U.S. patent application number 15/260555 was filed with the patent office on 2018-03-15 for method of planarizating film.
The applicant listed for this patent is Taiwan Semiconductor Manufacturing Co., Ltd.. Invention is credited to Chun-Chang Chen, Chihy-Yuan Cheng, Ching-Sen Kuo, Feng-Jia Shiu, Chun-Chang Wu, Shun-Shing Yang.
Application Number | 20180076081 15/260555 |
Document ID | / |
Family ID | 61525646 |
Filed Date | 2018-03-15 |
United States Patent
Application |
20180076081 |
Kind Code |
A1 |
Cheng; Chihy-Yuan ; et
al. |
March 15, 2018 |
Method of Planarizating Film
Abstract
A method includes forming a patterned layer on a substrate
having a first region and a second region being adjacent each
other. The patterned layer includes first features in the first
region. The second region is free of the patterned layer. The
method further includes forming a material layer on the patterned
layer and the substrate; forming a first guard ring disposed in the
second region and surrounding the first features; forming a
flowable-material (FM) layer over the material layer; forming a
patterned resist layer over the FM layer, wherein the patterned
resist layer includes a plurality of openings; and transferring the
plurality of openings to the material layer.
Inventors: |
Cheng; Chihy-Yuan; (Tainan
City, TW) ; Wu; Chun-Chang; (Nantou County, TW)
; Yang; Shun-Shing; (Tainan City, TW) ; Kuo;
Ching-Sen; (Taipei City, TW) ; Shiu; Feng-Jia;
(Hsinchu County, TW) ; Chen; Chun-Chang; (Tainan
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Hsin-Chu |
|
TW |
|
|
Family ID: |
61525646 |
Appl. No.: |
15/260555 |
Filed: |
September 9, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 29/0619 20130101;
H01L 21/823431 20130101; H01L 21/845 20130101; H01L 21/765
20130101; H01L 27/0886 20130101 |
International
Class: |
H01L 21/765 20060101
H01L021/765; H01L 29/06 20060101 H01L029/06; H01L 27/088 20060101
H01L027/088 |
Claims
1. A method, comprising: forming a patterned layer on a substrate
having a first region and a second region being adjacent each
other, wherein the patterned layer includes first features in the
first region, wherein the second region is free of the patterned
layer; forming a material layer on the patterned layer and the
substrate; forming a first guard ring disposed in the second region
and enclosing the first features, the first guard ring having a
height that extends from a top surface of the substrate; forming a
flowable-material (FM) layer over the material layer and the first
guard ring, wherein a portion of the FM layer is constrained within
an enclosure of the first guard ring; forming a patterned resist
layer over the FM layer, wherein the patterned resist layer
includes a plurality of openings; and transferring the plurality of
openings to the material layer.
2. The method of claim 1, wherein the first guard ring is a
continuous feature configured to completely enclose the first
features in a top view toward the substrate.
3. The method of claim 2, wherein the forming of the FM layer
includes: disposing a flowable material on the substrate; and
curing the flowable material to form the FM layer.
4. The method of claim 2, wherein the forming of the first guard
ring includes forming the first guard ring that has a width W1 and
disposed a distance D1 from the first features, wherein D1 is
greater than zero, and wherein W1 is greater than D1.
5. The method of claim 4, wherein the forming of the first guard
ring includes forming the first guard ring having a first ratio
W1/D1 greater than 5.
6. The method of claim 4, wherein the forming of the first guard
ring includes forming the first guard ring having a height Hr
substantially equal to a height of the first features.
7. The method of claim 4, further comprising forming a second guard
ring disposed in the second region and surrounding the first guard
ring.
8. The method of claim 7, wherein the forming of the second guard
ring includes forming the second guard ring that has a width W2 and
is disposed a distance D2 from the first guard ring, wherein D2 is
greater than zero, and wherein W2 is greater than D2.
9. The method of claim 8, wherein the forming of the second guard
ring includes forming the second guard ring feature having a second
ratio W2/D2 greater than 5, wherein W1 equals W2 and D2 is less
than D1.
10. The method of claim 7, wherein the forming of the first guard
ring and the forming of the second guard ring feature are
implemented simultaneously by a same process including deposition
and patterning.
11. A method comprising: forming a patterned layer on a substrate
having a first region and a second region being adjacent each
other, wherein the patterned layer includes first features in the
first region, wherein the second region is free of the patterned
layer; forming a first guard ring disposed in the second region and
surrounding the first features, the first guard ring having a
height that extends from a top surface of the substrate, wherein
the first guard ring has a width W1 and is spaced a distance D1
from the first features, wherein D1 is greater than zero, and
wherein W1 is greater than D1; forming a material layer over the
patterned layer and over the first guard ring; forming a patterned
resist over the material layer, wherein the patterned resist layer
includes a plurality of openings; and transferring the plurality of
openings to the material layer.
12. The method of claim 11, further comprising: disposing a
flowable-material (FM) over the material layer before the forming
of the patterned resist, wherein a portion of the FM layer is
constrained within the enclosure of the first guard ring; and
curing the FM to form a cured FM layer, wherein the forming of the
patterned resist includes forming the patterned resist layer over
the FM layer.
13. The method of claim 11, wherein the forming of the first guard
ring includes forming the first guard ring having a first ratio
W1/D1 greater than 5.
14. The method of claim 11, wherein the forming of the first guard
ring includes forming the first guard ring with a height such that
a top surface of the first guard ring is above and a bottom surface
of the first guard ring is below a top surface of the first
features.
15. The method of claim 11, further comprising forming a second
guard ring disposed in the second region and surrounding the first
guard ring in a continuous configuration, wherein the forming of
the second guard ring includes forming the second guard ring that
has a width W2 and is disposed a distance D2 from the first guard
ring, wherein D2 is greater than zero, wherein W2 is greater than
D2, and wherein D2 is less than D1.
16-20. (canceled)
21. A method, comprising: forming a patterned layer on a substrate
having a first region and a second region being adjacent each
other, wherein the patterned layer includes first features in the
first region, wherein the second region is free of the patterned
layer; forming a first guard ring and a second guard ring both
within the second region, wherein the first guard ring surrounds
the first features, wherein the second guard ring surrounds the
first guard ring, each of the first guard ring and the second guard
ring having a height that extends from the top surface of the
substrate; forming a material layer on the patterned layer, the
first guard ring, and the second guard ring, wherein the material
layer has an uneven topography; forming a patterned resist over the
material layer, wherein the patterned resist layer includes a
plurality of openings; and transferring the plurality of openings
to the material layer.
