U.S. patent application number 15/463795 was filed with the patent office on 2018-09-20 for tight integrated vertical transistor dual diode structure for electrostatic discharge circuit protector.
The applicant listed for this patent is INTERNATIONAL BUSINESS MACHINES CORPORATION. Invention is credited to Karthik Balakrishnan, Bahman Hekmatshoartabari, Alexander Reznicek, Jeng-Bang Yau.
Application Number | 20180269197 15/463795 |
Document ID | / |
Family ID | 63491170 |
Filed Date | 2018-09-20 |
United States Patent
Application |
20180269197 |
Kind Code |
A1 |
Balakrishnan; Karthik ; et
al. |
September 20, 2018 |
TIGHT INTEGRATED VERTICAL TRANSISTOR DUAL DIODE STRUCTURE FOR
ELECTROSTATIC DISCHARGE CIRCUIT PROTECTOR
Abstract
An electric static discharge (ESD) diode pair is disclosed. The
first diode of the device includes a first diode junction portion
having vertically orientated and horizontally oriented portions of
a first conductivity and a second diode junction portion of a
second conductivity in direct contact with both of the vertically
orientated and horizontally orientated portions of the first diode
junction portion. The second diode of the device includes a first
diode junction portion having vertically orientated and
horizontally oriented portions of a second conductivity and a
second diode junction portion having a first conductivity in direct
contact with both of the vertically orientated and horizontally
orientated portions of the first diode junction portion. A common
electrical contact is in direct contact first diode junction
portion for each of the first diode and the second diode.
Inventors: |
Balakrishnan; Karthik;
(White Plains, NY) ; Hekmatshoartabari; Bahman;
(White Plains, NY) ; Reznicek; Alexander; (Troy,
NY) ; Yau; Jeng-Bang; (Yorktown Heights, NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
Armonk |
NY |
US |
|
|
Family ID: |
63491170 |
Appl. No.: |
15/463795 |
Filed: |
March 20, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 29/8613 20130101;
H01L 29/0649 20130101; H01L 29/861 20130101; H01L 29/0684 20130101;
H01L 29/7827 20130101; H01L 29/45 20130101; H01L 29/456 20130101;
H01L 29/66204 20130101; H01L 29/20 20130101; H01L 29/16 20130101;
H01L 27/0255 20130101; H01L 29/0688 20130101; H01L 29/66136
20130101; H01L 29/0692 20130101 |
International
Class: |
H01L 27/02 20060101
H01L027/02; H01L 29/06 20060101 H01L029/06; H01L 29/16 20060101
H01L029/16; H01L 29/45 20060101 H01L029/45; H01L 29/66 20060101
H01L029/66; H01L 29/861 20060101 H01L029/861; H01L 29/78 20060101
H01L029/78 |
Claims
1. An electrical device comprising: a first region of a substrate
and a second region of the substrate; a first diode in the first
region of the substrate, the first diode including a first diode
junction portion having vertically orientated and horizontally
orientated portions of a first conductivity and a second diode
junction portion of a second conductivity in direct contact with
both of the vertically orientated and horizontally orientated
portions of the first diode junction portion; a second diode in the
second region of the substrate, the second diode including a first
diode junction portion having vertically orientated and
horizontally orientated portions of the second conductivity and a
second diode junction portion having the first conductivity in
direct contact with both of the vertically orientated and
horizontally orientated portions of the first diode junction
portion; and a common electrical contact is in direct contact with
the first diode junction portion for each of the first diode and
the second diode.
2. The electrical device of claim 1, wherein the electrical device
is an electrostatic device of a diode pair.
3. The electrical device of claim 1, wherein the horizontally
orientated portion of the first diode junction portion for the
first diode is present on an upper surface of the substrate, and
the horizontally orientated portion of the first diode junction
portion for the second diode is present on a upper surface, the
horizontally orientated portion of the first diode junction portion
for the first diode being separated from the horizontally
orientated portion of the first diode junction portion for the
second diode by a shallow trench isolation (STI) region.
4. The electrical device of claim 3, wherein a counter doped layer
is present underlying each of the horizontally orientated portion
of the first diode junction portion for the first diode and the
horizontally orientated portion of the first diode junction portion
for the second diode.
5. The electrical device of claim 1, wherein respective vertically
orientated portions for the first diode junction portion of the
first and second diodes are composed of a semiconductor fin
structure.
6. The electrical device of claim 5, wherein the semiconductor fin
structure comprises a type IV semiconductor material.
7. The electrical device of claim 1, wherein the common electrical
contact is comprised of a metal containing material.
8. The electrical device of claim 7, wherein the common electrical
contact is present directly over an isolation region separating the
first region of the substrate from the second region of the
substrate.
9. The electrical device of claim 7 further comprising a first
contact to the second diode junction portion of the first diode,
and a second contact that is separate from the first contact to the
second diode junction portion of the second diode.
10. The electrical device of claim 9, wherein the first
conductivity type is p-type and the second conductivity type is
n-type.
11. The electrical device of claim 10, wherein the common
electrical contact is the input/output of the device, the first
contact is to the positive supply voltage (VSS) and the second
contact is to the ground (VDD).
12. An electronic device comprising: a first diode in a first
region of a substrate, the first diode including a first diode
junction portion having an L-shaped geometry with vertically
orientated portions and horizontally orientated portions having a
first conductivity type and a second diode junction portion having
a second conductivity type in contact with the first diode junction
portion having the L-shaped geometry and the first conductivity
type; a second diode in a second region of the substrate, the
second diode including a first diode junction portion having an
L-shaped geometry with vertically orientated and horizontally
orientated portions having the second conductivity type and a
second diode junction portion in contact with first diode junction
portion having the L-shaped geometry and the second conductivity
type; and a common electrical contact in direct contact with the
vertically orientated portions for the first diode having the first
conductivity type and the vertically orientated portions for the
second diode having the second conductivity type.
13. The electronic device of claim 12, wherein the common
electrical contact is present directly over an isolation region
separating the first region of the substrate from the second region
of the substrate.
14. The electronic device of claim 12 further comprising a first
contact connected to the second diode junction portion of the first
diode, and a second contact that is separate from the first contact
connected to the second diode junction portion of the second
diode.
15. The electronic device of claim 12, wherein the first
conductivity type is p-type and the second conductivity type is
n-type, and wherein the common electrical contact is an
input/output of the device, a first contact is to a positive supply
voltage (VSS) and a second contact is to a ground (VDD).
16. A method of forming an electric static discharge (ESD) diode
pair comprising: forming a first diode including a first diode
junction portion having vertically orientated and horizontally
orientated portions with a first conductivity type and a second
diode junction portion in direct contact with both of the
vertically orientated and horizontally orientated portions of the
first diode junction portion; forming a second diode in a second
region of the substrate, the second diode including a first diode
junction portion having vertically orientated and horizontally
orientated portions of a second conductivity type and a second
diode junction portion having a first conductivity type in direct
contact with both of the vertically orientated and horizontally
orientated portions of the first diode junction portion having the
second conductivity type; and forming a common electrical contact
in direct contact with the vertically orientated portions of the
first diode junction portions for the first and second diodes.
17. The method of claim 16, wherein fin structures that provide the
vertically orientated portions of the first diode junction portion
for the first and second diode are epitaxially formed.
18. The method of claim 17, wherein the fin structures for the
first and second diodes is separated by a pitch ranging from 25 nm
to 40 nm.
19. The method of claim 17 further comprising forming a first
contact connected to the second diode junction portion of the first
diode, and forming a second contact that is separate from the first
contact connected, the second contact connected to the second diode
junction portion of the second diode.
20. The method of claim 19, wherein the first conductivity type is
p-type and the second conductivity type is n-type, and wherein the
common electrical contact is an input/output of the ESD diode pair,
the first contact is to a positive supply voltage (VSS) and the
second contact is to a ground (VDD).
Description
BACKGROUND
Technical Field
[0001] The present disclosure relates to vertical transistors and
electrostatic discharge circuit protectors.
