| Patent | Date |
|---|
Package with side-radiating wave launcher and waveguide
Grant 11,437,706 - Dogiamis , et al. September 6, 2 | 2022-09-06 |
Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications
Grant 11,430,751 - Aleksov , et al. August 30, 2 | 2022-08-30 |
Diodes for package substrate electrostatic discharge (ESD) protection
Grant 11,424,239 - Aleksov , et al. August 23, 2 | 2022-08-23 |
Inorganic piezoelectric materials formed on fibers and applications thereof
Grant 11,421,376 - Liff , et al. August 23, 2 | 2022-08-23 |
Microelectronic Assemblies
App 20220254754 - ELSHERBINI; Adel A. ; et al. | 2022-08-11 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20220231394 - ELSHERBINI; Adel A. ; et al. | 2022-07-21 |
Multi-chip package with high density interconnects
Grant 11,393,766 - Aleksov , et al. July 19, 2 | 2022-07-19 |
Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements
Grant 11,394,094 - Kamgaing , et al. July 19, 2 | 2022-07-19 |
Embedded very high density (VHD) layer
Grant 11,387,187 - Collins , et al. July 12, 2 | 2022-07-12 |
Microelectronic Assemblies
App 20220216158 - Aleksov; Aleksandar ; et al. | 2022-07-07 |
Microelectronic Package With Substrate-integrated Components
App 20220201843 - Dogiamis; Georgios ; et al. | 2022-06-23 |
Carrier For Microelectronic Assemblies Having Direct Bonding
App 20220199450 - Liff; Shawna M. ; et al. | 2022-06-23 |
Shield Structures In Microelectronic Assemblies Having Direct Bonding
App 20220199546 - Elsherbini; Adel A. ; et al. | 2022-06-23 |
Waveguide With Self-aligned Mirror In Package For Long Range Chip-to-chip Communications
App 20220196914 - ECTON; Jeremy D. ; et al. | 2022-06-23 |
Hermetic Sealing Structures In Microelectronic Assemblies Having Direct Bonding
App 20220189861 - Aleksov; Aleksandar ; et al. | 2022-06-16 |
Inter-component Material In Microelectronic Assemblies Having Direct Bonding
App 20220189850 - Liff; Shawna M. ; et al. | 2022-06-16 |
Inter-component Material In Microelectronic Assemblies Having Direct Bonding
App 20220189839 - Eid; Feras ; et al. | 2022-06-16 |
Multi-filter Die
App 20220190806 - Dogiamis; Georgios ; et al. | 2022-06-16 |
Electronic device fabric integration
Grant 11,360,512 - Dabby , et al. June 14, 2 | 2022-06-14 |
Electrostatic Discharge Protection In Integrated Circuits
App 20220181276 - Elsherbini; Adel A. ; et al. | 2022-06-09 |
Integrated Circuit Package Supports
App 20220181166 - Darmawikarta; Kristof Kuwawi ; et al. | 2022-06-09 |
Package spark gap structure
Grant 11,348,882 - Aleksov , et al. May 31, 2 | 2022-05-31 |
Microelectronic assemblies
Grant 11,348,897 - Elsherbini , et al. May 31, 2 | 2022-05-31 |
Microelectronic assemblies
Grant 11,335,641 - Aleksov , et al. May 17, 2 | 2022-05-17 |
Die Backend Diodes For Electrostatic Discharge (esd) Protection
App 20220149036 - Aleksov; Aleksandar ; et al. | 2022-05-12 |
Low loss and low cross talk transmission lines having l-shaped cross sections
Grant 11,329,358 - Elsherbini , et al. May 10, 2 | 2022-05-10 |
Zero-misalignment two-via structures using photoimageable dielectric film buildup film, and transparent substrate with electroless plating
Grant 11,328,996 - Strong , et al. May 10, 2 | 2022-05-10 |
Capacitor-wirebond pad structures for integrated circuit packages
Grant 11,328,986 - Aleksov , et al. May 10, 2 | 2022-05-10 |
Multi-filter die
Grant 11,316,497 - Dogiamis , et al. April 26, 2 | 2022-04-26 |
Microelectronic package with substrate-integrated components
Grant 11,310,907 - Dogiamis , et al. April 19, 2 | 2022-04-19 |
Integrated circuit package supports
Grant 11,309,192 - Darmawikarta , et al. April 19, 2 | 2022-04-19 |
Waveguide coupling systems and methods
Grant 11,309,619 - Oster , et al. April 19, 2 | 2022-04-19 |
Electrostatic discharge protection in integrated circuits
Grant 11,296,040 - Elsherbini , et al. April 5, 2 | 2022-04-05 |
Conductive Contact Structures For Electrostatic Discharge Protection In Integrated Circuits
App 20220102270 - Elsherbini; Adel A. ; et al. | 2022-03-31 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20220102261 - ELSHERBINI; Adel A. ; et al. | 2022-03-31 |
Low Leakage Thin Film Capacitors Using Titanium Oxide Dielectric With Conducting Noble Metal Oxide Electrodes
App 20220102483 - Sounart; Thomas ; et al. | 2022-03-31 |
Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity
Grant 11,289,431 - Eid , et al. March 29, 2 | 2022-03-29 |
Direct Bonding In Microelectronic Assemblies
App 20220093492 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Capacitors And Resistors At Direct Bonding Interfaces In Microelectronic Assemblies
App 20220093725 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Microelectronic Assemblies With Inductors In Direct Bonding Regions
App 20220093547 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Microelectronic Assemblies With Inductors In Direct Bonding Regions
