U.S. patent application number 16/050653 was filed with the patent office on 2018-11-22 for fingerprint sensing unit.
The applicant listed for this patent is J-METRICS TECHNOLOGY Co., Ltd.. Invention is credited to Shih-Chun Kuo, Wei-Ting Lin.
Application Number | 20180336393 16/050653 |
Document ID | / |
Family ID | 56756602 |
Filed Date | 2018-11-22 |
United States Patent
Application |
20180336393 |
Kind Code |
A1 |
Lin; Wei-Ting ; et
al. |
November 22, 2018 |
FINGERPRINT SENSING UNIT
Abstract
A fingerprint sensing unit includes a carrier substrate, a
fingerprint sensing chip on an upper surface of the carrier
substrate, a molding layer, a light-pervious cover layer on the
molding layer, and an adhesive layer between the light-pervious
cover layer and the molding layer. The fingerprint sensing chip is
electrically connected to the carrier substrate. The molding layer
covers the fingerprint sensing chip.
Inventors: |
Lin; Wei-Ting; (Taipei,
TW) ; Kuo; Shih-Chun; (Taipei, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
J-METRICS TECHNOLOGY Co., Ltd. |
Taipei |
|
TW |
|
|
Family ID: |
56756602 |
Appl. No.: |
16/050653 |
Filed: |
July 31, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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15156950 |
May 17, 2016 |
10061965 |
|
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16050653 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 2224/73207
20130101; H01L 23/3121 20130101; H01L 2224/13082 20130101; G06K
9/00013 20130101; H01L 24/17 20130101; H01L 25/0657 20130101; H01L
2224/83192 20130101; H01L 2224/83851 20130101; H01L 2224/48227
20130101; H01L 2924/00014 20130101; G06K 9/00053 20130101; H01L
23/60 20130101; H01L 2224/32225 20130101; H01L 2924/15158 20130101;
H01L 24/29 20130101; H01L 2224/81193 20130101; H01L 24/48 20130101;
H01L 2224/81191 20130101; H01L 24/16 20130101; H01L 2224/16145
20130101; H01L 2224/8185 20130101; H01L 2224/29011 20130101; H01L
24/73 20130101; H01L 2224/73215 20130101; H01L 2224/83851 20130101;
H01L 2225/06513 20130101; H01L 24/32 20130101; H01L 2924/00012
20130101; H01L 2224/45099 20130101; H01L 2224/8185 20130101; H01L
2924/00014 20130101; H01L 2224/16227 20130101; H01L 2224/17181
20130101; H01L 24/13 20130101; H01L 2924/00014 20130101; H01L
2224/73253 20130101 |
International
Class: |
G06K 9/00 20060101
G06K009/00; H01L 23/60 20060101 H01L023/60; H01L 23/00 20060101
H01L023/00 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 10, 2015 |
TW |
104214717 |
Nov 19, 2015 |
TW |
104218622 |
Claims
1. A fingerprint sensing unit, comprising: a carrier substrate; a
fingerprint sensing chip on an upper surface of the carrier
substrate and electrically connected to the carrier substrate; an
adhesive layer disposed on the fingerprint sensing chip; a
light-pervious cover layer on the adhesive layer; and a filling
layer disposed under the adhesive layer and surrounding the
fingerprint sensing chip, wherein the filling layer is located
between the adhesive layer and the carrier substrate.
2. The fingerprint sensing unit of claim 2, wherein the fingerprint
sensing unit further comprises a molding layer, and the molding
layer covers a part of the light-pervious cover layer, a part of
the filling layer, and a part of the carrier substrate.
Description
CROSS-REFERENCES TO RELATED APPLICATIONS
[0001] This application is a Division of application Ser. No.
15/156,950, filed on May 17, 2016 with claiming priority under 35
U.S.C. .sctn. 119(a) on Patent Application No. 104214717 filed in
Taiwan, R.O.C. on Sep. 10, 2015 and Patent Application No.
104218622 filed in Taiwan, R.O.C. on Nov. 19, 2015, the entire
contents of which are hereby incorporated by reference.
BACKGROUND
Technical Field
[0002] The instant disclosure relates to a fingerprint sensing unit
and a fingerprint sensing module, in particular, relates to a
fingerprint sensing unit and a fingerprint sensing module having a
light-pervious cover layer.
