U.S. patent application number 15/468109 was filed with the patent office on 2018-09-27 for under layer composition and method of manufacturing semiconductor device.
This patent application is currently assigned to Taiwan Semiconductor Manufacturing Co., Ltd.. The applicant listed for this patent is Taiwan Semiconductor Manufacturing Co., Ltd.. Invention is credited to Ching-Yu Chang, Chin-Hsiang Lin, Chen-Yu Liu, Ming-Hui Weng.
Application Number | 20180277359 15/468109 |
Document ID | / |
Family ID | 63556823 |
Filed Date | 2018-09-27 |
United States Patent
Application |
20180277359 |
Kind Code |
A1 |
Liu; Chen-Yu ; et
al. |
September 27, 2018 |
UNDER LAYER COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR
DEVICE
Abstract
Under layer composition and methods of manufacturing
semiconductor devices are disclosed. The method of manufacturing
semiconductor device includes the following steps. A layer of an
under layer composition is formed, wherein the under layer
composition includes a polymeric material and a cross-linker, and
the cross-linker includes at least one decomposable functional
group. A curing process is performed on the layer of the under
layer composition to form an under layer, wherein the cross-linker
is crosslinked with the polymeric material to form a crosslinked
polymeric material having the at least one decomposable functional
group. A patterned photoresist layer is formed over the under
layer. An etching process is performed to transfer a pattern of the
patterned photoresist layer to the under layer. The under layer is
removed by decomposing the decomposable functional group.
Inventors: |
Liu; Chen-Yu; (Kaohsiung
City, TW) ; Lin; Chin-Hsiang; (Hsin-Chu, TW) ;
Chang; Ching-Yu; (Yilang county, TW) ; Weng;
Ming-Hui; (New Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Hsinchu |
|
TW |
|
|
Assignee: |
Taiwan Semiconductor Manufacturing
Co., Ltd.
Hsinchu
TW
|
Family ID: |
63556823 |
Appl. No.: |
15/468109 |
Filed: |
March 24, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C09D 201/06 20130101;
H01L 21/31144 20130101; G03F 7/091 20130101; G03F 7/11 20130101;
H01L 21/31133 20130101 |
International
Class: |
H01L 21/027 20060101
H01L021/027; H01L 21/311 20060101 H01L021/311; C09D 201/06 20060101
C09D201/06; G03F 7/11 20060101 G03F007/11; G03F 7/16 20060101
G03F007/16; G03F 7/09 20060101 G03F007/09 |
Claims
1. (canceled)
2. (canceled)
3. (canceled)
4. (canceled)
5. (canceled)
6. A method of manufacturing a semiconductor device, comprising:
forming a layer of an under layer composition, wherein the under
layer composition comprises a polymeric material and a
cross-linker, and the cross-linker comprises at least one
decomposable functional group; performing a curing process on the
layer of the under layer composition to form an under layer,
wherein the cross-linker is crosslinked with the polymeric material
to form a crosslinked polymeric material having the at least one
decomposable functional group; forming a patterned photoresist
layer over the under layer; performing an etching process to
transfer a pattern of the patterned photoresist layer to the under
layer; and removing the under layer by decomposing the decomposable
functional group.
7. The method according to claim 6, wherein the polymeric material
comprises at least one reaction group providing a crosslinking
site, the at least one reaction group is selected from the group
consisting of a hydroxyl group, an alkoxyl group having a carbon
number less than 6, an amine group, a thiol group, a ester group,
an alkene group, an alkyne group, an epoxy group, an aziridine
group, an oxetane group, an aldehyde group, a ketone group, and a
carboxylic acid group.
8. The method according to claim 6, wherein the cross-linker
comprises at least one crosslinkable functional group, and the at
least one crosslinkable functional group is selected from the group
consisting of a hydroxyl group, an alkoxyl group having a carbon
number less than 6, an amine group, a thiol group, a ester group,
an alkene group, an alkyne group, an epoxy group, an aziridine
group, an oxetane group, an aldehyde group, a ketone group, and a
carboxylic acid group.
9. The method according to claim 6, wherein the at least one
decomposable functional group of the cross-linker is selected from
the group consisting of an ester group, an ether group, a silyl
ether group, an acetal group, a ketal group, an amide group, an
imine group, an imide group, and a carbamate group.
