U.S. patent application number 15/398608 was filed with the patent office on 2018-07-05 for electronic device fabric integration.
The applicant listed for this patent is Intel Corporation. Invention is credited to Aleksandar Aleksov, Nadine L. Dabby, Racquel L. Fygenson, Braxton Lathrop, Sasha N. Oster.
Application Number | 20180188771 15/398608 |
Document ID | / |
Family ID | 62711676 |
Filed Date | 2018-07-05 |
United States Patent
Application |
20180188771 |
Kind Code |
A1 |
Dabby; Nadine L. ; et
al. |
July 5, 2018 |
ELECTRONIC DEVICE FABRIC INTEGRATION
Abstract
Systems and methods describe herein provide a solution to the
technical problem of creating a wearable electronic devices. In
particular, these systems and methods enable electrical and
mechanical attachment of stretchable or flexible electronics to
fabric. A stretchable or flexible electronic platform is bonded to
fabric using a double-sided fabric adhesive, and conductive
adhesive is used to join pads on the electronic platform to
corresponding electrical leads on the fabric. An additional
waterproofing material may be used over and beneath the electronic
platform to provide a water-resistant or waterproof device. This
stretchable or flexible electronic platform integration process
allows the platform to bend and move with the fabric while
protecting the conductive connections. By using flexible and
stretchable conductive leads and adhesives, the platform is more
flexible and stretchable than traditional rigid electronics
enclosures.
Inventors: |
Dabby; Nadine L.; (Palo
Alto, CA) ; Oster; Sasha N.; (Chandler, AZ) ;
Aleksov; Aleksandar; (Chandler, AZ) ; Lathrop;
Braxton; (Lake Oswego, OR) ; Fygenson; Racquel
L.; (Goleta, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Intel Corporation |
Santa Clara |
CA |
US |
|
|
Family ID: |
62711676 |
Appl. No.: |
15/398608 |
Filed: |
January 4, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 2203/1311 20130101;
H05K 1/038 20130101; H05K 1/0283 20130101; G06F 1/163 20130101;
H05K 2203/1383 20130101; G06F 1/1656 20130101; H05K 3/321 20130101;
H05K 2201/0314 20130101; H05K 3/284 20130101; H05K 3/3463
20130101 |
International
Class: |
G06F 1/16 20060101
G06F001/16; H05K 3/06 20060101 H05K003/06 |
Claims
1. A stretchable and flexible electronic apparatus comprising: a
waterproof insulating layer attached to a garment; a plurality of
flexible conductive leads attached to the waterproof material; and
an electronics assembly attached to the waterproof material, the
plurality of flexible conductive leads mechanically and
conductively coupled to a corresponding plurality of electronics
contacts on the electronics assembly.
2. The apparatus of claim 1, the electronics assembly including at
least one of a flexible electronics assembly, a stretchable
electronics assembly, and a rigid electronics assembly.
3. The apparatus of claim 1, further including a conductive
adhesive disposed through a plurality of cutouts of a removable
mask onto predetermined conductive portions of the electronics
assembly, the predetermined conductive portions corresponding to
the plurality of flexible conductive leads.
4. The apparatus of claim 3, further including a non-conductive
electronics adhesive layer disposed on the electronics assembly by
the removable mask.
5. The apparatus of claim 3, wherein the conductive adhesive
provides the mechanical and conductive coupling between the
plurality of flexible conductive leads and the corresponding
plurality of electronics contacts on the electronics assembly.
6. The apparatus of claim 3, wherein the conductive adhesive
includes at least one of a conductive epoxy, a conductive glue, and
a joint-reinforced conductive paste.
7. The apparatus of claim 3, wherein the conductive adhesive
includes a low-temperature solder, the low-temperature solder
applied in solid form and subsequently reflowed to provide the
mechanical and conductive coupling.
8. The apparatus of claim 3, wherein the conductive adhesive
includes a biocompatible liquid metal alloy.
9. The apparatus of claim 1, further including a flexible
waterproof upper layer attached to the electronics assembly.
10. The apparatus of claim 9, further including an upper
non-conductive adhesive layer disposed between the flexible
waterproof upper layer and the electronics assembly.
11. The apparatus of claim 1, further including a lower
non-conductive adhesive layer disposed between the plurality of
flexible conductive leads and the waterproof insulating layer.
12. A stretchable and flexible electronic method comprising:
attaching a waterproof insulating layer to a garment; attaching a
plurality of flexible conductive leads to the waterproof material;
and attaching an electronics assembly to the waterproof material,
the plurality of flexible conductive leads mechanically and
conductively coupled to a corresponding plurality of electronics
contacts on the electronics assembly.
13. The method of claim 12, the electronics assembly including at
least one of a flexible electronics assembly, a stretchable
electronics assembly, and a rigid electronics assembly.