22. The method of claim 21, further comprising: disposing a
flowable material (FM) over the material layer before the forming
of the patterned resist, wherein the FM is constrained within an
enclosure of the first guard ring; and curing the FM to form a
cured FM layer, wherein the forming of the patterned resist
includes forming the patterned resist layer over the FM layer.
23. The method of claim 21, wherein the forming of the first guard
ring and the second guard ring further includes forming a third
guard ring disposed in the second region and configured to
completely enclose the second guard ring.
24. The method of claim 23, wherein the forming of the first guard
ring and the second guard ring includes forming the first guard
ring having a first width W1 and a first distance D1 to the
patterned layer, wherein D1 is greater than zero; the second guard
ring having a second width W2 and a second distance D2 to the first
guard ring, wherein D2 is greater than zero; the third guard ring
having a third width W3 and a third distance D3 to the second guard
ring, wherein, wherein D3 is greater than zero, wherein D3 is less
than D2 and D2 is less than D1; W1, W2 and W3 are substantially
equal; and a ratio W1/D1 is greater than 5.
25. (canceled)
26. The method of claim 21, wherein the forming of the first guard
ring and the second guard ring includes depositing a material layer
including polyimide.
Description
BACKGROUND
[0001] The semiconductor integrated circuit (IC) industry has
experienced rapid growth. Technological advances in IC design and
material have produced generations of ICs where each generation has
smaller and more complex circuits than previous generations. In the
course of IC evolution, functional density (i.e., the number of
interconnected devices per chip area) has generally increased while
geometry size has decreased. This scaling down process generally
provides benefits by increasing production efficiency and lowering
associated costs. Such scaling down has also increased the
complexity of IC processing and manufacturing. For these advances
to be realized, similar developments in IC processing and
manufacturing are needed. For example, due to uneven top surface,
existing lithography patterning process may generate with degraded
critical dimension (CD) uniformity. Therefore there is a need for a
semiconductor structure and the method making the same to the
various issues, such as CD uniformity.
BRIEF DESCRIPTION OF THE DRAWINGS
[0002] Aspects of the present disclosure are best understood from
the following detailed description when read with the accompanying
figures. It is noted that, in accordance with the standard practice
in the industry, various features are not drawn to scale. In fact,
the dimensions of the various features may be arbitrarily increased
or reduced for clarity of discussion.
[0003] FIG. 1 is a top view of a workpiece constructed in
accordance with some embodiments.
[0004] FIG. 2 is a top view of a semiconductor structure
constructed in accordance with some embodiments.
[0005] FIG. 3 is a sectional view of the semiconductor structure in
FIG. 2 constructed in accordance with some embodiments.
[0006] FIGS. 4 and 5 are sectional views of the semiconductor
structure in FIG. 2 at various fabrication stages, constructed in
accordance with some embodiments.
[0007] FIG. 6 is a top view of a semiconductor structure
constructed in accordance with some embodiments.
[0008] FIG. 7 is a sectional view of the semiconductor structure in
FIG. 6 constructed in accordance with some embodiments.
[0009] FIGS. 8, 9 and 10 are top views of a semiconductor structure
constructed in accordance with various embodiments.
[0010] FIG. 11 is a flowchart of an example method for fabricating
a semiconductor device constructed in accordance with some
embodiments.
[0011] FIGS. 12, 13, 14, 15, 16, 17, 18A, 18B, 18C, 18D, 19A and
19B are cross-sectional views of an example semiconductor device in
accordance with some embodiments.
[0012] FIG. 20 is another flowchart of an example method for
fabricating a semiconductor device constructed in accordance with
some embodiments.
[0013] FIGS. 21, 22, 23, 24A, 24B, 25A and 25B are cross-sectional
views of an example semiconductor device in accordance with some
embodiments.
[0014] FIG. 26 is another flowchart of an example method for
fabricating a semiconductor device constructed in accordance with
some embodiments.
[0015] FIGS. 27, 28, 29, 30, 31A, 31B, 32A and 32B are
cross-sectional views of an example semiconductor device in
accordance with some embodiments.
DETAILED DESCRIPTION
[0016] The following disclosure provides many different
embodiments, or examples, for implementing different features of
the provided subject matter. Specific examples of components and
arrangements are described below to simplify the present
disclosure. These are, of course, merely examples and are not
intended to be limiting. For example, the formation of a first
feature over or on a second feature in the description that follows
may include embodiments in which the first and second features are
formed in direct contact, and may also include embodiments in which
additional features may be formed between the first and second
features, such that the first and second features may not be in
direct contact. In addition, the present disclosure may repeat
reference numerals and/or letters in the various examples. This
repetition is for the purpose of simplicity and clarity and does
not in itself dictate a relationship between the various
embodiments and/or configurations discussed.
[0017] Further, spatially relative terms, such as "beneath,"
"below," "lower," "above," "upper" and the like, may be used herein
for ease of description to describe one element or feature's
relationship to another element(s) or feature(s) as illustrated in
the figures. The spatially relative terms are intended to encompass
different orientations of the device in use or operation in
addition to the orientation depicted in the figures. The apparatus
may be otherwise oriented (rotated 90 degrees or at other
orientations) and the spatially relative descriptors used herein
may likewise be interpreted accordingly.
[0018] FIG. 1 is a top view of a workpiece 10, in portion, in
accordance with some embodiments. FIG. 2 is a top view of a
semiconductor structure 12 (a portion of the workpiece 10) in
accordance with some embodiments. FIG. 3 is a sectional view of the
semiconductor structure 12, along the dashed line AA', in
accordance with some embodiments. The workpiece 10, the
semiconductor structure 12 and the method making the same are
collectively described with reference to FIGS. 1-3 and other
figures.
[0019] Referring to FIG. 1, the workpiece 10 is a semiconductor
wafer in fabrication, in accordance with some embodiments. The
workpiece 10 includes various patterns formed thereon and other
patterns to be formed thereon. For example, the workpiece 10 is a
silicon wafer, other semiconductor wafer or other suitable wafer
used to form integrated circuits thereon.