Description of the Related Art
[0002] Modern integrated circuits are made up of literally millions
of active devices such as transistors and memory devices. The
geometry of vertical transistors is attractive due to their
potential density with increased scaling requirements. Further
vertical transistors can allow for relaxed gate lengths to better
control electrostatics.
SUMMARY
[0003] In one embodiment, the methods and structures that are
described herein provide an electric static discharge (ESD) diode
pair using a vertical transistor compatible architecture and
process flow. In one embodiment, the electrical device includes a
first region of a substrate and a second region of the substrate. A
first diode is present in a first region of the substrate, the
first diode including a first diode junction portion having
vertically orientated and horizontally oriented portions of a first
conductivity and a second diode junction portion of a second
conductivity in direct contact with both of the vertically
orientated and horizontally orientated portions of the first diode
junction portion. A second diode is present in a second region of
the substrate, the second diode including a first diode junction
portion having vertically orientated and horizontally oriented
portions of a second conductivity and a second diode junction
portion having a first conductivity in direct contact with both of
the vertically orientated and horizontally orientated portions of
the first diode junction portion. A common electrical contact is in
direct contact first diode junction portion for each of the first
diode and the second diode.
[0004] In another embodiment, the electrical device includes a
first region of a substrate and a second region of the substrate. A
first diode is present in a first region of the substrate, the
first diode including a first diode junction portion having an
L-shaped geometry with vertically orientated portions and
horizontally orientated portions having a first conductivity type
and a second diode junction portion having a second conductivity
type in contact with the first diode junction portion having the
L-shaped geometry and the first conductivity type. A second diode
is present in a second region of the substrate, the second diode
including a first diode junction portion having an L-shaped
geometry with vertically orientated and horizontally oriented
portions having a second conductivity type and a second diode
junction portion in contact with first diode junction portion
having the L-shaped geometry and the second conductivity type. A
common electrical contact is in direct contact with the vertically
oriented portions having the first conductivity type and the second
conductivity type for the first and second diodes.
[0005] In another aspect, a method of forming an electric static
discharge (ESD) diode pair is described herein that uses a vertical
transistor architecture and vertical transistor process flow. In
one embodiment, the method may include forming a first diode
including a first diode junction portion having vertically
orientated and horizontally oriented portions with a first
conductivity type and a second diode junction portion in direct
contact with both of the vertically orientated and horizontally
orientated portions of the first diode junction portion. A second
diode may be formed in a second region of the substrate, the second
diode including a first diode junction portion having vertically
orientated and horizontally oriented portions of a second
conductivity type and a second diode junction portion having a
first conductivity type in direct contact with both of the
vertically orientated and horizontally orientated portions of the
first diode junction portion having the second conductivity type. A
common electrical contact is formed in direct contact with the
vertically oriented portions of the first diode junction portions
for the first and second diodes.
[0006] These and other features and advantages will become apparent
from the following detailed description of illustrative embodiments
thereof, which is to be read in connection with the accompanying
drawings.
BRIEF DESCRIPTION OF DRAWINGS
[0007] The disclosure will provide details in the following
description of preferred embodiments with reference to the
following figures wherein:
[0008] FIG. 1 is a circuit diagram of one embodiment of a circuit
diode pair.
[0009] FIG. 2 is a circuit diagram of one embodiment of a plurality
of electrostatic discharge (ESD) diode pairs in an electrical
device circuit.
[0010] FIG. 3A is a side cross-sectional view of one embodiment of
an electrostatic discharge (ESD) diode pair that includes a
vertical transistor architecture, in accordance with one embodiment
of the present disclosure.
[0011] FIG. 3B is a top down view of the structure depicted in FIG.
3A, in which the structure depicted in FIG. 3A is along section
line A-A of FIG. 3B.
[0012] FIG. 4 is a side cross-sectional view depicting one
embodiment of an initial material stack used in forming an
electrostatic discharge (ESD) diode pair, in accordance with the
present disclosure.
[0013] FIG. 5 is a side cross-sectional view depicting one
embodiment of processing the structure depicted in FIG. 4 to
provide a first region for a first diode and a second region for a
second diode, in accordance with present disclosure.
[0014] FIG. 6 is a side cross-sectional view depicting one
embodiment of forming a material stack on the structure depicted in
FIG. 5.
[0015] FIG. 7 is a side cross-sectional view depicting one
embodiment of forming fin structures.
[0016] FIG. 8 is side cross-sectional view depicting one embodiment
of removing a portion of the material stack to expose a doped
surface within the first region of the substrate, while the
material layers within the second region of the substrate are
protected with a block mask.
[0017] FIG. 9 is a side cross-sectional view depicting one
embodiment of epitaxially forming a doped semiconductor material
for a portion of the first diode in the first region of the
substrate.
[0018] FIG. 10 is a side cross-sectional view depicting one
embodiment of epitaxially forming a doped semiconductor material
for a portion of the second diode in the second region of the
substrate
[0019] FIG. 11 is a side cross-sectional view depicting one
embodiment of removing a portion of the material stack that is
present between the adjacent fin structures to provide a trench
opening for forming the common electrical contact.
[0020] FIG. 12 is a side cross-sectional view depicting one
embodiment of forming the common electrical contact to the fin
structures in the first and second regions of the substrate.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0021] Detailed embodiments of the claimed structures and methods
are disclosed herein; however, it is to be understood that the
disclosed embodiments are merely illustrative of the claimed
structures and methods that may be embodied in various forms. In
addition, each of the examples given in connection with the various
embodiments are intended to be illustrative, and not restrictive.
Further, the figures are not necessarily to scale, some features
may be exaggerated to show details of particular components.
Therefore, specific structural and functional details disclosed
herein are not to be interpreted as limiting, but merely as a
representative basis for teaching one skilled in the art to
variously employ the methods and structures of the present
disclosure. For purposes of the description hereinafter, the terms
"upper", "lower", "right", "left", "vertical", "horizontal", "top",
"bottom", and derivatives thereof shall relate to the embodiments
of the disclosure, as it is oriented in the drawing figures. The
terms "present on" means that a first element, such as a first
structure, is present on a second element, such as a second
structure, wherein intervening elements, such as an interface
structure, e.g. interface layer, may be present between the first
element and the second element. The term "direct contact" means
that a first element, such as a first structure, and a second
element, such as a second structure, are connected without any
intermediary conducting, insulating or semiconductor layers at the
interface of the two elements.
[0022] The term "conductivity type" when used to describe a region
or a material denotes that the semiconductor material or the
semiconductor material within the region being referred has been
doped to an n-type or p-type conductivity. As used herein, "P-type"
refers to the addition of impurities to an intrinsic semiconductor
that creates deficiencies of valence electrons, such as the
addition of boron, aluminum, or gallium to a type IV semiconductor,
such as silicon. As used herein, "N-type" refers to the addition of
impurities to an intrinsic semiconductor that contribute free
elections, such as the addition of antimony, arsenic, or
phosphorous to a type IV semiconductor, such as silicon.
[0023] With increasing scaling for next generation semiconductor
devices, vertical field effect transistors (vFETs) have become
increasingly attractive. For example, vertical FET devices are
attractive for 5 nm device architecture due to sub-30 nm fin pitch
and since they are not constrained by the contact poly pitch (CPP)
and gate width scaling. Vertical transistors are attractive
candidates for 5 nm node and beyond due to their potential of
better density scaling and allowing relaxed gate lengths to better
control the electrostatics.
[0024] It has been determined that fabricating a high-density,
integrated diode pair with minimal changes to the VFET process flow
can be useful for electrostatic discharge (ESD) applications. The
methods and structures described herein provide an ESD diode pair
using a vertical transistor-compatible architecture and process
flow. This enables savings in the area occupied by the device on a
substrate, which may be referred to as foot print savings, in
comparison to planar device orientations. A circuit diagram for an
ESD diode pair 200 is provided in FIG. 1. The savings in space
provided by the vertically orientated device elements that are
provided by the vertical transistor-compatible architecture and
process flow is especially advantageous for devices that include
multiple ESD protecting devices 205, as illustrated in the circuit
diagram depicted in FIG. 2.