14. The method of claim 12, further including: disposing a
removable mask on the electronics assembly; disposing a conductive
adhesive through the plurality of cutouts onto predetermined
conductive portions of the electronics assembly, the predetermined
conductive portions corresponding to the plurality of flexible
conductive leads; and removing the removable mask from the
electronics assembly.
15. The method of claim 14, further including disposing a
non-conductive electronics adhesive layer on the electronics
assembly.
16. The method of claim 15, wherein: the removable mask includes
the non-conductive electronics adhesive layer; and the
non-conductive electronics adhesive layer is disposed on the
electronics assembly by disposing the removable mask and removing
the removable mask from the electronics assembly.
17. The method of claim 14, wherein the conductive adhesive
provides the mechanical and conductive coupling between the
plurality of flexible conductive leads and the corresponding
plurality of electronics contacts on the electronics assembly.
18. At least one machine-readable storage medium, comprising a
plurality of instructions that, responsive to being executed with
processor circuitry of a computer-controlled device, cause the
computer-controlled device to: attach a waterproof insulating layer
to a garment; attach a plurality of flexible conductive leads to
the waterproof material; and attach an electronics assembly to the
waterproof material, the plurality of flexible conductive leads
mechanically and conductively coupled to a corresponding plurality
of electronics contacts on the electronics assembly.
19. The machine-readable storage medium of claim 18, the
electronics assembly including at least one of a flexible
electronics assembly, a stretchable electronics assembly, and a
rigid electronics assembly.
20. The machine-readable storage medium of claim 18, the
instructions further causing the computer-controlled device to:
disposing a removable mask on the electronics assembly; disposing a
conductive adhesive through the plurality of cutouts onto
predetermined conductive portions of the electronics assembly, the
predetermined conductive portions corresponding to the plurality of
flexible conductive leads; and removing the removable mask from the
electronics assembly.
21. The machine-readable storage medium of claim 20, the
instructions further causing the computer-controlled device to
disposing a non-conductive electronics adhesive layer on the
electronics assembly.
22. The machine-readable storage medium of claim 21, wherein: the
removable mask includes the non-conductive electronics adhesive
layer; and the non-conductive electronics adhesive layer is
disposed on the electronics assembly by disposing the removable
mask and removing the removable mask from the electronics
assembly.
23. The machine-readable storage medium of claim 20, wherein the
conductive adhesive includes a low-temperature solder in solid
form, the instructions further causing the computer-controlled
device to reflowing the low-temperature solder to provide the
mechanical and conductive coupling.
24. The machine-readable storage medium of claim 20, wherein the
conductive adhesive includes a biocompatible liquid metal
alloy.
25. The machine-readable storage medium of claim 18, the
instructions further causing the computer-controlled device to
attach a flexible waterproof upper layer to the electronics
assembly.
Description
TECHNICAL FIELD
[0001] Embodiments described herein generally relate to wearable
electronic devices.
BACKGROUND
[0002] There is an increasing demand for portable and wearable
electronic devices. Many wearable electronic devices are attached
to clothing by connecting a rigid electronic device enclosure to a
wearable fabric (e.g., wearable textile) using metallic snaps,
screws, or magnets. Wearable electronic devices may be attached to
clothing by installing the electronic device into a rigid plastic
casing that is superglued onto the wearable fabric. Wearable
electronic devices may also be overmolded onto wearable fabric
using thick plastic and adhesive. In each of these examples, the
electronic device or enclosure is hard and obtrusive. This is in
contrast with the physical characteristics of the fabric itself,
which is often stretchable, foldable, and lightweight. It is
desirable to provide a wearable electronic device with improved
flexibility and stretchability.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] FIG. 1 is a diagram of a waterproof material attachment
step, in accordance with at least one embodiment.
[0004] FIG. 2 is a diagram of a conductive fabric attachment step,
in accordance with at least one embodiment.
[0005] FIG. 3 is a diagram of an adhesive film mask step, in
accordance with at least one embodiment.
[0006] FIG. 4 is a diagram of a mask removal step, in accordance
with at least one embodiment.
[0007] FIG. 5 is a diagram of an electronic placement step, in
accordance with at least one embodiment.
[0008] FIG. 6 is a diagram of waterproof layer application step, in
accordance with at least one embodiment.
[0009] FIG. 7 is a block diagram of flexible electronics assembly,
in accordance with at least one embodiment.
[0010] FIG. 8 is a block diagram illustrating an electronic textile
device in the example form of an electronic device, according to an
example embodiment.
DESCRIPTION OF EMBODIMENTS
[0011] The systems and methods describe herein provide a solution
to the technical problem of creating a wearable electronic devices.