[0020] The workpiece 10 includes a plurality of integrated circuits
(referred to as semiconductor structure) 12 to be cut into separate
integrated circuit (IC) chips after the completion of the IC
fabrication. Each IC chip may be further tested and packaged to a
functional integrated circuit according to respective application.
The semiconductor structure 12 includes a first region 14 and a
second region 16 adjacent the first region 14. Furthermore, the
semiconductor structure 12 includes a pattern layer having a
plurality of circuit features 20 disposed within the first region
14 and being absent in the second region 16.
[0021] A guard ring structure 18 is disposed in the second region
16 and configured to surround the plurality of circuit features 20
within the first region 14. The guard ring structure 18 is a
continuous structure configured to enclose the circuit features 20
within the first region 14. In the present embodiment, the guard
ring structure 18 has a continuous structure and various dimensions
designed to effectively constrain a flowing material during the
fabrication stage such that to provide fabrication advantages. In
some embodiments, the guard ring structure 18 is spaced a distance
D from the first circuit features 20 and is designed to have a
width Wr. In furtherance of the embodiments, Wr is greater than D.
In some examples, the guard ring structure is designed to have the
ratio Wr/D greater than 5. In some examples, the guard ring 18 is
designed to have a height Hr, the circuit features 20 have a height
Hp that is substantially equal to Hr. In the present example, the
circuit features 20 and the guard ring structure 18 have respective
bottom surfaces being coplanar with each other. As illustrated in
FIG. 3, the substrate 22 has a planarized top surface 22T. The
circuit features 20 and the guard ring structure 18 are disposed on
the planarized surface 20A.
[0022] In some embodiments, the guard ring structure 18 includes
two or more continuous guard rings, such as one illustrated in FIG.
6 in a top view and FIG. 7 in a sectional view, along the dashed
line CC', of the semiconductor structure 12 in accordance with some
embodiments. In FIGS. 6 and 7, the semiconductor structure 12
includes a guard ring structure 18 having a first guard ring 18a
and a second guard ring 18b. Similarly, the first guard ring 18a is
spaced a distance D1 from the first circuit features 20 and is
designed to have a width W1. In furtherance of the embodiments, W1
is greater than D1. In some examples, the first guard ring 18a is
designed to have the ratio W1/D1 greater than 5. The second guard
ring 18b is spaced a distance D2 from the first guard ring 18a and
is designed to have a width W2. In furtherance of the embodiments,
W2 is greater than D2; W1 and W2 are substantially equal; and D2 is
less than D1. In some examples, the second guard ring 18b is
designed to have the ratio W2/D2 greater than 5.
[0023] In some embodiments, as illustrated in FIG. 8, the
semiconductor structure 12 includes circuit features 20 in the
first region 14 and the guard ring structure 18 having three
continuous guard rings 18a, 18b and 18c configured to surround the
circuit features 20 in the first region 14. Each guard ring has a
continuous feature to enclose the circuit features 20 inside, when
viewed in the top view. Particularly, the second ring 18b is
configured to surround the first guard ring 18a and the third ring
18c is configured to surround the second guard ring 18b. The three
guard rings are designed to have the dimensions and gaps similar to
the guard ring structure 12 in FIG. 2 or in FIG. 6. In the present
embodiments, the first guard ring 18a is spaced a distance D1 from
the first circuit features 20 and is designed to have a width W1,
wherein W1 is greater than D1. In some examples, the ratio W1/D1 is
greater than 5. The second guard ring 18b is spaced a distance D2
from the first guard ring 18a and is designed to have a width W2,
wherein W2 is greater than D2; W1 and W2 are substantially equal;
and D2 is less than D1. In some examples, the ratio W2/D2 is
greater than 5. Similarly, The third guard ring 18c is spaced a
distance D3 from the second guard ring 18b and is designed to have
a width W3, wherein W3 is greater than D3; W2 and W3 are
substantially equal; and D3 is less than D2. In some examples, the
ratio W3/D3 is greater than 5.
[0024] In the present embodiment, the first region 14 and the
second region 16 are designed and configured to have different
functional circuits or devices. For example, the first region 14 is
designed for memory devices, such as non-volatile memory cells; and
the second region 16 is designed for logic devices. The
corresponding circuits in the first and second regions are designed
with respective considerations and are fabricated in different
procedures. In some examples, the first region 14 is configured for
the non-volatile memory cells and the circuit features 20 in the
first region 14 are fin active regions designed for the
non-volatile memory cells to be formed thereon.
[0025] In some embodiments, as illustrated in FIG. 9, the
semiconductor structure 12 may include two or more first regions,
such as first regions 14-1 and 14-2, designed and configured for
the non-volatile memory cells. In some other examples, the
different first regions are designed for different memory devices,
such as the first region 14-1 for non-volatile memory cells and the
first region 14-2 for static random access memory cells. The guard
ring structure is designed to have respective guard rings to
enclose the corresponding first regions. For example, a first guard
ring structure 18-1 is configured in the second region 16 and is
designed to surround the first region 14-1 and a second guard ring
structure 18-2 is configured in the second region 16 and is
designed to surround the first region 14-2. Each guard ring
structure is designed to have gaps and dimensions similar those in
FIG. 2, 6 or 8. For example, the first guard ring structure 18-1
includes a continuous guard ring to enclose the circuit features 20
in the first region 14-1. The first guard ring structure 18-1 is
spaced a distance D1 from the corresponding circuit features 20 and
is designed to have a width W1, wherein W1 is greater than D1. In
some examples, the ratio W1/D1 is greater than 5. The first guard
ring structure 18-1 may include two or more guard rings, such as
those in FIGS. 6 and 8. The second guard ring structure 18-2 is
designed similarly as the first guard ring structure 18-1 in terms
of configuration and dimensions. For example, the second guard ring
structure 18-2 includes a continuous guard ring being spaced a
distance D from the corresponding circuit features 20 in the first
region 14-2 and is designed to have a width W, wherein W is greater
than D. In some examples, the ratio W/D is greater than 5. FIG. 10
is a top view of the semiconductor structure 12 in accordance with
some other embodiments. The semiconductor structure 12 includes
three first regions, such as first regions 14-1, 14-2 and 14-3,
designed and configured for different functional circuits. In some
other examples, the different first regions are designed for
different memory devices, such as the first region 14-1 for
non-volatile NAND memory cells, the first region 14-2 for
non-volatile NOR memory cells, and the first region 14-3 for static
random access memory cells.