10. The method according to claim 6, wherein the curing process is
performed at a temperature ranging between about 100.degree. C. and
400.degree. C.
11. The method according to claim 6, further comprising forming a
middle layer between the under layer and the patterned photoresist
layer.
12. The method according to claim 6, wherein in the step of
decomposing the decomposable functional group, a bond in the at
least one decomposable functional group is broken.
13. The method according to claim 6, wherein removing the under
layer is performed under a condition of pH 4.about.10.
14. The method according to claim 6, wherein removing the under
layer is performed under a condition of pH 6-8.
15. A method of manufacturing a semiconductor device, comprising:
forming an under layer over a dielectric layer, wherein the under
layer comprises a crosslinked polymeric material comprising at
least one decomposable functional group; forming a patterned
photoresist layer over the under layer; performing a first etching
process to transfer a pattern of the patterned photoresist layer to
the under layer; by using the under layer as a mask, performing a
second etching process to transfer the pattern to the dielectric
layer; and removing the under layer by decrosslinking the
crosslinked polymeric material through the at least one
decomposable functional group.
16. The method according to claim 15, wherein the at least one
decomposable functional group is selected from the group consisting
of an ester group, an ether group, a silyl ether group, an acetal
group, a ketal group, an amide group, an imine group, an imide
group, and a carbamate group.
17. The method according to claim 15, wherein the under layer is
formed directly on the dielectric layer.
18. The method according to claim 15, wherein the dielectric layer
is a low-k dielectric layer.
19. The method according to claim 15, wherein removing the under
layer is performed under a condition of pH 4.about.10.
20. The method according to claim 15, wherein removing the under
layer is performed under a condition of pH 6.about.8.
21. A method of manufacturing a semiconductor device, comprising:
forming a layer of an under layer composition, wherein the under
layer composition comprises a polymeric material and a
cross-linker, the polymeric material comprises at least one
reaction group, the cross-linker comprises at least one
crosslinkable functional group and at least one decomposable
functional group, the at least one crosslinkable functional group
is capable of crosslinking with the at least one reaction group of
the polymeric material, and the decomposable functional group is
capable of being decomposed under a condition of pH 4.about.10;
performing a curing process on the layer of the under layer
composition to form an under layer, wherein the cross-linker is
crosslinked with the polymeric material to form a crosslinked
polymeric material having the at least one decomposable functional
group; forming a patterned photoresist layer over the under layer;
performing an etching process to transfer a pattern of the
patterned photoresist layer to the under layer; and removing the
under layer by decomposing the decomposable functional group.
22. The method according to claim 21, wherein the at least one
reaction group of the polymeric material is selected from the group
consisting of a hydroxyl group, an alkoxyl group having a carbon
number less than 6, an amine group, a thiol group, a ester group,
an alkene group, an alkyne group, an epoxy group, an aziridine
group, an oxetane group, an aldehyde group, a ketone group, and a
carboxylic acid group.
23. The method according to claim 21, wherein the at least one
crosslinkable functional group of the cross-linker is selected from
the group consisting of a hydroxyl group, an alkoxyl group having a
carbon number less than 6, an amine group, a thiol group, a ester
group, an alkene group, an alkyne group, an epoxy group, an
aziridine group, an oxetane group, an aldehyde group, a ketone
group, and a carboxylic acid group.
24. The method according to claim 21, wherein the at least one
decomposable functional group of the cross-linker is selected from
the group consisting of an ester group, an ether group, a silyl
ether group, an acetal group, a ketal group, an amide group, an
imine group, an imide group, and a carbamate group.
25. The method according to claim 21, wherein the decomposable
functional group is capable of being decomposed under a condition
of pH 6.about.8.
Description
BACKGROUND
[0001] Photolithography (or lithography) is frequently used in
manufacturing semiconductor integrated circuits (IC). In a typical
lithography process, a resist film is spin-coated on a surface of a
silicon wafer and is subsequently exposed and developed to form a
pattern for etching the silicon wafer. As semiconductor fabrication
technology continues to scale down where functional density has
generally increased while geometry size has generally decreased,
there has been a demand for a reduction in resist film thickness
and a better reflectivity control during exposure. Accordingly,
some new material and/or new techniques in lithography have been
developed. For example, some lithography processes use
silicon-containing resist over a carbon-containing bottom
anti-reflective coating (BARC) layer to reduce resist film
thickness. For another example, some lithography processes use a
tri-layer stack that includes a resist over a silicon-containing
middle layer over a carbon-containing under layer. However, these
approaches present new challenges.