App 20220093546 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Conductive Route Patterning For Electronic Substrates
App 20220093520 - Ecton; Jeremy D. ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093517 - Aleksov; Aleksandar ; et al. | 2022-03-24 |
Package-integrated Bistable Switch For Electrostatic Discharge (esd) Protection
App 20220093531 - Eid; Feras ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093561 - Eid; Feras ; et al. | 2022-03-24 |
In-package Rf Waveguides As High Bandwidth Chip-to-chip Interconnects And Methods For Using The Same
App 20220084965 - ALEKSOV; Aleksandar ; et al. | 2022-03-17 |
Zero-misalignment Two-via Structures
App 20220084931 - STRONG; Veronica ; et al. | 2022-03-17 |
Radio Frequency Antennas And Waveguides For Communication Between Integrated Circuit Devices
App 20220084962 - Aleksov; Aleksandar ; et al. | 2022-03-17 |
Electroless Metal-defined Thin Pad First Level Interconnects For Lithographically Defined Vias
App 20220084927 - Aleksov; Aleksandar ; et al. | 2022-03-17 |
Die backend diodes for electrostatic discharge (ESD) protection
Grant 11,264,373 - Aleksov , et al. March 1, 2 | 2022-03-01 |
Polarization defined zero misalignment vias for semiconductor packaging
Grant 11,264,239 - Tanaka , et al. March 1, 2 | 2022-03-01 |
Dual-damascene zero-misalignment-via process for semiconductor packaging
Grant 11,264,307 - Aleksov , et al. March 1, 2 | 2022-03-01 |
Electroless metal-defined thin pad first level interconnects for lithographically defined vias
Grant 11,257,745 - Aleksov , et al. February 22, 2 | 2022-02-22 |
Semiconductor package having a coaxial first layer interconnect
Grant 11,244,912 - Vadlamani , et al. February 8, 2 | 2022-02-08 |
Conductive contact structures for electrostatic discharge protection in integrated circuits
Grant 11,239,155 - Elsherbini , et al. February 1, 2 | 2022-02-01 |
High performance integrated RF passives using dual lithography process
Grant 11,227,825 - Elsherbini , et al. January 18, 2 | 2022-01-18 |
Package-integrated bistable switch for electrostatic discharge (ESD) protection
Grant 11,222,856 - Eid , et al. January 11, 2 | 2022-01-11 |
Zero-misalignment two-via structures
Grant 11,222,836 - Strong , et al. January 11, 2 | 2022-01-11 |
Microelectronic Package Electrostatic Discharge (esd) Protection
App 20210410343 - Strong; Veronica Aleman ; et al. | 2021-12-30 |
In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same
Grant 11,211,345 - Aleksov , et al. December 28, 2 | 2021-12-28 |
Methods For Conductively Coating Millimeter Waveguides
App 20210376437 - Aleksov; Aleksandar ; et al. | 2021-12-02 |
Airgap Structures For High Speed Signal Integrity
App 20210375746 - Feng; Hongxia ; et al. | 2021-12-02 |
Electrostatic discharge protection in integrated circuits
Grant 11,189,580 - Elsherbini , et al. November 30, 2 | 2021-11-30 |
High-density Interconnects For Integrated Circuit Packages
App 20210358855 - Strong; Veronica ; et al. | 2021-11-18 |
Rfic Having Coaxial Interconnect And Molded Layer
App 20210358872 - PIETAMBARAM; Srinivas V. ; et al. | 2021-11-18 |
First Layer Interconnect First On Carrier Approach For Emib Patch
App 20210343673 - LIU; Changhua ; et al. | 2021-11-04 |
Interconnection Structure Fabrication Using Grayscale Lithography
App 20210343635 - Swan; Johanna ; et al. | 2021-11-04 |
Dual-substrate waveguide filter
Grant 11,158,917 - Aleksov , et al. October 26, 2 | 2021-10-26 |
Microelectronic package electrostatic discharge (ESD) protection
Grant 11,147,197 - Strong , et al. October 12, 2 | 2021-10-12 |
Fabricating An Rf Filter On A Semiconductor Package Using Selective Seeding
App 20210305668 - MARIN; Brandon C. ; et al. | 2021-09-30 |
High-density interconnects for integrated circuit packages
Grant 11,133,263 - Strong , et al. September 28, 2 | 2021-09-28 |
Inorganic Dies With Organic Interconnect Layers And Related Structures
App 20210296175 - Aleksov; Aleksandar ; et al. | 2021-09-23 |
RFIC having coaxial interconnect and molded layer
Grant 11,107,781 - Pietambaram , et al. August 31, 2 | 2021-08-31 |
Semiconductor Package Including A Modular Side Radiating Waveguide Launcher
App 20210265288 - DOGIAMIS; GEORGIOS ; et al. | 2021-08-26 |
Microelectronic Devices Designed With Mold Patterning To Create Package-level Components For High Frequency Communication Systems
App 20210265732 - EID; Feras ; et al. | 2021-08-26 |
Interconnection structure fabrication using grayscale lithography
Grant 11,101,205 - Swan , et al. August 24, 2 | 2021-08-24 |
Methods for conductively coating millimeter waveguides
Grant 11,095,012 - Aleksov , et al. August 17, 2 | 2021-08-17 |
First layer interconnect first on carrier approach for EMIB patch
Grant 11,088,103 - Liu , et al. August 10, 2 | 2021-08-10 |
Fabricating an RF filter on a semiconductor package using selective seeding
