict the environment (temperature,
etc.) of the internal space 14 from unfortunately fluctuating
greatly. Through this, for example, it is possible to execute
positional measurement of the substrate stage 8 and the measuring
stage 23 with good accuracy. For example, in the case in which the
substrate stage 8 has a scale measured by an encoder system,
thermal deformation of that scale can be restricted.
[0152] In addition, in the idling status, by the substrate stage 8
moving along the movement trajectory R1 in a status in which a
liquid immersion space LS has been formed by the liquid LQ between
the terminal optical element 10 and liquid immersion member 9 and
the dummy substrate DP held by the substrate holding part 7, for
example, it is possible to restrict the terminal optical element 10
and the liquid immersion member 9 from becoming polluted.
[0153] In the above way, in the present embodiment, the dummy
substrate DP is held by the substrate holding part 7, and various
processing such as adjustment processing and maintenance processing
are executed using that dummy substrate DP. The status of usage of
that dummy substrate DP is managed by a management apparatus 3.
[0154] The management apparatus 3 manages the history of usage of
the dummy substrate DP from when usage of the dummy substrate DP is
started. The management apparatus 3 manages the dummy substrate DP
in relation to a plurality of management items.
[0155] In the present embodiment, the management items include at
least one of the cumulative time in which the dummy substrate DP is
held by the substrate holding part 7, the liquid contact time at
which the dummy substrate DP and the liquid LQ are in contact, the
number of times a first status in which the dummy substrate DP and
the liquid LQ come into contact and a second status in which they
do not come into contact are repeated (repetition count), the
cumulative energy of the exposure light EL irradiated to the dummy
substrate DP, the number of times the dummy substrate DP is
transported between the buffer part 17 and the substrate holding
part 7 (transport count), and the time from when the dummy
substrate DP is unloaded from the accommodating apparatus 13 until
it is loaded to the accommodating apparatus 13 (amount of time
within the apparatus).
[0156] In addition, the management parameters are determined to in
advance with respect to the respective plurality of management
items discussed above. In the present embodiment, the management
parameters are determined according to the description of usage of
the dummy substrate DP.
[0157] Table 1 shows the description of usage of the dummy
substrate DP and the relationship between the predetermined
management parameters in relation to the respective management
items.
TABLE-US-00001 TABLE 1 Cumulative Amount Energy of of Time
Description Liquid the Within of Cumulative Contact Repetition
Exposure Transport the Usage Time Time Count Light Count Apparatus
First cleaning 30 days 30 days 1,000,000 -- 1,000,000 30 days mode
times times Second 30 days 6 hours 21 times -- 1,000,000 30 days
cleaning mode times Adjustment of 30 days 30 days 1,000,000 --
1,000,000 30 days synchronous times times movement error Adjustment
of 30 days 30 days 1,000,000 10J 1,000,000 30 days projection times
times optical system Adjustment of 30 days 30 days 1,000,000 8J
1,000,000 30 days the amount of times times irradiation of exposure
light Photo-cleaning 30 minutes 6 hours 21 times 15J 30 times 30
days
[0158] The management parameters are values that are predetermined
according to the description of usage of the dummy substrate DP and
that concern the lifespan relating to the dummy substrate DP. In
other words, the management parameters are terms, determined
according to the description of usage of the dummy substrate DP,
during which it is possible for the surface status of the dummy
substrate DP to maintain the expected performance (values). The
surface status of the dummy substrate DP includes at least one of
the contact angle (lyophobicity) of the dummy substrate DP with
respect to the liquid LQ and the degree of pollution (the amount of
foreign matter per unit area) of the surface of the dummy substrate
DP.