[0002] For example, in the tri-layer approach, the
carbon-containing layer is very difficult to remove, and thus dry
etch process is applied. However, when the carbon-containing layer
is formed over a dielectric layer, the removal of the
carbon-containing layer may damage the dielectric layer
therebeneath. This unavoidably reduces device reliability.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] Aspects of the present disclosure are best understood from
the following detailed description when read with the accompanying
figures. It is noted that, in accordance with the standard practice
in the industry, various features are not drawn to scale. In fact,
the dimensions of the various features may be arbitrarily increased
or reduced for clarity of discussion.
[0004] FIGS. 1A-1F are schematic cross-sectional views illustrating
a method of manufacturing a semiconductor device in accordance with
some embodiments of the disclosure.
[0005] FIG. 2A is a schematic view of an under layer composition in
accordance with some embodiments of the disclosure.
[0006] FIG. 2B is a schematic view of an under layer in accordance
with some embodiments of the disclosure.
[0007] FIG. 2C is a schematic view of an under layer under a
condition of pH 4.about.10 in accordance with some embodiments of
the disclosure.
[0008] FIG. 3A is a schematic view of an under layer composition in
accordance with some embodiments of the disclosure.
[0009] FIG. 3B is a schematic view of an under layer in accordance
with some embodiments of the disclosure.
[0010] FIG. 3C is a schematic view of an under layer under a
condition of pH 4.about.10 in accordance with some embodiments of
the disclosure.
DETAILED DESCRIPTION
[0011] The following disclosure provides many different
embodiments, or examples, for implementing different features of
the provided subject matter. Specific examples of components and
arrangements are described below to simplify the present
disclosure. These are, of course, merely examples and are not
intended to be limiting. For example, the formation of a first
feature over or on a second feature in the description that follows
may include embodiments in which the first and second features are
formed in direct contact, and may also include embodiments in which
additional features may be formed between the first and second
features, such that the first and second features may not be in
direct contact. In addition, the present disclosure may repeat
reference numerals and/or letters in the various examples. This
repetition is for the purpose of simplicity and clarity and does
not in itself dictate a relationship between the various
embodiments and/or configurations discussed.
[0012] Further, spatially relative terms, such as "beneath,"
"below," "lower," "above," "upper" and the like, may be used herein
for ease of description to describe one element or feature's
relationship to another element(s) or feature(s) as illustrated in
the figures. The spatially relative terms are intended to encompass
different orientations of the device in use or operation in
addition to the orientation depicted in the figures. The apparatus
may be otherwise oriented (rotated 90 degrees or at other
orientations) and the spatially relative descriptors used herein
may likewise be interpreted accordingly.
[0013] The advanced lithography process, method, and materials
described in the current disclosure can be used in many
applications, including fin-type field effect transistors
(FinFETs). For example, the fins may be patterned to produce a
relatively close spacing between features, for which the above
disclosure is well suited. In addition, spacers used in forming
fins of FinFETs can be processed according to the above
disclosure.
[0014] FIGS. 1A-1F are schematic cross-sectional views illustrating
a method of manufacturing a semiconductor device in accordance with
some embodiments of the disclosure. Referring to FIGS. 1A and 1B,
an under layer 140 is formed over a dielectric layer 120. In some
embodiments, the dielectric layer 120 is formed over a substrate
110, and the under layer 140 is formed over the dielectric layer
120. The substrate 110 includes a silicon substrate in some
embodiments. The substrate 110 may include another elementary
semiconductor, such as germanium, or diamond in some embodiments.
The substrate 110 may include a compound semiconductor, such as
silicon carbide, gallium arsenic, indium arsenide, and indium
phosphide. The substrate 110 may include an alloy semiconductor,
such as silicon germanium, silicon germanium carbide, gallium
arsenic phosphide, and gallium indium phosphide. The substrate 110
may include one or more epitaxial semiconductor layer, such as
semiconductor layer(s) epitaxially grown on a silicon substrate.