Related Art
[0003] As the development of technology, mobile phones, personal
notebooks, tablet PCs, or other electronic devices have become the
essential apparatus in life. The information stored in those
electronic devices, such as contact information and photos,
increases rapidly. Those electronic devices are thus become
personalized. Therefore, in order to avoid important information
from being lost or stolen, the electronic devices respectively
equipped with fingerprint identification components become
popular.
[0004] Existing manufacturing process for producing an electronic
device with fingerprint recognition function includes forming an
opening on one side of the electronic device, disposing a
fingerprint sensing chip in the opening, disposing the
corresponding layout circuit, and then covering the fingerprint
sensing chip with molding material. Thus, in the existing
manufacturing process for producing the electronic devices with
fingerprint recognition function, several complicated fabrication
steps for additionally mounting the fingerprint sensing chip on the
electronic devices are required.
SUMMARY
[0005] In an embodiment of the instant disclosure, a fingerprint
sensing unit comprises a carrier substrate, a fingerprint sensing
chip disposed on an upper surface of the carrier substrate, a
molding layer, a light-pervious cover layer on the molding layer,
and an adhesive layer between the light-pervious cover layer and
the molding layer. The fingerprint sensing chip is electrically
connected to the carrier substrate. The molding layer covers the
fingerprint sensing chip.
[0006] In an embodiment of the instant disclosure, a fingerprint
sensing unit comprises a carrier substrate, a fingerprint sensing
chip on an upper surface of the carrier substrate, an adhesive
layer on the fingerprint sensing chip, a light-pervious cover layer
on the adhesive layer, and a filling layer disposed under the
adhesive layer. The fingerprint sensing chip is electrically
connected to the carrier substrate. The filling layer surrounds the
fingerprint sensing chip and is located between the adhesive layer
and the carrier substrate.
[0007] In an embodiment of the instant disclosure, a fingerprint
sensing module comprises a fingerprint sensing unit and a circuit
board. The fingerprint sensing unit comprises a carrier substrate
having an upper surface and a lower surface opposite to the upper
surface, a fingerprint sensing chip on the upper surface, a molding
layer, a light-pervious cover layer on the molding layer, and an
adhesive layer between the light-pervious cover layer and the
molding layer. The fingerprint sensing chip is electrically
connected to the carrier substrate. The molding layer covers the
fingerprint sensing chip. The circuit board is disposed on the
lower surface and electrically connected to the carrier
substrate.
[0008] In summary, in the above mentioned embodiments of the
fingerprint sensing unit of the present disclosure, the
light-pervious cover layer can be disposed on the molding layer
covering the fingerprint sensing chip through the adhesive layer or
be disposed on the fingerprint sensing chip so as to form an
individual fingerprint sensing module.
[0009] In addition, the fingerprint sensing unit according to one
embodiment of the present disclosure comprises the outer conductive
ring member which surrounds the molding layer and contacts the side
surface of the molding layer. The outer conductive ring member
comprises the attaching layer and the conductive layer which is
formed by sputter deposition or evaporation deposition. The outer
conductive ring member can be electrically connected to the
fingerprint sensing chip through the gold finger pattern.
[0010] According to different demand of products, the outer
conductive ring member can further comprise the isolation layer. In
another embodiment of the instant disclosure, the inner conductive
ring member which is located on the light-pervious cover layer
contacts a part of bump exposed through the top surface of the
molding layer and is electrically connected to the fingerprint
sensing chip. Thus, the design flexibility of the fingerprint
sensing unit can be improved.
[0011] Furthermore, the fingerprint sensing module comprises the
fingerprint sensing unit and a circuit board electrically connected
to the fingerprint sensing unit. The circuit board is electrically
connected to the gold finger pattern on the on the lower surface of
the carrier substrate. The fingerprint sensing module can further
comprise the conductive bezel. The conductive bezel surrounds the
fingerprint sensing unit and contacts the isolation layer so that
the signal from the fingerprint sensing chip cannot be transmitted
to the conductive bezel through the side surface of the conductive
layer. The conductive bezel is electrically connected to grounding
pads of the circuit board so that the conductive bezel can be
grounded for preventing electrostatic discharge. Compared to the
prior art, the fingerprint sensing module of the present disclosure
is an individual and modularized packaging module that is capable
of easily mounting on the electronic devices, such as the smart
phone, notebook and the like. Thus, in the manufacturing process
for producing an electronic device with fingerprint recognition
function, several complicated fabrication steps for additionally
mounting the fingerprint sensing chip on electronic device can be
omitted.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a cross-sectional view of a fingerprint sensing
unit according to the first embodiment of the instant
disclosure.