[0159] For example, there is a possibility that the contact angle
(lyophobicity) on the surface of the dummy substrate DP with
respect to the liquid LQ will change according to the liquid
contact time. For example, when the liquid contact time becomes
long, there is a high possibility that the contact angle
(lyophobicity) of the surface of the dummy substrate DP with
respect to the liquid LQ will decrease (deteriorate). In addition,
there is a possibility that the contact angle (lyophobicity) of the
dummy substrate DP with respect to the liquid LQ will also change
according to the cumulative energy of the exposure light EL
irradiated to the dummy substrate DP. For example, when the
cumulative energy of the exposure light EL irradiated to the dummy
substrate DP becomes large, there is a high possibility that the
contact angle (lyophobicity) of the surface of the dummy substrate
DP with respect to the liquid LQ will decrease (deteriorate). In
addition, even in the case in which at least one of the cumulative
time and the time within the apparatus becomes long and the
repetition count becomes large, there is a possibility that the
contact angle (lyophobicity) of the surface of the dummy substrate
DP with respect to the liquid LQ will deteriorate.
[0160] In addition, there is a possibility that the degree of
pollution of the surface of the dummy substrate DP will change
according to at least one of the cumulative time, the liquid
contact time, the repetition count, and the amount of time within
the apparatus. For example, when the liquid contact time of
cleaning processing becomes long or the repetition count becomes
large, the possibility that foreign matter that has peeled from the
liquid immersion member 9 will adhere to the surface of the dummy
substrate DP becomes higher, and there is a possibility that the
degree of pollution of the surface of the dummy substrate DP will
become higher. In addition, when at least one of the cumulative
time or the amount of time spent within the apparatus becomes long,
the possibility that, for example, foreign matter that floats in
the air will adhere to the surface of the dummy substrate DP
becomes higher, and there is a possibility that the degree of
pollution of the surface of the dummy substrate DP will become
higher. In addition, when the transport count becomes large, the
possibility that foreign matter (including drops of the liquid LQ)
will adhere to the surface SB of the dummy substrate DP during
transport becomes higher, and there is a possibility that the
degree of pollution of the surface of the dummy substrate DP will
become higher.
[0161] In Table 1, for example, in the case in which the dummy
substrate DP is used in the first cleaning mode, the management
parameter relating to the liquid contact time is 30 days.
Specifically, in the case in which the dummy substrate DP is used
in the first cleaning mode, the liquid contact time up to 30 days
is allowed. In the case in which usage in the first cleaning mode
is performed, when the liquid contact time exceeds 30 days, for
example, there is a high possibility that the contact angle of the
surface of the dummy substrate DP with respect to the liquid LQ
will unfortunately become lower than the tolerance value
(deteriorate). In addition, in the case in which the dummy
substrate DP is used in the second cleaning mode, which uses the
cleaning liquid LC, the surface of the dummy substrate DP tends to
deteriorate in comparison with the case in which usage in the first
cleaning mode is performed, so the management parameter relating to
the liquid contact time is set to six hours. When the liquid
contact time exceeds six hours in the case in which usage in the
second cleaning mode is performed, there is a high possibility that
the contact angle of the surface of the dummy substrate DP with
respect to the liquid LQ will unfortunately decrease (deteriorate)
to below the tolerance value.
[0162] In this way, in the present embodiment, the management
parameters relating to the management items are determined
according to the description of usage of the dummy substrate
DP.
[0163] Note that the management items, management parameters and
descriptions of usage, etc. of Table 1 are only examples. The
management parameters may be appropriately determined according to,
for example, the durability of the surface (film F) of the dummy
substrate DP, the status of usage of the dummy substrate DP,
etc.
[0164] When the lyophobicity of the surface of the dummy substrate
DP deteriorates, for example, it becomes no longer possible to hold
the liquid LQ (cleaning liquid LC) in the space with respect to the
terminal optical element 10 and the liquid immersion member 9 well,
and it becomes no longer possible to form a liquid immersion space
well. As a result, there is a possibility that nonconformities will
occur, such as the liquid of the liquid immersion space
unfortunately flowing out during the prescribed processing that
uses the dummy substrate DP.