For example, the substrate may have an epitaxial layer overlying a
bulk semiconductor. Further, the substrate may be strained for
performance enhancement. For example, the epitaxial layer may
include semiconductor materials different from those of the bulk
semiconductor such as a layer of silicon germanium overlying a bulk
silicon, or a layer of silicon overlying a bulk silicon germanium
formed by a process including selective epitaxial growth (SEG).
Furthermore, the substrate 110 may include a
semiconductor-on-insulator (SOI) structure. For example, the
substrate may include a buried oxide (BOX) layer formed by a
process such as separation by implanted oxygen (SIMOX). In other
embodiments, the substrate 110 may include a glass such as in thin
film transistor (TFT) technologies. In some embodiments, the
substrate 110 may have the electric resistance less than 10.sup.3
ohm-meter.
[0015] In some embodiments, the substrate 110 may also include
other material layers or circuit patterns formed thereover. For
example, the substrate 110 may further include one or more material
layers to be patterned (by etching to remove or ion implantation to
introduce dopants), such as a gate material stack to be patterned
to form gates; or a semiconductor material to be patterned to form
isolation trenches. In other embodiments, multiple semiconductor
material layers, such as gallium arsenic (GaAs) and aluminum
gallium arsenic (AlGaAs), are epitaxially grown on the substrate
110 and are patterned to form various devices, such as
light-emitting diodes (LEDs). In some other embodiments, the
substrate 110 includes fin active regions and three dimensional fin
field-effect transistors (FinFETs) formed or to be formed thereon.
The substrate 110 may include various doped features formed
therein, such as doped well structure (e.g., a P-typed doped well
and an N-type doped well).
[0016] In some embodiments, the dielectric layer 120 to be
patterned is formed on the substrate 110. The dielectric layer 120
is patterned to form trenches for conductive lines or holes for
contacts or vias, for example. In some embodiments, the dielectric
layer 120 may be a low-k dielectric layer having a k value lower
than 4, for example. In some embodiments, the dielectric layer 120
is a material such as, a fluorine-doped silicon dioxide, a
carbon-doped silicon dioxide, a porous silicon dioxide, a porous
carbon-doped silicon dioxide, a porous SiLK, a spin-on silicone
based polymeric dielectric, or a spin-on organic polymeric
dielectric.
[0017] Referring to FIG. 1B, the under layer 140 is formed over the
dielectric layer 120. In some embodiments, a tri-layer photoresist,
for example, is formed over the dielectric layer 120, and the
tri-layer photoresist includes the under layer 140, a middle layer
150 over the under layer 140 and a patterned photoresist layer 160
over the middle layer 150. The under layer 140 may function as a
hard mask to transfer a pattern to the dielectric layer 120. The
under layer 140 may have a density higher than the BARC layer.
Existing under layer is hard to remove, and the existing wet
etching process is not effective to remove the under layer. A dry
etching process is applied, but the dry etching process likely
damages the dielectric layer or the substrate directly
therebeneath. The disclosed method and the material of the under
layer 140 are designed such that the under layer 140 is able to be
effectively removed by mild wet condition without damage to the
material layer therebeneath.
[0018] In some embodiments, as shown in FIGS. 1A and 1B, the
formation of the under layer 140 includes spin-on coating a layer
of an under layer composition 130 and curing the layer of the under
layer composition 130. The under layer composition 130 used in the
above-described process is further explained in association with
FIG. 2A. Referring to FIG. 2A, the under layer composition 130
includes a polymeric material and a cross-linker 136. The polymeric
material includes a plurality of polymers 134 which are not
crosslinked with each other. Each polymer 134 includes a reaction
group (R1) 134a that provides a crosslinking site and thus is
capable of reacting to the cross-linker 136. Each polymer 134 may
include at least one backbone unit containing carbon, hydrogen and
oxygen. The backbone units can be repeated and/or combined. In some
embodiments, the reaction group (R1) 134a may be selected from the
group consisting of a hydroxyl group, an alkoxyl group having a
carbon number less than 6, an amine group, a thiol group, a ester
group, an alkene group, an alkyne group, an epoxy group, an
aziridine group, an oxetane group, an aldehyde group, a ketone
group, and a carboxylic acid group.
