Lin; Wei-Ting
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Wei-Ting.The latest application filed is for "package structure and method of manufacturing the same".
Company Profile
23.78.93
- Lin; Wei-Ting - Taipei TW
- Lin; Wei-Ting - Yunlin County TW
- Lin; Wei-Ting - Taipei City TW
- Lin; Wei-Ting - Hsinchu TW
- Lin; Wei-Ting - Taichung TW
- Lin; Wei-Ting - Taichung City TW
- Lin; Wei-Ting - Goleta CA
- Lin; Wei-Ting - Taoyuan TW
- LIN; WEI-TING - TAOYUAN CITY TW
- LIN; WEI-TING - TAOYUAN COUNTY TW
- Lin; Wei-Ting - New Taipei TW
- LIN; WEI-TING - New Taipei City TW
- Lin; Wei-Ting - Hsin-Chu TW
- Lin; Wei-Ting - Toufen TW
- Lin; Wei-Ting - Taipei County TW
- Lin; Wei-Ting - Mountain View CA
Patent Activity
| Patent | Date |
|---|---|
| Package-on-package with redistribution structure Grant 11,417,643 - Liu , et al. August 16, 2 | 2022-08-16 |
| Communication device and echo cancellation method Grant 11,277,168 - Lin , et al. March 15, 2 | 2022-03-15 |
| Package Structure And Method Of Manufacturing The Same App 20210407963 - Lin; Wei-Ting ; et al. | 2021-12-30 |
| Semiconductor device Grant 11,211,339 - Wang , et al. December 28, 2 | 2021-12-28 |
| Semiconductor substrate Grant 11,121,261 - Lin , et al. September 14, 2 | 2021-09-14 |
| Communication Device And Echo Cancellation Method App 20210175924 - LIN; Wei-Ting ; et al. | 2021-06-10 |
| MOSFET and manufacturing method thereof Grant 11,031,496 - Lin , et al. June 8, 2 | 2021-06-08 |
| Linear guide apparatus Grant 10,900,518 - Lin January 26, 2 | 2021-01-26 |
| Semiconductor Substrate App 20210005750 - Lin; Wei-Ting ; et al. | 2021-01-07 |
| System and method for bonding package lid Grant 10,879,140 - Lin , et al. December 29, 2 | 2020-12-29 |
| Linear Guide Apparatus App 20200400189 - Lin; Wei-Ting | 2020-12-24 |
| Semiconductor packaging structure and process Grant 10,867,835 - Ho , et al. December 15, 2 | 2020-12-15 |
| Manufacturing Method Of A Semiconductor Device App 20200357659 - CHANG; SHOU ZEN ; et al. | 2020-11-12 |
| Mosfet And Manufacturing Method Thereof App 20200328302 - Lin; Wei-Ting ; et al. | 2020-10-15 |
| Lid Attach Process And Dispenser Head App 20200286748 - CHEN; Chin-Liang ; et al. | 2020-09-10 |
| Semiconductor device and manufacturing method thereof Grant 10,727,082 - Chang , et al. | 2020-07-28 |
| Lid attach processes for semiconductor packages Grant 10,685,853 - Chen , et al. | 2020-06-16 |
| Semiconductor Device App 20200111753 - WANG; CHUEI-TANG ; et al. | 2020-04-09 |
| Package Structure And Methods Of Forming The Same App 20200066704 - Liu; Yu-Chih ; et al. | 2020-02-27 |
| Spindle with intelligent auto-detection system Grant 10,534,345 - Lin Ja | 2020-01-14 |
| Methods of forming package-on-package structures Grant 10,515,941 - Liu , et al. Dec | 2019-12-24 |
| Semiconductor device Grant 10,510,681 - Wang , et al. Dec | 2019-12-17 |
| Multi-layer-multi-reference prediction using adaptive temporal filtering Grant 10,448,013 - Mukherjee , et al. Oc | 2019-10-15 |
| Optical housing for high power fiber components Grant 10,365,442 - Lin , et al. July 30, 2 | 2019-07-30 |
| Spindle With Intelligent Auto-detection System App 20190179287 - Lin; Wei-Ting | 2019-06-13 |