[0165] In addition, when the degree of pollution of the surface of
the dummy substrate DP deteriorates, there is a possibility that
damage will unfortunately increase, such as foreign matter of the
dummy substrate DP adhering to members in the vicinity (terminal
optical element 10, liquid immersion member 9, substrate stage 8,
transport system 4, etc.) during the prescribed processing that
uses that dummy substrate DP.
[0166] In this way, in the case in which the prescribed processing
is performed using the dummy substrate DP, when a dummy substrate
DP in which the lyophobicity with respect to the liquid LQ or the
degree of pollution has deteriorated continues to be used, there is
a possibility that it will be no longer possible to execute that
prescribed processing well. As a result, there is a possibility
that exposure performance will deteriorate, such as in exposure
defects being produced, and that defective devices will be
produced.
[0167] Therefore, in the present embodiment, the control apparatus
1 determines the appropriateness of usage of the dummy substrate DP
based on the output of the management apparatus 3 and the
management parameters stored in the storage apparatus 2. As
discussed above, the management apparatus 3 includes a timer and a
counter, etc. and is able to measure (manage) values relating to
the respective management items discussed above. The control
apparatus 1 compares the values measured by the management
apparatus 3 relating to the respective management items discussed
above with the predetermined management parameters and determines
the appropriateness of usage of dummy substrate DP based on the
results of that comparison.
[0168] For example, the control apparatus 1, in the case in which
the output of the management apparatus 3 is less than the
management parameter determined according to the description of
usage of the dummy substrate DP, determines that that dummy
substrate DP can be used and continues usage of that dummy
substrate DP. On the other hand, the control apparatus 1, in the
case in which it has been determined that the output of the
management apparatus 3 exceeds the management parameter, determines
that that dummy substrate DP is not usable.
[0169] The control apparatus 1 uses the transport system 4 to
transport the dummy substrates DP that have been determined to be
unusable to the accommodating apparatus 13 from at least one of the
substrate holding part 7 and the buffer part 17. The control
apparatus 1 unloads the usable dummy substrates DP accommodated in
the accommodating apparatus 13 from the accommodating apparatus 13
and accommodates them in the buffer part 17. Note that the usable
dummy substrates DP include unused dummy substrates DP. The control
apparatus 1 starts usage of the dummy substrates DP accommodated in
that buffer part 17.
[0170] In the present embodiment, two dummy substrates DP are
accommodated in the buffer part 17, and the control apparatus 1
determines the respective appropriateness of usage of those two
dummy substrates DP. In addition, the control apparatus 1 is able
to determine the appropriateness of usage of the respective
plurality (for example 50) of dummy substrates DP that the
accommodating apparatus 13 is able to accommodate.
[0171] In the present embodiment, identification marks are arranged
as identifiers of the respective plurality of dummy substrates DP.
The identification marks are peculiar marks respectively applied to
a plurality of dummy substrates DP. In the present embodiment, an
alignment system 19 is able to measure those identification marks.
When the identification marks are measured by the alignment system
19, the control apparatus 1 controls the substrate stage 8, which
holds the dummy substrate DP, to arrange the identification mark of
the dummy substrate DP in the measurement region of the alignment
system 19. The alignment system 19 measures the identification mark
of the dummy substrate DP held by the substrate holding part 7. The
measurement results of the alignment system 19 are output to the
control apparatus 1. The control apparatus 1 is able to determine
the appropriateness of usage of the respective plurality of dummy
substrates DP based on the output of the management apparatus 3 and
the measurement results of the alignment system 19.
[0172] Note that, the measuring apparatus for measuring the
identifiers is not limited to the alignment system 19. For example,
the measuring apparatus that is able to measure the identifiers
(identification marks) arranged on the dummy substrates DP may also
be arranged in the accommodating apparatus 13 or in the transport
path between the accommodating apparatus 13 and the buffer part
17.
[0173] Note that the identifiers for identifying the respective
plurality of dummy substrates DP are not limited to the
identification marks and may also be, for example, IC chips
arranged in the respective plurality of dummy substrates DP.