Grant 11,081,768 - Marin , et al. August 3, 2 | 2021-08-03 |
Microelectronic Package With Mold-integrated Components
App 20210233856 - Dogiamis; Georgios ; et al. | 2021-07-29 |
Inorganic dies with organic interconnect layers and related structures
Grant 11,062,947 - Aleksov , et al. July 13, 2 | 2021-07-13 |
Electrostatic Discharge Protection In Integrated Circuits Using Materials With Optically Controlled Electrical Conductivity
App 20210202403 - Eid; Feras ; et al. | 2021-07-01 |
Electrostatic Discharge Protection In Integrated Circuits Using Positive Temperature Coefficient Material
App 20210202404 - Eid; Feras ; et al. | 2021-07-01 |
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems
Grant 11,050,155 - Eid , et al. June 29, 2 | 2021-06-29 |
Inorganic Dies With Organic Interconnect Layers And Related Structures
App 20210193518 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Inorganic Dies With Organic Interconnect Layers And Related Structures
App 20210193519 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Electrostatic Discharge Protection In Integrated Circuits
App 20210193596 - Elsherbini; Adel A. ; et al. | 2021-06-24 |
Die Backend Diodes For Electrostatic Discharge (esd) Protection
App 20210193645 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Package-integrated Bistable Switch For Electrostatic Discharge (esd) Protection
App 20210193597 - Eid; Feras ; et al. | 2021-06-24 |
Conductive Contact Structures For Electrostatic Discharge Protection In Integrated Circuits
App 20210193571 - Elsherbini; Adel A. ; et al. | 2021-06-24 |
Diodes For Package Substrate Electrostatic Discharge (esd) Protection
App 20210193644 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Electrostatic Discharge Protection In Integrated Circuits
App 20210193595 - Elsherbini; Adel A. ; et al. | 2021-06-24 |
Multi-filter Die
App 20210175873 - Dogiamis; Georgios ; et al. | 2021-06-10 |
Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric
Grant 11,031,666 - Elsherbini , et al. June 8, 2 | 2021-06-08 |
Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer
Grant 11,024,933 - Rawlings , et al. June 1, 2 | 2021-06-01 |
Microelectronic Package With Substrate-integrated Components
App 20210160999 - Dogiamis; Georgios ; et al. | 2021-05-27 |
Adaptable displays using piezoelectric actuators
Grant 11,016,288 - Oster , et al. May 25, 2 | 2021-05-25 |
Microelectronic package with mold-integrated components
Grant 11,011,470 - Dogiamis , et al. May 18, 2 | 2021-05-18 |
Package Spark Gap Structure
App 20210143111 - Aleksov; Aleksandar ; et al. | 2021-05-13 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20210134726 - BRAUNISCH; Henning ; et al. | 2021-05-06 |
Monolithic die with acoustic wave resonators and active circuitry
Grant 10,998,879 - Kamgaing , et al. May 4, 2 | 2021-05-04 |
Organic interposers for integrated circuit packages
Grant 10,998,272 - Aleksov , et al. May 4, 2 | 2021-05-04 |
Microelectronic Package With Mold-integrated Components
App 20210125931 - Dogiamis; Georgios ; et al. | 2021-04-29 |
Semiconductor package comprising chiplets disposed on a substrate which are electromagnetically coupled by dielectric waveguides and a computing networks formed therefrom
Grant 10,992,017 - Kamgaing , et al. April 27, 2 | 2021-04-27 |
Microelectronic Package Electrostatic Discharge (esd) Protection
App 20210120708 - Strong; Veronica Aleman ; et al. | 2021-04-22 |
Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems
Grant 10,976,822 - Dogiamis , et al. April 13, 2 | 2021-04-13 |
Process for creating piezo-electric mirrors in package
Grant 10,969,574 - Oster , et al. April 6, 2 | 2021-04-06 |
Piezo actuators for optical beam steering applications
Grant 10,969,576 - Aleksov , et al. April 6, 2 | 2021-04-06 |
Package power delivery using plane and shaped vias
Grant 10,971,416 - Bharath , et al. April 6, 2 | 2021-04-06 |
Wearable sensing patch technologies
Grant 10,959,633 - Baxi , et al. March 30, 2 | 2021-03-30 |
Systems, methods and apparatuses for implementing increased human perception of haptic feedback systems
Grant 10,964,178 - Aleksov , et al. March 30, 2 | 2021-03-30 |
Dual-substrate Waveguide Filter
App 20210091443 - Aleksov; Aleksandar ; et al. | 2021-03-25 |
High-density Interconnects For Integrated Circuit Packages
App 20210082825 - Strong; Veronica ; et al. | 2021-03-18 |
Dual Sided Thermal Management Solutions For Integrated Circuit Packages
App 20210080500 - Braunisch; Henning ; et al. | 2021-03-18 |
Organic Interposers For Integrated Circuit Packages
App 20210082822 - Aleksov; Aleksandar ; et al. | 2021-03-18 |
System comprising first and second servers interconnected by a plurality of joined waveguide sections
Grant 10,950,919 - Kamgaing , et al. March 16, 2 | 2021-03-16 |
Radio frequency (RF) module with shared inductor
Grant 10,951,248 - Kamgaing , et al. March 16, 2 | 2021-03-16 |