[0013] FIG. 2A is a cross-sectional view of a fingerprint sensing
unit according to the second embodiment of the instant
disclosure.
[0014] FIG. 2B is a cross-sectional view of a fingerprint sensing
unit according to another embodiment of the instant disclosure.
[0015] FIG. 2C is a cross-sectional view of a fingerprint sensing
unit according to the third embodiment of the instant
disclosure.
[0016] FIG. 3A is a cross-sectional view of a fingerprint sensing
unit according to the fourth embodiment of the instant
disclosure.
[0017] FIG. 3B is a cross-sectional view of a fingerprint sensing
device according to another embodiment of the instant
disclosure.
[0018] FIG. 4 is a cross-sectional view of a fingerprint sensing
device according to the fifth embodiment of the instant
disclosure.
[0019] FIG. 5 is a cross-sectional view of a fingerprint sensing
device according to the sixth embodiment of the instant
disclosure.
[0020] FIG. 6A is a cross-sectional view of a fingerprint sensing
module according to an embodiment of the instant disclosure.
[0021] FIG. 6B is a cross-sectional view of a fingerprint sensing
module according to another embodiment of the instant
disclosure.
DETAILED DESCRIPTION
[0022] FIG. 1 is a cross-sectional view of a fingerprint sensing
unit according to the first embodiment of the instant disclosure.
Please refer to FIG. 1, the fingerprint sensing unit 100(the
fingerprint sensing unit herein is referred to as the fingerprint
sensing device having a light-pervious cover layer in the parent
Application No. 104214717 claimed priority on) comprises a carrier
substrate 110(the carrier substrate herein is referred to as the
substrate in the parent Application), a fingerprint sensing chip
120 on the carrier substrate 110, a molding layer 130, a
light-pervious cover layer 140 on the molding layer 130, and an
adhesive layer 160 between the light-pervious cover layer 140 and
the molding layer 130. The fingerprint sensing chip 120 is covered
by the molding layer 130.
[0023] The carrier substrate 110 is used as the carrier of the
fingerprint sensing chip 120. In practice, the carrier substrate
110 may be an integrated circuit carrier (IC carrier), and the
layout pattern (not shown) on an upper surface Si of the carrier
substrate 110 is designed according to the requirements of
electrically connections.
[0024] The fingerprint sensing chip 120 is disposed on the upper
surface S1 of the carrier substrate 110 and electrically connected
to the carrier substrate 110. In this embodiment, the fingerprint
sensing chip 120 is electrically connected to the carrier substrate
110 through at least one bond wire W1 by wire bonding method.
However, in another embodiment, the fingerprint sensing chip 120
can be connected to the carrier substrate 110 by other method. For
example, the fingerprint sensing chip 120 is electrically connected
to the carrier substrate 110 through at least one bump (not shown)
by flip chip method. It is to be noted that, the mounting method of
the fingerprint sensing chip 120 is not intended to limit the scope
of the present invention.
[0025] The molding layer 130 covers the fingerprint sensing chip
120 and the bond wire W1 and partially covering the upper surface
S1 of the carrier substrate 110. The molding layer 130 has a top
surface 132a and at least one side surface 132b. The side surface
132b is located around the top surface 132a and connected to the
top surface 132a. In the embodiment, the material of the molding
layer 130 may be epoxy molding compound (EMC), phenolics, or
silicones.
[0026] The light-pervious cover layer 140 is above the fingerprint
sensing chip 120. In this embodiment, the light-pervious cover
layer 140 is located on the top surface 132a of the molding layer
130. The light-pervious cover layer 140 may be glass substrate,
plastic substrate or sapphire substrate. Specifically, the
light-pervious cover layer 140 is a substrate being pervious to
light, and the transmittance of the light-pervious cover layer 140
depends on the light transmitting property of the light-pervious
cover layer 140 so that the light-pervious cover layer 140 can be
transparent or translucent. The light-pervious cover layer 140 may
be capable of allowing a specific light spectrum passing
therethrough, for example, visible light.