In particular, these systems and methods enable electrical and
mechanical attachment of stretchable or flexible electronics to
fabric or other textiles. The fabrics or other textiles may be used
in clothing, upholstery (e.g., car seat cushions), towels, sheets,
blankets, protective structures (e.g., umbrellas, awnings), sails,
or other fabric or textiles. A stretchable or flexible electronic
platform is bonded to fabric using a double-sided fabric adhesive,
and conductive adhesive is used to join pads on the electronic
platform to corresponding electrical leads on the fabric. An
additional waterproofing material may be used over and beneath the
electronic platform to provide a water-resistant or waterproof
device.
[0012] This stretchable or flexible electronic platform integration
process allows the platform to bend and move with the fabric while
protecting the conductive connections. The resulting structure
(e.g., form factor) is significantly lower in profile than snap
connections, and enables connecting a significantly increased
number of electrical leads in the same amount of space as snap
connection implementations. Because the electronic platform and
adhesive may both be flexible and stretchable, the platform is more
apt to be able to bend and move with the fabric then a traditional
rigid enclosure. The systems and methods described herein provide a
reliable solution that is easily manufactured, which enables easy
implementation within a traditional garment supply chain.
[0013] The following description and the drawings sufficiently
illustrate specific embodiments to enable those skilled in the art
to understand the specific embodiment. Other embodiments may
incorporate structural, logical, electrical, process, and other
changes. Portions and features of various embodiments may be
included in, or substituted for, those of other embodiments.
Embodiments set forth in the claims encompass all available
equivalents of those claims.
[0014] FIG. 1 is a diagram of a waterproof material attachment step
100, in accordance with at least one embodiment. In an embodiment,
step 100 includes attaching a flexible and waterproof material 105
to a garment 110. Material 105 may include an adhesive on one side,
and the material 105 may be attached to the garment 110 using heat
and pressure. Once applied, the material 105 provides a flexible
and waterproof barrier between the garment 110 and flexible
electronic components applied in subsequent steps. Step 100
includes attaching a double-sided and non-conductive adhesive
(e.g., bonding tape) 115 to the material 105. The adhesive 115 may
be disposed initially on a backing, and the adhesive 115 may be
attached to the material 105 by placing the backing and adhesive
115 on the material 105 and applying heat and pressure. Once the
adhesive 115 is applied to the material 105, the backing may be
removed. In another embodiment, waterproofing may be applied in
liquid form. If the underlying garment 110 already includes a
water-resistant or waterproof barrier, then step 100 may be
omitted.
[0015] FIG. 2 is a diagram of a conductive fabric attachment step
200, in accordance with at least one embodiment. Material 205
includes the flexible and waterproof material 105 and adhesive 115
applied in step 100. In step 200, conductive fabric leads 210, 215,
220, 225, 230, 235, and 240 are cut into electrical leads of
desired size and shape. Each of these conductive fabric leads
210-240 are placed on the material 205, and may be adhered to the
material 205 using heat and pressure.
[0016] FIG. 3 is a diagram of an adhesive film mask step 300, in
accordance with at least one embodiment. Mask 345 includes cutouts
(e.g., negative space) 310, 315, 320, 325, and 330, which may be
cut using a laser cutter, a die cutter, or other film removal
method. The cutouts 310-330 correspond to electrical connection
points on a reverse side (e.g., bottom) of underlying electronic
components 305. A single mask 345 may be used, or one or more
additional masks 350 may be applied to the electronic components
305, and may include additional cutouts 335 and 340.
[0017] The cutouts 310-340 provide a mask through which a
conductive adhesive 355 is applied to the bottom of the underlying
electronic components 305. The conductive adhesive 355 may be
deposited using a conductive adhesive applicator 360, a screen
printing process, or other adhesive disposition method. The
conductive adhesive 355 may include a conductive epoxy, a
conductive glue, a joint-reinforced conductive paste, or other
conductive viscous adhesive. The conductive adhesive 355 may
include a low-temperature solder, and may be applied in solid form
and subsequently reflowed to create a mechanical and electrical
connection. The conductive adhesive 355 may include a conductive
film or paste, such as an anisotropic conductive film or paste. The
conductive adhesive 355 may be deposited directly in specific
areas, or a stencil (e.g., adhesive mask and squeegee or adhesive
mask and spray) may be used to apply the conductive adhesive 355 to
the bottom of the underlying electronic components 305. The
conductive adhesive 355 may be cured using ambient air, using an
oven-curing process, or using a standard textile process such as
ironing (e.g., application of heat and pressure). The conductive
adhesive 355 may include a stretchable electrical contact, such as
an adhesive and conductive fabric. The conductive adhesive 355 may
include a biocompatible liquid metal alloy, such as gallium-indium,
gallium-indium-tin (e.g., Galinstan), metal-hydrogel, or other
biocompatible liquid metal alloy.