[0174] In addition, the respective dummy substrates DP may also be
identified by tracking and managing the locations of the respective
dummy substrates DP within the exposure apparatus EX by means of
the control apparatus 1 without providing identifiers on the
respective dummy substrates DP.
[0175] Through this, the control apparatus 1 is able to obtain the
usable dummy substrates DP from among the plurality of dummy
substrates DP. For example, the control apparatus 1, based on the
output of the management apparatus 3, the management parameters and
the measurements results of the identifiers, even in the case in
which the usable dummy substrates DP and the unusable dummy
substrates DP are mixed in the accommodating apparatus 13, is able
to select, from this plurality of dummy substrates DP, the dummy
substrates DP to be held in the substrate holding part 7 and
used.
[0176] In addition, the control apparatus 1 displays the
determination results as to the appropriateness of usage of the
plurality of dummy substrates DP on a control panel that is not
shown, etc. and reports these to the operator. The display contents
include one of a display to the effect that said dummy substrate DP
is not usable, a display to the effect that said dummy substrate DP
is usable and an expiration date, and a display of the current
values of the respective management items of said dummy substrate
DP (for example, the cumulative time held by the substrate holding
part 7 up to the current point in time, the cumulative liquid
contact time, the cumulative amount of energy, etc.). Then, the
control apparatus 1 prohibits subsequent usage of the dummy
substrates DP determined to be unusable.
[0177] In addition, the control apparatus 1 is able to select the
dummy substrates DP to be held by the substrate holding part 7 and
used based on the output of the management apparatus 3 and the
predetermined management parameters so that the surface statuses of
the plurality of dummy substrates DP become the same. Specifically,
that plurality of dummy substrates DP may be sequentially used so
that the deterioration statuses of the plurality (for example, 50
units) of the dummy substrates DP become uniform.
[0178] Furthermore, the control apparatus 1 is also able to
individually manage the respective dummy substrates DP to match the
purposes of usage so that the plurality of dummy substrates DP are
processing specialized dummy substrates that accompany exposure
operations and cleaning specialized dummy substrates. In this case,
the respective purposes of usage may be displayed on a control
panel that is not shown to correspond to the respective dummy
substrates DP.
[0179] As described above, in the present embodiment, determination
of the appropriateness of usage of the dummy substrates DP was
performed based on the output of the management apparatus 3 that
manages the statuses of usage of the dummy substrates DP and
predetermined management parameters, so, for example, it is
possible to restrict a status in which, for example, deteriorated
dummy substrates DP continue to be used from occurring. Therefore,
it is possible to restrict the occurrence of exposure defects
attributable to the usage of deteriorated dummy substrates DP and
the occurrence of defective devices.
[0180] In addition, in the present embodiment, in the case in which
a plurality of dummy substrates DP are prepared, from among the
plurality of dummy substrates DP, the dummy substrates DP caused to
be held by the substrate holding part 7 and used were selected
based on the output of the management apparatus 3 and the
management parameters, so, for example, it is possible to restrict
the occurrence of non-conformities in which the unusable dummy
substrates DP are unfortunately transported to the substrate
holding part 7 and those unusable dummy substrates DP are
unfortunately used. Therefore, it is possible to restrict the
occurrence of exposure defects and the occurrence of defective
devices.
[0181] In addition, in the present embodiment, it is possible to
derive the surface statuses of the dummy substrates DP (at least
one of the lyophobicity with respect to the liquid LQ and the
degree of pollution) by managing the plurality of management items,
so it is possible to use dummy substrates DP which have the
expected surface statuses.
[0182] Note that, in the present embodiment, it was possible for
the buffer part 17 to accommodate two dummy substrates DP. In that
case, there may be division into a description of usage of one
dummy substrate DP of the two dummy substrates DP accommodated in
the buffer part 17 and a description of usage of the other dummy
substrate DP. For example, in the case in which the respective two
dummy substrates DP are to be used in cleaning processing, one of
the dummy substrates DP is used in the first cleaning mode, and the
other dummy substrate DP is used in the second cleaning mode.