[0027] The adhesive layer 160 is located between the molding layer
130 and a color layer 150. Specifically, the adhesive layer 160 is
a bonding material. The light-pervious cover layer 140 attached to
the color layer 150 is adhered to the top surface 132a of the
molding layer 130 through the adhesive layer 160.
[0028] The fingerprint sensing unit 100 selectively comprises the
color layer 150. The color layer 150 is disposed between the
light-pervious cover layer 140 and the adhesive layer 160. In
practice, the color layer 150 is a color paste having at least one
color, such as but not limited to red, white, silver or black.
Since the light-pervious cover layer 140 is pervious to light, the
color of the color layer 150 under the light-pervious cover layer
140 can be appeared. Thus, the color layer 150 is used for
providing the fingerprint sensing unit 100 with color, and the
color of the color layer 150 can be adjusted according to practical
requirements.
[0029] In this embodiment, the manufacturing method of the
fingerprint sensing unit 100 can comprise the following steps. At
least one fingerprint sensing chip 120 is disposed on the carrier
substrate 110. The fingerprint sensing chip 120 can be electrically
connected to the carrier substrate 110 by various methods, and the
first embodiment is illustrated by the case of the wire bonding
method. Then, the molding layer 130 covers the fingerprint sensing
chip 120 and the bond wire W1 and partial upper surface S1 of the
carrier substrate 110. The color layer 150 is disposed on the
light-pervious cover layer 140, and then the adhesive layer 160 is
disposed on the color layer 150. Next, the light-pervious cover
layer 140 attached to the color layer 150 adheres to the top
surface 132a of the molding layer 130 through the adhesive layer
160. It is to be noted that, a singulation process may be carried
out to form individual electronic packages by laser ablating or
knife cutting or other techniques. The said individual electronic
package is substantially equal to the fingerprint sensing unit
100.
[0030] FIG. 2A is a cross-sectional view of a fingerprint sensing
unit according to the second embodiment of the instant disclosure.
The fingerprint sensing unit 200 in accordance with the second
embodiment is similar to the fingerprint sensing unit 100 in
accordance with the first embodiment. The fingerprint sensing unit
200 comprises an outer conductive ring member 270. The outer
conductive ring member 270 surrounds the molding layer 130 and
contacts the side surface 132b of the molding layer 130. The outer
conductive ring member 270 is electrically connected to the
fingerprint sensing chip 120 through the carrier substrate 110.
Specifically, the outer conductive ring member 270 is electrically
connected to the fingerprint sensing chip 120 through the layout
pattern of the carrier substrate 110. In this embodiment, a gold
finger pattern F1 on the lower surface S2 of the carrier substrate
110 extends to the edge of the lower surface S2 of the carrier
substrate 110. Thus, the outer conductive ring member 270 covering
the side surface 132b of the molding layer 130 can be electrically
connected to the outer conductive ring member 270. However, in
order to consider the design and the manufacture process
requirement of the fingerprint sensing unit, in another embodiment,
the conductive ring member 270 can be electrically connected to the
metal layer (not shown) exposed from the lateral of the carrier
substrate 110.
[0031] In this embodiment, the outer conductive ring member 270 may
comprise an attaching layer 272 and a conductive layer 274. The
attaching layer 272 can be used as a seed layer. The conductive
layer 274 can be used for signal transmission. The attaching layer
272 can contact the side surface 132b of the molding layer 130 and
be located between the conductive layer 274 and the molding layer
130, and the conductive layer 274 can contact the attaching layer
272. The attaching layer 272 and the conductive layer 274 made of
the metal material, the alloy material, or other conductive
material are formed sequentially on the side surface 132b of the
molding layer 130 by sputter deposition or evaporation
deposition.