[0018] Masks 345 and 350 may be formed from adhesive or
non-adhesive materials. A non-adhesive material may need to be held
in place during application, such as using a hand 350 or a
stabilizing assembly. The use of an adhesive film to form masks 345
and 350 may use existing manufacturing methodologies, and may
reduce or eliminate the need for alignment using a hand 350 or a
stabilizing assembly.
[0019] FIG. 4 is a diagram of a mask removal step 400, in
accordance with at least one embodiment. In an embodiment, the
conductive adhesive masks are cut from a non-conductive
double-sided adhesive film (e.g., bonding tape), where each mask
includes a non-adhesive and removable backing 445 and 450. This use
of an adhesive film enables adhering the masks to electronic
components 405 using heat and pressure, and the removable backing
445 and 450 removes any conductive adhesive applied beyond the
perimeter of the cutouts 410-440. Electronics components 405 may be
flexible, stretchable, rigid, or any combination thereof. Removal
of the removable backing 445 and 450 leaves an applied layer of
non-conductive adhesive on one or more underlying electronic
components, such the reverse side (e.g., bottom) of underlying
electronic components 455 and 460. In another embodiment, masks are
cut from a non-adhesive and disposable layer, and subsequently
aligned with the electronic components 405 to allow application of
the conductive adhesive. When the masks are cut from a non-adhesive
layer, a separate layer of adhesive is applied to the electronic
components 405 after removal of the masks. The adhesive may be
applied to the electronic components 405 in liquid form, such as
using a stencil (e.g., adhesive mask and squeegee or adhesive mask
and spray). The adhesive may be cured using ambient air, using an
oven-curing process, or using a standard textile process such as
ironing (e.g., application of heat and pressure).
[0020] FIG. 5 is a diagram of an electronic placement step 500, in
accordance with at least one embodiment. Following mask removal
step 400, the electronic component assembly 505 is flipped to apply
the adhesive side to an underlying flexible and stretchable
material 550. The masked conductive adhesive applied in adhesive
film mask step 300 is aligned with corresponding conductive fabric
leads 510-540. The electronic component assembly 505 may be
attached to the underlying material 550 based on the type of
adhesive film and conductive adhesive, such as using heat and
pressure to cure conductive epoxy.
[0021] FIG. 6 is a diagram of waterproof layer application step
600, in accordance with at least one embodiment. Following
application and curing adhesive film and conductive adhesive in
electronic placement step 500, a flexible and stretchable
waterproof material 610 is applied to the electronic component
assembly 605. The waterproof material 610 may include a waterproof
fabric, an applied plastic such as thermoplastic polyurethane
(TPU), or another waterproof material. An adhesive may be used to
secure the waterproof material 610, or the waterproof material 610
may be secured to the electronic component assembly 605, such as
being laminated using heat and pressure. The waterproof material
610 may be applied using a metal or plastic mold that causes the
waterproof material 610 to conform closely to the electronic
component assembly 605, thereby providing an improved, watertight
seal. The waterproof material 610 may also be sprayed on or
deposited using a mask. In an embodiment, the electronic component
assembly 605 may be manufactured to include a waterproof upper
layer, in which case step 600 may be omitted.
[0022] FIG. 7 is a block diagram of flexible and stretchable
electronics assembly 700, in accordance with at least one
embodiment. Assembly 700 may be formed using various embodiments,
such as embodiments described in steps 100-600. In an embodiment,
assembly 700 includes a flexible insulating material 720 attached
to a garment 710. The flexible insulating material 720 provides a
backing and insulation for subsequently applied flexible electronic
components, and may be also include a stretchable material. Garment
710, insulating material 720, or both may be selected to provide a
waterproof barrier. Assembly 700 includes a double-sided and
nonconductive adhesive 730 applied to one side of the insulating
material 720 in locations corresponding to the placement of
conductive electrical leads 740. Conductive fabric is cut into
electrical leads 740, which are placed in specific locations on the
nonconductive adhesive 730. In various alternative embodiments,
various other types of conductive leads (e.g., conductive
interconnect) may be used. For example, the conductive leads may be
formed using sewn-in or embroidered conductive thread, conductive
ink screen printed onto the fabric, a wire coated in an insulating
material and attached to a fabric, or other fabric-mounted or
textile-mounted conductive leads.
[0023] Assembly 700 includes an electronics layer 770. A
non-conductive adhesive mask 760 is applied to the electronics
layer 770, and conductive adhesive 750 is applied through one or
more cutouts within mask 760 onto the electronics layer 770. The
mask 760 is removed, and the electronics layer 770 and conductive
adhesive 750 are applied to the conductive electrical leads 740. If
electronics 770 do not already include a waterproof upper coating,
a flexible and waterproof material 780 is applied to protect the
electronics layer 770.