[0025] In some embodiments, the methods and structures described
herein also can provide for space saving in the back end of the
line (BEOL) wiring by providing at least some connections to the
diodes in the front end of the line (FEOL) level. In some
embodiments, the use of a cut mask to create a shallow trench
isolation (STI) region in the ESD diode composed of two vertically
orientated transistor like devices enables a tight pitch between
the fin structures within the ESD diode. The diode pair of the ESD
device is integrated back to back using a contact similar to a gate
conductor produced using a vertically orientated field effect
transistor (VFET) process flow. This reduces the amount of
electrical contacts that need to be produced during back end of the
line processing, which in turn can reduce the foot print of the
device. Some embodiments of structures disclosed herein, are now
described in more detail with reference to FIGS. 3A-3B.
[0026] Referring to FIGS. 3A and 3B, in some embodiments, the
methods and structures that are described herein provide an
electric static discharge (ESD) diode pair 100 using a vertical
transistor compatible architecture. The electrical device may
include a first region 90 of a substrate 10 including a first diode
50a, and a second region 95 of the substrate 10 including a second
diode 50b. The first diode 50a includes a first diode junction
portion 20a, 25a having an L-shaped geometry with vertically
orientated portions 25a and horizontally orientated portions 20a
having a first conductivity type, and a second diode junction
portion 45a in direct contact with both of the vertically
orientated and horizontally orientated portions 20a, 25a of the
first diode junction portion. In one embodiment, the first diode
junction portion 20a, 25a of the first diode 50a has a conductivity
type, i.e., first conductivity type, that is n-type; and the second
diode junction portion 45a of the first diode 50a is p-type, i.e.,
the second conductivity type is p-type.
[0027] The term "L-shaped" geometry denotes a side-cross sectional
geometry of the first diode junction portions 20a, 20b, 25a, 25b
for the first and second diode 50a, 50b when view along section
line A-A of FIG. 3B. An end portion of the vertically orientated
portions 25a, 25b are in direct contact with an end portion of the
horizontally orientated portions 20a, 20b.
[0028] The first diode junction portion 20a, 25a having the first
conductivity type, and the second diode junction portion 45a having
the second conductivity type may provide a first p-n junction for
the first diode 50a. In the embodiment depicted in FIG. 3A, the
p-type second conductivity portion 45a is in direct contact with
the ground contact (VSS) or 0 volt supply; and the n-type first
conductivity portions 20a, 25a is in direct contact with the
input/output contact, which is a common contact to both the first
diode 50a and the second diode 50b.
[0029] Referring to FIGS. 3A and 3B, the second diode 50b that is
present in the second region 95 of the substrate may include a
first diode junction portion 20b, 25b having an L-shaped geometry
with a vertically orientated portion 25b and horizontally oriented
portion 20b each having a second conductivity type, and a second
diode junction portion 45b having a second conductivity type that
is in direct contact with both of the vertically orientated and
horizontally orientated portions of the first junction diode
portion 20b, 25b of the second diode 50b In one embodiment, the
first diode junction portion 20b, 25b of the second diode 50b has a
second conductivity type that is p-type; and the second junction
diode portion 45b of the second diode 50b has a first conductivity
type that is n-type.
[0030] The first diode junction portion 20b, 25b having the second
conductivity type, and the second diode junction portion 45b having
the first conductivity type may provide a second p-n junction for
the second diode 50b. In the embodiment depicted in FIGS. 3A and
3B, the n-type second diode junction portion 45b is in direct
contact with the positive power supply contact (VDD); and the
p-type first diode junction portion 20b, 25b is in direct contact
with the input/output contact, which is a common contact to both
the first diode 50a and the second diode 50b.
[0031] Each of the first diode 50a and the second diode 50b may
each include a horizontally orientated portion 20a, 20b of the
first diode junction portion that may be provided by or deposited
upon an upper surface of a substrate 10 composed of a semiconductor
material. More specifically, the horizontally orientated portions
20a, 20b may be a semiconductor material layer that was an upper
surface of a semiconductor substrate that was doped, e.g., by ion
implantation; or was deposited atop a semiconductor substrate and
doped either by in situ doping or ion implantation or a combination
thereof.
[0032] In some embodiments, the horizontally orientated portion
20a, 20b of the first diode junction portion 20a, 20b, 25a, 25b for
each of the first and second diodes 50a, 50b is separated from the
supporting semiconductor substrate 10 by a counter doped region
15a, 15b. The term "counter doped" means that the counter doped
region 15a, 15b has an opposite conductivity type as the
horizontally orientated portion 20a, 20b of the first diode
junction portion 20a, 20b, 25a, 25b for each of the first and
second diodes 50a, 50b. For example, in the first device region 90,
when the horizontally orientated portion 20a is doped to an n-type
conductivity, the counter doped region 15a that is present in the
first region 90 has a p-type conductivity; and when the
horizontally orientated portion 20b that is present in the second
region 95 has a p-type conductivity, the counter doped region 15b
may have an n-type conductivity.
[0033] Although the supporting substrate 10 is depicted as a bulk
substrate, in other embodiments, the supporting substrate 10 may be
a semiconductor on insulator (SOI) substrate. As will be further
described below the horizontally orientated portion 20a, 20b of the
first diode junction portion 20a, 20b, 25a, 25b for each of the
first and second diodes 50a, 50b, and the counter doped regions
15a, 15b may be formed by ion implantation into the supporting
substrate 10 or epitaxial growth atop the supporting substrate
10.
[0034] The horizontally orientated portion 20a, 20b of the first
diode junction portion 20a, 20b, 25a, 25b for each of the first and
second diodes 50a, 50b, the counter doped regions 15a, 15b, and the
supporting substrate 10 may each be composed of a semiconductor
material, such as a type IV or type III-V semiconductor. Examples
of type IV semiconductors that are suitable for use as the base
material for the horizontally orientated portion 20a, 20b of the
first diode junction portion for each of the first and second
diodes 50a, 50b, the counter doped regions 15a, 15b, and the
supporting substrate 10 may include silicon (Si), crystalline
silicon (c-Si), monocrystalline silicon, germanium, silicon
germanium (SiGe), silicon doped with carbon (Si:C), silicon
germanium doped with carbon (SiGe:C) and a combination thereof, and
similar semiconductors, e.g., semiconductor materials including at
least one element from Group IVA (i.e., Group 14) of the Periodic
Table of Elements. Examples of type III-V materials can include
gallium arsenic (GaAs).
[0035] In some embodiments, when the horizontally orientated
portion 20a of the first diode junction portion 20a, 25a for the
first diode 50a is n-type, the n-type dopant may be present in a
concentration ranging from 1.times.10.sup.19 dopants/cm.sup.3 to
4.times.10.sup.20 dopants/cm.sup.3. In some embodiments, when the
horizontally orientated portion 20b of the second diode junction
portion 20b, 25b for the first diode 50b is p-type, the p-type
dopant may be present in a concentration ranging from
1.times.10.sup.17 dopants/cm.sup.3 to 1.times.10.sup.19
dopants/cm.sup.3.
[0036] Referring to FIGS. 3A and 3B, the first region 90 of the
substrate may be separated from the second region 95 of the
substrate by an isolation region 24, such as a shallow trench
isolation (STI) region. The isolation region 24 may be composed of
a dielectric material, such as an oxide, e.g., silicon oxide, or a
nitride, e.g., silicon nitride.