[0032] It is worth mentioning that, in this embodiment, the
light-pervious cover layer 140 attached to the color layer 150 is
adhered to the top surface 132a of the molding layer 130 through
the adhesive layer 160 and then singulation process is carried out
to form a plurality of chip packaging structures (not shown). Then,
the outer conductive ring member 270 is formed on said chip
packaging structures. When the user's finger touches the outer
conductive ring member 270 of the fingerprint sensing unit 200, the
fingerprint sensing chip 120 emits a signal through the outer
conductive ring member 270 to the finger of the user. The signal is
changed by the fingerprint and then is reflected back to the
fingerprint sensing chip 120 so that the fingerprint sensing chip
120 can identify the user's identity.
[0033] However, to consider the design and the manufacture process
requirement of the fingerprint sensing unit, in another embodiment,
shown in FIG. 2B, a singulation process is carried out to form a
plurality of chip packaging structures (not shown) and the outer
conductive ring member 270 is formed on said chip packaging
structures. Then, the light-pervious cover layer 140 attached to
the color layer 150 is adhered to the top surface 132a of the
molding layer 130 through the adhesive layer 160. Thus, the
light-pervious cover layer 140 covers the top surface of the outer
conductive ring member 270. In order to make the finger of the user
can receive the signal transmitted by the outer conductive ring
member 270, the fingerprint sensing unit 200 can further comprises
a booster integrated circuit (not shown) to strengthen the signal
from the fingerprint sensing chip 120 through the outer conductive
ring member 270 and the light-pervious cover layer 140 to the
finger of the user.
[0034] FIG. 2C is a cross-sectional view of a fingerprint sensing
unit according to the third embodiment of the instant disclosure.
In this embodiment, the outer conductive ring 370 of the
fingerprint sensing device 300 further comprises an isolation layer
376 disposed the outer side of the conductive layer 374. Namely,
the conductive layer 374 is located between the isolation layer 376
and the attaching layer 372. The material of the isolation layer
376 is electrically insulating material so that the isolation layer
376 prevents the signal be transmitted through the side surface of
the conductive layer 374. Beside, in order to consider the design
and the manufacture process requirement of the fingerprint sensing
unit, the outer conductive ring member 370 can be electrically
connected to the metal layer G1 exposed from the lateral of the
carrier substrate 110. When the user's finger touches the outer
conductive ring member 370 of the fingerprint sensing unit 300, the
fingerprint sensing chip 120 emits a signal through the outer
conductive ring member 370 and the metal layer G1 to the finger of
the user. Thus, the fingerprint sensing chip 120 can identify the
user's identity.
[0035] FIG. 3A is a cross-sectional view of a fingerprint sensing
unit according to the fourth embodiment of the instant disclosure.
In this embodiment, the fingerprint sensing chip 120 of the
fingerprint sensing unit 400 is electrically connected to the
carrier substrate 110 by flip chip method. However, the mounting
method of the fingerprint sensing chip 120 is not intended to limit
the scope of the present invention. The fingerprint sensing unit
400 further comprises at least one bump B1 disposed on the
fingerprint sensing chip 120. The bump B1 is used as the electric
contact to an inner conductive ring member 470. However, in another
embodiment, the fingerprint sensing chip 120 may be electrically
connected to the inner conductive ring member 470 through other
method, such as, through anisotropic conductive film (ACF) A1.
However, for the electric connection between the fingerprint
sensing chip 120 and inner conductive ring member 470, the present
invention is not limited to the above-described methods.
[0036] The molding layer 130 at least covers a side surface of the
fingerprint sensing chip 120 and the bump B1, and the partial
surface of the bump B1 is exposed through the top surface 132a of
the molding layer 130.
[0037] The inner conductive ring member 470 is located between the
light-pervious cover layer 140 and the molding layer 130, and the
inner conductive ring member 470 is electrically connected to the
fingerprint sensing chip 120. Specifically, the inner conductive
ring member 470 is located under the light-pervious cover layer 140
and the color layer 150 and is electrically connected to the
partial surface of the bump B1 exposed through the top surface 132a
of the molding layer 130. Thus, the inner conductive ring member
470 can be electrically connected to the fingerprint sensing chip
120. Specifically, the inner conductive ring member 470 is annular
and is formed by depositing the conductive materiel on the color
layer 150 through the sputter process and lithography process.
Furthermore, the anisotropic conductive film Al can be coated on
the partial surface of the bump B1 exposed through the top surface
132a of the molding layer 130 so that the inner conductive ring
member 470 can be better electrically connected to the bump B1.