[0019] The cross-linker 136 is an organic cross-linker, for
example. In some embodiments, the cross-linker 136 includes an
aromatic structure, an aliphatic structure, a cycloalkyl structure,
or a combination thereof. The cross-linker 136 includes at least
one crosslinkable functional group (R2) 138a and at least one
decomposable functional group (R3) 138b. In some embodiments, the
crosslinkable functional group (R2) 138a and the decomposable
functional group (R3) 138b are directly bonded.
[0020] The crosslinkable functional group (R2) 138a is capable of
crosslinking with the reaction group (R1) 134a of the polymer 134
in the polymeric material. In some embodiments, the crosslinkable
functional group (R2) 138a may be selected from the group
consisting of a hydroxyl group, an alkoxyl group having a carbon
number less than 6, an amine group, a thiol group, a ester group,
an alkene group, an alkyne group, an epoxy group, an aziridine
group, an oxetane group, an aldehyde group, a ketone group, and a
carboxylic acid group.
[0021] The decomposable functional group (R3) 138b has weak
chemical stability and thus is capable of being decomposed under a
weak acid or base condition such as pH 4.about.10. In some
embodiments, the decomposable functional group (R3) 138b may be
selected from the group consisting of an ester group, an ether
group, a silyl ether group, an acetal group, a ketal group, an
amide group, an imine group, an imide group, and a carbamate
group.
[0022] In some embodiments, the under layer composition 130 may be
substantially free of silicon. The under layer composition 130 may
include a photoresist (or resist) that is either a positive-type or
negative-type. In some embodiments, the under layer composition 130
may further include an additives and/or a dye. The additive may
include various chemicals designed to modify the characteristics
and enhance of the performance of the under layer composition 130.
In some embodiments, the additives include surfactant,
fluoro-containing groups, or both. The dye is sensitive to light
and is able to modify the characteristics (such as refractive index
n and extinction coefficient .kappa.) of the under layer 140. In
some embodiments, the under layer composition 130 also includes
solvent when it is disposed over the substrate 110. In various
example, the solvent includes isopropyl alcohol (IPA), propylene
glycol methyl ether (PGEE), propylene glycol monomethyl ether
acetate (PGMEA), H.sub.2O, ether, alcohol, ketone, or ester.
[0023] After coating on the dielectric layer 120, a curing process
is performed on the layer of the under layer composition 130, so as
to form the under layer 140. During the curing process, the
polymers 134 and the cross-linker 136 interact with each other to
form the under layer 140 as illustrated in FIG. 2B. In detail, each
crosslinkable functional group (R2) 138a of the cross-linker 136 is
chemically bonded to the crosslinking site of the polymer 134, and
thus the polymers 134 are crosslinked to form a crosslinked
polymeric material. It is noted that as shown in FIG. 2B, the
formed under layer 140 has the decomposable functional group (R3)
138b derived from the cross-linker 136. In some embodiments, the
decomposable functional group (R3) 138b is exposed. Interactions
between the polymer 134 and the cross-linker 136 may be represent
as R1+R2-R3.fwdarw.R1'-R2'-R3. For example, when one of R1 and R2
is --OH and the other is --OMe, R1'-R2' is --O--, and the byproduct
is MeOH. Similarly, when one of R1 and R2 is --COOMe and the other
is --NH.sub.2, R1'-R2' is --CO--NH--, and the byproduct is MeOH, or
when R1 and R2 are --SH, R1'-R2' is --S--S--, and the byproduct is
H.sub.2. The curing process may contain at least one of a thermal
treatment, a photo treatment, and an irradiation treatment. The
curing temperature (crosslinking temperature) of the thermal
treatment ranges between about 100.degree. C. and 400.degree. C.,
such as between about 200.degree. C. and 300.degree. C. In one
embodiment, the curing temperature may be about 250.degree. C., for
example. The photo treatment may be performed with a light of a
wavelength ranging from about 10 nm to 1000 nm, such as 170 nm to
250 nm.