[0037] Each of the first and second diodes 50a, 50b may include a
vertically orientated portion 25a, 25b of the first diode junction
portion 20a, 25a, 20b, 25b for each device. The vertically
orientated portion 25a, 25b of the first diode junction portion
20a, 25a, 20b, 25b for each device may be provided by semiconductor
fin structure. Similar to the horizontally orientated portions 20a,
20b of the first diode junction portion 20a, 25b, 20b, 25b for each
of the diodes 50a, 50b, each of the semiconductor fin structures
may be composed of a semiconductor material, e.g., a type IV
semiconductor material, such as silicon or germanium, or a type
III-V semiconductor material, such as gallium arsenic (GaAs). The
semiconductor fin structures may have a height ranging from 10 nm
to 200 nm. In another embodiment, each of the fin structures has a
first height ranging from 20 nm to 100 nm. In one example, each of
the fin structures has a height ranging from 30 nm to 50 nm. Each
of fin structures may have a width ranging from 5 nm to 20 nm. In
another embodiment, each of the fin structures has a width ranging
from 6 nm to 12 nm. In one example, each fin structure has a width
that is equal to 8 nm. The pitch separating adjacent fin structures
may range from 10 nm to 50 nm. In another embodiment, the pitch
separating adjacent fin structures may range from 25 nm to 40 nm.
In one example, the pitch is equal to 30 nm. The pitch selected for
the adjacent fin structures may be less than the contacted gate
pitch, i.e., the pitch may be equal to a minimum non-contacted gate
pitch or less.
[0038] The semiconductor fin structure that provides the vertically
orientated portion 25a of the first diode junction portion 20a, 25a
of the first diode 50a typically has a same conductivity type as
the horizontally orientated portion 20a for the first diode
junction portion 20a, 25a. For example, when the horizontally
orientated portion 20a for the first diode junction portion 20a,
25a of the first diode 50b is n-type, the vertically orientated
portion 25a for the first diode junction portion 20a, 25a is
n-type. In some embodiments, when the vertically orientated portion
25a of the first diode junction portion 20a, 25a for the first
diode 50a is n-type, the n-type dopant may be present in a
concentration ranging from 1.times.10.sup.19 dopants/cm.sup.3 to
4.times.10.sup.20 dopants/cm.sup.3. For example, when the
horizontally orientated portion 20b for the first diode junction
portion 20b, 25b of the second diode 50b is p-type, the vertically
orientated portion 25b for the first diode junction portion 20b,
25b for the second diode 50b is p-type. In this example, the p-type
dopant may be present in a concentration ranging from
1.times.10.sup.17 dopants/cm.sup.3 to 1.times.10.sup.19
dopants/cm.sup.3.
[0039] The vertically orientated portion 25a, 25b of the first
diode junction portion 20a, 25a, 20b, 25b for each of the first and
second diodes 50a, 50b is in an epitaxially formed relationship
with the horizontally orientated portions 20a, 20b of the first and
second diodes 50a, 50b. For example, if the horizontally orientated
portions 20a, 20b have a monocrystalline crystal structure, the
vertically orientated portions 25a, 25b have a monocrystalline
crystal structure. For example, if the material compositions for
the vertical and horizontally orientated portions 20a, 20b, 25a,
25b are substantially similar, the lattice structure for the
vertically orientated portions 25a, 25b will substantially match
the lattice structure of the horizontally orientated portions 20a,
20b.
[0040] A common electrical contact 30 is in direct contact with the
vertically oriented portions 25a, 25b of the first diode junction
portion 20a, 20b, 25a, 25b for the first and second diodes 50a,
50b. The common electrical contact 30 is a single structure of an
electrically conductive material that is simultaneously in contact
with a portion of the first diode junction portion 20a, 25a, 20b,
25b for each of the first diode 50a and the second diode 50b. The
common electrical contact 30 may be composed of a metal or a doped
semiconductor, e.g., n-type doped polysilicon. The metal of the
common electrical contact 30 may be composed of TiAl, TaN, TiN,
HfN, HfSi, TiAlN, Ru, Pt, Mo, Co and alloys and combinations
thereof.
[0041] Still referring to FIGS. 3A and 3B, the common electrical
contact 30 may be separated from the STI 24, by a first dielectric
spacer 40 (which may be referred to as the bottom spacer) and a
second dielectric spacer 51 (which may be referred to as the top
spacer) may be formed atop the common electrical contact 30. Each
of the first and second dielectric spacer 40, 51 may be composed of
an oxide, such as silicon oxide, nitride, such as silicon nitride
or a combination thereof.
[0042] The second diode junction region 45a, 45b is present in
direct contact with the first diode junction portion 20a, 20b, 25a,
25b for each of the first diode 50a and the second diode 50b. The
second diode junction portion 45a, 45b typically has the opposing
conductivity type as the corresponding first diode junction portion
20a, 20b, 25a, 25b. For example, if the first diode junction
portion 20a, 25a for the first diode 50a is doped to an n-type
conductivity, the second diode junction portion 45a for the first
diode 50b is doped to a p-type conductivity. For example, if the
first diode junction portion 20b, 25b for the second diode 50b is
doped to a p-type conductivity, the second diode junction portion
45b for the second diode 50b is doped to an n-type
conductivity.
[0043] Similar to the first diode junction portion 20a, 20b, 25a,
25b, the second diode portion 45a, 45b may be composed of a
semiconductor material, e.g., a type IV semiconductor materials,
such as silicon (Si) or germanium (Ge), or a type III-V
semiconductor material, such as gallium arsenide (GaAs). In some
embodiments, the second diode portions 45a, 45b are formed using an
epitaxial deposition process atop an exposed surface of the
vertical orientated portions 25a, 25b and the horizontally
orientated portions 20a, 20b of the first diode junction portion
20a, 20b, 25a, 25b.
[0044] In some embodiments, when the second diode portions 45a, 45b
is n-type, the n-type dopant may be present in a concentration
ranging from 1.times.10.sup.19 dopants/cm.sup.3 to
4.times.10.sup.20 dopants/cm.sup.3. In some embodiments, when the
second diode portions 45a, 45b is p-type, the p-type dopant may be
present in a concentration ranging from 1.times.10.sup.17
dopants/cm.sup.3 to 1.times.10.sup.19 dopants/cm.sup.3.
[0045] Still referring to FIGS. 3A and 3B, the ESD diode pair
device 100 may also include a dielectric layer 46 encapsulating the
device, wherein via contacts 34a, 34b, 35 to the second extend
through the dielectric layer 46. Referring to FIG. 3B, in some
embodiments, a common via contact 35 extends through the dielectric
layer 46 to the common electrical contact 30 that is in direct
contact with the first diode junction portion 20a, 25a, 20b, 25b
for each of the first and second diodes 50a, 50b. In some
embodiments, a first via contact 34a is in direct contact with the
second diode junction portion 45a of the first diode 50a, and a
second via contact 34b is in direct contact with the second diode
junction portion 45b of the second diode 50b, in which the first
and second contact 34a, 34b are separate from one another. The
first via contact 34a is in direct contact with the ground contact
(VSS) or 0 (zero) volt supply; and the second via contact 34b in
direct contact with the positive power supply contact (VDD). Some
embodiments of methods for forming the structures depicted in FIGS.
3A and 3B are now described in greater detail with further
reference to FIGS. 4-12.
[0046] FIG. 4 depicts one embodiment of an initial material stack
used in forming an ESD diode pair device 100. In some embodiments,
the initial material stack includes a supporting substrate 10, a
counter doped layer 15a, and a material layer for provide the
horizontal portion 20a for the first diode junction portion 20a,
25a for the first diode 50a. The supporting substrate 10 has been
described above with reference to FIGS. 3A and B. The counter doped
layer 15a may be formed on the upper surface of the supporting
substrate 10 by ion implantation into the upper surface of the
supporting substrate 10 or by epitaxial growth in combination with
in situ doping or ion implantation. The counter doped layer 15a
depicted in FIG. 4 is processed to provide the counter doped layer
15a within the first region 90 of the structure depicted in FIGS.