[0024] FIG. 8 is a block diagram illustrating an electronic textile
device in the example form of an electronic device 800, within
which a set or sequence of instructions may be executed to cause
the machine to perform any one of the methodologies discussed
herein, according to an example embodiment. In alternative
embodiments, the electronic device 800 operates as a standalone
device or may be connected (e.g., networked) to other machines. In
a networked deployment, the electronic device 800 may operate in
the capacity of either a server or a client machine in
server-client network environments, or it may act as a peer machine
in peer-to-peer (or distributed) network environments. The
electronic device 800 may be an integrated circuit (IC), a portable
electronic device, a personal computer (PC), a tablet PC, a hybrid
tablet, a personal digital assistant (PDA), a mobile telephone, or
any electronic device 800 capable of executing instructions
(sequential or otherwise) that specify actions to be taken by that
machine to detect a user input. Further, while only a single
electronic device 800 is illustrated, the terms "machine" or
"electronic device" shall also be taken to include any collection
of machines or devices that individually or jointly execute a set
(or multiple sets) of instructions to perform any one or more of
the methodologies discussed herein. Similarly, the term
"processor-based system" shall be taken to include any set of one
or more machines that are controlled by or operated by a processor
(e.g., a computer) to execute instructions, individually or
jointly, to perform any one or more of the methodologies discussed
herein.
[0025] Example electronic device 800 includes at least one
processor 802 (e.g., a central processing unit (CPU), a graphics
processing unit (GPU) or both, processor cores, compute nodes,
etc.), a main memory 804 and a static memory 806, which communicate
with each other via a link 808 (e.g., bus). In an example, the
"processor-based system" includes a system with a single processor
802 or a system with multiple processors functioning as nodes
within a distributed network, where the nodes are located in
different parts of the garment. The electronic device 800 may
further include a display unit 812, where the display unit 812 may
include a single component that provides a user-readable display
and a protective layer, or another display type. The electronic
device 800 may further include an input device 814, such as a
microphone, a pushbutton, a keyboard, an NFC card reader, or a user
interface (UI) navigation device (e.g., a mouse or touch-sensitive
input). The electronic device 800 may additionally include a
storage device 816, such as a drive unit. The electronic device 800
may additionally include a signal generation device 818 to provide
audible or visual feedback, such as a speaker to provide an audible
feedback or one or more LEDs to provide a visual feedback. The
electronic device 800 may include a network interface device 820.
The electronic device 800 may additionally include one or more
additional sensors 810, such as a global positioning system (GPS)
sensor, compass, accelerometer, inertial measurement unit,
biometric sensor, or other sensor. Multiple sensors 810 may be
function independently or in conjunction, such as using multiple
sensor nodes attached in various locations to the same garment or
textile.
[0026] The storage device 816 includes a machine-readable medium
822 on which is stored one or more sets of data structures and
instructions 824 (e.g., software) embodying or utilized by any one
or more of the methodologies or functions described herein. The
instructions 824 may also reside, completely or at least partially,
within the main memory 804, static memory 806, and/or within the
processor 802 during execution thereof by the electronic device
800. The main memory 804, static memory 806, and the processor 802
may also constitute machine-readable media.
[0027] While the machine-readable medium 822 is illustrated in an
example embodiment to be a single medium, the term
"machine-readable medium" may include a single medium or multiple
media (e.g., a centralized or distributed database, and/or
associated caches and servers) that store the one or more
instructions 824. The term "machine-readable medium" shall also be
taken to include any tangible medium that is capable of storing,
encoding or carrying instructions for execution by the machine and
that cause the machine to perform any one or more of the
methodologies of the present disclosure or that is capable of
storing, encoding or carrying data structures utilized by or
associated with such instructions. The term "machine-readable
medium" shall accordingly be taken to include, but not be limited
to, solid-state memories, and optical and magnetic media. Specific
examples of machine-readable media include non-volatile memory,
including but not limited to, by way of example, semiconductor
memory devices (e.g., electrically programmable read-only memory
(EPROM), electrically erasable programmable read-only memory
(EEPROM)) and flash memory devices; magnetic disks such as internal
hard disks and removable disks: magneto-optical disks; and CD-ROM
and DVD-ROM disks.