Interconnection Structure Fabrication Using Grayscale Lithography
App 20210074620 - Swan; Johanna ; et al. | 2021-03-11 |
Package Substrate With High-density Interconnect Layer Having Pillar And Via Connections For Fan Out Scaling
App 20210066232 - May; Robert Alan ; et al. | 2021-03-04 |
Monolithic Die With Acoustic Wave Resonators And Active Circuitry
App 20210067132A1 - | 2021-03-04 |
Capacitor-wirebond Pad Structures For Integrated Circuit Packages
App 20210066184 - Aleksov; Aleksandar ; et al. | 2021-03-04 |
Tunable Capacitor Arrangements In Integrated Circuit Package Substrates
App 20210066265 - Eid; Feras ; et al. | 2021-03-04 |
Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates
Grant 10,937,594 - Sounart , et al. March 2, 2 | 2021-03-02 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,923,429 - Braunisch , et al. February 16, 2 | 2021-02-16 |
Thermal Management In Integrated Circuit Packages
App 20210041182 - Eid; Feras ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043541 - Eid; Feras ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043543 - Eid; Feras ; et al. | 2021-02-11 |
Bridge For Radio Frequency (rf) Multi-chip Modules
App 20210044030 - Aleksov; Aleksandar ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043544 - Eid; Feras ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043573 - Eid; Feras ; et al. | 2021-02-11 |
Integrated Filter Stack For A Radio Frequency (rf) Front-end Module (fem)
App 20210036685 - Kamgaing; Telesphor ; et al. | 2021-02-04 |
Integrated Radio Frequency (rf) Front-end Module (fem)
App 20210036682 - Kamgaing; Telesphor ; et al. | 2021-02-04 |
Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling
Grant 10,872,872 - May , et al. December 22, 2 | 2020-12-22 |
Method For Fabricating Multiplexed Hollow Waveguides Of Variable Type On A Semiconductor Package
App 20200395317 - MARIN; Brandon C. ; et al. | 2020-12-17 |
Fabricating An Rf Filter On A Semiconductor Package Using Selective Seeding
App 20200373261 - MARIN; Brandon C. ; et al. | 2020-11-26 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20200357747 - BRAUNISCH; Henning ; et al. | 2020-11-12 |
In Situ Package Integrated Thin Film Capacitors For Power Delivery
App 20200350303 - SOUNART; Thomas ; et al. | 2020-11-05 |
Piezoelectrically actuated mirrors for optical communications
Grant 10,816,733 - Oster , et al. October 27, 2 | 2020-10-27 |
Flexible packaging for a wearable electronic device
Grant 10,820,437 - Aleksov , et al. October 27, 2 | 2020-10-27 |
Multi-chip Package With High Density Interconnects
App 20200321281 - Aleksov; Aleksandar ; et al. | 2020-10-08 |
Method for making a flexible wearable circuit
Grant 10,798,817 - Aleksov , et al. October 6, 2 | 2020-10-06 |
Stacked Platforms With Waveguide Interconnects
App 20200315052 - Kamgaing; Telesphor ; et al. | 2020-10-01 |
Microelectronic Package With Radio Frequency (rf) Chiplet
App 20200303329 - Elsherbini; Adel A. ; et al. | 2020-09-24 |
Waveguide Fan-out
App 20200303327 - Elsherbini; Adel A. ; et al. | 2020-09-24 |
Zero-misalignment Two-via Structures
App 20200294901 - STRONG; Veronica ; et al. | 2020-09-17 |
Multi-package On-board Waveguide Interconnects
App 20200296823 - Kamgaing; Telesphor ; et al. | 2020-09-17 |
Waveguide Interconnect For Packages
App 20200294940 - Dogiamis; Georgios ; et al. | 2020-09-17 |
Through-substrate Waveguide
App 20200294939 - Aleksov; Aleksandar ; et al. | 2020-09-17 |
First Layer Interconnect First On Carrier Approach For Emib Patch
App 20200286847 - LIU; Changhua ; et al. | 2020-09-10 |
Package With Side-radiating Wave Launcher And Waveguide
App 20200280121 - Dogiamis; Georgios ; et al. | 2020-09-03 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,763,216 - Braunisch , et al. Sep | 2020-09-01 |
Microelectronic Assemblies
App 20200273839 - ELSHERBINI; Adel A. ; et al. | 2020-08-27 |
Zero-misalignment Two-via Structures Using Photoimageable Dielectric, Buildup Film, And Electrolytic Plating
App 20200258839 - A1 | 2020-08-13 |
Electroless Metal-defined Thin Pad First Level Interconnects For Lithographically Defined Vias
App 20200258827 - A1 | 2020-08-13 |
Multi-die microelectronic device with integral heat spreader
Grant 10,741,534 - Aleksov , et al. A | 2020-08-11 |
Multi-chip package with high density interconnects
Grant 10,727,185 - Aleksov , et al. | 2020-07-28 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20200235449 - ELSHERBINI; Adel A. ; et al. | 2020-07-23 |
Integrated magnetic inductors for embedded-multi-die interconnect bridge substrates
Grant 10,714,434 - Pietambaram , et al. | 2020-07-14 |
Microelectronic Assemblies
App 20200219816 - Aleksov; Aleksandar ; et al. | 2020-07-09 |
Zero-misalignment Two-via Structures Using Photoimageable Dielectric Film Buildup Film, And Transparent Substrate With Electrole
App 20200219814 - STRONG; Veronica ; et al. | 2020-07-09 |