3A and 3B. Therefore, in this example, the counter doped layer 15a
is doped to a p-type conductivity. The counter doped layer 15a may
have a thickness ranging from 5 nm to 50 nm. The material layer for
providing the first source/drain regions 20a may also be formed
using ion implantation or epitaxial growth in combination with ion
implantation or in situ doping. The material layer for providing
the horizontal portion 20a for the first diode junction portion
20a, 25a for the first diode 50a is typically doped to an n-type
conductivity. The thickness for the material layer for providing
the horizontal portion 20a for the first diode junction portion
20a, 25a for the first diode 50a typically has a thickness ranging
from 10 nm to 100 nm.
[0047] FIG. 5 depicts one embodiment the structure depicted in FIG.
4 following processing to provide a first region 90 and a second
region 95. An isolation region 24 is formed to isolate the first
region 90 from the second region 95. The isolation region 24 is
formed by etching a trench, e.g., by reactive ion etch, through the
material layers for the first counter doped layer 15a, and the
material layer for the horizontal portion 20a for the first diode
junction portion 20a, 25a for the first diode 50a into the
supporting substrate 10. The trench is then filled with a
dielectric material, such as an oxide, e.g., silicon oxide
(SiO.sub.2), or a nitride, such as silicon nitride. The deposition
process may be a chemical vapor deposition process.
[0048] Following formation of the isolation region 24, the portion
of the structure that provides the first region 90 may be protected
by forming an etch mask thereon, while the portions of the first
counter doped layer 15a and the material layer for the horizontal
portion 20a for the first diode junction portion 20a, 25a for the
first diode 50a that are exposed by the etch mask are removed from
the second region 95, e.g., via etch process. The etch mask may be
a photoresist mask that is patterned using photolithography. The
etch mask may also be provided by a hard mask, e.g., a mask
composed of a dielectric material layer, such as silicon nitride.
The etch process or removing the exposed portions of the first
counter doped layer 15a, and the material layer for the
horizontally orientated portion 20a of the first diode junction
portion that are present in the second region 95 may be removed by
an etch process, such as a selective etch process, e.g., an etch
process that is selective to the supporting substrate 10. In some
embodiments, the etch process may be an anisotropic etch process,
such as reactive ion etch.
[0049] Still referring to FIG. 4, the second counter doped layer
15a, and the material layer for providing the horizontally
orientated portion 20b of the first diode junction portion 20b, 25b
for the second diode 50b may be formed on the portion of the
supporting substrate 10 that is present in the second region 95. In
one embodiment, the second counter doped layer 15a is formed using
epitaxial growth. The terms "epitaxial growth and/or deposition"
and "epitaxially formed and/or grown," mean the growth of a
semiconductor material (crystalline material) on a deposition
surface of another semiconductor material (crystalline material),
in which the semiconductor material being grown (crystalline over
layer) has substantially the same crystalline characteristics as
the semiconductor material of the deposition surface (seed
material). In an epitaxial deposition process, the chemical
reactants provided by the source gases are controlled, and the
system parameters are set so that the depositing atoms arrive at
the deposition surface of the semiconductor substrate with
sufficient energy to move about on the surface such that the
depositing atoms orient themselves to the crystal arrangement of
the atoms of the deposition surface. Therefore, an epitaxially
grown semiconductor material has substantially the same crystalline
characteristics as the deposition surface on which the epitaxially
grown material is formed.
[0050] The epitaxially formed second counter doped layer 15a, and
the horizontally orientated portion 20b for the first diode
junction portion 20b, 25b of the second diode 50b can be a type IV
semiconductor containing material layer. For example, the
epitaxially formed in situ doped n-type semiconductor material 15b
and the horizontally orientated portion 20b for the first diode
junction portion 20b, 25b that is doped to a p-type conductivity
may be composed of silicon (Si), germanium (Ge), silicon germanium
(SiGe) and other semiconductor materials. The epitaxial deposition
process may employ the deposition chamber of a chemical vapor
deposition type apparatus, such as a PECVD apparatus. A number of
different sources may be used for the epitaxial deposition of the
in situ doped n-type semiconductor material and the p-type
semiconductor material for the material layers formed in the second
region 95. In some embodiments, the gas source for the deposition
of an epitaxially formed in situ doped n-type semiconductor
material and/or p-type semiconductor material may include silicon
(Si) deposited from silane, disilane, trisilane, tetrasilane,
hexachlorodisilane, tetrachlorosilane, dichlorosilane,
trichlorosilane, disilane and combinations thereof. In other
examples, when the in situ doped n-type or p-type semiconductor
material includes germanium, a germanium gas source may be selected
from the group consisting of germane, digermane, halogermane,
dichlorogermane, trichlorogermane, tetrachlorogermane and
combinations thereof. The temperature for epitaxial silicon
germanium deposition typically ranges from 450.degree. C. to
900.degree. C. Although higher temperature typically results in
faster deposition, the faster deposition may result in crystal
defects and film cracking.
[0051] The epitaxially formed second counter doped layer 15b, and
the material layer for providing the horizontally orientated
portion 20b for the first diode junction portion 20b, 25b of the
second diode 50b can each be doped using ion implantation or may be
doped in situ. By "in-situ" it is meant that the dopant that
dictates the conductivity type of the material layer is introduced
during the process step, e.g., epitaxial deposition, which forms
the material layer. As noted above, the second counter doped layer
15a is typically doped to an n-type conductivity. The n-type gas
dopant source may include arsine (A.sub.sH.sub.3), phosphine
(PH.sub.3). The horizontally orientated portion 20b for the first
diode junction portion 20b, 25b of the second diode 50b is
typically doped to a p-type conductivity. A p-type dopant, such as
borane and diborane gas, may be employed to in situ dope the p-type
semiconductor material.
[0052] The second counter doped layer 15b may have a thickness
ranging from 5 nm to 50 nm. The thickness of the material layer for
the horizontally orientated portion 20b for the first diode
junction portion 20b, 25b of the second diode 50b typically ranges
from 10 nm to 100 nm.
[0053] FIG. 6 depicts one embodiment of forming a material stack on
the structure depicted in FIG. 5. In some embodiments, the material
stack may include a first dielectric spacer layer that provides the
first spacer 40 (also referred to as bottom spacer), a sacrificial
structure layer 60, a second dielectric spacer layer 51 and a cap
dielectric layer 52. Each of the aforementioned layers may be
formed atop the structure depicted in FIG. 6 using a deposition
process, such as chemical vapor deposition (CVD), plasma enhanced
chemical vapor deposition (PECVD), metal organic chemical vapor
deposition (MOCVD), room temperature chemical vapor deposition
(RTCVD), high density plasma chemical vapor deposition (HDPCVD) and
combinations thereof.
[0054] The first dielectric spacer layer that provides the first
spacer 40 may be composed of any dielectric material, and in some
instances may be composed of silicon oxide or silicon nitride. In
some embodiments, the first spacer 40 can be composed of a low-k
material. As used herein, the term "low-k" denotes a dielectric
material having a dielectric constant equal to the dielectric
constant of silicon oxide (SiO.sub.2) or less. Examples of
materials suitable for the low-k dielectric material include
diamond like carbon (DLC), organosilicate glass (OSG), fluorine
doped silicon dioxide, carbon doped silicon dioxide, carbon doped
silicon nitride, porous silicon dioxide, porous carbon doped
silicon dioxide, boron doped silicon nitride, spin-on organic
polymeric dielectrics (e.g., SILK.TM.), spin-on silicone based
polymeric dielectric (e.g., hydrogen silsesquioxane (HSQ) and
methylsilsesquioxane (MSQ), and combinations thereof. The thickness
of the first dielectric spacer layer may range from 5 nm to 20
nm.
[0055] The sacrificial structure layer 60 may be composed of any
material that can be removed selectively to the first dielectric
spacer layer. In some embodiments, the sacrificial gate structure
layer 60 may be composed of a silicon containing material, such as
amorphous silicon (.alpha.-Si).