[0028] The instructions 824 may further be transmitted or received
over a communications network 826 using a transmission medium via
the network interface device 820 utilizing any one of a number of
well-known transfer protocols (e.g., HTTP). Examples of
communication networks include a local area network (LAN), a wide
area network (WAN), the Internet, mobile telephone networks, and
wireless data networks (e.g., Wi-Fi, NFC, Bluetooth, Bluetooth LE,
3G, 3G LTE/LTE-A, WiMAX networks, etc.). The term "transmission
medium" shall be taken to include any intangible medium that is
capable of storing, encoding, or carrying instructions for
execution by the machine, and includes digital or analog
communications signals or other intangible medium to facilitate
communication of such software.
[0029] To better illustrate the method and apparatuses disclosed
herein, a non-limiting list of embodiments is provided here.
[0030] Example 1 is a stretchable and flexible electronic apparatus
comprising: a waterproof insulating layer attached to a garment; a
plurality of flexible conductive leads attached to the waterproof
material; and an electronics assembly attached to the waterproof
material, the plurality of flexible conductive leads mechanically
and conductively coupled to a corresponding plurality of
electronics contacts on the electronics assembly.
[0031] In Example 2, the subject matter of Example 1 optionally
includes the electronics assembly including at least one of a
flexible electronics assembly, a stretchable electronics assembly,
and a rigid electronics assembly.
[0032] In Example 3, the subject matter of any one or more of
Examples 1-2 optionally include a conductive adhesive disposed
through a plurality of cutouts of a removable mask onto
predetermined conductive portions of the electronics assembly, the
predetermined conductive portions corresponding to the plurality of
flexible conductive leads.
[0033] In Example 4, the subject matter of Example 3 optionally
includes a non-conductive electronics adhesive layer disposed on
the electronics assembly by the removable mask.
[0034] In Example 5, the subject matter of any one or more of
Examples 3-4 optionally include wherein the conductive adhesive
provides the mechanical and conductive coupling between the
plurality of flexible conductive leads and the corresponding
plurality of electronics contacts on the electronics assembly.
[0035] In Example 6, the subject matter of any one or more of
Examples 3-5 optionally include wherein the conductive adhesive
includes at least one of a conductive epoxy, a conductive glue, and
a joint-reinforced conductive paste.
[0036] In Example 7, the subject matter of any one or more of
Examples 3-6 optionally include wherein the conductive adhesive
includes a low-temperature solder, the low-temperature solder
applied in solid form and subsequently reflowed to provide the
mechanical and conductive coupling.
[0037] In Example 8, the subject matter of any one or more of
Examples 3-7 optionally include wherein the conductive adhesive
includes a biocompatible liquid metal alloy.
[0038] In Example 9, the subject matter of any one or more of
Examples 1-8 optionally include a flexible waterproof upper layer
attached to the electronics assembly.
[0039] In Example 10, the subject matter of Example 9 optionally
includes an upper non-conductive adhesive layer disposed between
the flexible waterproof upper layer and the electronics
assembly.
[0040] In Example 11, the subject matter of any one or more of
Examples 1-10 optionally include a lower non-conductive adhesive
layer disposed between the plurality of flexible conductive leads
and the waterproof insulating layer.
[0041] Example 12 is a stretchable and flexible electronic method
comprising: attaching a waterproof insulating layer to a garment;
attaching a plurality of flexible conductive leads to the
waterproof material; and attaching an electronics assembly to the
waterproof material, the plurality of flexible conductive leads
mechanically and conductively coupled to a corresponding plurality
of electronics contacts on the electronics assembly.
[0042] In Example 13, the subject matter of Example 12 optionally
includes the electronics assembly including at least one of a
flexible electronics assembly, a stretchable electronics assembly,
and a rigid electronics assembly.
[0043] In Example 14, the subject matter of any one or more of
Examples 12-13 optionally include disposing a removable mask on the
electronics assembly; disposing a conductive adhesive through the
plurality of cutouts onto predetermined conductive portions of the
electronics assembly, the predetermined conductive portions
corresponding to the plurality of flexible conductive leads; and
removing the removable mask from the electronics assembly.
[0044] In Example 15, the subject matter of Example 14 optionally
includes disposing a non-conductive electronics adhesive layer on
the electronics assembly.
[0045] In Example 16, the subject matter of Example 15 optionally
includes wherein: the removable mask includes the non-conductive
electronics adhesive layer; and the non-conductive electronics
adhesive layer is disposed on the electronics assembly by disposing
the removable mask and removing the removable mask from the
electronics assembly.
[0046] In Example 17, the subject matter of any one or more of
Examples 14-16 optionally include wherein the conductive adhesive
provides the mechanical and conductive coupling between the
plurality of flexible conductive leads and the corresponding
plurality of electronics contacts on the electronics assembly.
[0047] In Example 18, the subject matter of any one or more of
Examples 14-17 optionally include wherein disposing the conductive
adhesive includes disposing at least one of a conductive epoxy, a
conductive glue, and a joint-reinforced conductive paste.