Integrated Magnetic Inductors For Embedded-multi-die Interconnect Bridge Substrates
App 20200211985 - Pietambaram; Srinivas V. ; et al. | 2020-07-02 |
Microelectronic Assemblies With Via-trace-via Structures
App 20200211949 - Strong; Veronica Aleman ; et al. | 2020-07-02 |
Microelectronic Assemblies Having Conductive Structures With Different Thicknesses
App 20200205279 - Ecton; Jeremy ; et al. | 2020-06-25 |
Integration Of Iii-v Transistors In A Silicon Cmos Stack
App 20200194427 - DEWEY; Gilbert ; et al. | 2020-06-18 |
Flexible electronic system with wire bonds
Grant 10,685,949 - Aleksov , et al. | 2020-06-16 |
Thin electronic package elements using laser spallation
Grant 10,672,701 - Raghunathan , et al. | 2020-06-02 |
Semiconductor Package Having A Coaxial First Layer Interconnect
App 20200168569 - VADLAMANI; Sai ; et al. | 2020-05-28 |
Microelectronic Devices Designed With Package Integrated Variable Capacitors Having Piezoelectric Actuation
App 20200168402 - EID; Feras ; et al. | 2020-05-28 |
Piezoelectric driven switches integrated in organic, flexible displays
Grant 10,658,566 - Liff , et al. | 2020-05-19 |
Alignment of single and multi-mode optical fibers using piezoelectric actuators
Grant 10,649,158 - Swan , et al. | 2020-05-12 |
Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs
Grant 10,651,525 - Elsherbini , et al. | 2020-05-12 |
Surface Finishes With Low Rbtv For Fine And Mixed Bump Pitch Architectures
App 20200135679 - DARMAWAIKARTA; Kristof ; et al. | 2020-04-30 |
Membrane test for mechanical testing of stretchable electronics
Grant 10,634,594 - Mahajan , et al. | 2020-04-28 |
In-package Rf Waveguides As High Bandwidth Chip-to-chip Interconnects And Methods For Using The Same
App 20200118951 - ALEKSOV; Aleksandar ; et al. | 2020-04-16 |
Multi-die Microelectronic Device With Integral Heat Spreader
App 20200105731 - Aleksov; Aleksandar ; et al. | 2020-04-02 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20200075493 - BRAUNISCH; Henning ; et al. | 2020-03-05 |
Microelectronic Devices Designed With Package Integrated Tunable Ferroelectric Capacitors
App 20200075491 - DOGIAMIS; Georgios C. ; et al. | 2020-03-05 |
Package-integrated Piezoelectric Device For Blood-pressure Monitoring Using Wearable Package Systems
App 20200060558 - ALEKSOV; Aleksandar ; et al. | 2020-02-27 |
Piezoelectrically Actuated Mirrors For Optical Communications
App 20200064555 - OSTER; Sasha N. ; et al. | 2020-02-27 |
Microelectronic Devices Designed With 3d Stacked Ultra Thin Package Modules For High Frequency Communications
App 20200066663 - ALEKSOV; Aleksandar ; et al. | 2020-02-27 |
Waveguide connector with tapered slot launcher
Grant 10,566,672 - Elsherbini , et al. Feb | 2020-02-18 |
Microelectronic Devices Designed With Ultra-high-k Dielectric Capacitors Integrated With Package Substrates
App 20200051743 - SOUNART; Thomas L. ; et al. | 2020-02-13 |
Microelectronic Devices Designed With Mold Patterning To Create Package-level Components For High Frequency Communication System
App 20200052404 - EID; Feras ; et al. | 2020-02-13 |
Embedded Very High Density (vhd) Layer
App 20200006236 - Collins; Andrew Paul ; et al. | 2020-01-02 |
Substrate Integrated Thin Film Capacitors Using Amorphous High-k Dielectrics
App 20200006258 - ALEKSOV; Aleksandar ; et al. | 2020-01-02 |
Microelectronic Assemblies Having Interposers
App 20200006235 - Aleksov; Aleksandar ; et al. | 2020-01-02 |
Electronic Device Fabric Integration
App 20200004290 - Dabby; Nadine L. ; et al. | 2020-01-02 |
Rfic Having Coaxial Interconnect And Molded Layer
App 20190393172 - PIETAMBARAM; Srinivas V. ; et al. | 2019-12-26 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,510,669 - Braunisch , et al. Dec | 2019-12-17 |
Integrated Circuit Package Supports
App 20190371621 - Darmawikarta; Kristof Kuwawi ; et al. | 2019-12-05 |
Polarization Defined Zero Misalignment Vias For Semiconductor Packaging
App 20190363059 - TANAKA; Hiroki ; et al. | 2019-11-28 |
Package Substrate With High-density Interconnect Layer Having Pillar And Via Connections For Fan Out Scaling
App 20190363063 - MAY; Robert Alan ; et al. | 2019-11-28 |
Display for stretchable computing device
Grant 10,492,267 - Elsherbini , et al. Nov | 2019-11-26 |
Package Power Delivery Using Plane And Shaped Vias
App 20190355636 - Bharath; Krishna ; et al. | 2019-11-21 |
Dual-damascene Zero-misalignment-via Process For Semiconductor Packaging
App 20190355647 - ALEKSOV; Aleksandar ; et al. | 2019-11-21 |
Via architecture for increased density interface
Grant 10,475,736 - Aleksov , et al. Nov | 2019-11-12 |
Stretchable electronic assembly
Grant 10,477,688 - Aleksov , et al. Nov | 2019-11-12 |
Stretchable electronics fabrication method with strain redistribution layer
Grant 10,468,357 - Dias , et al. No | 2019-11-05 |
Polarization defined zero misalignment vias for semiconductor packaging