[0026] The guard ring structure is designed to enhance the
fabrication capability (that will be further described at later
stage) and remains in the semiconductor structure 12 in accordance
with some embodiments. In this case, other functional circuit, such
as logic circuit, is formed in the second region 16. The memory
circuit in the first region 14 and the logic circuit in the second
region 16 are separated by the guard ring structure 18. The guard
ring structure is designed to have respective guard rings to
enclose the corresponding first regions. For example, a first guard
ring structure 18-1 is configured in the second region 16 and is
designed to surround the first region 14-1; a second guard ring
structure 18-2 is configured in the second region 16 and is
designed to surround the first region 14-2; and a third guard ring
structure 18-3 is configured in the second region 16 and is
designed to surround the first region 14-3. Each guard ring
structure is designed to have gaps and dimensions similar those in
FIG. 2, 6 or 8.
[0027] Referring back to FIGS. 2 and 3, the semiconductor structure
12 includes a substrate 22. The substrate 22 includes silicon.
Alternatively or additionally, the substrate 22 may include other
elementary semiconductor such as germanium. The substrate 22 may
also include a compound semiconductor such as silicon carbide,
gallium arsenic, indium arsenide, and indium phosphide. The
substrate 22 may include an alloy semiconductor such as silicon
germanium, silicon germanium carbide, gallium arsenic phosphide,
and gallium indium phosphide. In one embodiment, the substrate 22
includes an epitaxial layer. For example, the substrate 22 may have
an epitaxial layer overlying a bulk semiconductor. Furthermore, the
substrate 22 may include a semiconductor-on-insulator (SOI)
structure. For example, the substrate 22 may include a buried oxide
(BOX) layer formed by a process such as separation by implanted
oxygen (SIMOX) or other suitable technique, such as wafer bonding
and grinding.
[0028] The substrate 22 may also include various p-type doped
regions and/or n-type doped regions, implemented by a process such
as ion implantation and/or diffusion. Those doped regions include
n-well, p-well, light doped region (LDD) and various channel doping
profiles configured to form various integrated circuit (IC)
devices, such as a complimentary metal-oxide-semiconductor
field-effect transistor (CMOSFET), imaging sensor, and/or light
emitting diode (LED). The substrate 210 may further include other
functional features or devices, such as passive devices resistors
or capacitors.
[0029] The substrate 22 may also include various isolation regions.
The isolation regions separate various device regions in the
substrate 22. The isolation regions include different structures
formed by using different fabrication technologies. For example,
the isolation region may include shallow trench isolation (STI)
features. The formation of an STI may include etching a trench in
the substrate 22; and filling in the trench with insulator
materials such as silicon oxide, silicon nitride, and/or silicon
oxynitride. The filled shallow trench isolation features may have a
multi-film structure such as a thermal oxide liner layer on the
trench sidewall, and then silicon oxide or silicon nitride
deposited to fill in the trench. A chemical mechanical polishing
(CMP) process may be applied to polish back excessive portions of
the insulator materials and planarize the top surface of the
isolation features.
[0030] In the present embodiment as an example for illustration,
the semiconductor structure 12 includes three dimensional devices
and the circuit features 20 are fin active regions. The fin active
regions are active regions extruded from the top surface 22T of the
substrate and have three-dimensional profiles. This is further
illustrated in FIG. 4 as a sectional view the semiconductor
structure 12 in FIG. 2 along the dashed line BB', constructed
according to some embodiments. The fin active regions 20 are
defined by the shallow trench isolation (STI) features 24. The fin
active regions 20 may be formed after the formation of the STI
features 24. The formation of the fin active regions 20 includes
recessing the STI features 24 in one example; or selectively
epitaxially growing in another example.
[0031] In some embodiments, the semiconductor structure 12 further
includes gate stacks 26, as illustrated FIG. 5 in a sectional view
of the semiconductor structure 12 in FIG. 2 along the dashed line
AA'. The gate stacks 26 each include a gate dielectric layer and a
gate electrode disposed on the gate dielectric layer. In some
examples, the gate stacks include silicon oxide as the gate
dielectric layer and doped polysilicon as the gate electrode. In
some other examples, gate stacks include high dielectric constant
material layer (high-k dielectric material) as the gate dielectric
layer, and metal or metal alloy as the gate electrode. The gate
dielectric layer may include one or more dielectric film, such as
an interfacial layer (IL) and a high-k dielectric layer on the IL.
In the furtherance of the examples, the high-k dielectric material
may include LaO, AlO, ZrO, TiO, Ta.sub.2O.sub.5, Y.sub.2O.sub.3,
SrTiO.sub.3 (STO), BaTiO.sub.3 (BTO), BaZrO, HfZrO, HfLaO, HfSiO,
LaSiO, AlSiO, HfTaO, HfTiO, (Ba,Sr)TiO.sub.3 (BST),
Al.sub.2O.sub.3, Si.sub.3N.sub.4, oxynitrides (SiON), other
suitable materials, or a combination thereof. The IL may be formed
by thermal oxidation, ALD or other suitable technique. The high-k
dielectric material may be formed by CVD, ALD, PVD, other suitable
technique, or a combination thereof.
[0032] The gate electrode may include a single layer or
alternatively a multi-layer structure, such as a combination of
various metal or metal alloy layers tuned with respective
parameters, such as a suitable work function to enhance device
performance. The gate electrode may include doped semiconductor,
metal, metal alloy, metal silicide, or a combination thereof. In
some examples, the gate electrode may include Ti, Ag, Al, TiAlN,
TaC, TaCN, TaSiN, Mn, Zr, TiN, TaN, Ru, Mo, Al, WN, Cu, W, any
suitable conductive materials, and/or a combination thereof. The
gate electrode may be deposited by PVD, plating, CVD, ALD, other
suitable technique or a combination thereof.
[0033] The gate stacks 26 are designed differently. For example,
the gate stacks 26 each further include a floating gate electrode
inserted in the gate dielectric layer. The floating gate electrode
is electrically isolated from the gate electrode (also referred to
as control gate) and the channel region by the gate dielectric
layer.