| Optical Housing For High Power Fiber Components App 20190146159 - LIN; CHIANG-HSIN ; et al. | 2019-05-16 |
| Semiconductor Packaging Structure and Process App 20190139817 - Ho; Kuan-Lin ; et al. | 2019-05-09 |
| System and Method for Bonding Package Lid App 20190122946 - Lin; Shih-Yen ; et al. | 2019-04-25 |
| System and method for bonding package lid Grant 10,269,668 - Lin , et al. | 2019-04-23 |
| Animation synthesis system and lip animation synthesis method Grant 10,249,291 - Lin , et al. | 2019-04-02 |
| Intelligent notification device and intelligent notification method Grant 10,237,390 - Huang , et al. | 2019-03-19 |
| Servo motor and circuit board thereof Grant 10,211,700 - Tsao , et al. Feb | 2019-02-19 |
| Light Curing Apparatus App 20190016020 - LIN; WEI-TING ; et al. | 2019-01-17 |
| Semiconductor packaging structure and process Grant 10,157,772 - Ho , et al. Dec | 2018-12-18 |
| Semiconductor Device App 20180350752 - WANG; CHUEI-TANG ; et al. | 2018-12-06 |
| Fingerprint Sensing Unit App 20180336393 - Lin; Wei-Ting ; et al. | 2018-11-22 |
| Light curing apparatus Grant 10,118,193 - Lin , et al. November 6, 2 | 2018-11-06 |
| Data transmission system and communication method Grant 10,085,204 - Chiang , et al. September 25, 2 | 2018-09-25 |
| Fingerprint sensing unit and fingerprint sensing module Grant 10,061,965 - Lin , et al. August 28, 2 | 2018-08-28 |
| Semiconductor device and manufacturing method thereof Grant 10,043,761 - Wang , et al. August 7, 2 | 2018-08-07 |
| Multi-layer-multi-reference Prediction Using Adaptive Temporal Filtering App 20180184086 - Mukherjee; Debargha ; et al. | 2018-06-28 |
| Package Structure and Methods of Forming the Same App 20180122791 - Liu; Yu-Chih ; et al. | 2018-05-03 |
| Servo Motor And Circuit Board Thereof App 20180062477 - Tsao; Wei-Min ; et al. | 2018-03-01 |
| Method of manufacturing a chip package Grant 9,893,043 - Chen , et al. February 13, 2 | 2018-02-13 |
| Ring structure for chip packaging Grant 9,887,144 - Lin , et al. February 6, 2 | 2018-02-06 |
| Packages with Die Stack Including Exposed Molding Underfill App 20180033775 - Liu; Yu-Chih ; et al. | 2018-02-01 |
| Package structure and methods of forming the same Grant 9,859,265 - Liu , et al. January 2, 2 | 2018-01-02 |
| Semiconductor Packaging Structure and Process App 20170345708 - Ho; Kuan-Lin ; et al. | 2017-11-30 |
| Animation Synthesis System And Lip Animation Synthesis Method App 20170345201 - LIN; Wei-Ting ; et al. | 2017-11-30 |
| Packaging methods for semiconductor devices with encapsulant ring Grant 9,805,997 - Liu , et al. October 31, 2 | 2017-10-31 |
| Packages with die stack including exposed molding underfill Grant 9,793,242 - Liu , et al. October 17, 2 | 2017-10-17 |
| Semiconductor device and manufacturing method thereof Grant 9,786,520 - Liu , et al. October 10, 2 | 2017-10-10 |
| System and Method for Bonding Package Lid App 20170271223 - Lin; Shih-Yen ; et al. | 2017-09-21 |
| Semiconductor packaging structure and process Grant 9,735,043 - Ho , et al. August 15, 2 | 2017-08-15 |
| Suspended capacitive fingerprint sensor and method for manufacturing the same Grant 9,684,811 - Lin June 20, 2 | 2017-06-20 |
| Fingerprint sensor packaging module and manufacturing method thereof Grant 9,679,188 - Lin June 13, 2 | 2017-06-13 |