[0038] The adhesive layer 160 is located under the light-pervious
cover layer 150. Specifically, the adhesive layer 160 is located on
the color layer 150 and is disposed on the inner side of the inner
conductive ring member 470. The adhesive layer 160 contacts the
color layer 150 and the fingerprint sensing chip 120. Namely, the
adhesive layer 160 fills in the space surrounded by the inner side
of the inner conductive ring member 470, the color layer 150 and
the fingerprint sensing chip 120. In practice, the material of the
adhesive layer 160 may be an underfill material, and the
light-pervious cover layer 140 attached to the color layer 150 and
the inner conductive ring member 470 adheres to a top surface of
the fingerprint sensing chip 120 through the adhesive layer 160.
The inner conductive ring member 470 is electrically contacts the
partial surface of the bump B1 exposed through the top surface 132a
of the molding layer 130. It is to be noted that, the adhesive
layer 160 and the molding layer 130 may be made of the same
material and be formed in the same process. For example, the
adhesive layer 160 and the molding layer 130 both are made of
underfill material. Or, the adhesive layer 160 and the molding
layer 130 may be made of different materials and be formed in
different process respectively.
[0039] For example, the adhesive layer 160 is made of an underfill
material to fill the space surrounded by the inner side of the
inner conductive ring member 470, the color layer 150 and the
fingerprint sensing chip 120, and the molding layer 130 is made of
epoxy molding compound to at least covers the side surface of the
fingerprint sensing chip 120. When the user's finger touches the
light-pervious cover layer 140 of the fingerprint sensing unit 400,
the fingerprint sensing chip 120 emits a signal through the bumps
B1 and the inner conductive ring member 470 and the signal pass
through the light-pervious cover layer 140 to the finger of the
user. Thus, the fingerprint sensing chip 120 can identify the
user's identity.
[0040] FIG. 3B is a cross-sectional view of a fingerprint sensing
unit according to another embodiment of the instant disclosure. In
this embodiment, the fingerprint sensing chip 120 of the
fingerprint sensing unit 400 is electrically connected to the
carrier substrate 110 by wire bonding method. However, the mounting
method of the fingerprint sensing chip 120 is not intended to limit
the scope of the present invention. Specifically, a plurality of
the bumps B1 disposed on the fingerprint sensing chip 120 is used
as the electric contacts to the inner conductive ring member 470.
The molding layer 130 covers the fingerprint sensing chip 120 and
the plurality of the bumps B1, and the partial surface of the bumps
B1 are exposed through the top surface 132a of the molding layer
130. The material of the adhesive layer 160 may be an underfill
material. The adhesive layer 160 is located between the
light-pervious cover layer 140 and the molding layer 130. The
adhesive layer 160 is disposed on the inner side of the inner
conductive ring member 470 and contacts the molding layer 130.
Specifically, the adhesive layer 160 fills in the space surrounded
by the inner side of the inner conductive ring member 470, the
color layer 150 and the molding layer 130. In practice, the
adhesive layer 160 may extend to the top surface 132a of the
molding layer 130. The light-pervious cover layer 140 attached to
the color layer 150 and the inner conductive ring member 470
adheres to the top surface 132a of the molding layer 130 through
the adhesive layer 160. The inner conductive ring member 470
electrically contacts the partial surface of the bump B1 exposed
through the top surface 132a of the molding layer 130. Beside, in
this embodiment, the fingerprint sensing unit 400 can further
comprise the outer conductive ring member 270. The outer conductive
ring member 270 surrounds the molding layer 130 and is electrically
connected to the inner conductive ring member 470 exposed through
the side surface 132b of the molding layer 130. The embodiments of
the outer conductive ring member 270 can be the outer conductive
ring member 270 of the fingerprint sensing unit 200 and the outer
conductive ring member 370 of the fingerprint sensing unit 300
(shown in FIG. 2A-2C).
[0041] When the user's finger touches the outer conductive ring
member 270 of the fingerprint sensing unit 400, the fingerprint
sensing chip 120 can emits a signal through the gold finger pattern
F1 and the outer conductive ring member 270 to the finger of the
user or emits a signal through the bumps B1 and the inner
conductive ring member 470 to the outer conductive ring member 270.