[0034] The semiconductor structure 12 may also include source/drain
(S/D) features (not shown in FIG. 5) formed in the semiconductor
substrate and configured adjacent the gate stacks 26. The S/D
features may be formed by ion implantation, or selective epitaxial
growth to provide strain effect in order to increase the carrier
mobility and enhance the device performance. The S/D features and
gate stacks are configured to form various devices, such as fin
field-effect transistors (FinFETs), and/or non-volatile memory
devices.
[0035] The formation of the gate stacks 26 includes deposition and
patterning. While patterning the deposited gate materials, a
patterned photoresist layer is formed on the top. Since the
semiconductor structure 12 has an uneven profile, thus formed
photoresist layer also has a high topography, causing poor critical
dimension (CD) uniformity issue. By utilizing the guarding ring
structure 18, the flowable material used in the lithography process
is constrained by the guard ring structure, resulting in the
patterned photoresist layer has improved topography and better CD
uniformity. An exemplary process is further described below.
Various gate materials are deposited on the substrate, and a gate
hard mask layer may be additionally deposited on the gate
materials. Then a photoresist layer is coated thereon. For example,
a bottom antireflective coating (BARC) layer is first coated by
spin-on coating. The BARC layer functions to reduce reflection
during the lithography exposure process and provide etching
resistance during the patterning. The formation of the BARC layer
includes coating and curing. Since the BARC layer is flowable
during the coating stage, the guard ring structure 18 will
constrain the flowable material within the first region 14, thereby
resulting in more even top surface. The photoresist layer is coated
on and is patterned by the lithography exposure process and
developing process. The pattern defined in the patterned
photoresist layer is transferred to the hard mask and then to the
gate materials by etching, resulting in the gate stacks 26, such as
those illustrated in FIG. 5.
[0036] The semiconductor structure 12 may also include one or more
inter-level dielectric (ILD) layer disposed on the semiconductor
material. For examples, the ILD layer may include silicon oxide,
silicon nitride, silicon oxynitride, a low dielectric constant
material (low-k dielectric material), silicon carbide, and/or other
suitable layers. The ILD may be deposited by thermal oxidation
chemical vapor deposition (CVD), atomic layer deposition (ALD),
physical vapor deposition (PVD), thermal oxidation, combinations
thereof, or other suitable techniques.
[0037] The semiconductor structure 12 may further include various
conductive features disposed in the ILD layer and configured to
form an interconnect structure that couple various S/D features,
the gate stacks and/or other circuit features to form a functional
integrated circuit.
[0038] The disclosed method and the semiconductor structure formed
thereby are further described below according to some embodiment.
FIG. 11 is a flowchart of a method 100 of fabricating one or more
semiconductor devices in accordance with some embodiments. The
method 100 is discussed in detail below, with reference to a
semiconductor device 200, shown in FIGS. 12, 13, 14, 15, 16, 17,
18A, 18B, 18C, 18D, 19A and 19B.
[0039] Referring to FIGS. 11 and 12, the method 100 begins at step
102 by providing a semiconductor device 200 having a plurality of
features 220 protruding from a substrate 210. The substrate 210
includes silicon. Alternatively or additionally, the substrate 210
may include other elementary semiconductor such as germanium. The
substrate 210 may also include a compound semiconductor such as
silicon carbide, gallium arsenic, indium arsenide, and indium
phosphide. The substrate 210 may include an alloy semiconductor
such as silicon germanium, silicon germanium carbide, gallium
arsenic phosphide, and gallium indium phosphide. In one embodiment,
the substrate 210 includes an epitaxial layer. For example, the
substrate 210 may have an epitaxial layer overlying a bulk
semiconductor. Furthermore, the substrate 210 may include a
semiconductor-on-insulator (SOI) structure. For example, the
substrate 210 may include a buried oxide (BOX) layer formed by a
process such as separation by implanted oxygen (SIMOX) or other
suitable technique, such as wafer bonding and grinding.
[0040] The semiconductor device 200 may also include various p-type
doped regions and/or n-type doped regions, implemented by a process
such as ion implantation and/or diffusion. Those doped regions
include n-well, p-well, light doped region (LDD) and various
channel doping profiles configured to form various integrated
circuit (IC) devices, such as a complimentary
metal-oxide-semiconductor field-effect transistor (CMOSFET),
imaging sensor, and/or light emitting diode (LED). The substrate
210 may further include other functional features such as a
resistor or a capacitor formed in and on the substrate.
[0041] The semiconductor device 200 may also include various
isolation regions. The isolation regions separate various device
regions in the substrate 210. The isolation regions include
different structures formed by using different processing
technologies. For example, the isolation region may include shallow
trench isolation (STI) regions. The formation of an STI may include
etching a trench in the substrate 210 and filling in the trench
with insulator materials such as silicon oxide, silicon nitride,
and/or silicon oxynitride. The filled trench may have a multi-layer
structure such as a thermal oxide liner layer with silicon nitride
filling the trench. A chemical mechanical polishing (CMP) may be
performed to polish back excessive insulator materials and
planarize the top surface of the isolation features.
[0042] The semiconductor device 200 may also include a plurality of
inter-level dielectric (ILD) layers such as silicon oxide, silicon
nitride, silicon oxynitride, a low-k dielectric, silicon carbide,
and/or other suitable layers. The ILD may be deposited by thermal
oxidation chemical vapor deposition (CVD), atomic layer deposition
(ALD), physical vapor deposition (PVD), thermal oxidation,
combinations thereof, or other suitable techniques.
[0043] The features 220 may include gate stacks. In some
embodiments, gate stacks include dummy gate stacks formed by
dielectric layers and poly silicon. In some embodiments, gate
stacks include high-k/metal gate (HK/MG) formed by dielectric
layers and electrode layers. The dielectric layers may include an
interfacial layer (IL) and a HK dielectric layer deposited by
suitable techniques, such as chemical vapor deposition (CVD),
atomic layer deposition (ALD), physical vapor deposition (PVD),
thermal oxidation, combinations thereof, and/or other suitable
techniques. The IL may include oxide, HfSiO and oxynitride and the
HK dielectric layer may include LaO, AlO, ZrO, TiO,
Ta.sub.2O.sub.5, Y.sub.2O.sub.3, SrTiO.sub.3 (STO), BaTiO.sub.3
(BTO), BaZrO, HfZrO, HfLaO, HfSiO, LaSiO, AlSiO, HfTaO, HfTiO,
(Ba,Sr)TiO.sub.3 (BST), Al.sub.2O.sub.3, Si.sub.3N.sub.4,
oxynitrides (SiON), and/or other suitable materials. The electrode
layer may include a single layer or alternatively a multi-layer
structure, such as various combinations of a metal layer with a
work function to enhance the device performance (work function
metal layer), liner layer, wetting layer, adhesion layer and a
conductive layer of metal, metal alloy or metal silicide). The MG
electrode may include Ti, Ag, Al, TiAlN, TaC, TaCN, TaSiN, Mn, Zr,
TiN, TaN, Ru, Mo, Al, WN, Cu, W, any suitable materials, and/or a
combination thereof.