[0183] Note that, in the present embodiment, the dummy substrates
DP that are transported to the substrate holding part 7 were made
the dummy substrates DP accommodated in the buffer part 17. The
dummy substrates DP accommodated in the accommodating apparatus 13
may also be transported to the substrate holding part 7 without
going via the buffer part 17. In addition, the dummy substrates DP
held by the substrate holding part 7 may also be transported to the
accommodating apparatus 13 without going via the buffer part
17.
[0184] Note that, in the embodiments discussed above, the
accommodating apparatus 13 is able to accommodate at least one of
the substrate P for device manufacture and the dummy substrate DP.
In that case, an identifier for identifying the type of the
accommodated substrate (either a substrate P or dummy substrate DP)
may be provided in the accommodating apparatus 13. Specifically, a
first identifier can be provided in the accommodating apparatus 13
that accommodates a substrate P, and a second identifier that is
different from the first identifier can be provided in the
accommodating apparatus 13 that accommodates a dummy substrate DP.
Through this, the control apparatus 1 is able to ascertain the type
of substrate P accommodated by the accommodating apparatus 13 by
measuring the first and second identifiers. In addition, the
control apparatus 1, in a case in which the second identifier has
been measured, specifically, in a case in which it has been
determined that the accommodating apparatus 13 that accommodates a
dummy substrate DP is connected to the exposure apparatus EX, is
able to start the management operation of the management apparatus
13.
[0185] Note that, in the embodiments discussed above, the
projection optical system PL fills the optical path space of the
emitting side (image plane side) of the terminal optical element
with a liquid, but a projection optical system that also fills the
optical path space of the incidence side (object plane side) of the
terminal optical element with a liquid as disclosed in the
specification of U.S. Patent Application Publication No.
2005/0248856 may also be employed.
[0186] Note that, the liquid LQ of the respective embodiments
discussed above is water, but it may also be a liquid other than
water. For the liquid LQ, one that has transmittivity with respect
to the exposure light EL, as high a refractive index as possible,
and stability with respect to the projection optical system or the
film of the photosensitive material (photoresist) that forms the
surface of the substrate is preferable. For example, for the liquid
LQ, it is also possible to use hydrofluroether (HF),
perfluoropolyether (PFPE), Fomblin oil, cedar oil, etc. In
addition, for the liquid LQ, one whose refractive index is
approximately 1.6.about.1.8 may also be used. In addition, the
optical element (terminal optical element, etc.) of the projection
optical system PL that comes into contact with the liquid LQ may
also be formed of a material that has a higher refractive index
than quartz and fluorite (for example, 1.6 or more). In addition,
for the liquid LQ, it is also possible to use various fluids, for
example, supercritical fluids.
[0187] In addition, for example, in the case in which the exposure
light EL is F.sub.2 laser light, this F.sub.2 laser light does not
pass through water, so it is possible to use, as the liquid LQ, one
that allows F.sub.2 laser light to pass through, for example, a
fluorine group fluid such as perfluoropolyether (PFPE), fluorine
group oil, etc. In this case, hydrophillization processing is
performed by forming a thin film at a portion that comes into
contact with the liquid LQ using a substance with a molecular
structure that has low polarity including, for example,
fluorine.
[0188] Note that applicable as the substrate P of the respective
embodiments discussed above are not only semiconductor wafers for
semiconductor device manufacture but glass substrates for display
devices, ceramic wafers for thin-film magnetic heads or mask or
reticle base plates (synthetic quartz, silicon wafers), etc. used
in exposure apparatuses.