[0056] The second dielectric spacer layer 51 is similar to the
first dielectric spacer layer. For example, the sacrificial spacer
layer 51 may be composed of silicon oxide or silicon nitride. The
cap dielectric layer 52 in some examples may be composed of an
oxide, such as silicon oxide. The selection of the composition of
the cap dielectric layer 52 and the second dielectric spacer layer
51 can be selected to provide that the cap dielectric layer 52 can
be removed by an etch process that is selective to the second
dielectric spacer layer 51. The second dielectric spacer layer 51
protects the sacrificial structure layer 60 from being etched by
the process steps that remove the cap dielectric layer 53.
[0057] FIG. 7 depicts forming semiconductor fin structures 25a, 25b
for the vertically orientated portions 25a, 25b of the first diode
junction portion for the first diode 50a in the first region 90 and
the second diode 50b in the second region 95. The reference numbers
25a, 25b may be used to refer to the semiconductor fin structures
and the vertically orientated portions 25a, 25b of the first diode
junction portion 20a, 25a, 20b, 25b interchangeably. The fin
structures 25a, 25b provide the vertically orientated portions for
the first and second diodes 50a, 50b of the ESD diode pair 100. In
some embodiments, forming the fin structures 25a, 25b may begin
with forming fin structure openings through the material stack. The
fin structure openings are formed using deposition,
photolithography and etch processes. First, an etch mask is formed
atop the material stack including the sacrificial structure layer
60 having openings exposing the portions of the material stack, in
which the fin structure openings are formed. Specifically, a etch
mask can be produced by applying a photoresist to the surface to be
etched; exposing the photoresist to a pattern of radiation; and
then developing the pattern into the photoresist utilizing
conventional resist developer to produce the etch mask. Once the
patterning of the photoresist is completed, the sections covered of
the material stack covered by the etch mask are protected while the
exposed regions are removed using an etching process that removes
the unprotected regions. In some embodiments, the etch process may
be an anisotropic etch that removes the exposed portions of the
dielectric cap layer 52, the second dielectric spacer layer 51, and
the sacrificial gate layer 60, as well as a portion of the first
spacer layer 40 to expose a surface of the horizontally orientated
portions 20a, 20b of the first diode junction portion 20a, 20b,
25a, 25b for the first and second diodes 50a, 50b. In some
embodiments, the etch process for forming the fin structure
openings may be selective to the material of the horizontally
orientated portions 20a, 20b of the first diode junction portion
20a, 20b, 25a, 25b for the first and second diodes 50a, 50b. For
example, the etch process for forming the fin structure openings
can be a reactive ion etch process.
[0058] Still referring to FIG. 7, following the formation of the
fin structure openings, a thermal oxidation process forms a
dielectric surface 61 of the sidewall surface of the sacrificial
gate layer 60 that are exposed within the fin structure openings.
In the embodiments in which the sacrificial structure layer 60 is
composed of a silicon containing material, the dielectric surface
61 may be composed of an oxide, such as silicon oxide.
[0059] In a following process step, the fin structures 25a, 25b are
formed filling the fin structure openings using an epitaxial
deposition process that employs the exposed surface of the
horizontally orientated portions 20a, 20b of the first diode
junction portion 20a, 20b, 25a, 25b for the first and second diodes
50a, 50b at the base of the fin structure openings as an epitaxial
deposition growth surface. The epitaxial semiconductor material
that provides the fin structures 25a, 25b does not form on
dielectric surfaces, such as the dielectric cap layer 52 or the
dielectric surface 61 of the sacrificial structure layer 60. The
epitaxial growth process for forming the fin structures 25a, 25b is
similar to the epitaxial growth process that is described above for
forming the horizontally orientated portions 220b of the first
diode junction portion 20a, 20b, 25a, 25b for the second diode 50b
and the second counter doped layer 15b. Therefore, the above
description for epitaxially forming the first source/rain region
20b and the second counter doped layer 15 is suitable for
describing at least one method of the epitaxial deposition
processes used to form the fin structures 25a, 25b.
[0060] The geometry and composition of the fin structures 25a, 25b
that are formed in FIG. 7 have been described in greater detail
with reference to FIGS. 3A and 3B. In some embodiments, the fin
structure 25a of the first diode 50a that is present within the
first region 90 has the same composition as the horizontally
orientated portion 20a of the first diode junction portion 20a, 20b
for the first diode 50a. In some embodiments, the fin structure 25b
of the second diode 50b that is present within the second region 95
has the same composition as the horizontally orientated portion 20b
of the first diode junction portion 20b, 25b for the second diode
50b. The semiconductor fin structures 25a, 25b typically are doped
to the same conductivity type as the horizontally oriented portions
20a, 20b of the first diode junction portion 20a, 20b, 25a, 25b for
the first and second diodes 50a, 50b.
[0061] In some embodiments, the fin structure 25a being formed in
the first region 50a has the same composition as the fin structure
25b being formed in the second region 50b. In other embodiments,
the fin structure 25a being formed in the first region 50a has a
different composition as the fin structure 25b being formed in the
second region 50b. Typically, the fin structure 25a in the first
device region 50a is doped, e.g., n-type doped, to a different
conductivity type than the second fin structure 25b, e.g., p-type
doped, formed in the second device region 50b.
[0062] To provide that the fin structures 25a, 25b have different
epitaxial compositions, i.e., base compositions, e.g., silicon or
germanium or type III-V composition, and/or conductivity types,
e.g., n-type or p-type, block masks may be employed. For example, a
first block mask, e.g., photoresist mask, may be formed over the
second region 95 protecting the fin structure opening present
within that region, while a first epitaxial deposition process
forms a fin structure 25a within the first region 90. Thereafter,
the first block mask may be removed, and a second block mask may be
formed exposing the fin structure opening in the second region 95
while covering the fin structure 25a previously formed in the first
region 90. In this example, a second epitaxial deposition process
may be used to form the fin structure 25b in the second region 95
having a different composition than the fin structure 25a formed by
the first epitaxial deposition process in the first region 90.
[0063] In some embodiments, the pitch P1 separating adjacent fin
structures 25a, 25b is selected to provide that the devices are
positioned at less than the contacted gate pitch. In some
embodiments, the pitch P1 separating the adjacent fin structures
25a, 25b may range from 10 nm to 60 nm. In yet another embodiment,
the pitch P1 separating the adjacent fin structures 25a, 25b may
range from 25 nm to 40 nm.
[0064] FIG. 7 further depicts recessing the epitaxially formed fin
structures 25a, 25b, and forming a dielectric cap 65 on the
recessed surfaces of the fin structures 25a, 25b. The fin
structures 25a, 25b may be recessed using an etch that is selective
to the cap dielectric layer 52. Etching the epitaxially formed fin
structures 25a, 25b forms a recess in the upper portions of the fin
structure openings. The recess is filled with a deposited
dielectric material to provide the dielectric cap 65. In some
embodiments, the dielectric cap 65 may be composed of a nitride,
such as silicon nitride, that is deposited using chemical vapor
deposition (CVD), such as plasma enhanced chemical vapor deposition
(PECVD).
[0065] Fin spacers 66 may then be formed on upper portions of the
fin structures 25a, 25b, as depicted in FIG. 8. In some
embodiments, forming the fin spacers 66 may begin with removing the
cap dielectric layer 52 with an etch process, such as an etch
process that is selective to the second dielectric spacer layer 51.
Removing the cap dielectric layer 52 exposes upper sidewalls of the
fin structures 25a, 25b. The fin spacers 66 are formed on the
exposed upper sidewalls of the fin structures 25a, 25b using a
conformal deposition process, such as plasma enhanced chemical
vapor deposition (PECVD), following by an anisotropic etchback
process, such as reactive ion etch.
[0066] After forming the fin spacers 66, a second cap dielectric
layer 21' may be formed having an upper surface that is coplanar
with the upper surface of the fin spacers 66. The second cap
dielectric layer 52' is similar to the original cap dielectric
layer 52, and may have the same composition as the original cap
dielectric layer 52. For example, the second cap dielectric layer
52' may be composed of an oxide, such as silicon oxide. The second
cap dielectric layer 52' may be deposited using chemical vapor
deposition, and may be planarized by a process, such as chemical
mechanical planarization.