[0024] Referring to FIG. 1B, after performing the curing process,
the under layer 140 is formed over the substrate 110. In some
embodiments, the under layer 140 is formed directly on the
dielectric layer 120. The under layer 140 may have a thickness
ranging between 100 angstroms and 9000 angstroms. For example, the
thickness of the under layer 140 can be about 500 angstroms. In
another embodiment, the under layer 140 has a thickness ranging
between about 1000 angstroms and 3500 angstroms. Further, the under
layer 140 may have other parameters that fall within selected
ranges. For example, the under layer 140 has a refractive index in
a range between about 1 and 3, and an extinction coefficient
(absorption value) .kappa. in a range between about 0.01 and 1.0.
Alternatively, the under layer 140 may have a refractive index of
about 1.5 and an extinction coefficient of about 0.35.
[0025] Referring to FIG. 1B, a middle layer 150 is formed over the
under layer 140. The middle layer 150 may be a silicon-containing
layer designed to provide etch selectivity from the under layer
140. In some embodiments, the middle layer 150 functions an etch
mask to transfer a pattern to the under layer 140. In alternative
embodiments, the middle layer 150 is also designed to function as a
bottom anti-reflective coating that reduces reflection during a
lithography exposure process, thereby increasing the imaging
contrast and enhancing the imaging resolution. In some embodiments,
the formation of the middle layer 150 includes spin-on coating and
curing (such as a thermal treatment with a suitable baking
temperature). In some embodiments, the middle layer 150 includes a
silicon-containing organic polymer. The silicon-containing organic
polymer may be crosslinked. In alternative embodiments, the middle
layer 150 may include a silicon-containing inorganic polymer. For
example, the inorganic polymeric material may include silicon
oxide, silicon nitride or silicon oxynitride. The middle layer 150
may include pure silicon such as polycrystalline silicon or silicon
oxide. For example, the middle layer 150 may include spin-on glass
(SOG) known in the art. The middle layer may include a
metal-containing organic polymer material that contains metal such
as titanium, titanium nitride, aluminum, and tantalum. The middle
layer 150 may have a thickness ranging between about 100 and 1000
angstroms, or alternatively a range between about 150 and 300
angstroms.
[0026] Referring to FIG. 1B, a patterned photoresist layer 160 is
then formed over the middle layer 150. In some embodiments, the
patterned photoresist layer 160 includes at least one opening, such
that portion of the middle layer 150 is uncovered within the
opening, for example. The opening of the patterned photoresist
layer 160 is configured according to a predetermined pattern. The
patterned photoresist layer 160 may have a thickness ranging
between about 50 angstroms and 5000 angstroms. Alternatively, the
patterned photoresist layer 160 may have a thickness ranging
between about 500 angstroms and 3000 angstroms, or ranging between
about 1000 angstroms and 1500 angstroms. The patterned photoresist
layer 160 can be a positive-type resist or a negative-type resist.
For advanced semiconductor patterning using an extreme ultraviolet
(EUV) radiation beam, the patterned photoresist layer 160 may use a
chemical amplification (CA) resist. The patterned photoresist layer
160 is formed by a lithography process that may include processing
steps of resist coating, soft baking, mask aligning, exposing,
post-exposure baking, developing, and hard baking. For
illustration, the exposing process may be carried out by exposing
the semiconductor device under a radiation beam through a mask
having a predefined pattern (or a reversed pattern). The radiation
beam may be ultraviolet (UV) or EUV, such as a 248 nm beam from a
Krypton Fluoride (KrF) excimer laser, or a 193 nm beam from an
Argon Fluoride (ArF) excimer laser. The lithography process may
utilize other exposing modes or technologies, such as on-axis,
off-axis, quadripole, or dipole exposure technologies. The
lithography patterning may alternatively be implemented or replaced
by other proper methods such as maskless lithography, electron-beam
writing, ion-beam writing, and molecular imprint techniques. The
patterned photoresist layer 160 may include acid molecular or
radiation-sensitive acid generator, such that acid can be generated
when a radiation beam is applied. The patterned photoresist layer
160 may be further processed using a hardening process. The
hardening process may include plasma treatment, ultraviolet (UV)
curing, ion implant bombard, e-beam treatment, or combinations
thereof.