[0189] Applicable as the exposure apparatus are, in addition to
step-and-scan system scanning type exposure apparatuses (scanning
steppers) that synchronously move the mask M and the substrate P to
scan expose the pattern of the mask M, step-and-repeat system
projection exposure apparatuses (steppers) that full-field expose
the pattern of the mask M in a status in which the mask M and the
substrate P have been made stationary and sequentially step move
the substrate P.
[0190] In addition, in step-and-repeat system exposure, after a
reduced image of a first pattern has been transferred onto the
substrate P using a projection optical system in a status in which
the first pattern and the substrate P have been made substantially
stationary, a reduced image of the second pattern may be full-field
exposed onto the substrate P so that it is partially superposed
with the first pattern using a projection optical system in a
status in which the second pattern and the substrate P have been
made substantially stationary (stitch system full-field exposure
apparatus). In addition, for the stitch system exposure apparatus,
application to a step-and-stitch system exposure apparatus that
partially superposes and transfers at least two patterns on the
substrate P and sequentially moves the substrate P is also
possible.
[0191] In addition, as disclosed in the specification of U.S. Pat.
No. 6,611,316, for example, it is also possible to apply the
present invention to an exposure apparatus that synthesizes two
mask patterns on a substrate via a projection optical system and
double exposes, substantially synchronously, one shot region on a
substrate by a single scanning exposure. In addition, the present
invention is also applicable to a proximity system exposure
apparatus, a mirror projection analyzer, etc.
[0192] In addition, the present invention is also applicable to
twin stage type exposure apparatuses that comprise a plurality of
substrate stages such as those disclosed in the specification of
U.S. Pat. No. 6,341,007, the specification of U.S. Pat. No.
6,400,441, the specification of U.S. Pat. No. 6,549,269, the
specification of U.S. Pat. No. 6,590,634, the specification of U.S.
Pat. No. 6,208,407, and the specification of U.S. Pat. No.
6,262,796.
[0193] The types of exposure apparatuses EX are not limited to
exposure apparatuses for semiconductor device fabrication that
expose a semiconductor device pattern on a substrate P but are also
widely applicable to exposure apparatuses for the manufacture of
such as liquid crystal display elements and for the manufacture of
displays, and exposure apparatuses for the manufacture of thin film
magnetic heads, image pickup elements (CCDs), micromachines, MEMS,
DNA chips or reticles or masks.
[0194] In addition, in the respective embodiments discussed above,
for the light source apparatus that generates ArF excimer laser
light as the exposure light EL, it is possible to use an ArF
excimer laser, but is also possible to use a high frequency wave
generating apparatus that includes a solid state laser light source
such as a DFB semiconductor laser or a fiber laser, a light
amplification part that has a fiber amp, a wavelength conversion
part, etc. and outputs pulsed light with a wavelength of 193 nm
such as that disclosed in the specification of U.S. Pat. No.
7,023,610. In addition, in the embodiments discussed above, the
aforementioned illumination regions and projection regions are
rectangle shape respectively, but may be other shape such as
circular shape.
[0195] In the respective embodiments discussed above, a light
transmitting type mask that forms a prescribed shielding pattern
(or phase pattern/dimming pattern) on a light transmissive
substrate is used, but instead of this mask, a variable forming
mask (also called electronic mask, active mask, or image generator)
that forms a transmittance pattern, a reflection pattern or a light
emitting pattern based on electronic data of the pattern to be
exposed, such as that disclosed in the specification of U.S. Pat.
No. 6,778,257, may also be used. The variable forming mask
includes, for example, a DMD (digital micro-mirror device), which
is a kind of non-emissive type image display device (spatial light
modulator). In addition, the variable forming mask is not limited
to a DMD, and the non-emissive type image display device described
below may be used in place of a DMD. Here, the non-emissive type
image display device is an element that spatially modulates the
amplitude (intensity), phase or deflection status of light that
progresses in a prescribed direction, and examples of transmitting
type spatial modulators are, in addition to a transmission type
liquid crystal display element (LCD: liquid crystal display), an
electro-chromic display (ECD), etc. In addition, other examples of
reflecting type spatial light modulators are, in addition to the
DMD discussed above, a reflection mirror array, a reflecting type
liquid crystal display element, an electrophoretic display (EPD),
electronic paper (or electronic ink), and a grating light valve and
the like.