| System and method for bonding package lid Grant 9,673,119 - Lin , et al. June 6, 2 | 2017-06-06 |
| Method of manufacturing package structure Grant 9,661,794 - Chang , et al. May 23, 2 | 2017-05-23 |
| Power Saving Device With Power Supply App 20170141593 - CHEN; WEN-SHENG ; et al. | 2017-05-18 |
| Touch module and method of fabricating the same Grant 9,632,632 - Lin , et al. April 25, 2 | 2017-04-25 |
| Semiconductor Device And Manufacturing Method Thereof App 20170110412 - WANG; CHUEI-TANG ; et al. | 2017-04-20 |
| Fingerprint Sensor Packaging Module And Manufacturing Method Thereof App 20170091517 - Lin; Wei-Ting | 2017-03-30 |
| Fingerprint Sensing Unit And Fingerprint Sensing Module App 20170076134 - LIN; WEI-TING ; et al. | 2017-03-16 |
| Lid Attach Processes For Semiconductor Packages App 20170076960 - CHEN; Chin-Liang ; et al. | 2017-03-16 |
| Semiconductor Device And Manufacturing Method Thereof App 20170062360 - CHANG; SHOU ZEN ; et al. | 2017-03-02 |
| Fingerprint identification device Grant 9,553,062 - Fan , et al. January 24, 2 | 2017-01-24 |
| Intelligent Notification Device And Intelligent Notification Method App 20170013111 - Huang; Min-Che ; et al. | 2017-01-12 |
| Automatic Notification Device And Automatic Notification Method App 20160353257 - Huang; Min-Che ; et al. | 2016-12-01 |
| Lid attach process and apparatus for fabrication of semiconductor packages Grant 9,502,373 - Chen , et al. November 22, 2 | 2016-11-22 |
| Semiconductor device design method, system and computer program product Grant 9,501,593 - Huang , et al. November 22, 2 | 2016-11-22 |
| Body-shaping support structure Grant 9,486,080 - Lin November 8, 2 | 2016-11-08 |
| Data Transmission System And Communication Method App 20160278005 - CHIANG; CHI-KANG ; et al. | 2016-09-22 |
| Suspended Capacitive Fingerprint Sensor And Method For Manufacturing The Same App 20160275333 - Lin; Wei-Ting | 2016-09-22 |
| Apparatus for manufacturing a semiconductor device and method of manufacturing a semiconductor device Grant 9,415,501 - Ho , et al. August 16, 2 | 2016-08-16 |
| Electronic Apparatus Having Fingerprint Sensor Operating In Vector Mode App 20160224775 - Lin; Wei-Ting | 2016-08-04 |
| Patterned substrate for epitaxially growing semiconductor material, and method for patterning a substrate Grant 9,391,235 - Wuu , et al. July 12, 2 | 2016-07-12 |
| Semiconductor Device Design Method, System And Computer Program Product App 20160188776 - HUANG; Mu-Jen ; et al. | 2016-06-30 |
| Adhesive Composition, Adhesive Comprising The Same, And Method Of Fabricating Adhesive Comprising The Same App 20160186012 - Cai; Yong-Qi ; et al. | 2016-06-30 |
| Capacitive-type touch control display Grant 9,310,946 - Lin , et al. April 12, 2 | 2016-04-12 |
| Semiconductor device design method, system and computer program product Grant 9,305,134 - Huang , et al. April 5, 2 | 2016-04-05 |
| Adhesive pattern for advance package reliability improvement Grant 9,287,233 - Chen , et al. March 15, 2 | 2016-03-15 |
| Semiconductor Device And Manufacturing Method Thereof App 20160071744 - LIU; YU-CHIH ; et al. | 2016-03-10 |
| Method of bonding and debonding substrate Grant 9,278,512 - Sun , et al. March 8, 2 | 2016-03-08 |