[0048] In Example 19, the subject matter of any one or more of
Examples 14-18 optionally include wherein disposing the conductive
adhesive includes disposing a low-temperature solder in solid form,
the method further including reflowing the low-temperature solder
to provide the mechanical and conductive coupling.
[0049] In Example 20, the subject matter of any one or more of
Examples 14-19 optionally include wherein disposing the conductive
adhesive includes disposing a biocompatible liquid metal alloy.
[0050] In Example 21, the subject matter of any one or more of
Examples 12-20 optionally include attaching a flexible waterproof
upper layer to the electronics assembly.
[0051] In Example 22, the subject matter of Example 21 optionally
includes disposing an upper non-conductive adhesive layer between
the flexible waterproof upper layer and the electronics
assembly.
[0052] In Example 23, the subject matter of any one or more of
Examples 12-22 optionally include disposing a lower non-conductive
adhesive layer between the plurality of flexible conductive leads
and the waterproof insulating layer.
[0053] Example 24 is at least one machine-readable medium including
instructions, which when executed by a computing system, cause the
computing system to perform any of the methods of Examples
12-23.
[0054] Example 25 is an apparatus comprising means for performing
any of the methods of Examples 12-23.
[0055] Example 26 is at least one machine-readable storage medium,
comprising a plurality of instructions that, responsive to being
executed with processor circuitry of a computer-controlled device,
cause the computer-controlled device to: attach a waterproof
insulating layer to a garment; attach an plurality of flexible
conductive leads to the waterproof material; and attach an
electronics assembly to the waterproof material, the plurality of
flexible conductive leads mechanically and conductively coupled to
a corresponding plurality of electronics contacts on the
electronics assembly.
[0056] In Example 27, the subject matter of Example 26 optionally
includes the electronics assembly including at least one of a
flexible electronics assembly, a stretchable electronics assembly,
and a rigid electronics assembly.
[0057] In Example 28, the subject matter of any one or more of
Examples 26-27 optionally include the instructions further causing
the computer-controlled device to: disposing a removable mask on
the electronics assembly: disposing a conductive adhesive through
the plurality of cutouts onto predetermined conductive portions of
the electronics assembly, the predetermined conductive portions
corresponding to the plurality of flexible conductive leads; and
removing the removable mask from the electronics assembly.
[0058] In Example 29, the subject matter of Example 28 optionally
includes the instructions further causing the computer-controlled
device to disposing a non-conductive electronics adhesive layer on
the electronics assembly.
[0059] In Example 30, the subject matter of Example 29 optionally
includes wherein: the removable mask includes the non-conductive
electronics adhesive layer: and the non-conductive electronics
adhesive layer is disposed on the electronics assembly by disposing
the removable mask and removing the removable mask from the
electronics assembly.
[0060] In Example 31, the subject matter of any one or more of
Examples 28-30 optionally include wherein the conductive adhesive
provides the mechanical and conductive coupling between the
plurality of flexible conductive leads and the corresponding
plurality of electronics contacts on the electronics assembly.
[0061] In Example 32, the subject matter of any one or more of
Examples 28-31 optionally include wherein the conductive adhesive
includes at least one of a conductive epoxy, a conductive glue, and
a joint-reinforced conductive paste.
[0062] In Example 33, the subject matter of any one or more of
Examples 28-32 optionally include wherein the conductive adhesive
includes a low-temperature solder in solid form, the instructions
further causing the computer-controlled device to reflowing the
low-temperature solder to provide the mechanical and conductive
coupling.
[0063] In Example 34, the subject matter of any one or more of
Examples 28-33 optionally include wherein the conductive adhesive
includes a biocompatible liquid metal alloy.
[0064] In Example 35, the subject matter of any one or more of
Examples 26-34 optionally include the instructions further causing
the computer-controlled device to attach a flexible waterproof
upper layer to the electronics assembly.
[0065] In Example 36, the subject matter of Example 35 optionally
includes the instructions further causing the computer-controlled
device to dispose an upper non-conductive adhesive layer between
the flexible waterproof upper layer and the electronics
assembly.
[0066] In Example 37, the subject matter of any one or more of
Examples 26-36 optionally include the instructions further causing
the computer-controlled device to dispose a lower non-conductive
adhesive layer between the plurality of flexible conductive leads
and the waterproof insulating layer.
[0067] Example 38 is a stretchable and flexible electronic
apparatus comprising: means for attaching a waterproof insulating
layer to a garment; means for attaching a plurality of flexible
conductive leads to the waterproof material: and means for
attaching an electronics assembly to the waterproof material, the
plurality of flexible conductive leads mechanically and
conductively coupled to a corresponding plurality of electronics
contacts on the electronics assembly.