Thus, the fingerprint sensing chip 120 can identify the user's
identity.
[0042] FIG. 4 is a cross-sectional view of a fingerprint sensing
unit according to the fifth embodiment of the instant disclosure.
The difference between the fingerprint sensing unit 500 in
accordance with the fifth embodiment and the fingerprint sensing
unit 100 in accordance with the first embodiment is that the
fingerprint sensing unit 500 further comprises an integrated
circuit chip 520. In this embodiment, the integrated circuit chip
520 is disposed on the carrier substrate 110, and the fingerprint
sensing chip 120 is disposed on the integrated circuit chip through
at least one bump B1. In general, the integrated circuit chip 620
is a signal processing chip, which is electrically connected to the
fingerprint sensing chip 120, to process the sensing signal from
the fingerprint sensing chip 120.
[0043] FIG. 5 is a cross-sectional view of a fingerprint sensing
unit according to the sixth embodiment of the instant disclosure.
Please refer to FIG. 5, in this embodiment, the fingerprint sensing
chip 120 of the fingerprint sensing unit 600 is disposed on the
carrier substrate 110, and the color layer 150 is disposed on the
light-pervious cover layer 640. The adhesive layer 660 may be a die
attach film (DAF). The adhesive layer 660 is disposed on the color
layer 150 and adheres to the fingerprint sensing chip 120 and
covers the partial arc of the bond wire W1. The width L1 of the
light-pervious cover layer 740 is larger than the width L2 of the
fingerprint sensing chip 120.
[0044] The fingerprint sensing unit 600 can further comprise a
filling layer 680. In practice, the filling layer 780 may be an
underfill material. The filling layer 680 is disposed under the
adhesive layer 600 and is located between the adhesive layer 600
and the carrier substrate 110. Specifically, the filling layer 780
fills in the space between the adhesive layer 660 and the carrier
substrate 110 and surrounds the fingerprint sensing chip 120. The
fingerprint sensing device 700 further comprises a molding layer
630. The molding layer 630 covers at least one side surface P2 of
the light-pervious cover layer 640, partial filling layer 680 and
partial carrier substrate 110. The top surface 632a of the molding
layer 630 is roughly flush with a top surface P1 of the
light-pervious cover layer 640. However, in another embodiment, the
fingerprint sensing device 600 may merely use the filling layer 680
to protect the fingerprint sensing chip 120 without the molding
layer 630 to package.
[0045] The manufacturing method of the fingerprint sensing unit 600
can comprise the following steps. At least one fingerprint sensing
chip 120 is disposed on the carrier substrate 110. The fingerprint
sensing chip 120 can be electrically connected to the carrier
substrate 110 by various methods. The color layer 150 is disposed
on the light-pervious cover layer 640, and then the adhesive layer
160 is disposed on the color layer 150. Then, the light-pervious
cover layer 640 attached to the color layer 150 and the adhesive
layer 660 is cut into multiple units. The light-pervious cover
layer 640 of every unit adheres to the fingerprint sensing chip 120
through the adhesive layer 660. The width L1 of the light-pervious
cover layer 640 is larger than the width L2 of the fingerprint
sensing chip 120. Then, the filling layer 680 fills in the space
under the light-pervious cover layer 640 and surrounds the
fingerprint sensing chip 120. The molding layer 630 covers the side
surfaces P2 of the light-pervious cover layer 640, partial filling
layer 680 and partial carrier substrate 110. The top surface 632a
of the molding layer 630 is roughly flush with the top surface P1
of the light-pervious cover layer 640. Then, a singulation process
may be carried out to form individual electronic packages by laser
ablating or knife cutting or other techniques, said individual
electronic package is substantially equal to the fingerprint
sensing unit 600.