| Touch Module and Method of Fabricating the Same App 20150355745 - Lin; Wei-Ting ; et al. | 2015-12-10 |
| Package Structure and Methods of Forming the Same App 20150357309 - Liu; Yu-Chih ; et al. | 2015-12-10 |
| Method Of Manufacturing A Chip Package App 20150357318 - Chen; Chin-Liang ; et al. | 2015-12-10 |
| Semiconductor device and manufacturing method thereof Grant 9,209,046 - Liu , et al. December 8, 2 | 2015-12-08 |
| Method of Forming Line Pattern on Substrate App 20150286141 - Lin; Wei-Ting ; et al. | 2015-10-08 |
| Touch Module and Display Device Using the Same App 20150277615 - LIN; Wei-Ting ; et al. | 2015-10-01 |
| Rotating curing Grant 9,147,584 - Lu , et al. September 29, 2 | 2015-09-29 |
| Patterned substrate and light-emitting diode having the same Grant 9,142,719 - Wuu , et al. September 22, 2 | 2015-09-22 |
| Semiconductor device and manufacturing method thereof Grant 9,142,523 - Liu , et al. September 22, 2 | 2015-09-22 |
| Body-shaping Support Structure App 20150250318 - Lin; Wei-Ting | 2015-09-10 |
| System and Method for Bonding Package Lid App 20150214128 - Lin; Shih-Yen ; et al. | 2015-07-30 |
| Packaging Methods for Semiconductor Devices, and Packaged Semiconductor Devices App 20150214074 - Liu; Yu-Chih ; et al. | 2015-07-30 |
| Capacitive-type Touch Control Display App 20150205421 - LIN; Wei-Ting ; et al. | 2015-07-23 |
| Touch panel with single electrode layer Grant 9,075,466 - Lin , et al. July 7, 2 | 2015-07-07 |
| Packages with Die Stack Including Exposed Molding Underfill App 20150187734 - Liu; Yu-Chih ; et al. | 2015-07-02 |
| Semiconductor Packaging Structure and Process App 20150179607 - Ho; Kuan-Lin ; et al. | 2015-06-25 |
| Adhesive Pattern For Advance Package Reliability Improvement App 20150155221 - Chen; Chin-Liang ; et al. | 2015-06-04 |
| Emiconductor Device And Manufacturing Method Thereof App 20150145115 - LIU; YU-CHIH ; et al. | 2015-05-28 |
| Semiconductor Device And Manufacturing Method Thereof App 20150093856 - LIU; YU-CHIH ; et al. | 2015-04-02 |
| Flip-chip BGA assembly process Grant 8,993,378 - Liu , et al. March 31, 2 | 2015-03-31 |
| Method Of Bonding And Debonding Substrate App 20150083312 - SUN; Shuo-Yang ; et al. | 2015-03-26 |
| Shock absorbers for a bicycle Grant 8,979,109 - Lin March 17, 2 | 2015-03-17 |
| Semiconductor Device Design Method, System And Computer Program Product App 20150074627 - HUANG; Mu-Jen ; et al. | 2015-03-12 |
| Lid Attach Process And Apparatus For Fabrication Of Semiconductor Packages App 20150069089 - CHEN; Chin-Liang ; et al. | 2015-03-12 |
| Apparatus For Manufacturing A Semiconductor Device And Method Of Manufacturing A Semiconductor Device App 20150059159 - HO; KUAN-LIN ; et al. | 2015-03-05 |
| Lid attach process and apparatus for fabrication of semiconductor packages Grant 8,916,419 - Chen , et al. December 23, 2 | 2014-12-23 |
| Semiconductor device design method, system and computer program product Grant 8,904,326 - Huang , et al. December 2, 2 | 2014-12-02 |
| Adjustable Stand Holder App 20140191102 - LIN; Wei-Ting | 2014-07-10 |
| Shock absorbers for a bicycle App 20140145412 - Lin; Wei-Ting | 2014-05-29 |
| Support Rack App 20140137952 - LIN; Wei-Ting | 2014-05-22 |
| Vehicle Light Device With Light Guide Cover App 20140119039 - LIN; Wei-Ting | 2014-05-01 |