[0067] FIG. 8 also depicts one embodiment of removing a majority of
the material stack that includes the sacrificial structure layer 60
from the first region 90. FIG. 8 depicts one embodiment of removing
a portion of the material stack to expose the horizontally
orientated portion 20a of the first diode junction portion 20a, 25a
of the first diode 50a within the first region 90 of the substrate
10, while the second region 95 of the substrate is protected with a
block mask 67. The block mask 67 may be composed of a photoresist
material or may be a hard mask, such as silicon oxide or silicon
nitride. The block mask 67 may be patterned using photolithography
and etching processes.
[0068] In some embodiments, an anisotropic etch, such as reactive
ion etch (RIE), can remove the exposed portions of the second
dielectric cap 52', the second dielectric spacer 51, the
sacrificial structure layer 60 and the first dielectric spacer
layer 40. The etch process for removing the aforementioned layers
is typically selective to the horizontally orientated portion 20a
of the first diode junction portion 20a, 20b for the first diode
50a in the first region 90. Due to the anisotropic nature of the
etch process, a remaining portion of the second dielectric spacer
layer 53', a remaining portion of the sacrificial gate layer 60'
and a remaining portion of the first dielectric spacer layer 40' is
present underlying the fin spacers 66.
[0069] FIG. 9 depicts one embodiment of epitaxially forming a doped
semiconductor material for a portion of the first diode 50a in the
first region 90 of the substrate 10. The epitaxially formed doped
semiconductor material provides the second diode junction portion
45a of the first diode 50a, and is in direct contact with the
horizontally orientated and vertically orientated portions 20a, 25a
of the first diode junction portion 20a, 25a of the first diode 50a
in the first region 90. In some embodiments, prior to forming the
second diode portion 45a for the first diode 50a, the remaining
portion of the sacrificial structure layer 60' and the dielectric
surface 61 of the sidewall surface of the sacrificial gate layer 60
that is underlying the fin structure 66 may be removed using an
isotropic selective etch, such as a plasma etch, gas etch or wet
etch process. The etch process may be selective to the fin
structure 25a. Following the isotropic etch, the outside sidewalls
of the fin structures 25a are exposed.
[0070] The second diode junction portion 45a for the first diode
50a may be formed in the first region 90 using a low temperature
epitaxial growth processes (the top epitaxy can be done at
temperatures below 550.degree. C.). The second diode junction
portion 45a is composed of an epitaxially formed semiconductor
material, such as type IV or type III-V semiconductor material. For
example, when the second diode junction portion 45a for the first
diode 50a is composed of a type IV semiconductor, the second diode
junction portion 45a may be composed of silicon, e.g.,
monocrystalline silicon or single crystalline silicon, germanium,
silicon germanium and combinations thereof. For example, when the
second diode junction portion 45a for the first diode 50a is
composed of a type III-V semiconductor, the second diode junction
portion 45a may be composed of InGaAs.
[0071] The second diode junction portion 45a of the first diode 50a
may have an opposite conductivity type as the first diode junction
portion 20a, 25a of the first diode 50a. For example, when the
first diode junction portion 20a, 25a of the first diode 50a has an
n-type conductivity, the second diode junction portion 45a has a
p-type conductivity. In another example, when the first diode
junction portions 20a, 25a of the first diode 50a has a p-type
conductivity, the second diode junction portion 45a has an n-type
conductivity.
[0072] The methods of forming and doping the second diode junction
portion 45a is similar to the methods and forming and doping the
first diode junction portions 20a, 25a. Therefore, the above
forming methods, e.g., epitaxial forming, and doping method, e.g.,
in situ doping methods, for producing the first diode junction
portion 20a, 25a is suitable for describing at least one embodiment
of forming the second diode junction portion 45a.
[0073] The second diode junction 45a is formed in epitaxial
relationship with the both the horizontal portion 20a and the
vertical portion 25a of the first diode junction portion 20a, 25a.
For example, if the first diode junction portion 20a, 25a has a
monocrystalline crystal structure, the second diode junction 45a
will have a monocrystalline crystal structure. For example, if the
material compositions for the first and second diode portions 45a,
20a, 25a are substantially similar, the lattice structure for the
second diode portion 45a will substantially match the lattice
structure of the first diode junction portion 20a, 25a.
[0074] Epitaxial growth of opposite dopant in-situ doped epitaxy on
exposed source semiconductor surface and from n-doped channel
sidewall, i.e., epitaxial growth on the (100) bottom surface is
faster than on the (110) fin sidewall leading to drawn epitaxy
structure. More specifically, epitaxial growth from the bottom up,
i.e., from the (100) surface is faster than the sidewall growth off
the (110) sidewall if the sidewall is the fin structure 25a,
25b.
[0075] After forming the second diode junction 45a in the first
region 90 of the substrate, an interlevel dielectric 46 is
deposited on the upper surface of the second diode junction 45a in
the first region 90, and the block mask 67 that was present over
the second region 95 of the substrate 10 is removed.
[0076] FIG. 10 depicts one embodiment of epitaxially forming a
doped semiconductor material for a portion of the second diode in
the second region 95 of the substrate 10. The epitaxially formed
doped semiconductor material provides the second diode junction
portion 45b of the second diode 50b, and is in direct contact with
the horizontally orientated and vertically orientated portions 20b,
25b of the first diode junction portion 20b, 25b of the second
diode 50b in the second region 95. In some embodiments, prior to
forming the second diode portion 45b for the second diode 50b, a
bock mask is formed over the first region of the substrate 90,
leaving the second region 95 of the substrate exposed. An
anisotropic etch, such as reactive ion etch (RIE), can remove the
exposed portions of the second dielectric cap 52', the second
dielectric spacer 51, the sacrificial structure layer 60 and the
first dielectric spacer layer 40 that are present in the second
region 95 of the substrate. The etch process for removing the
aforementioned layers is typically selective to the horizontally
orientated portion 20b of the first diode junction portion 20b for
the second diode 50b in the second region 95. The remaining portion
of the sacrificial structure layer 60' and the dielectric surface
61 of the sidewall surface of the sacrificial gate layer 60 that is
underlying the fin structure 66 in the second region 95 may be
removed using an isotropic selective etch, such as a plasma etch,
gas etch or wet etch process. The etch process may be selective to
the fin structure 25b. Following the isotropic etch, the outside
sidewalls of the fin structures 25b are exposed.
[0077] The second diode junction portion 45b for the second diode
50b may be formed in the first region 90 using a low temperature
epitaxial growth process. The second diode junction portion 45b is
composed of an epitaxially formed semiconductor material, such as
type IV or type III-V semiconductor material. For example, when the
second diode junction portion 45b for the second diode 50b is
composed of a type IV semiconductor, the second diode junction
portion 45b may be composed of silicon, e.g., monocrystalline
silicon or single crystalline silicon, germanium, silicon germanium
and combinations thereof.
[0078] The second diode junction portion 45b of the second diode
50b may have an opposite conductivity type as the first diode
junction portion 20b, 25b of the second diode 50b. For example,
when the first diode junction portion 20b, 25b of the second diode
50b has a p-type conductivity, the second diode junction portion
45b has an n-type conductivity.
[0079] Therefore, the above described forming methods, e.g.,
epitaxial forming, and doping method, e.g., in situ doping methods,
for producing the first diode junction portion 20a, 25a is suitable
for describing at least one embodiment of forming the second diode
junction portion 45b. The second diode junction portion 45b is
formed in epitaxial relationship with the both the horizontal
portion 20b and the vertical portion 25b of the first diode
junction portion 20b, 25b.
[0080] An interlevel dielectric 46 is formed over the second diode
junction portion 45b in the second region 95 of the substrate
10.