[0044] The features 220 may also include source/drain (S/D)
features, which include germanium (Ge), silicon (Si), gallium
arsenide (GaAs), aluminum gallium arsenide (AlGaAs), silicon
germanium (SiGe), gallium arsenide phosphide (GaAsP), gallium
antimony (GaSb), indium antimony (InSb), indium gallium arsenide
(InGaAs), indium arsenide (InAs), and/or other suitable materials.
The S/D features may be formed by epitaxial growing processes, such
as CVD deposition techniques (e.g., vapor-phase epitaxy (VPE)
and/or ultra-high vacuum CVD (UHV-CVD)), molecular beam epitaxy,
and/or other suitable processes.
[0045] The features 220 may also include conductive features
integrated with the ILD layer in the substrate 210 to form an
interconnect structure configured to couple the various p-type and
n-type doped regions and the other functional features (such as
gate electrodes), resulting a functional integrated circuit. In one
example, the features 220 may include a portion of the interconnect
structure and the interconnect structure includes a multi-layer
interconnect (MLI) structure and an ILD layer over the substrate
210 integrated with a MLI structure, providing an electrical
routing to couple various devices in the substrate 210 to the
input/output power and signals. The interconnect structure includes
various metal lines, contacts and via features (or via plugs). The
metal lines provide horizontal electrical routing. The contacts
provide vertical connection between silicon substrate and metal
lines while via features provide vertical connection between metal
lines in different metal layers.
[0046] In the present embodiment, the semiconductor device 200 has
first regions, 212A and 212B, where it has one or more features 220
and a second region 214 where features 220 are absent. The density
of features 220 may vary from one first region 212A to another
first region 212B. In an example, in one first region 212A,
features 220 occupy more than 30% of the first region 212A while in
another first region 212B, the feature 220 occupies about 100% of
the another first region 212B.
[0047] Referring to FIGS. 11 and 13, method 100 proceeds to step
104 by forming a material layer 310 over the substrate 210. The
material layer 310 may include silicon oxide, silicon nitride,
silicon oxynitride, a low-k dielectric, silicon carbide, and/or
other suitable materials. The material layer 310 may be formed by
CVD, ALD, PVD, and/or other suitable processes.
[0048] Typically, topography of the material layer 310 after
deposition is usually influenced (or impacted) by the topography of
the substrate 210. Due to absent of features 220 in the second
region 214, it is common that material layer 310 has a non-flat
topography (or rugged topography) after it is formed over the
substrate 210, such that a top surface of the material layer 310 in
the first regions, 212 A and 212B, is higher than it is in the
second region 214. This rugged topography of the material layer 310
may create loading effect in a subsequent etching process and
result in poor uniformity of critical dimension (CD). For example,
a CD of an etching-formed feature located in the first regions,
212A and 212B, close to the second region 214 is different than
those in the first regions, 212A and 212B, located farther away
from the second region 214. The present disclosure provides a
method of reducing topography difference between the first region
and the second region and improving etching CD uniformity.
[0049] Referring to FIGS. 11 and 14, method 100 proceeds to step
106 by removing the material layer 310 from the second region 214.
In some embodiments, a patterned hard mask (HM) is formed over the
material layer 310 such that the material layer 310 in the first
regions, 212A and 212B, are covered by the patterned HM while it is
exposed in the second region 214. Then the exposed material layer
310 is etched. In some embodiments, the patterned HM is a patterned
photoresist layer and formed by a by a lithography process.
Alternatively, the patterned HM may be formed by depositing a HM
layer, forming a patterned photoresist layer over the HM layer by a
lithography process and etching the HM material layer through the
patterned photoresist layer to form the patterned HM. The etch
process may include a wet etch, a dry etch, and/or a combination
thereof.
[0050] Referring to FIGS. 11 and 15, method 100 proceeds to step
108 by forming one or more mandrel features 410 (also referred to
as guard rings, or collectively guard ring structure) in the second
region 214. The mandrel 410 is formed with a width w and a height
h. In the present embodiment, the mandrel feature 410 is designed
such that the width w may vary from one mandrel feature 410 to
another mandrel feature 410 and vary from one second region 214 to
another second region 214. Also, a total number of the mandrel
features 410 may vary from one second region 214 to another second
region 214. The mandrel feature 410 may include silicon oxide,
silicon oxynitride, polyimide, spin-on-glass (SOG), spin-on-polymer
(SOP), combinations thereof, and/or other suitable materials. In
some embodiments, the mandrel feature 410 includes a material which
is different from the material layer 310 to achieve etching
selectivity in subsequent etches.
[0051] The mandrel feature 410 may be formed by a procedure
including deposition, patterning, etching, and/or a combination
thereof. In some embodiments, the formation of the mandrel 410 may
include depositing a mandrel material layer; forming a resist
pattern; and etching the mandrel material layer using the resist
layer as an etch mask, thereby forming the mandrel 410. The mandrel
material layer may include silicon oxide, silicon nitride,
oxynitride, polyimide, spin-on-glass (SOG), spin-on-polymer (SOP),
combinations thereof, and/or any suitable materials. The mandrel
material layer may include multiple layers. The mandrel material
layer may be deposited by a suitable technique, such as CVD, PVD,
ALD, spin-on coating, and/or other suitable technique. The
patterning process includes coating a resist layer on the mandrel
material layer, performing a lithography exposure process to the
resist layer and developing the exposed resist layer to form the
resist pattern. The etching process includes a wet etch, a dry
etch, and/or a combination there.