Grant 10,453,812 - Tanaka , et al. Oc | 2019-10-22 |
Active Venting Garment Using Piezoelectric Elements
App 20190297975 - ALEKSOV; Aleksandar ; et al. | 2019-10-03 |
Flexible Packaging For A Wearable Electronic Device
App 20190281717 - Aleksov; Aleksandar ; et al. | 2019-09-12 |
Package power delivery using plane and shaped vias
Grant 10,410,939 - Bharath , et al. Sept | 2019-09-10 |
Dual-damascene zero-misalignment-via process for semiconductor packaging
Grant 10,403,564 - Aleksov , et al. Sep | 2019-09-03 |
Lithographacally defined vias for organic package substrate scaling
Grant 10,381,291 - Elsherbini , et al. A | 2019-08-13 |
Assembly architecture employing organic support for compact and improved assembly throughput
Grant 10,368,439 - Elsherbini , et al. July 30, 2 | 2019-07-30 |
Flexible and stretchable optical interconnect in wearable systems
Grant 10,353,146 - Aleksov , et al. July 16, 2 | 2019-07-16 |
Dual-damascene Zero-misalignment-via Process For Semiconductor Packaging
App 20190206767 - ALEKSOV; Aleksandar ; et al. | 2019-07-04 |
Substrate With Variable Height Conductive And Dielectric Elements
App 20190206781 - ALEKSOV; Aleksandar ; et al. | 2019-07-04 |
Thin Film Passive Devices Integrated In A Package Substrate
App 20190206786 - ALEKSOV; Aleksandar ; et al. | 2019-07-04 |
Multi-chip Package With High Density Interconnects
App 20190198447 - Aleksov; Aleksandar ; et al. | 2019-06-27 |
Polarization Defined Zero Misalignment Vias For Semiconductor Packaging
App 20190198467 - Tanaka; Hiroki ; et al. | 2019-06-27 |
Waveguide Topologies For Rack Scale Architecture Servers
App 20190198965 - Kamgaing; Telesphor ; et al. | 2019-06-27 |
Methods For Conductively Coating Millimeter Waveguides
App 20190198961 - Aleksov; Aleksandar ; et al. | 2019-06-27 |
Angle Mount Mm-wave Semiconductor Package
App 20190200451 - OSTER; SASHA ; et al. | 2019-06-27 |
Millimeter Wave Waveguide Connector With Integrated Waveguide Structuring
App 20190190106 - KAMGAING; TELESPHOR ; et al. | 2019-06-20 |
Waveguide Coupling Systems And Methods
App 20190190119 - OSTER; SASHA ; et al. | 2019-06-20 |
Systems, Methods And Apparatuses For Implementing Increased Human Perception Of Haptic Feedback Systems
App 20190188976 - ALEKSOV; Aleksandar ; et al. | 2019-06-20 |
Systems, Methods, And Apparatuses For Implementing Increased Human Perception Of Haptic Feedback Systems
App 20190187798 - DOGIAMIS; Georgios C. ; et al. | 2019-06-20 |
Stretchable electronic assembly
Grant 10,327,330 - Aleksov , et al. | 2019-06-18 |
Stretchable computing device
Grant 10,327,331 - Dabby , et al. | 2019-06-18 |
Package Substrate Integrated Devices
App 20190169020 - ALEKSOV; Aleksandar ; et al. | 2019-06-06 |
Millimeter-wave Holey Waveguides And Multi-material Waveguides
App 20190173149 - Elsherbini; Adel A. ; et al. | 2019-06-06 |
Package assembly with hermetic cavity
Grant 10,314,171 - Aleksov , et al. | 2019-06-04 |
Alignment Of Single And Multi-mode Optical Fibers Using Piezoelectric Actuators
App 20190121038 - SWAN; Johanna M. ; et al. | 2019-04-25 |
Complementary tunneling FET devices and method for forming the same
Grant 10,269,942 - Aleksov | 2019-04-23 |
Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards
Grant 10,263,312 - Oster , et al. | 2019-04-16 |
Waveguide connector with slot launcher
Grant 10,256,521 - Elsherbini , et al. | 2019-04-09 |
Dielectric waveguide bundle including a supporting feature for connecting first and second server boards
Grant 10,249,925 - Dogiamis , et al. | 2019-04-02 |
Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates
Grant 10,251,272 - Aleksov , et al. | 2019-04-02 |
Via Architecture For Increased Density Interface
App 20190096798 - Aleksov; Aleksandar ; et al. | 2019-03-28 |
On-chip Waveguide Networks
App 20190089036 - Kamgaing; Telesphor ; et al. | 2019-03-21 |
Multimode Waveguide
App 20190081705 - Braunisch; Henning ; et al. | 2019-03-14 |
Fabric-based piezoelectric energy harvesting
Grant 10,215,164 - Dabby , et al. Feb | 2019-02-26 |
Gradient encapsulant protection of devices in stretchable electronics
Grant 10,206,277 - Dias , et al. Feb | 2019-02-12 |
Bendable and stretchable electronic devices and methods
Grant 10,204,855 - Levander , et al. Feb | 2019-02-12 |
Wearable Sensing Patch Technologies
App 20190038170 - Baxi; Amit ; et al. | 2019-02-07 |
Dual-sided Package Assembly Processing
App 20190043776 - MALATKAR; Pramod ; et al. | 2019-02-07 |
Package-integrated Piezoelectric Optical Grating Switch Array
App 20190033500 - SOUNART; Thomas L. ; et al. | 2019-01-31 |
Process For Creating Piezo-electric Mirrors In Package
App 20190033575 - OSTER; Sasha N. ; et al. | 2019-01-31 |
Adaptable Displays Using Piezoelectric Actuators
App 20190033576 - OSTER; Sasha N. ; et al. | 2019-01-31 |
Strain Sensitive Piezoelectric System With Optical Indicator
App 20190036004 - EID; Feras ; et al. | 2019-01-31 |