[0081] FIG. 11 depicts one embodiment of removing a portion of the
material stack 52, 51, 60 that is present between the adjacent fin
structures 25a, 25b to provide a trench opening 80 for forming the
common electrical contact 30. In some embodiments, an etch mask 81
is formed protecting the first and second region 90, 95 of the
substrate 10, the etch mask 81 leaving the portion of the substrate
10 including the isolation region exposed. An etch process, such as
reactive ion etch, can then remove the cap dielectric layer 52, the
inside fin spacer 66 that are present between the adjacent fin
structures 25a, 25b, as well as the second dielectric spacer layer
51 and the remaining portion of the sacrificial structure layer 60.
The etch process may be selective to the first dielectric spacer
layer 40.
[0082] FIG. 12 depicts one embodiment of forming the common
electrical contact 30 to the fin structures 25a, 25b in the first
and second regions 90, 95 of the substrate 10. The common
electrical contact 30 may be a metal or metal nitride. For example,
the common electrical contact may be composed of tungsten,
tantalum, titanium, aluminum, copper, platinum, gold, silver, as
well as other metals used in interconnects. Examples of metal
nitrides that are suitable for forming the common electrical
contact 30 may include titanium nitride, tungsten nitride and
tantalum nitride. Other examples of compositions suitable for the
common electric contact 30 may include TiAl, HfN, TiAlN, Ru, Pt,
Mo, Co and alloys and combinations thereof. The material layer for
the common electrical contact 30 may be deposited using physical
vapor deposition, such as sputtering. In yet further examples, the
material layer for the common electrical contact 30 may be
deposited using plating, electroplating, electroless deposition,
and combinations thereof. In other examples, the material layer for
the common electrical contact 30 may be deposited by CVD, e.g.,
plasma enhanced chemical vapor deposition (PECVD).
[0083] Following deposition of the material layer for the common
electrical contact 30, an etch process, such as reactive ion etch
(RIE), may recess the material layer to the appropriate height. An
interlevel dielectric layer 46 may be deposited on the recessed
surface of the common electrical contact 30.
[0084] Referring to FIGS. 3A and 3B, following formation of the
common electrical contact 30, via contacts 34a, 34b, 35 may be
formed to each of the first and second diodes 50a, 50b. A first via
contact 34a may be formed to the second diode junction portion 45a
of the first diode 50a in the first region 90. A second via contact
34b may be formed to the second diode junction portion 45b. A
common via contact 35 is formed to the common electrical contact
30.
[0085] The via contacts 34a, 34b, 35 may be produce by forming a
via opening through the interlevel dielectric layer 46; and filling
the via opening with an electrically conductive material. The via
opening may be formed using photolithography and etch processes.
For example, a photoresist mask may be formed exposing the portion
of the dielectric material layers in which the via opening is to be
formed, wherein following formation of the photoresist mask, the
via opening may be etched into the interlevel dielectric using an
etch process, such as reactive ion etch. The via opening may be
filled with a doped semiconductor material, such as n-type doped
polysilicon, or a metal, such as copper, aluminum, titanium,
tungsten, platinum or combinations thereof, to form the via
contacts 34a, 34b, 35. The electrically conductive material may be
deposited into the via opening using physical vapor deposition
(PVD). Examples of PVD processes suitable for depositing the metal
for the via contacts 34a, 34b, 35 include plating, electroplating,
electroless plating, sputtering and combinations thereof.
[0086] The present embodiments can include a design for an
integrated circuit chip, which can be created in a graphical
computer programming language, and stored in a computer storage
medium (such as a disk, tape, physical hard drive, or virtual hard
drive such as in a storage access network). If the designer does
not fabricate chips or the photolithographic masks used to
fabricate chips, the designer can transmit the resulting design by
physical means (e.g., by providing a copy of the storage medium
storing the design) or electronically (e.g., through the Internet)
to such entities, directly or indirectly. The stored design is then
converted into the appropriate format (e.g., GDSII) for the
fabrication of photolithographic masks, which typically include
multiple copies of the chip design in question that are to be
formed on a wafer. The photolithographic masks are utilized to
define areas of the wafer (and/or the layers thereon) to be etched
or otherwise processed.
[0087] Methods as described herein can be used in the fabrication
of integrated circuit chips. The resulting integrated circuit chips
can be distributed by the fabricator in raw wafer form (that is, as
a single wafer that has multiple unpackaged chips), as a bare die,
or in a packaged form. In the latter case, the chip is mounted in a
single chip package (such as a plastic carrier, with leads that are
affixed to a motherboard or other higher level carrier) or in a
multichip package (such as a ceramic carrier that has either or
both surface interconnections or buried interconnections). In any
case, the chip is then integrated with other chips, discrete
circuit elements, and/or other signal processing devices as part of
either (a) an intermediate product, such as a motherboard, or (b)
an end product. The end product can be any product that includes
integrated circuit chips, ranging from toys and other low-end
applications to advanced computer products having a display, a
keyboard or other input device, and a central processor.
[0088] It should also be understood that material compounds will be
described in terms of listed elements, e.g., SiGe. These compounds
include different proportions of the elements within the compound,
e.g., SiGe includes Si.sub.xGe.sub.1-x where x is less than or
equal to 1, etc. In addition, other elements can be included in the
compound and still function in accordance with the present
principles. The compounds with additional elements will be referred
to herein as alloys.
[0089] is to be appreciated that the use of any of the following
"/", "and/or", and "at least one of", for example, in the cases of
"A/B", "A and/or B" and "at least one of A and B", is intended to
encompass the selection of the first listed option (A) only, or the
selection of the second listed option (B) only, or the selection of
both options (A and B). As a further example, in the cases of "A,
B, and/or C" and "at least one of A, B, and C", such phrasing is
intended to encompass the selection of the first listed option (A)
only, or the selection of the second listed option (B) only, or the
selection of the third listed option (C) only, or the selection of
the first and the second listed options (A and B) only, or the
selection of the first and third listed options (A and C) only, or
the selection of the second and third listed options (B and C)
only, or the selection of all three options (A and B and C). This
can be extended, as readily apparent by one of ordinary skill in
this and related arts, for as many items listed.
[0090] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
example embodiments. As used herein, the singular forms "a," "an"
and "the" are intended to include the plural forms as well, unless
the context clearly indicates otherwise. It will be further
understood that the terms "comprises," "comprising," "includes"
and/or "including," when used herein, specify the presence of
stated features, integers, steps, operations, elements and/or
components, but do not preclude the presence or addition of one or
more other features, integers, steps, operations, elements,
components and/or groups thereof.
[0091] Spatially relative terms, such as "beneath," "below,"
"lower," "above," "upper," and the like, can be used herein for
ease of description to describe one element's or feature's
relationship to another element(s) or feature(s) as illustrated in
the FIGS. It will be understood that the spatially relative terms
are intended to encompass different orientations of the device in
use or operation in addition to the orientation depicted in the
FIGS. For example, if the device in the FIGS. is turned over,
elements described as "below" or "beneath" other elements or
features would then be oriented "above" the other elements or
features. Thus, the term "below" can encompass both an orientation
of above and below. The device can be otherwise oriented (rotated
90 degrees or at other orientations), and the spatially relative
descriptors used herein can be interpreted accordingly. In
addition, it will also be understood that when a layer is referred
to as being "between" two layers, it can be the only layer between
the two layers, or one or more intervening layers can also be
present.
[0092] It will be understood that, although the terms first,
second, etc. can be used herein to describe various elements, these
elements should not be limited by these terms. These terms are only
used to distinguish one element from another element. Thus, a first
element discussed below could be termed a second element without
departing from the scope of the present concept.
[0093] Having described preferred embodiments of a structure and
method for forming a VERTICAL TRANSISTOR DUAL DIODE STRUCTURE FOR
ELECTROSTATIC DISCHARGE CIRCUIT PROTECTOR, it is noted that
modifications and variations can be made by persons skilled in the
art in light of the above teachings. It is therefore to be
understood that changes may be made in the particular embodiments
disclosed which are within the scope of the invention as outlined
by the appended claims. Having thus described aspects of the
invention, with the details and particularity required by the
patent laws, what is claimed and desired protected by Letters
Patent is set forth in the appended claims.
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