[0196] In addition, instead of the variable forming mask comprising
a non-emissive type image display device, a pattern forming
apparatus that includes a self-emissive type image display element
may also be used. In this case, an illumination system is not
required. Here, examples of the self-emissive type image display
element are a CRT (cathode ray tube), an inorganic EL display, an
organic EL display (OLED: organic light emitting diode), an LED
display, an LD display, a field emission display (FED), and a
plasma display (PDP: plasma display panel). In addition, used for
the self-emissive type image display element with which the pattern
formation apparatus is equipped are a solid state light source chip
that has a plurality of light emission points, a solid state light
source chip array on which chips are arranged in a plurally arrayed
shape, or a type in which a plurality of light emission points are
built into one substrate, and the solid state light source chip may
also be electrically controlled to form a pattern. Note that the
solid state light source element may be inorganic or organic.
[0197] In the respective embodiments discussed above, an exposure
apparatus that comprises a projection optical system PL was
described as an example, but it is also possible to apply the
present invention to exposure apparatuses and exposure methods that
do not use a projection optical system PL. Even in the case in
which, in this way, a projection optical system PL is not used, the
exposure light is irradiated to the substrate via an optical member
such as a lens, etc., and the liquid immersion part is formed in a
prescribed space between such an optical member and the
substrate.
[0198] In addition, it is also possible to apply the present
invention to an exposure apparatus (lithography system) that
exposes a line and space pattern onto a substrate P by forming
interference fringes on the substrate P as disclosed in, for
example, the International Patent Publication No. 2001/035168
pamphlet.
[0199] As discussed above, the exposure apparatus EX of the
embodiment of the present application is manufactured by assembling
various subsystems, including the respective constituent elements
presented in the Scope of Patents Claims of the present
application, so that the prescribed mechanical precision,
electrical precision and optical precision can be maintained. To
ensure these respective precisions, performed before and after this
assembly are adjustments for achieving optical precision with
respect to the various optical systems, adjustments for achieving
mechanical precision with respect to the various mechanical
systems, and adjustments for achieving electrical precision with
respect to the various electrical systems. The process of assembly
from the various subsystems to the exposure apparatus includes
mechanical connections, electrical circuit wiring connections, air
pressure circuit piping connections, etc. among the various
subsystems. Obviously, before the process of assembly from these
various subsystems to the exposure apparatus, there are the
processes of individual assembly of the respective subsystems. When
the process of assembly of the various subsystems to the exposure
apparatus has ended, overall adjustment is performed, and the
various precisions are ensured for the exposure apparatus as a
whole. Note that it is preferable that manufacture of the exposure
apparatus be performed in a clean room in which the temperature,
the degree of cleanliness, etc. are controlled.
[0200] As shown in FIG. 10, micro devices such as semiconductor
devices are manufactured by going through a step 201 that performs
micro device function and performance design, a step 202 that
creates the mask (reticle) based on this design step, a step 203
that manufactures the substrate that is the device base material, a
substrate processing step 204 that includes substrate processing
(exposure processing) that exposes the substrate with exposure
light using the pattern of a mask according to the embodiments
discussed above and develops the exposed substrate, a device
assembly step (including processing processes such as the dicing
process, bonding process and packaging process) 205, an inspection
step 206, etc. Operations that use the dummy substrate DP of the
embodiments discussed above are included in the substrate
processing step 204.
[0201] Note that the requirements of the respective embodiments
discussed above may be appropriately combined. In addition, the
disclosures of all public documents and U.S. patents relating to
the exposure apparatuses, etc. that have been cited in the
respective embodiments and modification examples discussed above
shall be invoked and considered a part of the descriptions of this
document.
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