Piezoelectric Driven Switches Integrated In Organic, Flexible Displays
App 20190036002 - LIFF; Shawna M. ; et al. | 2019-01-31 |
Inorganic Piezoelectric Materials Formed On Fibers & Applications Thereof
App 20190032272 - LIFF; Shawna M. ; et al. | 2019-01-31 |
Piezo Actuators For Optical Beam Steering Applications
App 20190025573 - ALEKSOV; Aleksandar ; et al. | 2019-01-24 |
Package-integrated microchannels
Grant 10,186,465 - Eid , et al. Ja | 2019-01-22 |
Microelectronic Devices Designed With Ultra-high-k Dielectric Capacitors Integrated With Package Substrates
App 20190008046 - ALEKSOV; Aleksandar ; et al. | 2019-01-03 |
Package Integrated Passives
App 20190006457 - Aleksov; Aleksandar ; et al. | 2019-01-03 |
Flexible And Stretchable Optical Interconnect In Wearable Systems
App 20190003882 - Aleksov; Aleksandar ; et al. | 2019-01-03 |
Multi-layer Flexible/stretchable Electronic Package For Advanced Wearable Electronics
App 20180376585 - Aleksov; Aleksandar ; et al. | 2018-12-27 |
Improved Package Power Delivery Using Plane And Shaped Vias
App 20180331003 - BHARATH; Krishna ; et al. | 2018-11-15 |
Package substrate first-level-interconnect architecture
Grant 10,121,679 - Aleksov , et al. November 6, 2 | 2018-11-06 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20180315690 - ELSHERBINI; Adel A. ; et al. | 2018-11-01 |
Thin Electronic Package Elements Using Laser Spallation
App 20180308792 - Raghunathan; Vivek ; et al. | 2018-10-25 |
Interconnect alloy material and methods
Grant 10,099,307 - Zhong , et al. October 16, 2 | 2018-10-16 |
Flexible microelectronic systems and methods of fabricating the same
Grant 10,103,037 - Aleksov , et al. October 16, 2 | 2018-10-16 |
Stretchable Electronic Assembly
App 20180295720 - Aleksov; Aleksandar ; et al. | 2018-10-11 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20180288868 - ELSHERBINI; Adel A. ; et al. | 2018-10-04 |
Stretchable embedded electronic package
Grant 10,080,290 - Aleksov , et al. September 18, 2 | 2018-09-18 |
Stretchable Computing Device
App 20180255635 - Dabby; Nadine L. ; et al. | 2018-09-06 |
Lithographacally Defined Vias For Organic Package Substrate Scaling
App 20180233431 - ELSHERBINI; Adel A. ; et al. | 2018-08-16 |
Package-integrated Microchannels
App 20180226310 - EID; Feras ; et al. | 2018-08-09 |
Stretchable and flexible electrical substrate interconnections
Grant 10,039,186 - Baxi , et al. July 31, 2 | 2018-07-31 |
Electronic Device Fabric Integration
App 20180188771 - Dabby; Nadine L. ; et al. | 2018-07-05 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging
Grant 10,008,452 - Ma , et al. June 26, 2 | 2018-06-26 |
Low loss and low cross talk transmission lines using shaped vias
Grant 9,992,859 - Elsherbini , et al. June 5, 2 | 2018-06-05 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20180145031 - BRAUNISCH; Henning ; et al. | 2018-05-24 |
Patch system for in-situ therapeutic treatment
Grant 9,967,040 - Aleksov , et al. May 8, 2 | 2018-05-08 |
Magnetic detachable electrical connections between circuits
Grant 9,954,309 - Eid , et al. April 24, 2 | 2018-04-24 |
Waveguide Bundle Fabrication In Suspended Media Targeting Bend-induced Strain Relief
App 20180097269 - Dogiamis; Georgios C. ; et al. | 2018-04-05 |
Fabrication Process For Ribbon Bundled Millimeter-waveguide
App 20180097268 - Oster; Sasha ; et al. | 2018-04-05 |
Device, System And Method For Detecting Degradation Of A Flexible Circuit
App 20180089984 - Subramanian; Vijay Krishnan ; et al. | 2018-03-29 |
Waveguide Connector With Slot Launcher
App 20180090803 - ELSHERBINI; ADEL A. ; et al. | 2018-03-29 |
Waveguide Connector With Tapered Slot Launcher
App 20180090848 - ELSHERBINI; ADEL A. ; et al. | 2018-03-29 |
Stretchable And Flexible Electrical Substrate Interconnections
App 20180084643 - Baxi; Amit Sudhir ; et al. | 2018-03-22 |
Method of fabricating a stretchable computing device
Grant 9,915,978 - Dabby , et al. March 13, 2 | 2018-03-13 |
Method Of Fabricating A Stretchable Computing Device
App 20180049309 - Elsherbini; Adel A. ; et al. | 2018-02-15 |
Electrical connectors for high density attach to stretchable boards
Grant 9,893,438 - Oster , et al. February 13, 2 | 2018-02-13 |
Magnetic Detachable Electrical Connections Between Circuits
App 20180026393 - Eid; Feras ; et al. | 2018-01-25 |
Patch System For In-situ Therapeutic Treatment
App 20180026730 - Aleksov; Aleksandar ; et al. | 2018-01-25 |
Wellness Monitoring Using A Patch System
App 20180020982 - Elsherbini; Adel A. ; et al. | 2018-01-25 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 9,875,969 - Braunisch , et al. January 23, 2 | 2018-01-23 |
Stretchable Electronics Fabrication Method With Strain Redistribution Layer
App 20180019213 - DIAS; Rajendra C. ; et al. | 2018-01-18 |
Interconnect Alloy Material And Methods
App 20170361390 - Zhong; Ting ; et al. | 2017-12-21 |
Complementary Tunneling Fet Devices And Method For Forming The Same