[0046] FIG. 6A is a cross-sectional view of a fingerprint sensing
module according to an embodiment of the instant disclosure. The
fingerprint sensing module 10 is an independent packaging module,
which facilitates to be disposed on an electronic system with
fingerprint recognition function. In this embodiment, the
fingerprint sensing module 10 comprises the fingerprint sensing
unit and a circuit board 12 electrically connected to the
fingerprint sensing unit. In this embodiment, the fingerprint
sensing unit is substantially equal to the fingerprint sensing unit
300 (shown in FIG. 2C) and the circuit board 12 is electrically
connected to the gold finger pattern F1 on the on the lower surface
S2 of the carrier substrate 110. Beside, the fingerprint sensing
module 10 can further comprise a conductive bezel 14. The
conductive bezel 14 is an annular ring and surrounds the
fingerprint sensing unit. Specifically, the circuit board 12 can be
a printed circuit board (PCB) or a flexible printed circuit board
(FPCB). The conductive bezel 14 surrounds the molding layer 130 and
contacts the isolation layer 376 so that the signal from the
fingerprint sensing chip 120 cannot be transmitted to the
conductive bezel 14 through the side surface of the conductive
layer 374. The conductive bezel 14 is electrically connected to
grounding pads (not shown) of the circuit board 12 so that the
conductive bezel 14 can be grounded for preventing electrostatic
discharge (ESD). It is to be noted that, in another embodiment,
according to the design of the fingerprint sensing module 10, the
fingerprint sensing unit of the fingerprint sensing module 10 can
be other embodiment of the fingerprint sensing unit of the instant
disclosure.
[0047] FIG. 6B is a cross-sectional view of a fingerprint sensing
module according to another embodiment of the instant disclosure.
In this embodiment, the conductive bezel 14 further comprises a
cover frame 14a. In order to prevent the signal be transmitted to
the conductive bezel 14 through the side surface of the conductive
layer 374, the isolation layer 376 is disposed on the conductive
layer 374 and extends towards a surface 142 of the light-pervious
cover layer 140, and the cover frame 14a contacts the isolation
layer 376. The cover frame 14a extends towards the central of the
conductive bezel 14 and covers a part of the surface 142 of the
light-pervious cover layer 140.
[0048] In summary, in the above mentioned embodiments of the
fingerprint sensing unit of the present disclosure, the
light-pervious cover layer can be disposed on the molding layer
covering the fingerprint sensing chip through the adhesive layer or
be disposed on the fingerprint sensing chip so as to form an
individual fingerprint sensing module.
[0049] In addition, the fingerprint sensing unit according to one
embodiment of the present disclosure comprises the outer conductive
ring member which surrounds the molding layer and contacts the side
surface of the molding layer. The outer conductive ring member
comprises the attaching layer and the conductive layer which is
formed by sputter deposition or evaporation deposition. The outer
conductive ring member can be electrically connected to the
fingerprint sensing chip through the gold finger pattern. According
to different demand of products, the outer conductive ring member
can further comprise the isolation layer. In another embodiment of
the instant disclosure, the inner conductive ring member which is
located on the light-pervious cover layer contacts a part of bump
exposed through the top surface of the molding layer and is
electrically connected to the fingerprint sensing chip. Thus, the
design flexibility of the fingerprint sensing unit can be
improved.
[0050] Furthermore, the fingerprint sensing module comprises the
fingerprint sensing unit and a circuit board electrically connected
to the fingerprint sensing unit. The circuit board is electrically
connected to the gold finger pattern on the on the lower surface of
the carrier substrate. The fingerprint sensing module can further
comprise the conductive bezel. The conductive bezel surrounds the
fingerprint sensing unit and contacts the isolation layer so that
the signal from the fingerprint sensing chip cannot be transmitted
to the conductive bezel through the side surface of the conductive
layer. The conductive bezel is electrically connected to grounding
pads of the circuit board so that the conductive bezel can be
grounded for preventing electrostatic discharge. Compared to the
prior art, the fingerprint sensing module of the present disclosure
is an individual and modularized packaging module that is capable
of easily mounting on the electronic devices, such as the smart
phone, notebook and the like. Thus, in the manufacturing process
for producing a electronic devices with fingerprint recognition
function, several complicated fabrication steps for additionally
mounting the fingerprint sensing chip on electronic device can be
omitted.
[0051] While the instant disclosure has been described by way of
example and in terms of the preferred embodiments, it is to be
understood that the invention needs not be limited to the disclosed
embodiments. For anyone skilled in the art, various modifications
and improvements within the spirit of the instant disclosure are
covered under the scope of the instant disclosure. The covered
scope of the instant disclosure is based on the appended
claims.
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