[0027] Referring to FIGS. 1C-1E, in some embodiments, a pattern of
the under layer 140 is transferred to the dielectric layer 120.
First, as shown in FIG. 1C, an etching process is applied to the
middle layer 150 using the patterned photoresist layer 160 as an
etch mask, thereby transferring the pattern from the patterned
photoresist layer 160 to the middle layer 114. In some embodiments,
the etching process may include dry etching, wet etching or a
combination thereof. In the present example, the dry etching
process includes a plasma etching process using an etchant having
fluorine, such as CF.sub.2, CF.sub.3, CF.sub.4, C.sub.2F.sub.2,
C.sub.2F.sub.3, C.sub.3F.sub.4, C.sub.4F.sub.4, C.sub.4F.sub.6,
C.sub.5F.sub.6, C.sub.6F.sub.6, C.sub.6F.sub.8, or a combination
thereof. The wet etching may be a buffered hydrofluoric acid (BHF)
wet etch to etch silicon dioxide in various examples.
[0028] Referring to FIGS. 1C and 1D, after the middle layer 150 is
patterned by the etching process, the patterned photoresist layer
160 is removed. The patterned photoresist layer 160 may be removed
by a proper technique, such as wet stripping or plasma ashing.
[0029] Referring to FIG. 1D, an etching process is applied to the
under layer 140 using the patterned middle layer 150 as an etch
mask, thereby transferring the pattern from the patterned middle
layer 150 to the under layer 140. In some embodiments, the etching
process may include dry etching, wet etching or a combination
thereof, with an etchant selectively etching the under layer 140
while the middle layer 150 substantially survives. For example, if
the middle layer 150 is a silicon-containing material while the
under layer 140 is a silicon-free material, the etching selectivity
can be achieved through proper choice of the etchant. The etching
process may include a plasma etching process using an etchant
having a sulfur-containing gas and an oxygen-containing gas. In one
example, the oxygen-containing gas includes oxygen (O.sub.2). In
one example, the sulfur-containing gas includes carbonyl sulfide
(COS). In another example, the sulfur-containing gas includes
sulfur dioxide (SO.sub.2).
[0030] Referring to FIGS. 1D and 1E, after the under layer 140 is
patterned by the etching process, the patterned middle layer 150
may be removed by a proper technique. In some embodiments, the
patterned middle layer 150 may be removed by dry etching, wet
etching such as using sulfuric peroxide mixture (SPM), ammonia
peroxide mixture (APM or SC-1), a diluted hydrofluoric acid (DHF)
or a combination thereof. In alternative embodiments, through
proper choice of the etchant based on the material of the patterned
photoresist layer 160 and the patterned middle layer 150, the
patterned photoresist layer 160 and the patterned middle layer 150
may be removed concurrently.
[0031] Referring to FIG. 1E, an etching process is applied to the
dielectric layer 120 using the patterned under layer 140 as an etch
mask, thereby transferring the pattern from the patterned under
layer 140 to the dielectric layer 120. The etching process is dry
etching, wet etching, or a combination thereof.
[0032] Referring to FIGS. 1F and 2C, the under layer 140 is removed
under a condition of pH 4.about.10. As shown in FIG. 2C, under a
condition of pH 4.about.10 as using a wet solution, the
decomposable functional group (R3) 138b of the crosslinked
polymeric material is decomposed, and thus the crosslinked polymers
134 are decrosslinked. Accordingly, the under layer 140 is easily
stripped. Decomposition of the decomposable functional group (R3)
138b involves a bond cleavage (bond broken), and may be represent
as R1'-R2'-R3.fwdarw.R1'-R2''+R3'. For example, R3 is --COO, and
R3' is --COOH. The bond may be broken by hydrolysis, but the
disclosure is not limited thereto. Since the decrosslinked
polymeric material has a smaller size than the crosslinked
polymeric material, the wet solution not only weakens the structure
of the under layer 140 but removes the under layer 140. In some
embodiments, pH of the condition is about 4, 5, 6, 7, 8, 9, 10,
including any range between any two of the preceding values. In
some embodiments, the wet solution is a weak acid or base solution,
and includes base or acid solute in a solvent. The solvent may be
an organic solvent, water or a combination thereof. In the combined
solvents, amount of the organic solvent is less than 50%, and
amount of water is larger than 50%, for example. In some
embodiments, the wet solution has pH 6.about.8. A temperature of
the wet solution ranges from room temperature to 70.degree. C. In
one embodiment, pH of the wet solution is about 8, and the
temperature of the wet solution is about 50.degree. C. In addition,
the wet solution has at least 70% water.