[0052] Referring to FIGS. 11 and 16, method 100 proceeds to step
110 by forming a flow able-material (FM) layer 510 over the
material layer 310 and the mandrel feature 410. A FM is a material
which fills in spaces between each of features 220 with a flowing
nature. The FM layer 510 may include polyimide, spin-on-glass
(SOG), spin-on-polymer (SOP), combinations thereof, and/or other
suitable materials. In some embodiments, the FM layer 510 includes
a material which is different from the mandrel feature 410 to
achieve etching selectivity in subsequent etches. The FM layer 510
may be formed by spin-on coating, CVD, and/or other suitable
techniques. As has been mentioned above, by choosing width w and
height h of the mandrel feature 410, the FM layer 510 has a more
planarized topography.
[0053] Referring to FIGS. 11 and 17, method 100 proceeds to step
112 by forming a patterned hard mask (HM) 610 over the FM layer
510. In some embodiments, the patterned HM 610 is a patterned
photoresist layer and formed by a by a lithography process. An
exemplary lithography process may include forming a photoresist
layer, exposing the photoresist layer by a lithography exposure
process, performing a post-exposure bake process, and developing
the photoresist layer to form the patterned resist layer.
Alternatively, the patterned HM 610 may be formed by depositing a
HM layer, forming a patterned photoresist layer over the HM layer
by a lithography process and etching the HM material layer through
the patterned photoresist layer to form the patterned HM. The etch
process may include a wet etch, a dry etch, and/or a combination
thereof. The pattered HM 610 has a plurality of first openings 615
in the first regions 212A and 212B and a second opening 616 to
expose the FM layer 510 in the second region 214.
[0054] Referring to FIGS. 11 and 18A, method 100 proceeds to step
114 by etching the FM layer 510 and the material layer 310 through
the first openings 615 to form trenches 710A and 710B in the
material layer 310. The etching of the FM layer 510 also occurs in
the second region where the etching removes the FM layer 510 and
the mandrel feature 410 through the second opening 616 to expose a
portion of the substrate 210. For the sake of clarity and to better
illustrate the concepts of the present disclosure, reference
numeral 710A identifies the trenches located closest to second
region 214 while reference numeral 710B identifies trenches located
farther away from second region 214. The etch process may include a
wet etch, a dry etch, and/or a combination thereof. As an example,
the trench etch includes a plasma dry etching process using a
fluorine-based chemistry, such as CF.sub.4, SF.sub.6,
CH.sub.2F.sub.2, CHF.sub.3, and/or C.sub.2F.sub.6. As another
example, a wet etching process may comprise etching in diluted
hydrofluoric acid (DHF); potassium hydroxide (KOH) solution;
ammonia; a solution containing hydrofluoric acid (HF), nitric acid
(HNO.sub.3), and/or acetic acid (CH.sub.3COOH); or other suitable
wet etchant.
[0055] Alternatively, as has been mentioned previously, the etch
process is chosen to etch the FM layer 510 and the material layer
310 without etching the mandrel feature 410. Therefore the mandrel
feature 410 remains in the second region 214 to designate a
structure for later process integration, as shown in FIG. 18B.
[0056] As shown in FIGS. 18A and 18B, the plurality of trenches
710A and 710B are formed with uniformed CDs. After forming the
trenches 710A and 710B, the patterned HM 610 is removed by a proper
etching process, as shown in FIG. 18C (in conjunction with the
process described with respect to FIG. 18A) and in FIG. 18D ((in
conjunction with the process described with respect to FIG. 18B).
In an embodiment, the patterned photoresist layer 610 is removed
wet stripping and/or plasma ashing,
[0057] Referring to FIGS. 11, 19A (in conjunction with the process
described with respect to FIG. 18C) and 19B (in conjunction with
the process described with respect to FIG. 18D), method 100
proceeds to step 116 by removing the remaining FM layer 510. The
etch process may include a wet etch, a dry etch, and/or a
combination thereof. In the present embodiment, the etch process is
chosen to selectively etching the remaining FM layer 510 without
substantially etching the material layer 310, the mandrel feature
410, the features 220 and the substrate 210. As a result, in the
first regions 212A and 212B, the trenches 710A and 710B still have
uniform CDs.
[0058] Additional steps can be provided before, during, and after
the method 100, and some of the steps described can be replaced or
eliminated for other embodiments of the method.
[0059] FIG. 20 is a flowchart of another example method 1000 for
fabricating the device 200. The steps 1002 and 1004, are similar to
those discussed above in steps 102 and 104 of method 100. Thus, the
discussion above with respect to steps 102 and 104 is applicable to
the steps 1002 and 1004, respectively. The present disclosure
repeats reference numerals and/or letters in the various
embodiments. This repetition is for the purpose of simplicity and
clarity such that repeated reference numerals and/or letters
indicate similar features amongst the various embodiments unless
stated otherwise.
[0060] Referring to FIGS. 20 and 21, method 1000 proceeds to step
1006 by forming the mandrel feature 410 over the material layer 310
in the second region 214. As a result, a first portion 310A of the
material layer 310 is positioned beside the mandrel feature 410 and
a second portion 310B of the material layer 310 is positioned
underneath the mandrel feature 410. The step 1006 is similar to
those discussed above in step 108. Thus, the discussion above with
respect to step 108 is applicable to step 1006.
[0061] Referring to FIGS. 20 and 22, method 1000 proceeds to step
1008 by forming the FM layer 510 over the material layer 310 and
the mandrel feature 410. The step 1008 is similar to those
discussed above in step 110. Thus, the discussion above with
respect to step 110 is applicable to step 1008.
[0062] Referring to FIGS. 20 and 23, method 1000 proceeds to step
1010 by forming the patterned HM 610 is over the FM layer 510. The
step 1010 is similar to those discussed above in step 112. Thus,
the discussion above with respect to step 112 is applicable to step
1010.
[0063] Referring to FIGS. 20 and 24A, method 1000 proceeds to step
1012 by etching the FM layer 510 and the material layer 310 through
the first openings 615 to form trenches 710A and 710B in the
material layer 310 and etching the FM layer 510 and the mandrel
feature 410 (both of the first portion 310A and the second portion
310B) through the second opening 616 in the second region 214. The
step 1012 is similar to those discussed above in step 114. Thus,
the discussion above with respect to step 114 is applicable to step
1012.