App 20170365694 - ALEKSOV; Aleksandar | 2017-12-21 |
Structural Brace For Electronic Circuit With Stretchable Substrate
App 20170344055 - Aleksov; Aleksandar ; et al. | 2017-11-30 |
Method of fabricating a stretchable computing device
Grant 9,832,863 - Elsherbini , et al. November 28, 2 | 2017-11-28 |
Organic thin film passivation of metal interconnections
Grant 9,824,991 - Aleksov , et al. November 21, 2 | 2017-11-21 |
Textile that includes an electronic system
Grant 9,788,581 - Aleksov , et al. October 17, 2 | 2017-10-17 |
Complementary tunneling FET devices and method for forming the same
Grant 9,786,769 - Aleksov October 10, 2 | 2017-10-10 |
Adaptive exoskeleton, control system and methods using the same
Grant 9,775,763 - Aleksov , et al. October 3, 2 | 2017-10-03 |
Membrane test for Mechanical Testing of Stretchable Electronics
App 20170268971 - MAHAJAN; Ravindranth V. ; et al. | 2017-09-21 |
Lateral Expansion Apparatus for Mechanical Testing of Stretchable Electronics
App 20170268972 - SUBRAMANIAN; Vijay Krishnan ; et al. | 2017-09-21 |
Patch system for in-situ therapeutic treatment
Grant 9,735,893 - Aleksov , et al. August 15, 2 | 2017-08-15 |
Microelectronic Structures Having Laminated Or Embedded Glass Routing Structures For High Density Packaging
App 20170200677 - Ma; Qing ; et al. | 2017-07-13 |
Stretchable electronic assembly
App 20170188464 - Aleksov; Aleksandar ; et al. | 2017-06-29 |
Flexible Electronic System With Wire Bonds
App 20170179103 - Aleksov; Aleksandar ; et al. | 2017-06-22 |
Physiological Characteristic Measurement System
App 20170172421 - Dabby; Nadine L. ; et al. | 2017-06-22 |
Gradient Encapsulant Protection Of Devices In Stretchable Electronics
App 20170181275 - Dias; Rajendra C. ; et al. | 2017-06-22 |
Methods for high precision microelectronic die integration
Grant 9,685,421 - Aleksov , et al. June 20, 2 | 2017-06-20 |
Conductive Flexible And Stretchable Encapsulation Method And Apparatus
App 20170164461 - Lathrop; Braxton ; et al. | 2017-06-08 |
Fabric-based Piezoelectric Energy Harvesting
App 20170163178 - Dabby; Nadine L. ; et al. | 2017-06-08 |
Stretchable Embedded Electronic Package
App 20170142839 - Aleksov; Aleksandar ; et al. | 2017-05-18 |
Organic Thin Film Passivation Of Metal Interconnections
App 20170141061 - ALEKSOV; Aleksandar ; et al. | 2017-05-18 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging
Grant 9,642,248 - Ma , et al. May 2, 2 | 2017-05-02 |
Method Of Fabricating A Stretchable Computing Device
App 20170094774 - Elsherbini; Adel ; et al. | 2017-03-30 |
Display For Stretchable Computing Device
App 20170094749 - Elsherbini; Adel ; et al. | 2017-03-30 |
Organic thin film passivation of metal interconnections
Grant 9,583,390 - Aleksov , et al. February 28, 2 | 2017-02-28 |
Space transformer
Grant 9,564,408 - Aleksov , et al. February 7, 2 | 2017-02-07 |
Shaped and oriented solder joints
Grant 9,564,412 - Aleksov , et al. February 7, 2 | 2017-02-07 |
Photovoltaic window
Grant 9,548,410 - Aleksov , et al. January 17, 2 | 2017-01-17 |
Flexible computing fabric
Grant 9,526,285 - Aleksov , et al. December 27, 2 | 2016-12-27 |
Thermal matched composite die
Grant 9,520,378 - Aleksov , et al. December 13, 2 | 2016-12-13 |
System and method for providing tactile feedback
Grant 9,323,327 - Aleksov , et al. April 26, 2 | 2016-04-26 |
Package substrate and die spacer layers having a ceramic backbone
Grant 9,258,880 - Aleksov , et al. February 9, 2 | 2016-02-09 |
Organic thin film passivation of metal interconnections
Grant 9,257,276 - Aleksov , et al. February 9, 2 | 2016-02-09 |
Shaped and oriented solder joints
Grant 9,233,835 - Aleksov , et al. January 12, 2 | 2016-01-12 |
Wireless charging system
Grant 9,118,188 - Doyle , et al. August 25, 2 | 2015-08-25 |
Methods for high precision microelectronic die integration
Grant 9,076,882 - Aleksov , et al. July 7, 2 | 2015-07-07 |
Magnetic attachment structure
Grant 9,010,618 - Aleksov , et al. April 21, 2 | 2015-04-21 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging
Grant 9,001,520 - Ma , et al. April 7, 2 | 2015-04-07 |
Method of manufacturing an inductor for a microelectronic device
Grant 8,621,744 - Aleksov , et al. January 7, 2 | 2014-01-07 |
Package substrate and die spacer layers having a ceramic backbone
Grant 8,604,353 - Aleksov , et al. December 10, 2 | 2013-12-10 |
Magnetic attachment structure
Grant 8,434,668 - Aleksov , et al. May 7, 2 | 2013-05-07 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 8,227,904 - Braunisch , et al. July 24, 2 | 2012-07-24 |
Method for fabricating package substrate and die spacer layers having a ceramic backbone
Grant 8,186,051 - Aleksov , et al. May 29, 2 | 2012-05-29 |
Multi-chip package and method of providing die-to-die interconnects in same
App 20100327424A1 - | 2010-12-30 |
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