[0033] For a better understanding of the embodiments of the
disclosure, an example of the under layer composition is
illustrated in FIG. 3A, and FIGS. 3B and 3C respectively show an
under layer formed by the under layer composition of FIG. 3A and
the under layer of FIG. 3B under a condition of pH 4.about.10.
Referring to FIG. 3A, the under layer composition 130 includes a
plurality of polymers 134 and a cross-linker 136. In the present
embodiment, the reaction group 134a is a hydroxyl group (--OH), the
crosslinkable functional group 138a is an epoxy group, and the
decomposable functional group 138b is a carboxyl group (--COO).
Referring to FIG. 3B, after the curing process, --O-- bond is
formed to crosslink the polymers 134 and the cross-linker 136, and
thus the under layer 140 has a crosslinked polymeric material.
Referring to FIG. 3C, under a condition of pH 4.about.10, the
decomposable functional group 138b is decomposed, and thus the
crosslinked polymeric material is decrosslinked to form a plurality
of polymers 134.
[0034] In some embodiments, the under layer has a crosslinked
polymeric material with a decomposable functional group, which is
derived from the cross-linker and has a weak chemical stability.
Therefore, under a condition of pH 4.about.10 such as using a mild
wet solution, the decomposable functional group is decomposed and
the crosslinked polymeric material is decrosslinked. Accordingly,
the under layer is easily removed by the mild wet solution. In
addition, compared with the dry etching process, since the under
layer is removed under a mild wet solution, damage to the material
layer such as a low-k dielectric layer beneath the under layer is
prevented. Thus, the reliability or performance of the
semiconductor device is improved.
[0035] In accordance with some embodiments of the present
disclosure, an under layer composition includes a polymeric
material and a cross-linker. The polymeric material includes at
least one reaction group. The cross-linker includes at least one
crosslinkable functional group and at least one decomposable
functional group, the at least one crosslinkable functional group
is capable of crosslinking with the at least one reaction group of
the polymeric material, and the decomposable functional group is
capable of being decomposed under a condition of pH 4.about.10.
[0036] In accordance with some embodiments of the present
disclosure, a method of manufacturing a semiconductor device
includes at least the following steps. A layer of an under layer
composition is formed, wherein the under layer composition includes
a polymeric material and a cross-linker, and the cross-linker
includes at least one decomposable functional group. A curing
process is performed on the layer of the under layer composition to
form an under layer, wherein the cross-linker is crosslinked with
the polymeric material to form a crosslinked polymeric material
having the at least one decomposable functional group. A patterned
photoresist layer is formed over the under layer. An etching
process is performed to transfer a pattern of the patterned
photoresist layer to the under layer. The under layer is removed by
decomposing the decomposable functional group.
[0037] In accordance with some embodiments of the present
disclosure, a method of manufacturing a semiconductor device
includes at least the following steps. An under layer is formed
over a dielectric layer, wherein the under layer includes a
crosslinked polymeric material including at least one decomposable
functional group. A patterned photoresist layer is formed over the
under layer. A first etching process is performed to transfer a
pattern of the patterned photoresist layer to the under layer. A
second etching process is performed to transfer the pattern to the
dielectric layer by using the under layer as a mask. The under
layer is removed by decrosslinking the crosslinked polymeric
material through the at least one decomposable functional
group.
[0038] The foregoing outlines features of several embodiments so
that those skilled in the art may better understand the aspects of
the present disclosure. Those skilled in the art should appreciate
that they may readily use the present disclosure as a basis for
designing or modifying other processes and structures for carrying
out the same purposes and/or achieving the same advantages of the
embodiments introduced herein. Those skilled in the art should also
realize that such equivalent constructions do not depart from the
spirit and scope of the present disclosure, and that they may make
various changes, substitutions, and alterations herein without
departing from the spirit and scope of the present disclosure.
* * * * *