[0068] In Example 39, the subject matter of Example 38 optionally
includes the electronics assembly including at least one of a
flexible electronics assembly, a stretchable electronics assembly,
and a rigid electronics assembly.
[0069] In Example 40, the subject matter of any one or more of
Examples 38-39 optionally include means for disposing a removable
mask on the electronics assembly: means for disposing a conductive
adhesive through the plurality of cutouts onto predetermined
conductive portions of the electronics assembly, the predetermined
conductive portions corresponding to the plurality of flexible
conductive leads; and means for removing the removable mask from
the electronics assembly.
[0070] In Example 41, the subject matter of Example 40 optionally
includes means for disposing a non-conductive electronics adhesive
layer on the electronics assembly.
[0071] In Example 42, the subject matter of Example 41 optionally
includes wherein: the removable mask includes the non-conductive
electronics adhesive layer; and the non-conductive electronics
adhesive layer is disposed on the electronics assembly by disposing
the removable mask and removing the removable mask from the
electronics assembly.
[0072] In Example 43, the subject matter of any one or more of
Examples 40-42 optionally include wherein the conductive adhesive
provides the mechanical and conductive coupling between the
plurality of flexible conductive leads and the corresponding
plurality of electronics contacts on the electronics assembly.
[0073] In Example 44, the subject matter of any one or more of
Examples 40-43 optionally include wherein the conductive adhesive
includes at least one of a conductive epoxy, a conductive glue, and
a joint-reinforced conductive paste.
[0074] In Example 45, the subject matter of any one or more of
Examples 40-44 optionally include wherein the conductive adhesive
includes disposing a low-temperature solder in solid form, the
apparatus further including means for reflowing the low-temperature
solder to provide the mechanical and conductive coupling.
[0075] In Example 46, the subject matter of any one or more of
Examples 40-45 optionally include wherein the conductive adhesive
includes a biocompatible liquid metal alloy.
[0076] In Example 47, the subject matter of any one or more of
Examples 38-46 optionally include means for attaching a flexible
waterproof upper layer to the electronics assembly.
[0077] In Example 48, the subject matter of Example 47 optionally
includes means for disposing an upper non-conductive adhesive layer
between the flexible waterproof upper layer and the electronics
assembly.
[0078] In Example 49, the subject matter of any one or more of
Examples 38-48 optionally include means for disposing a lower
non-conductive adhesive layer between the plurality of flexible
conductive leads and the waterproof insulating layer.
[0079] The above detailed description includes references to the
accompanying drawings, which form a part of the detailed
description. The drawings show, by way of illustration, specific
embodiments in which the invention can be practiced. These
embodiments are also referred to herein as "examples." Such
examples can include elements in addition to those shown or
described. However, the present inventors also contemplate examples
in which only those elements shown or described are provided.
Moreover, the present inventors also contemplate examples using any
combination or permutation of those elements shown or described (or
one or more aspects thereof), either with respect to a particular
example (or one or more aspects thereof), or with respect to other
examples (or one or more aspects thereof) shown or described
herein.
[0080] In this document, the terms "a", or "an" are used, as is
common in patent documents, to include one or more than one,
independent of any other instances or usages of "at least one" or
"one or more." In this document, the term "or" is used to refer to
a nonexclusive or, such that "A or B" includes "A but not B," "B
but not A," and "A and B," unless otherwise indicated. In this
document, the terms "including" and "in which" are used as the
plain-English equivalents of the respective terms "comprising" and
"wherein." Also, in the following claims, the terms "including" and
"comprising" are open-ended, that is, a system, device, article,
composition, formulation, or process that includes elements in
addition to those listed after such a term in a claim are still
deemed to fall within the scope of that claim. Moreover, in the
following claims, the terms "first," "second," and "third," etc.
are used merely as labels, and are not intended to impose numerical
requirements on their objects.
[0081] The above description is intended to be illustrative, and
not restrictive. For example, the above-described examples (or one
or more aspects thereof) may be used in combination with each
other. Other embodiments can be used, such as by one of ordinary
skill in the art upon reviewing the above description. The Abstract
is provided to allow the reader to ascertain quickly the nature of
the technical disclosure. It is submitted with the understanding
that it will not be used to interpret or limit the scope or meaning
of the claims. In the above Detailed Description, various features
may be grouped together to streamline the disclosure. This should
not be interpreted as intending that an unclaimed disclosed feature
is essential to any claim. Rather, inventive subject matter may lie
in less than all features of a particular disclosed embodiment.
Thus, the following claims are hereby incorporated into the
Detailed Description, with each claim standing on its own as a
separate embodiment, and it is contemplated that such embodiments
can be combined with each other in various combinations or
permutations. The scope should be determined with reference to the
appended claims, along with the full scope of equivalents to which
such claims are entitled.
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