[0064] Alternatively, as has been mentioned previously, the etch
process is chosen to etch the FM layer 510 and the material layer
310 without etching the mandrel feature 410. Therefore the mandrel
feature 410 and the second portion 310B of the material layer 310
remain in the second region to provide a designate structure for
later process integration, as shown in FIG. 24B.
[0065] Referring to FIGS. 20, 25A (in conjunction with the process
described with respect to FIG. 14A) and 15B (in conjunction with
the process described with respect to FIG. 24B), method 1000
proceeds to step 1014 by removing the remaining FM layer 510. The
step 1014 is similar to those discussed above in step 116. Thus,
the discussion above with respect to step 116 is applicable to step
1014. As a result, in the first regions 212A and 212B, the trenches
710A and 710B still have uniform CDs.
[0066] Additional steps can be provided before, during, and after
the method 1000, and some of the steps described can be replaced or
eliminated for other embodiments of the method.
[0067] FIG. 26 is a flowchart of another example method 2000 for
fabricating the device 200. Step 2002 is similar to those discussed
above in step 102 of method 100. Thus, the discussion above with
respect to step 102 is applicable to step 2002. The present
disclosure repeats reference numerals and/or letters in the various
embodiments. This repetition is for the purpose of simplicity and
clarity such that repeated reference numerals and/or letters
indicate similar features amongst the various embodiments unless
stated otherwise.
[0068] Referring to FIGS. 26 and 27, method 2000 proceeds to step
2004 by forming the mandrel feature 410 over the substrate 210 in
the second region 214. The step 2004 is similar to those discussed
above in step 108. Thus, the discussion above with respect to step
108 is applicable to step 2004.
[0069] Referring to FIGS. 26 and 28, method 2000 proceeds to step
2006 by forming the material layer 310 over the features 220 and
the mandrel feature 410. The material layer 310 is formed similarly
in many respects to the material layer 310 discussed above with
FIG. 3, including the materials discussed therein.
[0070] Referring to FIGS. 26 and 29, method 2000 proceeds to step
2008 by forming the FM layer 510 over the material layer 310. The
step 2008 is similar to those discussed above in step 110. Thus,
the discussion above with respect to step 110 is applicable to step
2008.
[0071] Referring to FIGS. 26 and 30, method 2000 proceeds to step
2010 by forming the patterned HM 610 is over the FM layer 510. The
step 2010 is similar to those discussed above in step 112. Thus,
the discussion above with respect to step 112 is applicable to step
2010.
[0072] Referring to FIGS. 20 and 31A, method 2000 proceeds to step
2012 by etching the FM layer 510 and the material layer 310 through
the first openings 615 to form the trenches 710A and 710B in the
material layer 310 and etching the FM layer 510, the material layer
310 and the mandrel feature 410 through the second opening 616 in
the second region 214. The step 1012 is similar to those discussed
above in step 114. Thus, the discussion above with respect to step
114 is applicable to step 1012.
[0073] Alternatively, as has been mentioned previously, the etch
process is chosen to etch the FM layer 510 and the material layer
310 without etching the mandrel feature 410. Therefore the mandrel
feature 410 remains to provide a designate structure for later
process integration, as shown in FIG. 31B.
[0074] Referring to FIGS. 36, 32A (in conjunction with the process
described with respect to FIG. 31A) and 32B (in conjunction with
the process described with respect to FIG. 32B), method 2000
proceeds to step 2014 by removing the remaining FM layer 510. The
step 2014 is similar to those discussed above in step 116. Thus,
the discussion above with respect to step 116 is applicable to step
2014.
[0075] Additional steps can be provided before, during, and after
the method 2000, and some of the steps described can be replaced or
eliminated for other embodiments of the method.
[0076] Based on the above, the present disclosure offers structures
and methods for improving etch CD uniformity in etching a film
which has a topography that is higher than an adjacent region. The
method employs forming a mandrel feature in the adjacent region to
provide a quite flat topography of a film for in-coming etching
process. The method demonstrates a feasible, flexible and low cost
planarization method for improving etch CD uniformity.
[0077] The present disclosure provides many different embodiments
of fabricating a semiconductor device that provide one or more
improvements over existing approaches. In one embodiment, a method
for fabricating a semiconductor device includes forming a material
layer over a first region of a substrate and a second region of the
substrate. A top surface of the material layer in the first region
is higher than a top surface of the material layer in the second
region. The method also includes removing the material layer from
the second region, forming a mandrel feature in the second region,
forming a flowable-material (FM) layer over the material layer and
the mandrel feature and forming a patterned hard mask (HM) over the
FM layer, the patterned HM has a plurality of first openings in the
first region. The method also includes etching the FM layer and the
material layer through the plurality of first openings to form a
plurality trenches in the material layer.
[0078] In another embodiment, a method includes forming a material
layer over a first region of a substrate and a second region of the
substrate. A top surface of the material layer in the first region
is higher than a top surface of the material layer in the second
region. The method also includes forming a mandrel feature over the
material layer in the second region, forming a flowable-material
(FM) layer over the material layer and the mandrel feature and
forming a patterned hard mask (HM) over the FM layer, the patterned
HM having a first opening over the first region of the substrate.
The method also includes etching the FM layer and the material
layer through the first opening to form a trench in the material
layer.
[0079] In yet another embodiment, a method includes providing a
substrate having a plurality of features protruding from the
substrate in a first region, forming a mandrel feature in a second
region of the substrate, forming a material layer over the
plurality of features in the first region and the mandrel feature
in the second region, forming a flowable-material (FM) layer over
the material layer and forming a patterned hard mask (HM) over the
FM layer, the patterned HM having a first opening over the first
region of the substrate. The method also includes etching the FM
layer and the material layer through the first opening to form a
trench in the material layer.
[0080] The foregoing outlines features of several embodiments so
that those skilled in the art may better understand the aspects of
the present disclosure. Those skilled in the art should appreciate
that they may readily use the present disclosure as a basis for
designing or modifying other processes and structures for carrying
out the same purposes and/or achieving the same advantages of the
embodiments introduced herein. Those skilled in the art should also
realize that such equivalent constructions do not depart from the
spirit and scope of the present disclosure, and that they may make
various changes, substitutions, and alterations herein without
departing from the spirit and scope of the present disclosure.
* * * * *