| Touch Panel With Single Electrode Layer App 20140092036 - LIN; Wei-Ting ; et al. | 2014-04-03 |
| Methods and apparatus for alignment in flip chip bonding Grant 8,664,039 - Sung , et al. March 4, 2 | 2014-03-04 |
| Method and apparatus for die assembly Grant 8,652,939 - Sung , et al. February 18, 2 | 2014-02-18 |
| Thin film transistor having a patterned passivation layer Grant 8,643,006 - Chen , et al. February 4, 2 | 2014-02-04 |
| Semiconductor Device Design Method, System And Computer Program Product App 20140007031 - HUANG; Mu-Jen ; et al. | 2014-01-02 |
| Semiconductor structure and fabricating method thereof Grant 8,609,460 - Liu , et al. December 17, 2 | 2013-12-17 |
| Lid Attach Process And Apparatus For Fabrication Of Semiconductor Packages App 20130260511 - CHEN; Chin-Liang ; et al. | 2013-10-03 |
| Adhesive Composition And Adhesive Comprising The Same App 20130189467 - Cai; Yong-Qi ; et al. | 2013-07-25 |
| Rotating Curing App 20130119565 - Lu; Jing Ruei ; et al. | 2013-05-16 |
| Methods and Apparatus For Alignment In Flip Chip Bonding App 20130095607 - Sung; Ming-Chung ; et al. | 2013-04-18 |
| Method and Apparatus for Die Assembly App 20130093094 - Sung; Ming-Chung ; et al. | 2013-04-18 |
| Corner Key And Frame Assembly Thereof App 20130064600 - Tseng; Huang-Chi ; et al. | 2013-03-14 |
| Ring Structure For Chip Packaging App 20130062752 - LIN; Wen-Yi ; et al. | 2013-03-14 |
| Flip-chip Bga Assembly Process App 20130059416 - LIU; Yu-Chih ; et al. | 2013-03-07 |
| Display with photo sensor and manufacturing method thereof Grant 8,368,068 - Cho , et al. February 5, 2 | 2013-02-05 |
| Thin Film Transistor And Fabrication Method Thereof App 20120267621 - Chen; Chia-Hsiang ; et al. | 2012-10-25 |
| Apparatus and methods for semiconductor packages with improved warpage Grant 8,288,208 - Liu , et al. October 16, 2 | 2012-10-16 |
| Display With Photo Sensor And Manufacturing Method Thereof App 20120205646 - Cho; An-Thung ; et al. | 2012-08-16 |
| Oxide Semiconductor Thin Film Transistor Structure And Method Of Making The Same App 20120132914 - Chen; Chia-Hsiang ; et al. | 2012-05-31 |
| Patterned Substrate For Epitaxially Growing Semiconductor Material, And Method For Patterning A Substrate App 20120128939 - WUU; Dong-Sing ; et al. | 2012-05-24 |
| Patterned Substrate And Light-emitting Diode Having The Same App 20120074453 - Wuu; Dong-Sing ; et al. | 2012-03-29 |
| Semiconductor Structure And Fabricating Method Thereof App 20120061661 - Liu; Po-Tsun ; et al. | 2012-03-15 |
| Massaging Device App 20110275967 - LIN; WEI-TING | 2011-11-10 |
| Motorized Bicycle with Electric Generating Function App 20100282534 - Lin; Wei-Ting | 2010-11-11 |
| Method For Operating Page And Electronic Device App 20100097337 - Lin; Wei-Ting ; et al. | 2010-04-22 |
| Actuating Device for a Motorized Wheeled Vehicle with an Electric Generating Function App 20100052454 - Lin; Wei-Ting | 2010-03-04 |
| Bidirectional and vertical motion actuator and method for manufacturing the same App 20040119376 - Chou, Bruce C. S. ; et al. | 2004-06-24 |
| Bandwidth optimization cache Grant 6,233,656 - Jones , et al. May 15, 2 | 2001-05-15 |
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